JP2011078755A5 - - Google Patents

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Publication number
JP2011078755A5
JP2011078755A5 JP2010208824A JP2010208824A JP2011078755A5 JP 2011078755 A5 JP2011078755 A5 JP 2011078755A5 JP 2010208824 A JP2010208824 A JP 2010208824A JP 2010208824 A JP2010208824 A JP 2010208824A JP 2011078755 A5 JP2011078755 A5 JP 2011078755A5
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interposer
input
integrated circuit
transducer
module
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JP5675242B2 (ja
JP2011078755A (ja
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JP2010208824A 2009-09-20 2010-09-17 大面積のモジュール式センサアレイ組立体および同組立体を作製する方法 Active JP5675242B2 (ja)

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Application Number Priority Date Filing Date Title
US24406909P 2009-09-20 2009-09-20
US61/244,069 2009-09-20
US12/714,239 2010-02-26
US12/714,239 US8345508B2 (en) 2009-09-20 2010-02-26 Large area modular sensor array assembly and method for making the same

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JP2011078755A JP2011078755A (ja) 2011-04-21
JP2011078755A5 true JP2011078755A5 (enExample) 2013-10-24
JP5675242B2 JP5675242B2 (ja) 2015-02-25

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JP2010208824A Active JP5675242B2 (ja) 2009-09-20 2010-09-17 大面積のモジュール式センサアレイ組立体および同組立体を作製する方法

