JP2004531608A5 - - Google Patents
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- JP2004531608A5 JP2004531608A5 JP2002587496A JP2002587496A JP2004531608A5 JP 2004531608 A5 JP2004531608 A5 JP 2004531608A5 JP 2002587496 A JP2002587496 A JP 2002587496A JP 2002587496 A JP2002587496 A JP 2002587496A JP 2004531608 A5 JP2004531608 A5 JP 2004531608A5
- Authority
- JP
- Japan
- Prior art keywords
- dianhydride
- bis
- polyamic acid
- group
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229920005575 poly(amic acid) Polymers 0.000 claims description 55
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 35
- 229920001721 polyimide Polymers 0.000 claims description 29
- 239000004642 Polyimide Substances 0.000 claims description 25
- 230000015572 biosynthetic process Effects 0.000 claims description 23
- 108010025899 gelatin film Proteins 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 10
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 claims description 8
- 239000007795 chemical reaction product Substances 0.000 claims description 8
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 6
- 150000001345 alkine derivatives Chemical group 0.000 claims description 6
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 claims description 6
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 6
- -1 cyano, hydroxy Chemical group 0.000 claims description 6
- 150000004985 diamines Chemical class 0.000 claims description 6
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical group C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 claims description 6
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 5
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 5
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 4
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 4
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 4
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 claims description 4
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 claims description 4
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims description 4
- IELKYPBJKLDRRX-UHFFFAOYSA-N 3-[(3-aminophenyl)-diethylsilyl]aniline Chemical compound C=1C=CC(N)=CC=1[Si](CC)(CC)C1=CC=CC(N)=C1 IELKYPBJKLDRRX-UHFFFAOYSA-N 0.000 claims description 4
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 4
- IWXCYYWDGDDPAC-UHFFFAOYSA-N 4-[(3,4-dicarboxyphenyl)methyl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C(C(O)=O)=C1 IWXCYYWDGDDPAC-UHFFFAOYSA-N 0.000 claims description 4
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 claims description 4
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims description 4
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical group O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 4
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N N-phenyl amine Natural products NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims description 4
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000003880 polar aprotic solvent Substances 0.000 claims description 3
- FHBXQJDYHHJCIF-UHFFFAOYSA-N (2,3-diaminophenyl)-phenylmethanone Chemical compound NC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1N FHBXQJDYHHJCIF-UHFFFAOYSA-N 0.000 claims description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 claims description 2
- XMXCPDQUXVZBGQ-UHFFFAOYSA-N 2,3,6,7-tetrachloronaphthalene-1,4,5,8-tetracarboxylic acid Chemical compound ClC1=C(Cl)C(C(O)=O)=C2C(C(=O)O)=C(Cl)C(Cl)=C(C(O)=O)C2=C1C(O)=O XMXCPDQUXVZBGQ-UHFFFAOYSA-N 0.000 claims description 2
- SDWGBHZZXPDKDZ-UHFFFAOYSA-N 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic acid Chemical compound C1=C(Cl)C(C(O)=O)=C2C(C(=O)O)=CC(Cl)=C(C(O)=O)C2=C1C(O)=O SDWGBHZZXPDKDZ-UHFFFAOYSA-N 0.000 claims description 2
- KZLDGFZCFRXUIB-UHFFFAOYSA-N 2-amino-4-(3-amino-4-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC(C=2C=C(N)C(O)=CC=2)=C1 KZLDGFZCFRXUIB-UHFFFAOYSA-N 0.000 claims description 2
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 claims description 2
- HUWXDEQWWKGHRV-UHFFFAOYSA-N 3,3'-Dichlorobenzidine Chemical compound C1=C(Cl)C(N)=CC=C1C1=CC=C(N)C(Cl)=C1 HUWXDEQWWKGHRV-UHFFFAOYSA-N 0.000 claims description 2
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 claims description 2
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 claims description 2
