JP2005101545A5 - - Google Patents

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JP2005101545A5
JP2005101545A5 JP2004228852A JP2004228852A JP2005101545A5 JP 2005101545 A5 JP2005101545 A5 JP 2005101545A5 JP 2004228852 A JP2004228852 A JP 2004228852A JP 2004228852 A JP2004228852 A JP 2004228852A JP 2005101545 A5 JP2005101545 A5 JP 2005101545A5
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Prior art keywords
polishing composition
removal
organic
ammonium salt
chain length
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Claims (7)

  1. 配線金属の除去を制限するための腐食インヒビターと、
    酸性pHと、
    砥粒と、
    式:
    Figure 2005101545

    (R1、R2、R3及びR4非置換のアリール、アルキル、アラルキル又はアルカリール基を表わす基であり、R1は、2〜15個の炭素原子の炭素鎖長を有する)を用いて形成される有機含有アンモニウム塩と
    を含み、
    前記有機含有アンモニウム塩が、21.7kPa未満の少なくとも1つの研磨圧力を用いて、TEOS除去を促進し、かつSiC、SiCN、Si34及びSiCOからなる群より選択される少なくとも1つのコーティングの除去を減少させる濃度を有する、
    水性研磨組成物。
  2. 1 が2〜15個の炭素原子の炭素鎖長を有する、請求項1記載の水性研磨組成物。
  3. アンモニウム塩が、テトラエチルアンモニウム、テトラブチルアンモニウム、ベンジルトリブチルアンモニウム、ベンジルトリメチルアンモニウム、ベンジルトリエチルアンモニウム、ジアリルジメチルアンモニウム、ジエチルアミノエチルメタクリレート、ジメチルアミノエチルメタクリレート、メタクリロイルオキシエチルトリメチルアンモニウム、3−(メタクリルアミド)プロピルトリメチルアンモニウム、トリエチレンテトラミン、テトラメチルグアニジン、ヘキシルアミン、及びそれらの混合物から選択される化合物で形成される、請求項1記載の水性研磨組成物。
  4. 砥粒0.05〜15重量%と、
    酸化剤0〜10重量%と、
    配線金属の除去を制限するための腐食インヒビター0.0025〜6重量%と、
    5未満のpHと、
    式:
    Figure 2005101545

    (R1、R2、R3及びR4非置換のアリール、アルキル、アラルキル又はアルカリール基を表わす基であり、R1は、2〜15個の炭素原子炭素鎖長を有する)を用いて形成される有機含有アンモニウム塩0.001〜3重量%と
    を含み、
    前記有機含有アンモニウム塩が、21.7kPa未満の少なくとも1つの研磨圧力を用いて、TEOS除去を促進し、かつSiC、SiCN、Si34及びSiCOからなる群より選択される少なくとも1つのコーティングの除去を減少させる濃度を有する、
    水性研磨組成物。
  5. 砥粒がシリカを含み、酸化剤が過酸化水素を含み、腐食インヒビターがベンゾトリアゾールを含み、組成物が3未満のpHと有機アンモニウムフッ化物塩を有する、請求項4記載の水性研磨組成物。
  6. 研磨組成物が硝酸、硫酸、塩酸、リン酸又はこれらの混合物を用いてpHを2〜3に調整されたものである、請求項5記載の水性研磨組成物。
  7. 1 が2〜5個の炭素原子の炭素鎖長を有する、請求項4記載の水性研磨組成物。
JP2004228852A 2003-08-05 2004-08-05 半導体層を研磨するための組成物 Active JP4681261B2 (ja)

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US10/634,437 US7018560B2 (en) 2003-08-05 2003-08-05 Composition for polishing semiconductor layers

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JP2005101545A JP2005101545A (ja) 2005-04-14
JP2005101545A5 true JP2005101545A5 (ja) 2007-08-30
JP4681261B2 JP4681261B2 (ja) 2011-05-11

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US (1) US7018560B2 (ja)
EP (1) EP1505133B1 (ja)
JP (1) JP4681261B2 (ja)
KR (1) KR101092939B1 (ja)
CN (1) CN1609156B (ja)
DE (1) DE602004012674T2 (ja)
TW (1) TWI365907B (ja)

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