FR2968124A1 - Reseau de capteurs empilable - Google Patents

Reseau de capteurs empilable Download PDF

Info

Publication number
FR2968124A1
FR2968124A1 FR1160448A FR1160448A FR2968124A1 FR 2968124 A1 FR2968124 A1 FR 2968124A1 FR 1160448 A FR1160448 A FR 1160448A FR 1160448 A FR1160448 A FR 1160448A FR 2968124 A1 FR2968124 A1 FR 2968124A1
Authority
FR
France
Prior art keywords
face
sensor
contact pads
substrate
sensor array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR1160448A
Other languages
English (en)
French (fr)
Inventor
John Eric Tkaczyk
Lowell Scott Smith
Charles Edward Baumgartner
Robert Gideon Wodnicki
Rayette Ann Fisher
Charles Gerard Woychik
Robert Stephen Lewandowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2968124A1 publication Critical patent/FR2968124A1/fr
Pending legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Surgery (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Gynecology & Obstetrics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Physics & Mathematics (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Measurement Of Radiation (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Micromachines (AREA)
FR1160448A 2010-11-30 2011-11-16 Reseau de capteurs empilable Pending FR2968124A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/956,194 US8659148B2 (en) 2010-11-30 2010-11-30 Tileable sensor array

Publications (1)

Publication Number Publication Date
FR2968124A1 true FR2968124A1 (fr) 2012-06-01

Family

ID=46052454

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1160448A Pending FR2968124A1 (fr) 2010-11-30 2011-11-16 Reseau de capteurs empilable

Country Status (3)