- XCOPFAYKRLHFSH-UHFFFAOYSA-N 3,5-bis(3-aminophenoxy)benzonitrile Chemical compound NC1=CC=CC(OC=2C=C(C=C(OC=3C=C(N)C=CC=3)C=2)C#N)=C1 XCOPFAYKRLHFSH-UHFFFAOYSA-N 0.000 claims description 2
- ZRJAHFLFCRNNMR-UHFFFAOYSA-N 3-amino-2-(4-aminophenyl)benzoic acid Chemical compound C1=CC(N)=CC=C1C1=C(N)C=CC=C1C(O)=O ZRJAHFLFCRNNMR-UHFFFAOYSA-N 0.000 claims description 2
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 claims description 2
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 claims description 2
- VILWHDNLOJCHNJ-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfanylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1SC1=CC=C(C(O)=O)C(C(O)=O)=C1 VILWHDNLOJCHNJ-UHFFFAOYSA-N 0.000 claims description 2
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 claims description 2
- VMFQOYLCRZRUMB-UHFFFAOYSA-N 4-n-(4-aminophenyl)-4-n-butylbenzene-1,4-diamine Chemical compound C=1C=C(N)C=CC=1N(CCCC)C1=CC=C(N)C=C1 VMFQOYLCRZRUMB-UHFFFAOYSA-N 0.000 claims description 2
- YFBMJEBQWQBRQJ-UHFFFAOYSA-N 4-n-(4-aminophenyl)-4-n-phenylbenzene-1,4-diamine Chemical compound C1=CC(N)=CC=C1N(C=1C=CC(N)=CC=1)C1=CC=CC=C1 YFBMJEBQWQBRQJ-UHFFFAOYSA-N 0.000 claims description 2
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims description 2
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 claims description 2
- DUZDWKQSIJVSMY-UHFFFAOYSA-N 5-[4-(6-amino-2-methylhexan-2-yl)phenyl]-5-methylhexan-1-amine Chemical compound NCCCCC(C)(C)C1=CC=C(C(C)(C)CCCCN)C=C1 DUZDWKQSIJVSMY-UHFFFAOYSA-N 0.000 claims description 2
- QLUCGFCTWIBISL-UHFFFAOYSA-N FC(C(C(F)(F)F)(C1=CC(=C(C=C1)C(=O)O)C(=O)O)C1=CC(=C(C=C1)C(=O)O)C(=O)O)(F)F.C(=O)(O)C=1C=C(C=CC1C(=O)O)C(C)(C)C1=CC(=C(C=C1)C(=O)O)C(=O)O Chemical compound FC(C(C(F)(F)F)(C1=CC(=C(C=C1)C(=O)O)C(=O)O)C1=CC(=C(C=C1)C(=O)O)C(=O)O)(F)F.C(=O)(O)C=1C=C(C=CC1C(=O)O)C(C)(C)C1=CC(=C(C=C1)C(=O)O)C(=O)O QLUCGFCTWIBISL-UHFFFAOYSA-N 0.000 claims description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 claims description 2
- GCAIEATUVJFSMC-UHFFFAOYSA-N benzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1C(O)=O GCAIEATUVJFSMC-UHFFFAOYSA-N 0.000 claims description 2
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 claims description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 2
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 2
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims description 2
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 claims description 2
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 claims description 2
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 claims description 2
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 claims description 2
- RTHVZRHBNXZKKB-UHFFFAOYSA-N pyrazine-2,3,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=NC(C(O)=O)=C(C(O)=O)N=C1C(O)=O RTHVZRHBNXZKKB-UHFFFAOYSA-N 0.000 claims description 2
- VHNQIURBCCNWDN-UHFFFAOYSA-N pyridine-2,6-diamine Chemical compound NC1=CC=CC(N)=N1 VHNQIURBCCNWDN-UHFFFAOYSA-N 0.000 claims description 2
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/848,895 US6653433B2 (en) | 1999-11-24 | 2001-05-04 | Polyimide composition having improved peel strength when clad |
| PCT/US2001/015130 WO2002090422A1 (en) | 2001-05-04 | 2001-05-10 | Polyimide composition having improved peel strength |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004531608A JP2004531608A (ja) | 2004-10-14 |
| JP2004531608A5 true JP2004531608A5 (enExample) | 2008-06-26 |
Family
ID=25304566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002587496A Pending JP2004531608A (ja) | 2001-05-04 | 2001-05-10 | 改善された剥離強度を有するポリイミド組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6653433B2 (enExample) |
| EP (1) | EP1395627B1 (enExample) |
| JP (1) | JP2004531608A (enExample) |
| KR (1) | KR100714952B1 (enExample) |
| DE (1) | DE60124321T2 (enExample) |
| TW (1) | TW567211B (enExample) |
| WO (1) | WO2002090422A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7018704B2 (en) * | 2001-09-28 | 2006-03-28 | Kaneka Corporation | Polyimide film for flexible printed board and flexible printed board using the same |
| US6956098B2 (en) * | 2002-09-20 | 2005-10-18 | E. I. Du Pont De Nemours And Company | High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto |
| US7026436B2 (en) * | 2002-11-26 | 2006-04-11 | E.I. Du Pont De Nemours And Company | Low temperature polyimide adhesive compositions and methods relating thereto |
| US6949296B2 (en) * | 2002-12-31 | 2005-09-27 | E. I. Du Pont De Nemours And Company | Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto |
