|
US8922021B2
(en)
|
2011-12-30 |
2014-12-30 |
Deca Technologies Inc. |
Die up fully molded fan-out wafer level packaging
|
|
US9576919B2
(en)
|
2011-12-30 |
2017-02-21 |
Deca Technologies Inc. |
Semiconductor device and method comprising redistribution layers
|
|
US10373870B2
(en)
|
2010-02-16 |
2019-08-06 |
Deca Technologies Inc. |
Semiconductor device and method of packaging
|
|
US9177926B2
(en)
|
2011-12-30 |
2015-11-03 |
Deca Technologies Inc |
Semiconductor device and method comprising thickened redistribution layers
|
|
DE102011012989B4
(de)
*
|
2011-03-03 |
2019-05-02 |
Ketek Gmbh |
Sensorkopf für einen Röntgendetektor
|
|
TW201320266A
(zh)
*
|
2011-11-11 |
2013-05-16 |
精材科技股份有限公司 |
半導體封裝件及其製法
|
|
US9831170B2
(en)
|
2011-12-30 |
2017-11-28 |
Deca Technologies, Inc. |
Fully molded miniaturized semiconductor module
|
|
US10672624B2
(en)
|
2011-12-30 |
2020-06-02 |
Deca Technologies Inc. |
Method of making fully molded peripheral package on package device
|
|
WO2013102146A1
(en)
|
2011-12-30 |
2013-07-04 |
Deca Technologies, Inc. |
Die up fully molded fan-out wafer level packaging
|
|
US10050004B2
(en)
|
2015-11-20 |
2018-08-14 |
Deca Technologies Inc. |
Fully molded peripheral package on package device
|
|
US9613830B2
(en)
|
2011-12-30 |
2017-04-04 |
Deca Technologies Inc. |
Fully molded peripheral package on package device
|
|
US20140005527A1
(en)
*
|
2012-06-29 |
2014-01-02 |
General Electric Company |
Method and system for dynamic referencing and registration used with surgical and interventional procedures
|
|
US9237648B2
(en)
|
2013-02-25 |
2016-01-12 |
Invensas Corporation |
Carrier-less silicon interposer
|
|
US9354186B2
(en)
*
|
2013-03-13 |
2016-05-31 |
Texas Instruments Incorporated |
X-ray sensor and signal processing assembly for an X-ray computed tomography machine
|
|
US10246322B2
(en)
*
|
2013-03-15 |
2019-04-02 |
Versana Micro Inc. |
Distributed sensor system
|
|
US20140321601A1
(en)
*
|
2013-04-26 |
2014-10-30 |
Texas Instruments Incorporated |
Active shield for x-ray computed tomography machine
|
|
JP5424371B1
(ja)
|
2013-05-08 |
2014-02-26 |
誠 雫石 |
固体撮像素子及び撮像装置
|
|
JP2014236183A
(ja)
*
|
2013-06-05 |
2014-12-15 |
株式会社東芝 |
イメージセンサ装置及びその製造方法
|
|
WO2015012866A1
(en)
*
|
2013-07-26 |
2015-01-29 |
Analogic Corporation |
Detector unit for detector array of radiation imaging modality
|
|
GB2516872A
(en)
|
2013-08-02 |
2015-02-11 |
Ibm |
A method for a logging process in a data storage system
|
|
JP6177663B2
(ja)
*
|
2013-10-30 |
2017-08-09 |
株式会社日立製作所 |
Ｘ線透過像撮像装置
|
|
EP2950345A1
(en)
*
|
2014-05-28 |
2015-12-02 |
ams AG |
Large-area image sensor module and method of producing a large-area image sensor
|
|
US10660612B2
(en)
|
2014-07-10 |
2020-05-26 |
Samsung Electronics Co., Ltd. |
Ultrasound probe and ultrasound imaging device
|
|
DE102014213734B4
(de)
*
|
2014-07-15 |
2021-01-21 |
Siemens Healthcare Gmbh |
Bildgebende Vorrichtung für elektromagnetische Strahlung
|
|
CN105765406B
(zh)
|
2014-09-26 |
2018-01-05 |
皇家飞利浦有限公司 |
具有加热设备的辐射探测器
|
|
CN106662661B
(zh)
*
|
2014-10-31 |
2019-06-25 |