Country Link
US (1) US8659148B2 (enExample)
JP (1) JP5955537B2 (enExample)
FR (1) FR2968124A1 (enExample)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8922021B2 (en) 2011-12-30 2014-12-30 Deca Technologies Inc. Die up fully molded fan-out wafer level packaging
US9576919B2 (en) 2011-12-30 2017-02-21 Deca Technologies Inc. Semiconductor device and method comprising redistribution layers
US10373870B2 (en) 2010-02-16 2019-08-06 Deca Technologies Inc. Semiconductor device and method of packaging
US9177926B2 (en) 2011-12-30 2015-11-03 Deca Technologies Inc Semiconductor device and method comprising thickened redistribution layers
DE102011012989B4 (de) * 2011-03-03 2019-05-02 Ketek Gmbh Sensorkopf für einen Röntgendetektor
TW201320266A (zh) * 2011-11-11 2013-05-16 精材科技股份有限公司 半導體封裝件及其製法
US9831170B2 (en) 2011-12-30 2017-11-28 Deca Technologies, Inc. Fully molded miniaturized semiconductor module
US10672624B2 (en) 2011-12-30 2020-06-02 Deca Technologies Inc. Method of making fully molded peripheral package on package device
WO2013102146A1 (en) 2011-12-30 2013-07-04 Deca Technologies, Inc. Die up fully molded fan-out wafer level packaging
US10050004B2 (en) 2015-11-20 2018-08-14 Deca Technologies Inc. Fully molded peripheral package on package device
US9613830B2 (en) 2011-12-30 2017-04-04 Deca Technologies Inc. Fully molded peripheral package on package device
US20140005527A1 (en) * 2012-06-29 2014-01-02 General Electric Company Method and system for dynamic referencing and registration used with surgical and interventional procedures
US9237648B2 (en) 2013-02-25 2016-01-12 Invensas Corporation Carrier-less silicon interposer
US9354186B2 (en) * 2013-03-13 2016-05-31 Texas Instruments Incorporated X-ray sensor and signal processing assembly for an X-ray computed tomography machine
US10246322B2 (en) * 2013-03-15 2019-04-02 Versana Micro Inc. Distributed sensor system
US20140321601A1 (en) * 2013-04-26 2014-10-30 Texas Instruments Incorporated Active shield for x-ray computed tomography machine
JP5424371B1 (ja) 2013-05-08 2014-02-26 誠 雫石 固体撮像素子及び撮像装置
JP2014236183A (ja) * 2013-06-05 2014-12-15 株式会社東芝 イメージセンサ装置及びその製造方法
WO2015012866A1 (en) * 2013-07-26 2015-01-29 Analogic Corporation Detector unit for detector array of radiation imaging modality
GB2516872A (en) 2013-08-02 2015-02-11 Ibm A method for a logging process in a data storage system
JP6177663B2 (ja) * 2013-10-30 2017-08-09 株式会社日立製作所 Ｘ線透過像撮像装置
EP2950345A1 (en) * 2014-05-28 2015-12-02 ams AG Large-area image sensor module and method of producing a large-area image sensor
US10660612B2 (en) 2014-07-10 2020-05-26 Samsung Electronics Co., Ltd. Ultrasound probe and ultrasound imaging device
DE102014213734B4 (de) * 2014-07-15 2021-01-21 Siemens Healthcare Gmbh Bildgebende Vorrichtung für elektromagnetische Strahlung
CN105765406B (zh) 2014-09-26 2018-01-05 皇家飞利浦有限公司 具有加热设备的辐射探测器
CN106662661B (zh) * 2014-10-31 2019-06-25 皇家飞利浦有限公司 用于探测辐射信号的传感器设备和成像系统
US9360318B1 (en) * 2014-12-23 2016-06-07 Compass Technology Company Limited Gyro MEMS sensor package
JP6693068B2 (ja) * 2015-03-12 2020-05-13 ソニー株式会社 固体撮像装置および製造方法、並びに電子機器
SG11201707508PA (en) 2015-04-07 2017-10-30 Shenzhen Xpectvision Tech Co Ltd Semiconductor x-ray detector
CN107533145B (zh) 2015-04-07 2019-03-19 深圳帧观德芯科技有限公司 制作半导体x射线检测器的方法
US9437536B1 (en) 2015-05-08 2016-09-06 Invensas Corporation Reversed build-up substrate for 2.5D
CN107850678B (zh) * 2015-07-17 2021-05-18 模拟技术公司 用于辐射成像模态装置的探测器阵列的探测器单元
US9751108B2 (en) * 2015-07-31 2017-09-05 Texas Instruments Incorporated Extended range ultrasound transducer
US10211160B2 (en) * 2015-09-08 2019-02-19 Invensas Corporation Microelectronic assembly with redistribution structure formed on carrier
WO2017059573A1 (en) * 2015-10-09 2017-04-13 Shenzhen Xpectvision Technology Co., Ltd. Packaging methods of semiconductor x-ray detectors
KR20170086886A (ko) * 2016-01-19 2017-07-27 삼성메디슨 주식회사 초음파 프로브 및 그 제조 방법
DE102016201808A1 (de) * 2016-02-05 2017-08-10 Siemens Healthcare Gmbh Röntgendetektor
US11924573B2 (en) * 2016-03-15 2024-03-05 Trustees Of Dartmouth College Stacked backside-illuminated quanta image sensor with cluster-parallel readout
AU2017281280B2 (en) * 2016-06-20 2022-01-06 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
JP6712917B2 (ja) * 2016-07-14 2020-06-24 株式会社日立製作所 半導体センサチップアレイ、および超音波診断装置
TWI800487B (zh) * 2016-09-09 2023-05-01 日商索尼半導體解決方案公司 固體攝像元件及製造方法、以及電子機器
DE102016221481B4 (de) 2016-11-02 2021-09-16 Siemens Healthcare Gmbh Strahlungsdetektor mit einer Zwischenschicht
JP2018078274A (ja) * 2016-11-10 2018-05-17 サムソン エレクトロ−メカニックス カンパニーリミテッド． イメージセンサー装置及びそれを含むイメージセンサーモジュール
MY191543A (en) * 2016-12-29 2022-06-30 Intel Corp Programmable redistribution die
WO2018133093A1 (en) * 2017-01-23 2018-07-26 Shenzhen Xpectvision Technology Co., Ltd. Methods of making semiconductor x-ray detector
