JP5955537B2 - タイリング可能なセンサアレイ - Google Patents
タイリング可能なセンサアレイ Download PDFInfo
- Publication number
- JP5955537B2 JP5955537B2 JP2011252145A JP2011252145A JP5955537B2 JP 5955537 B2 JP5955537 B2 JP 5955537B2 JP 2011252145 A JP2011252145 A JP 2011252145A JP 2011252145 A JP2011252145 A JP 2011252145A JP 5955537 B2 JP5955537 B2 JP 5955537B2
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- array
- contact pads
- substrate
- sensor array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
-
- H10W90/724—
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Heart & Thoracic Surgery (AREA)
- Surgery (AREA)
- Biophysics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Gynecology & Obstetrics (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Physics & Mathematics (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Measurement Of Radiation (AREA)
- Light Receiving Elements (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/956,194 | 2010-11-30 | ||
| US12/956,194 US8659148B2 (en) | 2010-11-30 | 2010-11-30 | Tileable sensor array |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012118060A JP2012118060A (ja) | 2012-06-21 |
| JP2012118060A5 JP2012118060A5 (enExample) | 2014-12-25 |
| JP5955537B2 true JP5955537B2 (ja) | 2016-07-20 |
Family
ID=46052454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011252145A Active JP5955537B2 (ja) | 2010-11-30 | 2011-11-18 | タイリング可能なセンサアレイ |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8659148B2 (enExample) |
| JP (1) | JP5955537B2 (enExample) |
| FR (1) | FR2968124A1 (enExample) |
Families Citing this family (76)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8922021B2 (en) | 2011-12-30 | 2014-12-30 | Deca Technologies Inc. | Die up fully molded fan-out wafer level packaging |
| US9576919B2 (en) | 2011-12-30 | 2017-02-21 | Deca Technologies Inc. | Semiconductor device and method comprising redistribution layers |
| US9177926B2 (en) | 2011-12-30 | 2015-11-03 | Deca Technologies Inc | Semiconductor device and method comprising thickened redistribution layers |
| US10373870B2 (en) | 2010-02-16 | 2019-08-06 | Deca Technologies Inc. | Semiconductor device and method of packaging |
| DE102011012989B4 (de) * | 2011-03-03 | 2019-05-02 | Ketek Gmbh | Sensorkopf für einen Röntgendetektor |
| CN103101875A (zh) * | 2011-11-11 | 2013-05-15 | 精材科技股份有限公司 | 半导体封装件及其制法 |
| US10672624B2 (en) | 2011-12-30 | 2020-06-02 | Deca Technologies Inc. | Method of making fully molded peripheral package on package device |
| US9831170B2 (en) | 2011-12-30 | 2017-11-28 | Deca Technologies, Inc. | Fully molded miniaturized semiconductor module |
| US9613830B2 (en) | 2011-12-30 | 2017-04-04 | Deca Technologies Inc. | Fully molded peripheral package on package device |
| US10050004B2 (en) | 2015-11-20 | 2018-08-14 | Deca Technologies Inc. | Fully molded peripheral package on package device |
| WO2013102146A1 (en) | 2011-12-30 | 2013-07-04 | Deca Technologies, Inc. | Die up fully molded fan-out wafer level packaging |
| US20140005527A1 (en) * | 2012-06-29 | 2014-01-02 | General Electric Company | Method and system for dynamic referencing and registration used with surgical and interventional procedures |
