Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
  • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
  • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
  • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
  • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
  • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2400/00—Presence of inorganic and organic materials
  • C09J2400/10—Presence of inorganic materials
  • C09J2400/12—Ceramic
  • C09J2400/123—Ceramic in the substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
  • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
  • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
  • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Definitions

• the invention relates to a method for separating electronic components from a composite, in particular chips from a wafer, in which the composite is first glued to a carrier and the components are separated from one another, after which the components are then used individually or in groups using a Vacuum pipette are detached from the carrier, the adhesive effect of the adhesive being selectively reduced, the adhesive reducing its adhesive effect in the corresponding area before or when the components are detached.
• wafers have been placed on a stretchable carrier film. These wafers are then cut into individual chips in a sawing process. This sawn wafer on carrier foil forms the input material for the so-called die-bond processes with a carrier frame.
• a needle the so-called die ejector, is first moved under the chip to be detached from the back, which removes the chip from the carrier film from below.
• the chip released in this way is taken over with a vacuum pipette and transferred to another substrate, where the chip is then subjected to further processes.
• a method is known in which, in addition to the above-mentioned features, the adhesive of the carrier material is weakened by the action of a heat source in order to improve the detachment of the chip.
• the object of the present invention is to provide a method with which it is possible to separate onto thinner chips, including chips that behave similarly to a film. These are in particular silicon chips with a thickness of less than 60 ⁇ m to a thickness of 10 ⁇ m.
• the method according to the invention provides that the carrier is designed as a rigid plate, preferably made of glass, glass ceramic or plastic, the Glue is deactivated in the corresponding area of the composite before the components are detached, the component being lifted off exclusively via the vacuum pipette.
• the advantage of this method is that vacuum pipettes can still be used for detaching, as in the previous methods, and that it is also possible in a simple manner to detach even thin chips which have high ductility and a film-like behavior, whereby no The ejector is used.
• the carrier can consist of a rigid plate, preferably made of glass, glass ceramic or plastic.
• the thermal conductivity of the carrier is better transversely to the carrier plane than in the carrier plane. Materials, in particular glass ceramics, which have these properties are well known; they are used for example in ceramic hobs.
• the adhesive is designed as a film. This ensures a uniform adhesive strength on the carrier.
• the carrier consists of a rigid plate, preferably made of glass, glass ceramic or plastic.
• the thermal conductivity of the carrier is better transversely to the carrier plane than in the carrier plane.
• Materials, in particular glass ceramics, which have these properties are well known; they are used for example in ceramic hobs.
• the adhesive is designed as a film. This ensures a uniform adhesive strength on the carrier.
• the selectively deactivated adhesive is heat-soluble. This makes it particularly easy to deactivate the adhesive in a specific area of the composite by applying specific heat in order to then detach the individual components. In the case of particularly thin components, the heat can be applied through the component to deactivate the adhesive.
• the heat to deactivate the adhesive can also be applied through the carrier. This option is useful, for example, if the components are somewhat thicker or sensitive to heat. A simple way of applying heat is to use hot air. However, the application of heat by heat radiation, for example infrared or laser radiation, is also advantageous.
• the electrical components are preferably silicon chips with a thickness of 10 ⁇ m to ⁇ O ⁇ m.
• FIG. 1 shows a plan view of a sawn wafer on a carrier plate
• FIG. 2 shows a sectional view through the carrier plate from FIG. 1 along the line II-II
• FIG. 3 shows an enlarged detailed view from FIG. 2 with a schematic representation of two heat sources and one vacuum pipette.
• a glass plate 1 as a carrier plate for an already sawn wafer 2, which consists of a multiplicity of chips 3 already separated from one another. It is a wafer or chip that has a thickness of less than 60 ⁇ m and a film-like behavior.
• the wafer 2 is glued to the glass plate 1 with the aid of an adhesive film 4.
• the adhesive film 4 consists of a heat-soluble adhesive, i.e. an adhesive that loses or greatly reduces its adhesive properties when heated.
• an adhesive film 4 is applied to the glass plate 1.
• the wafer 2 is then glued as a whole onto this adhesive film 4.
• the adhesive film can also be glued to the wafer 2, which is then glued to the glass plate with the adhesive film 4.
• the wafer 4 on the glass plate 1 is separated into the individual chips 3. This is done in a conventional manner by sawing.
• the adhesive film 4 is heated in the area of the wafer 2 from which the respective chip 3 is to be removed. 3 shows two different methods for this. In the left half 3, the underside of the glass plate 1 below the chip 3 to be removed is heated by means of a radiation source 5. In this area, the adhesive film 4 comes off, so that the chip can be removed upwards using a conventional vacuum pipette 6.
• FIG. 3 An alternative is shown in the right half of FIG. 3. There the heat is introduced from the top, this time with the aid of a hot air nozzle 7, which is placed above the chip 3 to be removed. The heat penetrates the chip 3 and dissolves the adhesive of the adhesive film 4 underneath. The hot air nozzle 7 then moves laterally and makes room for the vacuum pipette 6, which then receives the chip in a conventional manner.
• the chips removed with the vacuum pipette 6 can be processed further in a conventional manner, for example glued to another substrate or processed further in a subsequent die-bonding process.
• a large area of the carrier can also be heated so that the adhesive in the area of several chips is deactivated at the same time.

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Dicing (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (2)

Family

ID=7681089

Family Applications (1)

Country Status (5)

Families Citing this family (8)

Family Cites Families (12)

• 2001
  • 2001-04-10 DE DE10117880A patent/DE10117880B4/de not_active Expired - Fee Related
• 2002
  • 2002-04-10 EP EP02766624A patent/EP1419524A2/de not_active Withdrawn
  • 2002-04-10 WO PCT/EP2002/004001 patent/WO2002089176A2/de not_active Ceased
  • 2002-04-10 JP JP2002586378A patent/JP2004531061A/ja active Pending
  • 2002-04-10 US US10/474,644 patent/US20050164472A1/en not_active Abandoned

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