CN101670547B - 抛光装置及将基片从基片保持装置上取下来的方法 - Google Patents

抛光装置及将基片从基片保持装置上取下来的方法 Download PDF

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Publication number
CN101670547B
CN101670547B CN2009101790463A CN200910179046A CN101670547B CN 101670547 B CN101670547 B CN 101670547B CN 2009101790463 A CN2009101790463 A CN 2009101790463A CN 200910179046 A CN200910179046 A CN 200910179046A CN 101670547 B CN101670547 B CN 101670547B
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CN
China
Prior art keywords
substrate
semiconductor wafer
top ring
pusher
polishing
Prior art date
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Expired - Lifetime
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CN2009101790463A
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English (en)
Chinese (zh)
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CN101670547A (zh
Inventor
鸟居弘臣
叶山卓儿
八岛哲也
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Ebara Corp
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Ebara Corp
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Publication of CN101670547A publication Critical patent/CN101670547A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • H10P52/00—
    • H10P72/70—

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2009101790463A 2003-10-17 2004-10-14 抛光装置及将基片从基片保持装置上取下来的方法 Expired - Lifetime CN101670547B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003358593 2003-10-17
JP2003-358593 2003-10-17
JP2003358593A JP2005123485A (ja) 2003-10-17 2003-10-17 研磨装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800301959A Division CN100563926C (zh) 2003-10-17 2004-10-14 抛光装置

Publications (2)

Publication Number Publication Date
CN101670547A CN101670547A (zh) 2010-03-17
CN101670547B true CN101670547B (zh) 2012-07-25

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN2009101790463A Expired - Lifetime CN101670547B (zh) 2003-10-17 2004-10-14 抛光装置及将基片从基片保持装置上取下来的方法
CNB2004800301959A Expired - Lifetime CN100563926C (zh) 2003-10-17 2004-10-14 抛光装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB2004800301959A Expired - Lifetime CN100563926C (zh) 2003-10-17 2004-10-14 抛光装置

Country Status (7)

Country Link
US (2) US7445543B2 (enExample)
EP (1) EP1673201B1 (enExample)
JP (1) JP2005123485A (enExample)
KR (1) KR101088784B1 (enExample)
CN (2) CN101670547B (enExample)
TW (1) TWI330570B (enExample)
WO (1) WO2005037488A1 (enExample)

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JP5390807B2 (ja) 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP5254832B2 (ja) * 2009-02-04 2013-08-07 株式会社ディスコ ウェーハ保持機構
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DE102012212249B4 (de) * 2012-07-12 2016-02-25 Infineon Technologies Ag Verfahren zur Herstellung eines Verbundes und eines Halbleitermoduls
US9199354B2 (en) * 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
JP6027454B2 (ja) * 2013-02-05 2016-11-16 株式会社荏原製作所 研磨装置
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US9355882B2 (en) * 2013-12-04 2016-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Transfer module for bowed wafers
CN103730401A (zh) * 2013-12-24 2014-04-16 苏州市奥普斯等离子体科技有限公司 一种改进型芯片夹持装置
CN104907922A (zh) * 2014-03-11 2015-09-16 上海华虹宏力半导体制造有限公司 基座及其中防止硅片出现x型缺陷的去离子水控制装置
JP6032234B2 (ja) * 2014-03-19 2016-11-24 信越半導体株式会社 ワーク保持装置
JP2016043442A (ja) * 2014-08-21 2016-04-04 株式会社荏原製作所 研磨装置
US9539699B2 (en) 2014-08-28 2017-01-10 Ebara Corporation Polishing method
JP6225088B2 (ja) 2014-09-12 2017-11-01 株式会社荏原製作所 研磨方法および研磨装置
KR101580102B1 (ko) * 2015-02-10 2015-12-28 장경덕 수압을 이용한 웨이퍼 이면 연마장치
JP7157521B2 (ja) * 2016-03-15 2022-10-20 株式会社荏原製作所 基板研磨方法、トップリングおよび基板研磨装置
JP6427131B2 (ja) * 2016-03-18 2018-11-21 株式会社荏原製作所 研磨装置および研磨方法
KR102331075B1 (ko) * 2017-03-17 2021-11-25 주식회사 케이씨텍 기판 처리 장치
JP6990980B2 (ja) * 2017-03-31 2022-01-12 株式会社荏原製作所 基板処理装置
CN107671714B (zh) * 2017-09-27 2024-01-30 宜华生活科技股份有限公司 一种板件自动上料装置
KR102385573B1 (ko) * 2017-12-13 2022-04-12 삼성전자주식회사 로드 컵 및 이를 포함하는 화학기계적 연마 장치
JP7074607B2 (ja) * 2018-08-02 2022-05-24 株式会社荏原製作所 研磨装置用の治具
CN109249309B (zh) * 2018-11-10 2024-03-08 宇晶机器（长沙）有限公司 连续式多工位抛光机真空管路自清洗控制系统
CN109048662B (zh) * 2018-11-10 2024-03-15 宇晶机器（长沙）有限公司 连续式多工位抛光机真空吸附管路系统
JP7529544B2 (ja) * 2020-11-20 2024-08-06 株式会社東京精密 プローバの故障検知方法及びその故障検知装置
JP7715464B2 (ja) * 2021-09-02 2025-07-30 東京エレクトロン株式会社 基板処理装置
JP7682126B2 (ja) * 2022-04-22 2025-05-23 三菱電機株式会社 半導体装置の製造方法及び成型プレス機
CN116207009B (zh) * 2022-12-30 2023-10-27 江苏福旭科技有限公司 一种单晶硅片刻蚀抛光设备
CN117161950B (zh) * 2023-11-02 2023-12-26 南通海鹰机电集团有限公司 一种用于压力容器制造的抛光装置
CN120228607B (zh) * 2025-06-03 2025-08-19 北京特思迪半导体设备有限公司 用于方形基板抛光的压板、囊膜、抛光压头、设备及方法

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Also Published As

Publication number Publication date
WO2005037488A1 (en) 2005-04-28
US7942725B2 (en) 2011-05-17
EP1673201A1 (en) 2006-06-28
TW200528234A (en) 2005-09-01
CN100563926C (zh) 2009-12-02
EP1673201B1 (en) 2014-07-02
KR101088784B1 (ko) 2011-12-01
CN101670547A (zh) 2010-03-17
US20090068935A1 (en) 2009-03-12
JP2005123485A (ja) 2005-05-12
US7445543B2 (en) 2008-11-04
KR20070017973A (ko) 2007-02-13
TWI330570B (en) 2010-09-21
CN1867424A (zh) 2006-11-22
US20060292967A1 (en) 2006-12-28

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