| US9237648B2 (en) | 2013-02-25 | 2016-01-12 | Invensas Corporation | Carrier-less silicon interposer |
| US9354186B2 (en) * | 2013-03-13 | 2016-05-31 | Texas Instruments Incorporated | X-ray sensor and signal processing assembly for an X-ray computed tomography machine |
| US9862594B2 (en) * | 2013-03-15 | 2018-01-09 | Versana Micro Inc. | Wearable device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor |
| US20140321601A1 (en) * | 2013-04-26 | 2014-10-30 | Texas Instruments Incorporated | Active shield for x-ray computed tomography machine |
| JP5424371B1 (ja) | 2013-05-08 | 2014-02-26 | 誠 雫石 | 固体撮像素子及び撮像装置 |
| JP2014236183A (ja) * | 2013-06-05 | 2014-12-15 | 株式会社東芝 | イメージセンサ装置及びその製造方法 |
| CN105556673B (zh) | 2013-07-26 | 2018-11-30 | 模拟技术公司 | 用于辐射成像模式的探测器阵列的探测器单元 |
| GB2516872A (en) | 2013-08-02 | 2015-02-11 | Ibm | A method for a logging process in a data storage system |
| JP6177663B2 (ja) * | 2013-10-30 | 2017-08-09 | 株式会社日立製作所 | X線透過像撮像装置 |
| EP2950345A1 (en) * | 2014-05-28 | 2015-12-02 | ams AG | Large-area image sensor module and method of producing a large-area image sensor |
| US10660612B2 (en) | 2014-07-10 | 2020-05-26 | Samsung Electronics Co., Ltd. | Ultrasound probe and ultrasound imaging device |
| DE102014213734B4 (de) * | 2014-07-15 | 2021-01-21 | Siemens Healthcare Gmbh | Bildgebende Vorrichtung für elektromagnetische Strahlung |
| CN105765406B (zh) | 2014-09-26 | 2018-01-05 | 皇家飞利浦有限公司 | 具有加热设备的辐射探测器 |
| CN106662661B (zh) * | 2014-10-31 | 2019-06-25 | 皇家飞利浦有限公司 | 用于探测辐射信号的传感器设备和成像系统 |
| US9360318B1 (en) * | 2014-12-23 | 2016-06-07 | Compass Technology Company Limited | Gyro MEMS sensor package |
| JP6693068B2 (ja) * | 2015-03-12 | 2020-05-13 | ソニー株式会社 | 固体撮像装置および製造方法、並びに電子機器 |
| US9915741B2 (en) * | 2015-04-07 | 2018-03-13 | Shenzhen Xpectvision Technology Co., Ltd. | Method of making semiconductor X-ray detectors |
| US10007009B2 (en) | 2015-04-07 | 2018-06-26 | Shenzhen Xpectvision Technology Co., Ltd. | Semiconductor X-ray detector |
| US9437536B1 (en) | 2015-05-08 | 2016-09-06 | Invensas Corporation | Reversed build-up substrate for 2.5D |
| CN107850678B (zh) * | 2015-07-17 | 2021-05-18 | 模拟技术公司 | 用于辐射成像模态装置的探测器阵列的探测器单元 |
| US9751108B2 (en) * | 2015-07-31 | 2017-09-05 | Texas Instruments Incorporated | Extended range ultrasound transducer |
| US10211160B2 (en) * | 2015-09-08 | 2019-02-19 | Invensas Corporation | Microelectronic assembly with redistribution structure formed on carrier |
| EP3359981B1 (en) * | 2015-10-09 | 2021-05-26 | Shenzhen Xpectvision Technology Co., Ltd. | Packaging methods of semiconductor x-ray detectors |
| KR20170086886A (ko) * | 2016-01-19 | 2017-07-27 | 삼성메디슨 주식회사 | 초음파 프로브 및 그 제조 방법 |
| DE102016201808A1 (de) * | 2016-02-05 | 2017-08-10 | Siemens Healthcare Gmbh | Röntgendetektor |
| WO2017161060A1 (en) * | 2016-03-15 | 2017-09-21 | Dartmouth College | Stacked backside-illuminated quanta image sensor with cluster-parallel readout |
| KR20190022644A (ko) | 2016-06-20 | 2019-03-06 | 버터플라이 네트워크, 인크. | 미세제작된 초음파 트랜스듀서를 위한 전기 접촉부 배열 |
