JP2009004609A5 - - Google Patents

Download PDF

Info

Publication number
JP2009004609A5
JP2009004609A5 JP2007164820A JP2007164820A JP2009004609A5 JP 2009004609 A5 JP2009004609 A5 JP 2009004609A5 JP 2007164820 A JP2007164820 A JP 2007164820A JP 2007164820 A JP2007164820 A JP 2007164820A JP 2009004609 A5 JP2009004609 A5 JP 2009004609A5
Authority
JP
Japan
Prior art keywords
chip
wiring board
integrated circuit
semiconductor integrated
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007164820A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009004609A (ja
JP4945339B2 (ja
Filing date
Publication date
Priority claimed from JP2007164820A external-priority patent/JP4945339B2/ja
Priority to JP2007164820A priority Critical patent/JP4945339B2/ja
Application filed filed Critical
Priority to TW097119567A priority patent/TWI463580B/zh
Priority to US12/137,522 priority patent/US7888141B2/en
Priority to KR1020080057449A priority patent/KR101473492B1/ko
Priority to CN2008101286068A priority patent/CN101335191B/zh
Priority to CN201210068756.0A priority patent/CN102623402B/zh
Publication of JP2009004609A publication Critical patent/JP2009004609A/ja
Publication of JP2009004609A5 publication Critical patent/JP2009004609A5/ja
Priority to US12/987,779 priority patent/US8003495B2/en
Priority to US13/208,171 priority patent/US8222050B2/en
Publication of JP4945339B2 publication Critical patent/JP4945339B2/ja
Application granted granted Critical
Priority to US13/533,963 priority patent/US8372665B2/en
Priority to US13/742,788 priority patent/US8492173B2/en
Priority to US13/941,507 priority patent/US20130299098A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007164820A 2007-06-19 2007-06-22 半導体集積回路装置の製造方法 Active JP4945339B2 (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
JP2007164820A JP4945339B2 (ja) 2007-06-22 2007-06-22 半導体集積回路装置の製造方法
TW097119567A TWI463580B (zh) 2007-06-19 2008-05-27 Manufacturing method of semiconductor integrated circuit device
US12/137,522 US7888141B2 (en) 2007-06-19 2008-06-11 Manufacturing method for semiconductor integrated device
KR1020080057449A KR101473492B1 (ko) 2007-06-19 2008-06-18 반도체 집적 회로 장치의 제조 방법
CN2008101286068A CN101335191B (zh) 2007-06-19 2008-06-19 半导体集成电路装置的制造方法
CN201210068756.0A CN102623402B (zh) 2007-06-19 2008-06-19 半导体集成电路装置的制造方法
US12/987,779 US8003495B2 (en) 2007-06-19 2011-01-10 Manufacturing method for semiconductor integrated device
US13/208,171 US8222050B2 (en) 2007-06-19 2011-08-11 Manufacturing method for semiconductor integrated device
US13/533,963 US8372665B2 (en) 2007-06-19 2012-06-26 Manufacturing method for semiconductor integrated device
US13/742,788 US8492173B2 (en) 2007-06-19 2013-01-16 Manufacturing method for semiconductor integrated device
US13/941,507 US20130299098A1 (en) 2007-06-19 2013-07-14 Manufacturing method for semiconductor integrated device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007164820A JP4945339B2 (ja) 2007-06-22 2007-06-22 半導体集積回路装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012047743A Division JP2012156517A (ja) 2012-03-05 2012-03-05 半導体集積回路装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009004609A JP2009004609A (ja) 2009-01-08
JP2009004609A5 true JP2009004609A5 (enExample) 2010-06-17
JP4945339B2 JP4945339B2 (ja) 2012-06-06

Family

ID=40320662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007164820A Active JP4945339B2 (ja) 2007-06-19 2007-06-22 半導体集積回路装置の製造方法

Country Status (1)

Country Link
JP (1) JP4945339B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5491748B2 (ja) * 2009-03-05 2014-05-14 株式会社東芝 半導体装置の製造装置および半導体装置の製造方法
JP5717910B1 (ja) * 2014-02-26 2015-05-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP6653273B2 (ja) * 2017-01-26 2020-02-26 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6967411B2 (ja) * 2017-09-19 2021-11-17 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット
EP3569370A1 (en) * 2018-05-18 2019-11-20 SUPSI (Scuola Universitaria Professionale Della Svizzera Italiana) Device for gripping and welding electronic components and associated actuating head, robot and method
KR102866416B1 (ko) 2020-12-08 2025-09-29 가부시키가이샤 신가와 반도체 다이의 픽업 장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0620092B2 (ja) * 1984-09-11 1994-03-16 ロ−ム株式会社 半導体ペレットのダイボンディング用チャック装置
JPH07273493A (ja) * 1994-03-30 1995-10-20 Hitachi Techno Eng Co Ltd 搭載機
JPH1145930A (ja) * 1997-07-24 1999-02-16 Toshiba Electron Eng Corp 吸着ヘッド
JP2005150311A (ja) * 2003-11-13 2005-06-09 Nec Machinery Corp チップマウント方法及び装置
JP4644481B2 (ja) * 2004-12-24 2011-03-02 Ｊｕｋｉ株式会社 電子部品圧着搭載装置

Similar Documents

Publication Publication Date Title
JP2010245412A5 (enExample)
JP2009004609A5 (enExample)
WO2012068762A1 (zh) Sip系统集成级ic芯片封装件及其制作方法
JP2012118060A5 (enExample)
WO2009050785A1 (ja) 粘着剤、粘着シート、多層粘着シート及び電子部品の製造方法
WO2009014087A1 (ja) 半導体装置の製造方法
EP2629326A3 (en) Substrate transport method and substrate transport apparatus
CN103745932B (zh) Wb型封装基板的制作方法
JP2005332982A5 (enExample)
CN109671657B (zh) 晶粒转移设备及使用该设备转移晶粒的方法
JP2002280330A (ja) チップ状部品のピックアップ方法
CN112117250A (zh) 芯片封装结构及其制作方法
KR100539271B1 (ko) 휨 방지 재질을 사용하는 반도체 칩의 다이 접착 방법
TWI393494B (zh) 具有線路的基板條及其製造方法
JP2004531061A5 (enExample)
TWI484546B (zh) 補償晶粒厚度之覆晶接合製程
JP5054954B2 (ja) 半導体装置の製造方法
JP3621908B2 (ja) ベアチップ実装方法および実装システム
JPWO2011007398A1 (ja) ピックアップ装置
JP2006278520A5 (enExample)
TW201015646A (en) Ball-mounting method
JP5814713B2 (ja) ダイボンダ及びダイボンディング方法
JP2008078492A5 (enExample)
KR20090120208A (ko) 다이 공급 장치 및 이를 사용한 다이 공급 방법
CN118053767A (zh) 半导体封装的晶片黏着胶层气泡排除方法