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US (1) US8345508B2 (enExample)
JP (1) JP5675242B2 (enExample)
KR (1) KR20110031406A (enExample)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8345508B2 (en) * 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
US8830689B2 (en) * 2010-09-16 2014-09-09 Samsung Electro-Mechanics Co., Ltd. Interposer-embedded printed circuit board
KR101761817B1 (ko) * 2011-03-04 2017-07-26 삼성전자주식회사 대면적 엑스선 검출기
US8622752B2 (en) * 2011-04-13 2014-01-07 Teradyne, Inc. Probe-card interposer constructed using hexagonal modules
KR101460692B1 (ko) * 2011-06-09 2014-11-13 삼성전자주식회사 2차원 트랜스듀서-어레이를 구동시키는 장치, 의료영상시스템 및 2차원 트랜스듀서-어레이를 구동시키는 방법
US8659212B2 (en) * 2012-02-16 2014-02-25 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
KR101387225B1 (ko) * 2012-02-24 2014-04-21 경북대학교 산학협력단 2ｄ 배열형 초음파 프로브의 소형화 기술
KR101378012B1 (ko) 2012-03-14 2014-03-24 삼성전자주식회사 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법
US8742646B2 (en) 2012-03-29 2014-06-03 General Electric Company Ultrasound acoustic assemblies and methods of manufacture
JP6102075B2 (ja) * 2012-03-30 2017-03-29 セイコーエプソン株式会社 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置
KR101383298B1 (ko) 2012-04-25 2014-04-09 삼성전자주식회사 초음파 프로브 장치 및 초음파 프로브 장치의 제조 방법
US9180490B2 (en) * 2012-05-22 2015-11-10 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
KR101931358B1 (ko) 2012-06-25 2018-12-31 삼성전자주식회사 지그 및 그 제작방법과 지그를 이용한 초음파 프로브용 칩의 플립 칩 본딩방법
KR101984695B1 (ko) 2012-08-29 2019-09-03 삼성전자주식회사 그래핀 소자 및 그 제조방법
US9136293B2 (en) * 2012-09-07 2015-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for sensor module
KR20140033992A (ko) * 2012-09-11 2014-03-19 삼성전자주식회사 초음파 변환기
KR101919013B1 (ko) * 2012-09-13 2019-02-08 삼성전자주식회사 미세가공 초음파 변환기 어레이
EP2938440B1 (en) * 2012-12-28 2020-12-02 Koninklijke Philips N.V. Acoustic probe with components of acoustic elements having different pitches than each other
US10058891B2 (en) * 2013-02-05 2018-08-28 Sound Technology Inc. Ultrasound device
WO2014123922A1 (en) 2013-02-05 2014-08-14 Butterfly Network, Inc. Cmos ultrasonic transducers and related apparatus and methods
US9351081B2 (en) 2013-02-27 2016-05-24 Texas Instruments Incorporated Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug
US9470710B2 (en) 2013-02-27 2016-10-18 Texas Instruments Incorporated Capacitive MEMS sensor devices
CN105307975B (zh) 2013-03-15 2017-04-26 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)超声换能器及其形成方法
KR20220097541A (ko) 2013-03-15 2022-07-07 버터플라이 네트워크, 인크. 모놀리식 초음파 이미징 디바이스, 시스템 및 방법
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
TWI682817B (zh) * 2013-07-23 2020-01-21 美商蝴蝶網路公司 可互連的超音波換能器探頭以及相關的方法和設備
WO2015028311A1 (en) 2013-08-26 2015-03-05 Koninklijke Philips N.V. Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly
US20150087988A1 (en) * 2013-09-20 2015-03-26 General Electric Company Ultrasound transducer arrays
CN105849890B (zh) * 2013-11-15 2019-04-02 皇家飞利浦有限公司 集成电路阵列和用于制造集成电路阵列的方法
KR102392966B1 (ko) 2014-04-18 2022-05-02 버터플라이 네트워크, 인크. 초음파 촬영 압축 방법 및 장치
TWI687710B (zh) * 2014-04-18 2020-03-11 美商蝴蝶網路公司 單基板超音波成像裝置的架構、相關設備及方法
WO2015161147A1 (en) 2014-04-18 2015-10-22 Butterfly Network, Inc. Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods
CN105023877B (zh) * 2014-04-28 2019-12-24 联华电子股份有限公司 半导体晶片、封装结构与其制作方法
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
JP6528376B2 (ja) * 2014-08-27 2019-06-12 富士通株式会社 撮像装置及びその製造方法
US9613246B1 (en) * 2014-09-16 2017-04-04 Apple Inc. Multiple scan element array ultrasonic biometric scanner
US9952095B1 (en) 2014-09-29 2018-04-24 Apple Inc. Methods and systems for modulation and demodulation of optical signals
US9747488B2 (en) 2014-09-30 2017-08-29 Apple Inc. Active sensing element for acoustic imaging systems
US9904836B2 (en) 2014-09-30 2018-02-27 Apple Inc. Reducing edge effects within segmented acoustic imaging systems
US9984271B1 (en) 2014-09-30 2018-05-29 Apple Inc. Ultrasonic fingerprint sensor in display bezel
US10133904B2 (en) 2014-09-30 2018-11-20 Apple Inc. Fully-addressable sensor array for acoustic imaging systems