| JP6712917B2 (ja) * | 2016-07-14 | 2020-06-24 | 株式会社日立製作所 | 半導体センサチップアレイ、および超音波診断装置 |
| TWI800487B (zh) * | 2016-09-09 | 2023-05-01 | 日商索尼半導體解決方案公司 | 固體攝像元件及製造方法、以及電子機器 |
| DE102016221481B4 (de) | 2016-11-02 | 2021-09-16 | Siemens Healthcare Gmbh | Strahlungsdetektor mit einer Zwischenschicht |
| JP2018078274A (ja) | 2016-11-10 | 2018-05-17 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | イメージセンサー装置及びそれを含むイメージセンサーモジュール |
| MY191543A (en) * | 2016-12-29 | 2022-06-30 | Intel Corp | Programmable redistribution die |
| CN110291423A (zh) * | 2017-01-23 | 2019-09-27 | 深圳帧观德芯科技有限公司 | 制作半导体x射线检测器的方法 |
| EP3355342A1 (en) * | 2017-01-27 | 2018-08-01 | Detection Technology Oy | Laser assisted solder bonding of direct conversion compound semiconductor detector |
| EP3376261B1 (de) * | 2017-03-15 | 2020-04-29 | Siemens Healthcare GmbH | Röntgendetektor aufweisend ein konverterelement mit umverdrahtungseinheit |
| WO2018175564A1 (en) * | 2017-03-21 | 2018-09-27 | The Charles Stark Draper Laboratory, Inc. | Neuromorphic digital focal plane array |
| DE102017206105A1 (de) * | 2017-04-10 | 2018-10-11 | Robert Bosch Gmbh | Verfahren zum Herstellen eines elektronischen Steuermoduls |
| JP6928746B2 (ja) * | 2017-04-10 | 2021-09-01 | ブリルニクス シンガポール プライベート リミテッド | 固体撮像装置、固体撮像装置の製造方法、および電子機器 |
| EP3444843B8 (en) * | 2017-08-14 | 2021-03-24 | ams International AG | Assembly for detecting electromagnetic radiation and method of producing an assembly for detecting electromagnetic radiation |
| KR20200088380A (ko) * | 2017-11-15 | 2020-07-22 | 버터플라이 네트워크, 인크. | 초음파 장치들 및 초음파 디바이스들을 제조하기 위한 방법들 |
| DE102018200845B4 (de) * | 2018-01-19 | 2021-05-06 | Siemens Healthcare Gmbh | Montageverfahren für die Herstellung eines Röntgendetektors, Röntgendetektor und Röntgengerät |
| EP3745961B1 (en) * | 2018-01-30 | 2025-10-01 | BFLY Operations, Inc. | Methods and apparatuses for packaging an ultrasound-on-a-chip |
| US11067707B2 (en) * | 2018-05-07 | 2021-07-20 | Redlen Technologies, Inc. | Four-side buttable radiation detector unit and method of making thereof |
| US10693020B2 (en) * | 2018-06-01 | 2020-06-23 | Tt Electronics Plc | Semiconductor device package and method for use thereof |
| EP3620826A1 (en) * | 2018-09-10 | 2020-03-11 | Koninklijke Philips N.V. | Multi-piece mono-layer radiation detector |
| US11062975B2 (en) * | 2018-09-27 | 2021-07-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structures |
| US11498096B2 (en) * | 2018-11-06 | 2022-11-15 | Siemens Medical Solutions Usa, Inc. | Chip-on-array with interposer for a multidimensional transducer array |
| EP3719841B1 (en) * | 2019-04-01 | 2022-02-16 | Detection Technology Oy | Radiation sensor element and method |
| US11056453B2 (en) | 2019-06-18 | 2021-07-06 | Deca Technologies Usa, Inc. | Stackable fully molded semiconductor structure with vertical interconnects |
| WO2021006294A1 (ja) | 2019-07-09 | 2021-01-14 | 雫石 誠 | 医療車両、ct装置、及び駆動方法 |
| JP2020008587A (ja) * | 2019-08-01 | 2020-01-16 | シェンゼン・エクスペクトビジョン・テクノロジー・カンパニー・リミテッド | 半導体x線検出器の製造方法 |
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| WO2021142554A1 (en) * | 2020-01-17 | 2021-07-22 | The University Of British Columbia | Flexible capacitive micromachined ultrasonic transducer arrays |