EP3355342A1 (en) * 2017-01-27 2018-08-01 Detection Technology Oy Laser assisted solder bonding of direct conversion compound semiconductor detector
EP3376261B1 (de) 2017-03-15 2020-04-29 Siemens Healthcare GmbH Röntgendetektor aufweisend ein konverterelement mit umverdrahtungseinheit
WO2018175564A1 (en) * 2017-03-21 2018-09-27 The Charles Stark Draper Laboratory, Inc. Neuromorphic digital focal plane array
DE102017206105A1 (de) * 2017-04-10 2018-10-11 Robert Bosch Gmbh Verfahren zum Herstellen eines elektronischen Steuermoduls
JP6928746B2 (ja) * 2017-04-10 2021-09-01 ブリルニクス シンガポール プライベート リミテッド 固体撮像装置、固体撮像装置の製造方法、および電子機器
EP3444843B8 (en) 2017-08-14 2021-03-24 ams International AG Assembly for detecting electromagnetic radiation and method of producing an assembly for detecting electromagnetic radiation
DE102018200845B4 (de) * 2018-01-19 2021-05-06 Siemens Healthcare Gmbh Montageverfahren für die Herstellung eines Röntgendetektors, Röntgendetektor und Röntgengerät
WO2019152340A1 (en) * 2018-01-30 2019-08-08 Butterfly Network, Inc. Methods and apparatuses for packaging an ultrasound-on-a-chip
US11067707B2 (en) * 2018-05-07 2021-07-20 Redlen Technologies, Inc. Four-side buttable radiation detector unit and method of making thereof
US10693020B2 (en) * 2018-06-01 2020-06-23 Tt Electronics Plc Semiconductor device package and method for use thereof
EP3620826A1 (en) * 2018-09-10 2020-03-11 Koninklijke Philips N.V. Multi-piece mono-layer radiation detector
US11062975B2 (en) * 2018-09-27 2021-07-13 Taiwan Semiconductor Manufacturing Company, Ltd. Package structures
US11498096B2 (en) * 2018-11-06 2022-11-15 Siemens Medical Solutions Usa, Inc. Chip-on-array with interposer for a multidimensional transducer array
EP3719841B1 (en) * 2019-04-01 2022-02-16 Detection Technology Oy Radiation sensor element and method
US11056453B2 (en) 2019-06-18 2021-07-06 Deca Technologies Usa, Inc. Stackable fully molded semiconductor structure with vertical interconnects
CN114007510A (zh) 2019-07-09 2022-02-01 雫石诚 医疗车辆、ct装置及驱动方法
JP2020008587A (ja) * 2019-08-01 2020-01-16 シェンゼン・エクスペクトビジョン・テクノロジー・カンパニー・リミテッド 半導体ｘ線検出器の製造方法
US12109591B2 (en) * 2019-09-09 2024-10-08 GE Precision Healthcare LLC Ultrasound transducer array architecture and method of manufacture
JP2023510931A (ja) * 2020-01-17 2023-03-15 ザ ユニヴァーシティ オブ ブリティッシュ コロンビア 柔軟な静電容量型微細加工超音波振動子アレイ
WO2021148603A1 (en) * 2020-01-22 2021-07-29 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. A semiconductor photomultiplier module comprising a stacked configuration of a sensor chip and electronic readout chips
KR102736602B1 (ko) * 2020-02-10 2024-12-02 삼성전자주식회사 반도체 패키지 및 반도체 패키지의 제조 방법
FR3112423A1 (fr) * 2020-07-09 2022-01-14 Trixell Procédé de réalisation d’un imageur
CN114070235A (zh) * 2020-08-06 2022-02-18 联华电子股份有限公司 半导体模块及其制造方法
WO2022101313A1 (en) * 2020-11-13 2022-05-19 Ams-Osram Ag Module assembly for detection of x-ray radiation
US12261186B2 (en) * 2021-03-25 2025-03-25 Raytheon Company Mosaic focal plane array
US11728248B2 (en) 2021-07-01 2023-08-15 Deca Technologies Usa, Inc. Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects
WO2023101702A1 (en) * 2021-12-01 2023-06-08 Siemens Medical Solutions Usa, Inc. Interposer for semiconductor-based single photon emission computed tomography detector
DE102022209402A1 (de) * 2022-09-09 2024-03-14 Carl Zeiss Smt Gmbh Mikroelektromechanische Vorrichtung
WO2024161240A1 (en) * 2023-02-01 2024-08-08 Darkvision Technologies Inc. Method and apparatus for packaging system circuity and a transducer array
JP2024126285A (ja) 2023-03-07 2024-09-20 キヤノン株式会社 放射線検出装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5099128A (en) * 1989-03-17 1992-03-24 Roger Stettner High resolution position sensitive detector
JPH05207341A (ja) * 1992-01-30 1993-08-13 Sony Corp カメラの光学ブロック着脱装置
US7282382B2 (en) 2001-10-29 2007-10-16 Stmicroelectronics N.V. Method for producing a photodiode contact for a TFA image sensor
JP4237966B2 (ja) * 2002-03-08 2009-03-11 浜松ホトニクス株式会社 検出器
JP4364514B2 (ja) * 2003-01-08 2009-11-18 浜松ホトニクス株式会社 配線基板、及びそれを用いた放射線検出器
JP2005026419A (ja) * 2003-07-01 2005-01-27 Toshiba Corp 半導体放射線検出器及びこれを用いた画像診断装置
US20050098732A1 (en) 2003-11-10 2005-05-12 Ls Technologies, Inc. Flat-panel detector utilizing electrically interconnecting tiled photosensor arrays
US7289336B2 (en) 2004-10-28 2007-10-30 General Electric Company Electronic packaging and method of making the same
US20080068815A1 (en) 2006-09-18 2008-03-20 Oliver Richard Astley Interface Assembly And Method for Integrating A Data Acquisition System on a Sensor Array
JP5175853B2 (ja) 2006-09-25 2013-04-03 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ フリップチップ相互接続貫通チップビア
US7423335B2 (en) * 2006-12-29 2008-09-09 Advanced Chip Engineering Technology Inc. Sensor module package structure and method of the same
US7606346B2 (en) 2007-01-04 2009-10-20 General Electric Company CT detector module construction

