KR100714952B1 - 박리 강도가 개선된 폴리이미드 조성물 - Google Patents

박리 강도가 개선된 폴리이미드 조성물 Download PDF

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Publication number
KR100714952B1
KR100714952B1 KR1020037014309A KR20037014309A KR100714952B1 KR 100714952 B1 KR100714952 B1 KR 100714952B1 KR 1020037014309 A KR1020037014309 A KR 1020037014309A KR 20037014309 A KR20037014309 A KR 20037014309A KR 100714952 B1 KR100714952 B1 KR 100714952B1
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KR
South Korea
Prior art keywords
group
polyamic acid
bis
tetracarboxylic acid
diaminodiphenyl
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Expired - Fee Related
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KR1020037014309A
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English (en)
Korean (ko)
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KR20040012783A (ko
Inventor
메레디쓰 엘. 던바
제임스 에드먼
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
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Publication of KR20040012783A publication Critical patent/KR20040012783A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
KR1020037014309A 2001-05-04 2001-05-10 박리 강도가 개선된 폴리이미드 조성물 Expired - Fee Related KR100714952B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/848,895 US6653433B2 (en) 1999-11-24 2001-05-04 Polyimide composition having improved peel strength when clad
US09/848,895 2001-05-04
PCT/US2001/015130 WO2002090422A1 (en) 2001-05-04 2001-05-10 Polyimide composition having improved peel strength

Publications (2)

Publication Number Publication Date
KR20040012783A KR20040012783A (ko) 2004-02-11
KR100714952B1 true KR100714952B1 (ko) 2007-05-07

Family

ID=25304566

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037014309A Expired - Fee Related KR100714952B1 (ko) 2001-05-04 2001-05-10 박리 강도가 개선된 폴리이미드 조성물

Country Status (7)

Country Link
US (1) US6653433B2 (enExample)
EP (1) EP1395627B1 (enExample)
JP (1) JP2004531608A (enExample)
KR (1) KR100714952B1 (enExample)
DE (1) DE60124321T2 (enExample)
TW (1) TW567211B (enExample)
WO (1) WO2002090422A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI304079B (enExample) * 2001-09-28 2008-12-11 Kaneka Corp
US6956098B2 (en) * 2002-09-20 2005-10-18 E. I. Du Pont De Nemours And Company High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
US6949296B2 (en) * 2002-12-31 2005-09-27 E. I. Du Pont De Nemours And Company Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto
US7534649B2 (en) * 2006-05-12 2009-05-19 Intel Corporation Thermoset polyimides for microelectronic applications
KR101485185B1 (ko) 2007-12-14 2015-01-23 삼성전기주식회사 인쇄회로기판 형성용 조성물 및 그를 이용하는 인쇄회로기판
JP5479958B2 (ja) * 2009-03-10 2014-04-23 三星電子株式会社 金属含有ポリアミック酸の架橋体、金属含有ポリイミドの架橋体、その製造方法及びそれを利用したポリイミドフィルム
US9346927B2 (en) 2009-10-09 2016-05-24 Ube Industries, Ltd. Colored polyimide molded article, and process for production thereof
TWI551652B (zh) * 2014-05-30 2016-10-01 Ｌｇ化學股份有限公司 聚醯亞胺系溶液和使用其製備的聚醯亞胺系膜及含聚醯亞胺系膜的顯示器基板與裝置
KR101501875B1 (ko) * 2014-05-30 2015-03-11 주식회사 엘지화학 폴리이미드계 용액 및 이를 이용하여 제조된 폴리이미드계 필름
TWI843741B (zh) * 2018-08-07 2024-06-01 美商杜邦電子股份有限公司 用於電子裝置中之聚合物
CN113061338B (zh) * 2021-05-08 2022-11-15 深圳先进电子材料国际创新研究院 聚酰胺酸组合物、聚酰亚胺组合物、聚酰亚胺薄膜及聚酰亚胺覆铜板
CN114146571A (zh) * 2021-11-19 2022-03-08 黑龙江省科学院高技术研究院 一种油水分离用高通量季铵盐结构多孔膜材料的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05272245A (ja) * 1991-11-25 1993-10-19 Tetsuo Tawara 止水剤封止箱
US5272245A (en) 1990-11-26 1993-12-21 E. I. Du Pont De Nemours And Company Chemically etchable adhesives

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179614A (en) * 1961-03-13 1965-04-20 Du Pont Polyamide-acids, compositions thereof, and process for their preparation
US3179634A (en) * 1962-01-26 1965-04-20 Du Pont Aromatic polyimides and the process for preparing them
US3179630A (en) * 1962-01-26 1965-04-20 Du Pont Process for preparing polyimides by treating polyamide-acids with lower fatty monocarboxylic acid anhydrides
US4166170A (en) 1977-10-06 1979-08-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Mixed diamines for lower melting addition polyimide preparation and utilization
US4931540A (en) * 1987-11-24 1990-06-05 Hoechst Celanese Corporation Polymers prepared from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl] diphenyl ether dianhydride
US5432001A (en) 1990-01-30 1995-07-11 Trw Inc. Concentrated prepolymer composition useful for forming polyimide articles
US5091505A (en) 1990-01-30 1992-02-25 Trw Inc. Polymide resins prepared by addition reactions
US5338827A (en) 1990-01-30 1994-08-16 Trw Inc. Polyimide resins useful at high temperatures
US5132395A (en) 1990-01-30 1992-07-21 Trw Inc. Polyimide resins prepared by addition reactions
US5149760A (en) 1990-01-30 1992-09-22 Trw Inc. Halogenated polyimide resins prepared by addition reactions
US5096998A (en) 1990-10-31 1992-03-17 E. I. Du Pont De Nemours And Company Reactive-oligoimide adhesives, laminates, and methods of making the laminates
US5152863A (en) 1990-10-31 1992-10-06 E. I. Du Pont De Nemours And Company Reactive-oligoimide adhesives, laminates, and methods of making the laminates
US5145943A (en) * 1990-12-17 1992-09-08 Ethyl Corporation Production of particulate amide/imide prepolymers
US5460890A (en) * 1991-10-30 1995-10-24 E. I. Du Pont De Nemours And Company Biaxially stretched isotropic polyimide film having specific properties
US5272194A (en) 1992-01-17 1993-12-21 E. I. Du Pont De Nemours And Company Process for preparing a strengthened polyimide film containing organometallic compounds for improving adhesion
US5543222A (en) * 1994-04-29 1996-08-06 E. I. Du Pont De Nemours And Company Metallized polyimide film containing a hydrocarbyl tin compound

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5272245A (en) 1990-11-26 1993-12-21 E. I. Du Pont De Nemours And Company Chemically etchable adhesives
JPH05272245A (ja) * 1991-11-25 1993-10-19 Tetsuo Tawara 止水剤封止箱

Also Published As

Publication number Publication date
US20020010311A1 (en) 2002-01-24
EP1395627A1 (en) 2004-03-10
KR20040012783A (ko) 2004-02-11
DE60124321D1 (de) 2006-12-14
WO2002090422A1 (en) 2002-11-14
EP1395627B1 (en) 2006-11-02
US6653433B2 (en) 2003-11-25
DE60124321T2 (de) 2007-06-21
JP2004531608A (ja) 2004-10-14
TW567211B (en) 2003-12-21

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