JP2004531061A5 - - Google Patents
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- Publication number
- JP2004531061A5 JP2004531061A5 JP2002586378A JP2002586378A JP2004531061A5 JP 2004531061 A5 JP2004531061 A5 JP 2004531061A5 JP 2002586378 A JP2002586378 A JP 2002586378A JP 2002586378 A JP2002586378 A JP 2002586378A JP 2004531061 A5 JP2004531061 A5 JP 2004531061A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- composite structure
- separating
- structure according
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims 12
- 238000000034 method Methods 0.000 claims 11
- 239000000853 adhesive Substances 0.000 claims 7
- 230000001070 adhesive effect Effects 0.000 claims 7
- 239000004831 Hot glue Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000002241 glass-ceramic Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10117880A DE10117880B4 (de) | 2001-04-10 | 2001-04-10 | Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund |
| PCT/EP2002/004001 WO2002089176A2 (de) | 2001-04-10 | 2002-04-10 | Verfahren zum vereinzeln von elektronischen bauteilen aus einem verbund |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004531061A JP2004531061A (ja) | 2004-10-07 |
| JP2004531061A5 true JP2004531061A5 (enExample) | 2005-07-28 |
Family
ID=7681089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002586378A Pending JP2004531061A (ja) | 2001-04-10 | 2002-04-10 | 複合体から電子部品を分割する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20050164472A1 (enExample) |
| EP (1) | EP1419524A2 (enExample) |
| JP (1) | JP2004531061A (enExample) |
| DE (1) | DE10117880B4 (enExample) |
| WO (1) | WO2002089176A2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10323857A1 (de) | 2003-05-26 | 2005-01-27 | Osram Opto Semiconductors Gmbh | Gehäuse für ein Laserdiodenbauelement, Laserdiodenbauelement und Verfahren zum Herstellen eines Laserdiodenbauelements |
| JP2005019571A (ja) * | 2003-06-24 | 2005-01-20 | Canon Inc | チップの実装方法及び実装基板の製造装置 |
| DE10334576B4 (de) * | 2003-07-28 | 2007-04-05 | Infineon Technologies Ag | Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse |
| CN102422406B (zh) * | 2009-05-06 | 2014-07-09 | 康宁股份有限公司 | 用于玻璃基片的支承件 |
| DE102009035099B4 (de) * | 2009-07-29 | 2017-09-28 | Asm Assembly Systems Gmbh & Co. Kg | Vorrichtung und Verfahren zum Abheben von Bauteilen von einem Träger |
| EP2434528A1 (en) | 2010-09-28 | 2012-03-28 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | An active carrier for carrying a wafer and method for release |
| DE102016001602A1 (de) | 2016-02-11 | 2017-08-17 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zum Lösen auf einem Substral bereitgestellter elektronischer Bauteile mittels einer Strahlenquelle |
| DE102023109165B4 (de) | 2023-04-12 | 2025-10-09 | Infineon Technologies Ag | Verfahren und Apparatur zum Lösen einer haftfähigen Basisstruktur zum Ablösen einer elektronischen Komponente |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2492164B1 (fr) * | 1980-10-15 | 1987-01-23 | Radiotechnique Compelec | Procede de realisation simultanee de liaisons electriques multiples, notamment pour le raccordement electrique d'une micro-plaquette de semiconducteurs |
| JPS62267384A (ja) * | 1986-05-15 | 1987-11-20 | Sun A Chem Ind Co Ltd | ダイシングテ−プ |
| JPS6351273A (ja) * | 1986-08-19 | 1988-03-04 | Mitsubishi Electric Corp | 半導体基板の切り出し用テ−プ接着方法およびその装置 |
| JPH067571B2 (ja) * | 1988-07-28 | 1994-01-26 | 株式会社東芝 | 半導体チップの剥離装置 |
| US4934582A (en) * | 1989-09-20 | 1990-06-19 | Microelectronics And Computer Technology Corporation | Method and apparatus for removing solder mounted electronic components |
| JPH0492450A (ja) * | 1990-08-08 | 1992-03-25 | Sumitomo Electric Ind Ltd | チップ状部品のピックアップ方法及びその装置 |
| US5072874A (en) * | 1991-01-31 | 1991-12-17 | Microelectronics And Computer Technology Corporation | Method and apparatus for using desoldering material |
| JPH04336448A (ja) * | 1991-05-13 | 1992-11-24 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
| JP3217539B2 (ja) * | 1993-04-30 | 2001-10-09 | キヤノン株式会社 | 多色画像形成装置 |
| DE19850873A1 (de) * | 1998-11-05 | 2000-05-11 | Philips Corp Intellectual Pty | Verfahren zum Bearbeiten eines Erzeugnisses der Halbleitertechnik |
| DE19921230B4 (de) * | 1999-05-07 | 2009-04-02 | Giesecke & Devrient Gmbh | Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten |
| DE19962763C2 (de) * | 1999-07-01 | 2001-07-26 | Fraunhofer Ges Forschung | Verfahren zum Vereinzeln eines Wafers |
-
2001
- 2001-04-10 DE DE10117880A patent/DE10117880B4/de not_active Expired - Fee Related
-
2002
- 2002-04-10 EP EP02766624A patent/EP1419524A2/de not_active Withdrawn
- 2002-04-10 WO PCT/EP2002/004001 patent/WO2002089176A2/de not_active Ceased
- 2002-04-10 JP JP2002586378A patent/JP2004531061A/ja active Pending
- 2002-04-10 US US10/474,644 patent/US20050164472A1/en not_active Abandoned
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