| WO2021148603A1 (en) * | 2020-01-22 | 2021-07-29 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | A semiconductor photomultiplier module comprising a stacked configuration of a sensor chip and electronic readout chips |
| KR102736602B1 (ko) * | 2020-02-10 | 2024-12-02 | 삼성전자주식회사 | 반도체 패키지 및 반도체 패키지의 제조 방법 |
| FR3112423A1 (fr) * | 2020-07-09 | 2022-01-14 | Trixell | Procédé de réalisation d’un imageur |
| CN114070235A (zh) * | 2020-08-06 | 2022-02-18 | 联华电子股份有限公司 | 半导体模块及其制造方法 |
| JP7500876B2 (ja) * | 2020-11-13 | 2024-06-17 | エイエムエス-オスラム アーゲー | X線放射の検出のためのモジュールアセンブリ |
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| US11728248B2 (en) | 2021-07-01 | 2023-08-15 | Deca Technologies Usa, Inc. | Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects |
| JP7735568B2 (ja) * | 2021-12-01 | 2025-09-08 | シーメンス メディカル ソリューションズ ユーエスエー インコーポレイテッド | 半導体ベースの単一光子放出計算断層撮影検出器のためのインタポーザ |
| DE102022209402A1 (de) * | 2022-09-09 | 2024-03-14 | Carl Zeiss Smt Gmbh | Mikroelektromechanische Vorrichtung |
| EP4658980A1 (en) * | 2023-02-01 | 2025-12-10 | Darkvision Technologies Inc. | Method and apparatus for packaging system circuity and a transducer array |
| JP2024126285A (ja) | 2023-03-07 | 2024-09-20 | キヤノン株式会社 | 放射線検出装置 |
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| US5099128A (en) * | 1989-03-17 | 1992-03-24 | Roger Stettner | High resolution position sensitive detector |
| JPH05207341A (ja) * | 1992-01-30 | 1993-08-13 | Sony Corp | カメラの光学ブロック着脱装置 |
| US7282382B2 (en) | 2001-10-29 | 2007-10-16 | Stmicroelectronics N.V. | Method for producing a photodiode contact for a TFA image sensor |
| JP4237966B2 (ja) * | 2002-03-08 | 2009-03-11 | 浜松ホトニクス株式会社 | 検出器 |
| JP4364514B2 (ja) * | 2003-01-08 | 2009-11-18 | 浜松ホトニクス株式会社 | 配線基板、及びそれを用いた放射線検出器 |
| JP2005026419A (ja) * | 2003-07-01 | 2005-01-27 | Toshiba Corp | 半導体放射線検出器及びこれを用いた画像診断装置 |
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| US7289336B2 (en) | 2004-10-28 | 2007-10-30 | General Electric Company | Electronic packaging and method of making the same |
| US20080068815A1 (en) | 2006-09-18 | 2008-03-20 | Oliver Richard Astley | Interface Assembly And Method for Integrating A Data Acquisition System on a Sensor Array |
| JP5175853B2 (ja) | 2006-09-25 | 2013-04-03 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | フリップチップ相互接続貫通チップビア |
| US7423335B2 (en) * | 2006-12-29 | 2008-09-09 | Advanced Chip Engineering Technology Inc. | Sensor module package structure and method of the same |
| US7606346B2 (en) | 2007-01-04 | 2009-10-20 | General Electric Company | CT detector module construction |
-
2010
- 2010-11-30 US US12/956,194 patent/US8659148B2/en active Active
-
2011
- 2011-11-16 FR FR1160448A patent/FR2968124A1/fr active Pending
- 2011-11-18 JP JP2011252145A patent/JP5955537B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20120133001A1 (en) | 2012-05-31 |
| US8659148B2 (en) | 2014-02-25 |
| FR2968124A1 (fr) | 2012-06-01 |
| JP2012118060A (ja) | 2012-06-21 |
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