Also Published As

Publication number Publication date
JP2012118060A (ja) 2012-06-21
US20120133001A1 (en) 2012-05-31
JP5955537B2 (ja) 2016-07-20
US8659148B2 (en) 2014-02-25

Similar Documents

Publication Publication Date Title
FR2968124A1 (fr) Reseau de capteurs empilable
FR2991127A1 (fr) Transducteur echographique et procede pour fabriquer un transducteur echographique
US7288069B2 (en) Ultrasonic probe and method of manufacturing the same
JP5675242B2 (ja) 大面積のモジュール式センサアレイ組立体および同組立体を作製する方法
FR2879023A1 (fr) Matrice de transducteurs pour grande surface
CN105044758B (zh) 光谱成像检测器
CN100486524C (zh) 计算机断层摄影检测器制造过程
JP5314008B2 (ja) 超音波探触子及びその製造方法並びに超音波診断装置
FR2911967A1 (fr) Systeme d'imagerie echographique.
FR2946785A1 (fr) Transducteur ultrasonore a performances acoustiques ameliorees
FR2917841A1 (fr) Systeme ultrasonore a structure d'interconnexion par traversees
FR2915809A1 (fr) Systeme de surveillance ou d'imagerie a structure d'interconnexion pour matrice de capteurs a grande surface
CN105764420B (zh) 精确自动对准的ct检测器传感器
JP2003235098A (ja) 超音波トランスジューサ及びその製造方法
CN101199434A (zh) 模块化传感器组件及其制造方法
JP2001318155A (ja) 放射線検出器、およびｘ線ｃｔ装置
JP2014513279A (ja) スペクトルイメージング検出器
JP2012198195A (ja) アノード入射面を有する検出器システム、およびその検出器システムを製造する方法
WO1997017145A1 (fr) Sonde acoustique et procede de realisation
JP2006140461A (ja) 電子装置パッケージ及びその製造方法
JP2007195164A (ja) トランスジューサアセンブリ用の相互接続構造
EP4454768B1 (fr) Dispositif de transduction ultrasonore a adressage ligne-colonne
JP2010046184A (ja) Ｘ線検出器
Erikson et al. A 128/spl times/128 ultrasonic transducer hybrid array
KR20170016948A (ko) 모듈식 이미징 검출기 asic

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 5

PLSC Publication of the preliminary search report

Effective date: 20160916

PLFP Fee payment

Year of fee payment: 6