US9607203B1 (en) 2014-09-30 2017-03-28 Apple Inc. Biometric sensing device with discrete ultrasonic transducers
US9979955B1 (en) 2014-09-30 2018-05-22 Apple Inc. Calibration methods for near-field acoustic imaging systems
US9824254B1 (en) 2014-09-30 2017-11-21 Apple Inc. Biometric sensing device with discrete ultrasonic transducers
JP6759209B2 (ja) * 2014-12-15 2020-09-23 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 直接同軸取付けを備えるコンパクトな超音波変換器
US10695034B2 (en) 2015-05-15 2020-06-30 Butterfly Network, Inc. Autonomous ultrasound probe and related apparatus and methods
JP6608185B2 (ja) * 2015-06-18 2019-11-20 キヤノン株式会社 積層型イメージセンサおよび撮像装置
US11048902B2 (en) 2015-08-20 2021-06-29 Appple Inc. Acoustic imaging system architecture
EP3144074B1 (en) * 2015-09-16 2020-03-11 Samsung Medison Co., Ltd. Ultrasonic probe, ultrasonic imaging apparatus including the same, and method for controlling the ultrasonic imaging apparatus
US10275638B1 (en) 2015-09-29 2019-04-30 Apple Inc. Methods of biometric imaging of input surfaces
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
US10497856B2 (en) 2016-06-20 2019-12-03 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
US11712221B2 (en) 2016-06-20 2023-08-01 Bfly Operations, Inc. Universal ultrasound device and related apparatus and methods
US10856840B2 (en) 2016-06-20 2020-12-08 Butterfly Network, Inc. Universal ultrasound device and related apparatus and methods
GB201617255D0 (en) * 2016-10-11 2016-11-23 Oxford University Innovation Limited Modular ultrasound apparatus and methods
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US11446003B2 (en) 2017-03-27 2022-09-20 Vave Health, Inc. High performance handheld ultrasound
US10856843B2 (en) 2017-03-23 2020-12-08 Vave Health, Inc. Flag table based beamforming in a handheld ultrasound device
US10469846B2 (en) 2017-03-27 2019-11-05 Vave Health, Inc. Dynamic range compression of ultrasound images
US11531096B2 (en) 2017-03-23 2022-12-20 Vave Health, Inc. High performance handheld ultrasound
WO2018236956A1 (en) 2017-06-21 2018-12-27 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
US20190069880A1 (en) * 2017-09-04 2019-03-07 Canon Medical Systems Corporation Ultrasound probe and ultrasound probe manufacturing method
JP7168662B2 (ja) 2017-10-31 2022-11-09 コーニンクレッカ フィリップス エヌ ヴェ 超音波スキャナアセンブリ
US10802651B2 (en) 2018-01-30 2020-10-13 Apple Inc. Ultrasonic touch detection through display
JP7187165B2 (ja) * 2018-04-18 2022-12-12 キヤノンメディカルシステムズ株式会社 超音波プローブ及び超音波診断装置
US11498096B2 (en) 2018-11-06 2022-11-15 Siemens Medical Solutions Usa, Inc. Chip-on-array with interposer for a multidimensional transducer array
IL297106B2 (en) 2019-03-25 2024-01-01 Exo Imaging Inc Handheld ultrasound imager
US12109591B2 (en) 2019-09-09 2024-10-08 GE Precision Healthcare LLC Ultrasound transducer array architecture and method of manufacture
US11950512B2 (en) 2020-03-23 2024-04-02 Apple Inc. Thin-film acoustic imaging system for imaging through an exterior surface of an electronic device housing
US11656355B2 (en) 2020-07-15 2023-05-23 Siemens Medical Solutions Usa, Inc. Direct chip-on-array for a multidimensional transducer array
JP2022077181A (ja) * 2020-11-11 2022-05-23 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置及び電子機器
US12159850B2 (en) 2020-12-25 2024-12-03 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
CN112908873A (zh) * 2021-01-18 2021-06-04 上海易卜半导体有限公司 半导体组件组装方法、半导体组件和电子设备
US12154884B2 (en) 2021-02-01 2024-11-26 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
US12500203B2 (en) 2021-02-22 2025-12-16 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
US12000967B2 (en) 2021-03-31 2024-06-04 Apple Inc. Regional gain control for segmented thin-film acoustic imaging systems
US12039800B2 (en) 2021-03-31 2024-07-16 Apple Inc. Signal processing for segmented thin-film acoustic imaging systems for portable electronic devices
US20240377544A1 (en) * 2023-05-09 2024-11-14 Redlen Technologies, Inc. Direct attach radiation detector structures including pixelated sensors and read-out circuitry having varying pitch

