JP2011078755A5 - - Google Patents

Download PDF

Info

Publication number
JP2011078755A5
JP2011078755A5 JP2010208824A JP2010208824A JP2011078755A5 JP 2011078755 A5 JP2011078755 A5 JP 2011078755A5 JP 2010208824 A JP2010208824 A JP 2010208824A JP 2010208824 A JP2010208824 A JP 2010208824A JP 2011078755 A5 JP2011078755 A5 JP 2011078755A5
Authority
JP
Japan
Prior art keywords
interposer
input
integrated circuit
transducer
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010208824A
Other languages
English (en)
Japanese (ja)
Other versions
JP5675242B2 (ja
JP2011078755A (ja
Filing date
Publication date
Priority claimed from US12/714,239 external-priority patent/US8345508B2/en
Application filed filed Critical
Publication of JP2011078755A publication Critical patent/JP2011078755A/ja
Publication of JP2011078755A5 publication Critical patent/JP2011078755A5/ja
Application granted granted Critical
Publication of JP5675242B2 publication Critical patent/JP5675242B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010208824A 2009-09-20 2010-09-17 大面積のモジュール式センサアレイ組立体および同組立体を作製する方法 Active JP5675242B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US24406909P 2009-09-20 2009-09-20
US61/244,069 2009-09-20
US12/714,239 2010-02-26
US12/714,239 US8345508B2 (en) 2009-09-20 2010-02-26 Large area modular sensor array assembly and method for making the same

Publications (3)

Publication Number Publication Date
JP2011078755A JP2011078755A (ja) 2011-04-21
JP2011078755A5 true JP2011078755A5 (enExample) 2013-10-24
JP5675242B2 JP5675242B2 (ja) 2015-02-25

Family

ID=43757222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010208824A Active JP5675242B2 (ja) 2009-09-20 2010-09-17 大面積のモジュール式センサアレイ組立体および同組立体を作製する方法

Country Status (3)

