DE10117880B4 - Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund - Google Patents

Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund Download PDF

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Publication number
DE10117880B4
DE10117880B4 DE10117880A DE10117880A DE10117880B4 DE 10117880 B4 DE10117880 B4 DE 10117880B4 DE 10117880 A DE10117880 A DE 10117880A DE 10117880 A DE10117880 A DE 10117880A DE 10117880 B4 DE10117880 B4 DE 10117880B4
Authority
DE
Germany
Prior art keywords
adhesive
carrier
components
composite
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10117880A
Other languages
German (de)
English (en)
Other versions
DE10117880A1 (de
Inventor
Hans-Peter Dr. Monser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Muehlbauer GmbH and Co KG
Original Assignee
Muehlbauer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer GmbH and Co KG filed Critical Muehlbauer GmbH and Co KG
Priority to DE10117880A priority Critical patent/DE10117880B4/de
Priority to JP2002586378A priority patent/JP2004531061A/ja
Priority to EP02766624A priority patent/EP1419524A2/de
Priority to PCT/EP2002/004001 priority patent/WO2002089176A2/de
Priority to US10/474,644 priority patent/US20050164472A1/en
Publication of DE10117880A1 publication Critical patent/DE10117880A1/de
Application granted granted Critical
Publication of DE10117880B4 publication Critical patent/DE10117880B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/12—Ceramic
    • C09J2400/123—Ceramic in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
DE10117880A 2001-04-10 2001-04-10 Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund Expired - Fee Related DE10117880B4 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE10117880A DE10117880B4 (de) 2001-04-10 2001-04-10 Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund
JP2002586378A JP2004531061A (ja) 2001-04-10 2002-04-10 複合体から電子部品を分割する方法
EP02766624A EP1419524A2 (de) 2001-04-10 2002-04-10 Verfahren zum vereinzeln von elektronischen bauteilen aus einem verbund
PCT/EP2002/004001 WO2002089176A2 (de) 2001-04-10 2002-04-10 Verfahren zum vereinzeln von elektronischen bauteilen aus einem verbund
US10/474,644 US20050164472A1 (en) 2001-04-10 2002-04-10 Method for separating electronic components from a composite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10117880A DE10117880B4 (de) 2001-04-10 2001-04-10 Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund

Publications (2)

Publication Number Publication Date
DE10117880A1 DE10117880A1 (de) 2002-10-24
DE10117880B4 true DE10117880B4 (de) 2009-01-29

Family

ID=7681089

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10117880A Expired - Fee Related DE10117880B4 (de) 2001-04-10 2001-04-10 Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund

Country Status (5)

Country Link
US (1) US20050164472A1 (enExample)
EP (1) EP1419524A2 (enExample)
JP (1) JP2004531061A (enExample)
DE (1) DE10117880B4 (enExample)
WO (1) WO2002089176A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016001602A1 (de) 2016-02-11 2017-08-17 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Lösen auf einem Substral bereitgestellter elektronischer Bauteile mittels einer Strahlenquelle

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10323857A1 (de) 2003-05-26 2005-01-27 Osram Opto Semiconductors Gmbh Gehäuse für ein Laserdiodenbauelement, Laserdiodenbauelement und Verfahren zum Herstellen eines Laserdiodenbauelements
JP2005019571A (ja) * 2003-06-24 2005-01-20 Canon Inc チップの実装方法及び実装基板の製造装置
DE10334576B4 (de) * 2003-07-28 2007-04-05 Infineon Technologies Ag Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse
CN102422406B (zh) * 2009-05-06 2014-07-09 康宁股份有限公司 用于玻璃基片的支承件
DE102009035099B4 (de) * 2009-07-29 2017-09-28 Asm Assembly Systems Gmbh & Co. Kg Vorrichtung und Verfahren zum Abheben von Bauteilen von einem Träger
EP2434528A1 (en) 2010-09-28 2012-03-28 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO An active carrier for carrying a wafer and method for release
DE102023109165B4 (de) 2023-04-12 2025-10-09 Infineon Technologies Ag Verfahren und Apparatur zum Lösen einer haftfähigen Basisstruktur zum Ablösen einer elektronischen Komponente

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62267384A (ja) * 1986-05-15 1987-11-20 Sun A Chem Ind Co Ltd ダイシングテ−プ
JPH0239452A (ja) * 1988-07-28 1990-02-08 Toshiba Corp 半導体チップの剥離装置
JPH06317981A (ja) * 1993-04-30 1994-11-15 Canon Inc 多色画像形成装置
EP0999583A2 (de) * 1998-11-05 2000-05-10 Philips Corporate Intellectual Property GmbH Stabilisierung eines Substrats mittels Trägerelement
DE19921230A1 (de) * 1999-05-07 2000-11-09 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2492164B1 (fr) * 1980-10-15 1987-01-23 Radiotechnique Compelec Procede de realisation simultanee de liaisons electriques multiples, notamment pour le raccordement electrique d'une micro-plaquette de semiconducteurs
JPS6351273A (ja) * 1986-08-19 1988-03-04 Mitsubishi Electric Corp 半導体基板の切り出し用テ−プ接着方法およびその装置
US4934582A (en) * 1989-09-20 1990-06-19 Microelectronics And Computer Technology Corporation Method and apparatus for removing solder mounted electronic components
JPH0492450A (ja) * 1990-08-08 1992-03-25 Sumitomo Electric Ind Ltd チップ状部品のピックアップ方法及びその装置
US5072874A (en) * 1991-01-31 1991-12-17 Microelectronics And Computer Technology Corporation Method and apparatus for using desoldering material
JPH04336448A (ja) * 1991-05-13 1992-11-24 Oki Electric Ind Co Ltd 半導体装置の製造方法
DE19962763C2 (de) * 1999-07-01 2001-07-26 Fraunhofer Ges Forschung Verfahren zum Vereinzeln eines Wafers

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62267384A (ja) * 1986-05-15 1987-11-20 Sun A Chem Ind Co Ltd ダイシングテ−プ
JPH0239452A (ja) * 1988-07-28 1990-02-08 Toshiba Corp 半導体チップの剥離装置
JPH06317981A (ja) * 1993-04-30 1994-11-15 Canon Inc 多色画像形成装置
EP0999583A2 (de) * 1998-11-05 2000-05-10 Philips Corporate Intellectual Property GmbH Stabilisierung eines Substrats mittels Trägerelement
DE19921230A1 (de) * 1999-05-07 2000-11-09 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016001602A1 (de) 2016-02-11 2017-08-17 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Lösen auf einem Substral bereitgestellter elektronischer Bauteile mittels einer Strahlenquelle

Also Published As

Publication number Publication date
DE10117880A1 (de) 2002-10-24
WO2002089176A2 (de) 2002-11-07
US20050164472A1 (en) 2005-07-28
EP1419524A2 (de) 2004-05-19
JP2004531061A (ja) 2004-10-07
WO2002089176A3 (de) 2004-03-11

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20131101