皇家飞利浦有限公司 |
用于探测辐射信号的传感器设备和成像系统
|
|
US9360318B1
(en)
*
|
2014-12-23 |
2016-06-07 |
Compass Technology Company Limited |
Gyro MEMS sensor package
|
|
JP6693068B2
(ja)
*
|
2015-03-12 |
2020-05-13 |
ソニー株式会社 |
固体撮像装置および製造方法、並びに電子機器
|
|
SG11201707508PA
(en)
|
2015-04-07 |
2017-10-30 |
Shenzhen Xpectvision Tech Co Ltd |
Semiconductor x-ray detector
|
|
CN107533145B
(zh)
|
2015-04-07 |
2019-03-19 |
深圳帧观德芯科技有限公司 |
制作半导体x射线检测器的方法
|
|
US9437536B1
(en)
|
2015-05-08 |
2016-09-06 |
Invensas Corporation |
Reversed build-up substrate for 2.5D
|
|
CN107850678B
(zh)
*
|
2015-07-17 |
2021-05-18 |
模拟技术公司 |
用于辐射成像模态装置的探测器阵列的探测器单元
|
|
US9751108B2
(en)
*
|
2015-07-31 |
2017-09-05 |
Texas Instruments Incorporated |
Extended range ultrasound transducer
|
|
US10211160B2
(en)
*
|
2015-09-08 |
2019-02-19 |
Invensas Corporation |
Microelectronic assembly with redistribution structure formed on carrier
|
|
WO2017059573A1
(en)
*
|
2015-10-09 |
2017-04-13 |
Shenzhen Xpectvision Technology Co., Ltd. |
Packaging methods of semiconductor x-ray detectors
|
|
KR20170086886A
(ko)
*
|
2016-01-19 |
2017-07-27 |
삼성메디슨 주식회사 |
초음파 프로브 및 그 제조 방법
|
|
DE102016201808A1
(de)
*
|
2016-02-05 |
2017-08-10 |
Siemens Healthcare Gmbh |
Röntgendetektor
|
|
US11924573B2
(en)
*
|
2016-03-15 |
2024-03-05 |
Trustees Of Dartmouth College |
Stacked backside-illuminated quanta image sensor with cluster-parallel readout
|
|
AU2017281280B2
(en)
*
|
2016-06-20 |
2022-01-06 |
Butterfly Network, Inc. |
Electrical contact arrangement for microfabricated ultrasonic transducer
|
|
JP6712917B2
(ja)
*
|
2016-07-14 |
2020-06-24 |
株式会社日立製作所 |
半導体センサチップアレイ、および超音波診断装置
|
|
TWI800487B
(zh)
*
|
2016-09-09 |
2023-05-01 |
日商索尼半導體解決方案公司 |
固體攝像元件及製造方法、以及電子機器
|
|
DE102016221481B4
(de)
|
2016-11-02 |
2021-09-16 |
Siemens Healthcare Gmbh |
Strahlungsdetektor mit einer Zwischenschicht
|
|
JP2018078274A
(ja)
*
|
2016-11-10 |
2018-05-17 |
サムソン エレクトロ−メカニックス カンパニーリミテッド． |
イメージセンサー装置及びそれを含むイメージセンサーモジュール
|
|
MY191543A
(en)
*
|
2016-12-29 |
2022-06-30 |
Intel Corp |
Programmable redistribution die
|
|
WO2018133093A1
(en)
*
|
2017-01-23 |
2018-07-26 |
Shenzhen Xpectvision Technology Co., Ltd. |
Methods of making semiconductor x-ray detector
|
|
EP3355342A1
(en)
*
|
2017-01-27 |
2018-08-01 |
Detection Technology Oy |
Laser assisted solder bonding of direct conversion compound semiconductor detector
|
|
EP3376261B1
(de)
|
2017-03-15 |
2020-04-29 |
Siemens Healthcare GmbH |
Röntgendetektor aufweisend ein konverterelement mit umverdrahtungseinheit
|
|
WO2018175564A1
(en)
*
|
2017-03-21 |
2018-09-27 |
The Charles Stark Draper Laboratory, Inc. |
Neuromorphic digital focal plane array
|
|
DE102017206105A1
(de)
*
|
2017-04-10 |
2018-10-11 |
Robert Bosch Gmbh |
Verfahren zum Herstellen eines elektronischen Steuermoduls
|
|
JP6928746B2
(ja)
*
|
2017-04-10 |
2021-09-01 |
ブリルニクス シンガポール プライベート リミテッド |
固体撮像装置、固体撮像装置の製造方法、および電子機器
|
|
EP3444843B8
(en)
|
2017-08-14 |
2021-03-24 |
ams International AG |
Assembly for detecting electromagnetic radiation and method of producing an assembly for detecting electromagnetic radiation
|
