JP2004531061A - 複合体から電子部品を分割する方法 - Google Patents

複合体から電子部品を分割する方法 Download PDF

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Publication number
JP2004531061A
JP2004531061A JP2002586378A JP2002586378A JP2004531061A JP 2004531061 A JP2004531061 A JP 2004531061A JP 2002586378 A JP2002586378 A JP 2002586378A JP 2002586378 A JP2002586378 A JP 2002586378A JP 2004531061 A JP2004531061 A JP 2004531061A
Authority
JP
Japan
Prior art keywords
carrier
adhesive
heat
component
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002586378A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004531061A5 (enExample
Inventor
ブロッド、ヴォルカー
オーバーメイヤー、ラッガー
ハンス−ピーター モンサー
Original Assignee
ミュールバウアー・アクチエンゲゼルシャフト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミュールバウアー・アクチエンゲゼルシャフト filed Critical ミュールバウアー・アクチエンゲゼルシャフト
Publication of JP2004531061A publication Critical patent/JP2004531061A/ja
Publication of JP2004531061A5 publication Critical patent/JP2004531061A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/12—Ceramic
    • C09J2400/123—Ceramic in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2002586378A 2001-04-10 2002-04-10 複合体から電子部品を分割する方法 Pending JP2004531061A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10117880A DE10117880B4 (de) 2001-04-10 2001-04-10 Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund
PCT/EP2002/004001 WO2002089176A2 (de) 2001-04-10 2002-04-10 Verfahren zum vereinzeln von elektronischen bauteilen aus einem verbund

Publications (2)

Publication Number Publication Date
JP2004531061A true JP2004531061A (ja) 2004-10-07
JP2004531061A5 JP2004531061A5 (enExample) 2005-07-28

Family

ID=7681089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002586378A Pending JP2004531061A (ja) 2001-04-10 2002-04-10 複合体から電子部品を分割する方法

Country Status (5)

Country Link
US (1) US20050164472A1 (enExample)
EP (1) EP1419524A2 (enExample)
JP (1) JP2004531061A (enExample)
DE (1) DE10117880B4 (enExample)
WO (1) WO2002089176A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10323857A1 (de) 2003-05-26 2005-01-27 Osram Opto Semiconductors Gmbh Gehäuse für ein Laserdiodenbauelement, Laserdiodenbauelement und Verfahren zum Herstellen eines Laserdiodenbauelements
JP2005019571A (ja) * 2003-06-24 2005-01-20 Canon Inc チップの実装方法及び実装基板の製造装置
DE10334576B4 (de) * 2003-07-28 2007-04-05 Infineon Technologies Ag Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse
JP5514302B2 (ja) * 2009-05-06 2014-06-04 コーニング インコーポレイテッド ガラス基板用の担体
DE102009035099B4 (de) * 2009-07-29 2017-09-28 Asm Assembly Systems Gmbh & Co. Kg Vorrichtung und Verfahren zum Abheben von Bauteilen von einem Träger
EP2434528A1 (en) 2010-09-28 2012-03-28 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO An active carrier for carrying a wafer and method for release
DE102016001602A1 (de) 2016-02-11 2017-08-17 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Lösen auf einem Substral bereitgestellter elektronischer Bauteile mittels einer Strahlenquelle
DE102023109165B4 (de) 2023-04-12 2025-10-09 Infineon Technologies Ag Verfahren und Apparatur zum Lösen einer haftfähigen Basisstruktur zum Ablösen einer elektronischen Komponente

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2492164B1 (fr) * 1980-10-15 1987-01-23 Radiotechnique Compelec Procede de realisation simultanee de liaisons electriques multiples, notamment pour le raccordement electrique d'une micro-plaquette de semiconducteurs
JPS62267384A (ja) * 1986-05-15 1987-11-20 Sun A Chem Ind Co Ltd ダイシングテ−プ
JPS6351273A (ja) * 1986-08-19 1988-03-04 Mitsubishi Electric Corp 半導体基板の切り出し用テ−プ接着方法およびその装置
JPH067571B2 (ja) * 1988-07-28 1994-01-26 株式会社東芝 半導体チップの剥離装置
US4934582A (en) * 1989-09-20 1990-06-19 Microelectronics And Computer Technology Corporation Method and apparatus for removing solder mounted electronic components
JPH0492450A (ja) * 1990-08-08 1992-03-25 Sumitomo Electric Ind Ltd チップ状部品のピックアップ方法及びその装置
US5072874A (en) * 1991-01-31 1991-12-17 Microelectronics And Computer Technology Corporation Method and apparatus for using desoldering material
JPH04336448A (ja) * 1991-05-13 1992-11-24 Oki Electric Ind Co Ltd 半導体装置の製造方法
JP3217539B2 (ja) * 1993-04-30 2001-10-09 キヤノン株式会社 多色画像形成装置
DE19850873A1 (de) * 1998-11-05 2000-05-11 Philips Corp Intellectual Pty Verfahren zum Bearbeiten eines Erzeugnisses der Halbleitertechnik
DE19921230B4 (de) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten
DE19962763C2 (de) * 1999-07-01 2001-07-26 Fraunhofer Ges Forschung Verfahren zum Vereinzeln eines Wafers

Also Published As

Publication number Publication date
US20050164472A1 (en) 2005-07-28
WO2002089176A3 (de) 2004-03-11
DE10117880B4 (de) 2009-01-29
WO2002089176A2 (de) 2002-11-07
EP1419524A2 (de) 2004-05-19
DE10117880A1 (de) 2002-10-24

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