JP2005101545A5 - - Google Patents

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Publication number
JP2005101545A5
JP2005101545A5 JP2004228852A JP2004228852A JP2005101545A5 JP 2005101545 A5 JP2005101545 A5 JP 2005101545A5 JP 2004228852 A JP2004228852 A JP 2004228852A JP 2004228852 A JP2004228852 A JP 2004228852A JP 2005101545 A5 JP2005101545 A5 JP 2005101545A5
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JP
Japan
Prior art keywords
polishing composition
removal
organic
ammonium salt
chain length
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JP2004228852A
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English (en)
Japanese (ja)
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JP2005101545A (ja
JP4681261B2 (ja
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Priority claimed from US10/634,437 external-priority patent/US7018560B2/en
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Publication of JP2005101545A publication Critical patent/JP2005101545A/ja
Publication of JP2005101545A5 publication Critical patent/JP2005101545A5/ja
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Publication of JP4681261B2 publication Critical patent/JP4681261B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2004228852A 2003-08-05 2004-08-05 半導体層を研磨するための組成物 Expired - Lifetime JP4681261B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/634,437 US7018560B2 (en) 2003-08-05 2003-08-05 Composition for polishing semiconductor layers

Publications (3)

Publication Number Publication Date
JP2005101545A JP2005101545A (ja) 2005-04-14
JP2005101545A5 true JP2005101545A5 (enExample) 2007-08-30
JP4681261B2 JP4681261B2 (ja) 2011-05-11

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JP2004228852A Expired - Lifetime JP4681261B2 (ja) 2003-08-05 2004-08-05 半導体層を研磨するための組成物

Country Status (7)

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US (1) US7018560B2 (enExample)
EP (1) EP1505133B1 (enExample)
JP (1) JP4681261B2 (enExample)
KR (1) KR101092939B1 (enExample)
CN (1) CN1609156B (enExample)
DE (1) DE602004012674T2 (enExample)
TW (1) TWI365907B (enExample)

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