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05123317A (ja) * 1991-11-08 1993-05-21 Toshiba Corp ２次元アレイ超音波プローブ
DE4494829B4 (de) * 1993-07-08 2008-07-10 Siemens Ag Ultraschallabbildungssystem mit einer reduzierten Anzahl von Leitungen zwischen Hauptgerät und Applikator
US5527741A (en) * 1994-10-11 1996-06-18 Martin Marietta Corporation Fabrication and structures of circuit modules with flexible interconnect layers
US7500952B1 (en) * 1995-06-29 2009-03-10 Teratech Corporation Portable ultrasound imaging system
JPH09238924A (ja) * 1996-03-12 1997-09-16 Toshiba Corp 処置具及びこの処置具を備えた医用複合診断システム
US5732706A (en) * 1996-03-22 1998-03-31 Lockheed Martin Ir Imaging Systems, Inc. Ultrasonic array with attenuating electrical interconnects
US6541896B1 (en) * 1997-12-29 2003-04-01 General Electric Company Method for manufacturing combined acoustic backing and interconnect module for ultrasonic array
US6013032A (en) * 1998-03-13 2000-01-11 Hewlett-Packard Company Beamforming methods and apparatus for three-dimensional ultrasound imaging using two-dimensional transducer array
US6380766B2 (en) * 1999-03-19 2002-04-30 Bernard J Savord Integrated circuitry for use with transducer elements in an imaging system
US6282963B1 (en) * 1999-10-12 2001-09-04 General Electric Company Numerical optimization of ultrasound beam path
US6359367B1 (en) * 1999-12-06 2002-03-19 Acuson Corporation Micromachined ultrasonic spiral arrays for medical diagnostic imaging
US6346079B1 (en) * 2000-05-25 2002-02-12 General Electric Company Method and apparatus for adaptive frame-rate adjustment in ultrasound imaging system
JP4646465B2 (ja) * 2000-09-05 2011-03-09 キヤノン株式会社 記録媒体搬送装置及び該記録媒体搬送装置を備えた記録装置
US6506160B1 (en) * 2000-09-25 2003-01-14 General Electric Company Frequency division multiplexed wireline communication for ultrasound probe
US6491634B1 (en) * 2000-10-13 2002-12-10 Koninklijke Philips Electronics N.V. Sub-beamforming apparatus and method for a portable ultrasound imaging system
US6589180B2 (en) * 2001-06-20 2003-07-08 Bae Systems Information And Electronic Systems Integration, Inc Acoustical array with multilayer substrate integrated circuits
US7285092B2 (en) * 2002-12-18 2007-10-23 Barbara Ann Karmanos Cancer Institute Computerized ultrasound risk evaluation system
US7053530B2 (en) * 2002-11-22 2006-05-30 General Electric Company Method for making electrical connection to ultrasonic transducer through acoustic backing material
US6831394B2 (en) * 2002-12-11 2004-12-14 General Electric Company Backing material for micromachined ultrasonic transducer devices
JP2006510269A (ja) 2002-12-11 2006-03-23 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 超小型化された超音波送受波器
US6865140B2 (en) * 2003-03-06 2005-03-08 General Electric Company Mosaic arrays using micromachined ultrasound transducers
US7257051B2 (en) * 2003-03-06 2007-08-14 General Electric Company Integrated interface electronics for reconfigurable sensor array
US7353056B2 (en) * 2003-03-06 2008-04-01 General Electric Company Optimized switching configurations for reconfigurable arrays of sensor elements
US7052464B2 (en) * 2004-01-01 2006-05-30 General Electric Company Alignment method for fabrication of integrated ultrasonic transducer array
CN101061392A (zh) 2004-11-22 2007-10-24 皇家飞利浦电子股份有限公司 用于超声束形成器探头的混合集成电路
US7518251B2 (en) * 2004-12-03 2009-04-14 General Electric Company Stacked electronics for sensors
US7375420B2 (en) * 2004-12-03 2008-05-20 General Electric Company Large area transducer array
CN101102853B (zh) 2005-01-11 2010-12-08 皇家飞利浦电子股份有限公司 用于(多个)微束形成器的重分布互连和医学超声系统
CN101193711B (zh) 2005-06-07 2010-12-29 皇家飞利浦电子股份有限公司 用于超声传感器组件的多器件衬块
US7775979B2 (en) * 2005-06-29 2010-08-17 General Electric Company Transmit and receive interface array for highly integrated ultrasound scanner
JP5032075B2 (ja) * 2006-09-08 2012-09-26 株式会社東芝 超音波プローブシステム及び超音波診断装置
US7687976B2 (en) * 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
ES2397553T3 (es) * 2007-04-10 2013-03-07 C.R.Bard, Inc. Sistema de ultrasonidos de baja potencia
US7892176B2 (en) * 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080315331A1 (en) * 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure
US20090182229A1 (en) * 2008-01-10 2009-07-16 Robert Gideon Wodnicki UltraSound System With Highly Integrated ASIC Architecture
US20090182233A1 (en) * 2008-01-10 2009-07-16 Robert Gideon Wodnicki Ultrasound System With Integrated Control Switches
US8345508B2 (en) * 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same

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