| US7534649B2 (en) * | 2006-05-12 | 2009-05-19 | Intel Corporation | Thermoset polyimides for microelectronic applications |
| KR101485185B1 (ko) | 2007-12-14 | 2015-01-23 | 삼성전기주식회사 | 인쇄회로기판 형성용 조성물 및 그를 이용하는 인쇄회로기판 |
| US8288484B2 (en) * | 2009-03-10 | 2012-10-16 | Samsung Electronics Co., Ltd. | Cross-linked product of metal-containing polyamic acid, cross-linked product of metal-containing polyimide including the cross-linked product of metal-containing polyamic acid, method of manufacturing the cross-linked product of metal-containing polyimide, and polyimide film including the cross-linked product of metal-containing polyimide |
| EP2487196B1 (en) | 2009-10-09 | 2018-01-17 | Ube Industries, Ltd. | Process for the production of a colored polyimide molded article |
| KR101501875B1 (ko) * | 2014-05-30 | 2015-03-11 | 주식회사 엘지화학 | 폴리이미드계 용액 및 이를 이용하여 제조된 폴리이미드계 필름 |
| WO2015183056A1 (ko) * | 2014-05-30 | 2015-12-03 | 주식회사 엘지화학 | 폴리이미드계 용액 및 이를 이용하여 제조된 폴리이미드계 필름 |
| TWI843741B (zh) * | 2018-08-07 | 2024-06-01 | 美商杜邦電子股份有限公司 | 用於電子裝置中之聚合物 |
| CN113061338B (zh) * | 2021-05-08 | 2022-11-15 | 深圳先进电子材料国际创新研究院 | 聚酰胺酸组合物、聚酰亚胺组合物、聚酰亚胺薄膜及聚酰亚胺覆铜板 |
| CN114146571A (zh) * | 2021-11-19 | 2022-03-08 | 黑龙江省科学院高技术研究院 | 一种油水分离用高通量季铵盐结构多孔膜材料的制备方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3179614A (en) * | 1961-03-13 | 1965-04-20 | Du Pont | Polyamide-acids, compositions thereof, and process for their preparation |
| US3179634A (en) * | 1962-01-26 | 1965-04-20 | Du Pont | Aromatic polyimides and the process for preparing them |
| US3179630A (en) * | 1962-01-26 | 1965-04-20 | Du Pont | Process for preparing polyimides by treating polyamide-acids with lower fatty monocarboxylic acid anhydrides |
| US4166170A (en) | 1977-10-06 | 1979-08-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Mixed diamines for lower melting addition polyimide preparation and utilization |
| US4931540A (en) * | 1987-11-24 | 1990-06-05 | Hoechst Celanese Corporation | Polymers prepared from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl] diphenyl ether dianhydride |
| US5149760A (en) | 1990-01-30 | 1992-09-22 | Trw Inc. | Halogenated polyimide resins prepared by addition reactions |
| US5132395A (en) | 1990-01-30 | 1992-07-21 | Trw Inc. | Polyimide resins prepared by addition reactions |
| US5338827A (en) | 1990-01-30 | 1994-08-16 | Trw Inc. | Polyimide resins useful at high temperatures |
| US5432001A (en) | 1990-01-30 | 1995-07-11 | Trw Inc. | Concentrated prepolymer composition useful for forming polyimide articles |
| US5091505A (en) | 1990-01-30 | 1992-02-25 | Trw Inc. | Polymide resins prepared by addition reactions |
| US5096998A (en) | 1990-10-31 | 1992-03-17 | E. I. Du Pont De Nemours And Company | Reactive-oligoimide adhesives, laminates, and methods of making the laminates |
| US5152863A (en) | 1990-10-31 | 1992-10-06 | E. I. Du Pont De Nemours And Company | Reactive-oligoimide adhesives, laminates, and methods of making the laminates |
| US5272245A (en) | 1990-11-26 | 1993-12-21 | E. I. Du Pont De Nemours And Company | Chemically etchable adhesives |
| US5145943A (en) * | 1990-12-17 | 1992-09-08 | Ethyl Corporation | Production of particulate amide/imide prepolymers |
| US5460890A (en) * | 1991-10-30 | 1995-10-24 | E. I. Du Pont De Nemours And Company | Biaxially stretched isotropic polyimide film having specific properties |
| JPH0694732B2 (ja) * | 1991-11-25 | 1994-11-24 | 哲夫 田原 | 止水剤封止箱 |
| US5272194A (en) | 1992-01-17 | 1993-12-21 | E. I. Du Pont De Nemours And Company | Process for preparing a strengthened polyimide film containing organometallic compounds for improving adhesion |
| US5543222A (en) * | 1994-04-29 | 1996-08-06 | E. I. Du Pont De Nemours And Company | Metallized polyimide film containing a hydrocarbyl tin compound |
-
2001
- 2001-05-04 US US09/848,895 patent/US6653433B2/en not_active Expired - Fee Related
- 2001-05-10 WO PCT/US2001/015130 patent/WO2002090422A1/en not_active Ceased
- 2001-05-10 JP JP2002587496A patent/JP2004531608A/ja active Pending
- 2001-05-10 DE DE2001624321 patent/DE60124321T2/de not_active Expired - Fee Related
- 2001-05-10 EP EP01933279A patent/EP1395627B1/en not_active Expired - Lifetime
- 2001-05-10 KR KR1020037014309A patent/KR100714952B1/ko not_active Expired - Fee Related
- 2001-05-18 TW TW90111974A patent/TW567211B/zh not_active IP Right Cessation
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