|
DE102018200845B4
(de)
*
|
2018-01-19 |
2021-05-06 |
Siemens Healthcare Gmbh |
Montageverfahren für die Herstellung eines Röntgendetektors, Röntgendetektor und Röntgengerät
|
|
WO2019152340A1
(en)
*
|
2018-01-30 |
2019-08-08 |
Butterfly Network, Inc. |
Methods and apparatuses for packaging an ultrasound-on-a-chip
|
|
US11067707B2
(en)
*
|
2018-05-07 |
2021-07-20 |
Redlen Technologies, Inc. |
Four-side buttable radiation detector unit and method of making thereof
|
|
US10693020B2
(en)
*
|
2018-06-01 |
2020-06-23 |
Tt Electronics Plc |
Semiconductor device package and method for use thereof
|
|
EP3620826A1
(en)
*
|
2018-09-10 |
2020-03-11 |
Koninklijke Philips N.V. |
Multi-piece mono-layer radiation detector
|
|
US11062975B2
(en)
*
|
2018-09-27 |
2021-07-13 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Package structures
|
|
US11498096B2
(en)
*
|
2018-11-06 |
2022-11-15 |
Siemens Medical Solutions Usa, Inc. |
Chip-on-array with interposer for a multidimensional transducer array
|
|
EP3719841B1
(en)
*
|
2019-04-01 |
2022-02-16 |
Detection Technology Oy |
Radiation sensor element and method
|
|
US11056453B2
(en)
|
2019-06-18 |
2021-07-06 |
Deca Technologies Usa, Inc. |
Stackable fully molded semiconductor structure with vertical interconnects
|
|
CN114007510A
(zh)
|
2019-07-09 |
2022-02-01 |
雫石诚 |
医疗车辆、ct装置及驱动方法
|
|
JP2020008587A
(ja)
*
|
2019-08-01 |
2020-01-16 |
シェンゼン・エクスペクトビジョン・テクノロジー・カンパニー・リミテッド |
半導体ｘ線検出器の製造方法
|
|
US12109591B2
(en)
*
|
2019-09-09 |
2024-10-08 |
GE Precision Healthcare LLC |
Ultrasound transducer array architecture and method of manufacture
|
|
JP2023510931A
(ja)
*
|
2020-01-17 |
2023-03-15 |
ザ ユニヴァーシティ オブ ブリティッシュ コロンビア |
柔軟な静電容量型微細加工超音波振動子アレイ
|
|
WO2021148603A1
(en)
*
|
2020-01-22 |
2021-07-29 |
MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. |
A semiconductor photomultiplier module comprising a stacked configuration of a sensor chip and electronic readout chips
|
|
KR102736602B1
(ko)
*
|
2020-02-10 |
2024-12-02 |
삼성전자주식회사 |
반도체 패키지 및 반도체 패키지의 제조 방법
|
|
FR3112423A1
(fr)
*
|
2020-07-09 |
2022-01-14 |
Trixell |
Procédé de réalisation d’un imageur
|
|
CN114070235A
(zh)
*
|
2020-08-06 |
2022-02-18 |
联华电子股份有限公司 |
半导体模块及其制造方法
|
|
WO2022101313A1
(en)
*
|
2020-11-13 |
2022-05-19 |
Ams-Osram Ag |
Module assembly for detection of x-ray radiation
|
|
US12261186B2
(en)
*
|
2021-03-25 |
2025-03-25 |
Raytheon Company |
Mosaic focal plane array
|
|
US11728248B2
(en)
|
2021-07-01 |
2023-08-15 |
Deca Technologies Usa, Inc. |
Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects
|
|
WO2023101702A1
(en)
*
|
2021-12-01 |
2023-06-08 |
Siemens Medical Solutions Usa, Inc. |
Interposer for semiconductor-based single photon emission computed tomography detector
|
|
DE102022209402A1
(de)
*
|
2022-09-09 |
2024-03-14 |
Carl Zeiss Smt Gmbh |
Mikroelektromechanische Vorrichtung
|
|
WO2024161240A1
(en)
*
|
2023-02-01 |
2024-08-08 |
Darkvision Technologies Inc. |
Method and apparatus for packaging system circuity and a transducer array
|
|
JP2024126285A
(ja)
|
2023-03-07 |
2024-09-20 |
キヤノン株式会社 |
放射線検出装置
|