Country Link
US (1) US8345508B2 (enExample)
JP (1) JP5675242B2 (enExample)
KR (1) KR20110031406A (enExample)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8345508B2 (en) * 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
US8830689B2 (en) * 2010-09-16 2014-09-09 Samsung Electro-Mechanics Co., Ltd. Interposer-embedded printed circuit board
KR101761817B1 (ko) * 2011-03-04 2017-07-26 삼성전자주식회사 대면적 엑스선 검출기
US8622752B2 (en) * 2011-04-13 2014-01-07 Teradyne, Inc. Probe-card interposer constructed using hexagonal modules
KR101460692B1 (ko) * 2011-06-09 2014-11-13 삼성전자주식회사 2차원 트랜스듀서-어레이를 구동시키는 장치, 의료영상시스템 및 2차원 트랜스듀서-어레이를 구동시키는 방법
US8659212B2 (en) * 2012-02-16 2014-02-25 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
KR101387225B1 (ko) * 2012-02-24 2014-04-21 경북대학교 산학협력단 2ｄ 배열형 초음파 프로브의 소형화 기술
KR101378012B1 (ko) 2012-03-14 2014-03-24 삼성전자주식회사 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법
US8742646B2 (en) 2012-03-29 2014-06-03 General Electric Company Ultrasound acoustic assemblies and methods of manufacture
JP6102075B2 (ja) * 2012-03-30 2017-03-29 セイコーエプソン株式会社 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置
KR101383298B1 (ko) 2012-04-25 2014-04-09 삼성전자주식회사 초음파 프로브 장치 및 초음파 프로브 장치의 제조 방법
US9180490B2 (en) * 2012-05-22 2015-11-10 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
KR101931358B1 (ko) 2012-06-25 2018-12-31 삼성전자주식회사 지그 및 그 제작방법과 지그를 이용한 초음파 프로브용 칩의 플립 칩 본딩방법
KR101984695B1 (ko) 2012-08-29 2019-09-03 삼성전자주식회사 그래핀 소자 및 그 제조방법
US9136293B2 (en) * 2012-09-07 2015-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for sensor module
KR20140033992A (ko) * 2012-09-11 2014-03-19 삼성전자주식회사 초음파 변환기
KR101919013B1 (ko) * 2012-09-13 2019-02-08 삼성전자주식회사 미세가공 초음파 변환기 어레이
JP6306048B2 (ja) 2012-12-28 2018-04-04 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 互いに異なるピッチを有する音響要素のコンポーネントを有する音響プローブ
WO2014123556A1 (en) * 2013-02-05 2014-08-14 Sound Technology Inc. Ultrasound device
US9499392B2 (en) 2013-02-05 2016-11-22 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
US9351081B2 (en) 2013-02-27 2016-05-24 Texas Instruments Incorporated Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug
US9470710B2 (en) 2013-02-27 2016-10-18 Texas Instruments Incorporated Capacitive MEMS sensor devices
CA2903479C (en) 2013-03-15 2023-10-10 Butterfly Network, Inc. Monolithic ultrasonic imaging devices, systems and methods
TWI623081B (zh) 2013-03-15 2018-05-01 蝴蝶網路公司 互補式金屬氧化物半導體（ｃｍｏｓ）超音波換能器以及用於形成其之方法
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
EP3024594A2 (en) 2013-07-23 2016-06-01 Butterfly Network Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
EP3038762B1 (en) 2013-08-26 2019-12-18 Koninklijke Philips N.V. Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly
US20150087988A1 (en) * 2013-09-20 2015-03-26 General Electric Company Ultrasound transducer arrays
EP3069382B1 (en) * 2013-11-15 2021-09-29 Koninklijke Philips N.V. Integrated circuit array and method for manufacturing an array of integrated circuits
TWI671059B (zh) 2014-04-18 2019-09-11 美商蝴蝶網路公司 超音波成像壓縮方法和設備
CN106461767B (zh) 2014-04-18 2019-05-28 蝴蝶网络有限公司 单衬底超声成像装置的架构、相关设备和方法
CN106659464B (zh) 2014-04-18 2020-03-20 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)晶片中的超声换能器及相关装置和方法
CN105023877B (zh) * 2014-04-28 2019-12-24 联华电子股份有限公司 半导体晶片、封装结构与其制作方法
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
JP6528376B2 (ja) * 2014-08-27 2019-06-12 富士通株式会社 撮像装置及びその製造方法
US9613246B1 (en) * 2014-09-16 2017-04-04 Apple Inc. Multiple scan element array ultrasonic biometric scanner
US9952095B1 (en) 2014-09-29 2018-04-24 Apple Inc. Methods and systems for modulation and demodulation of optical signals
US10133904B2 (en) 2014-09-30 2018-11-20 Apple Inc. Fully-addressable sensor array for acoustic imaging systems
US9747488B2 (en) 2014-09-30 2017-08-29 Apple Inc. Active sensing element for acoustic imaging systems
US9607203B1 (en) 2014-09-30 2017-03-28 Apple Inc. Biometric sensing device with discrete ultrasonic transducers
US9904836B2 (en) 2014-09-30 2018-02-27 Apple Inc. Reducing edge effects within segmented acoustic imaging systems
US9984271B1 (en) 2014-09-30 2018-05-29 Apple Inc. Ultrasonic fingerprint sensor in display bezel
US9979955B1 (en) 2014-09-30 2018-05-22 Apple Inc. Calibration methods for near-field acoustic imaging systems
US9824254B1 (en) 2014-09-30 2017-11-21 Apple Inc. Biometric sensing device with discrete ultrasonic transducers
CN107107109A (zh) * 2014-12-15 2017-08-29 皇家飞利浦有限公司 具有直接同轴电缆附接的紧凑超声换能器
US10695034B2 (en) 2015-05-15 2020-06-30 Butterfly Network, Inc. Autonomous ultrasound probe and related apparatus and methods
JP6608185B2 (ja) * 2015-06-18 2019-11-20 キヤノン株式会社 積層型イメージセンサおよび撮像装置
US11048902B2 (en) 2015-08-20 2021-06-29 Appple Inc. Acoustic imaging system architecture
EP3144074B1 (en) * 2015-09-16 2020-03-11 Samsung Medison Co., Ltd. Ultrasonic probe, ultrasonic imaging apparatus including the same, and method for controlling the ultrasonic imaging apparatus
US10325136B1 (en) 2015-09-29 2019-06-18 Apple Inc. Acoustic imaging of user input surfaces
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
US10856840B2 (en) 2016-06-20 2020-12-08 Butterfly Network, Inc. Universal ultrasound device and related apparatus and methods
US10497856B2 (en) 2016-06-20 2019-12-03 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
US11712221B2 (en) 2016-06-20 2023-08-01 Bfly Operations, Inc. Universal ultrasound device and related apparatus and methods
GB201617255D0 (en) * 2016-10-11 2016-11-23 Oxford University Innovation Limited Modular ultrasound apparatus and methods
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US11446003B2 (en) 2017-03-27 2022-09-20 Vave Health, Inc. High performance handheld ultrasound
US10469846B2 (en) 2017-03-27 2019-11-05 Vave Health, Inc. Dynamic range compression of ultrasound images
US11531096B2 (en) 2017-03-23 2022-12-20 Vave Health, Inc. High performance handheld ultrasound
US10856843B2 (en) 2017-03-23 2020-12-08 Vave Health, Inc. Flag table based beamforming in a handheld ultrasound device
US10512936B2 (en) 2017-06-21 2019-12-24 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
US20190069880A1 (en) * 2017-09-04 2019-03-07 Canon Medical Systems Corporation Ultrasound probe and ultrasound probe manufacturing method
EP3703874B1 (en) * 2017-10-31 2022-05-18 Koninklijke Philips N.V. Ultrasound scanner assembly
US10802651B2 (en) 2018-01-30 2020-10-13 Apple Inc. Ultrasonic touch detection through display
JP7187165B2 (ja) * 2018-04-18 2022-12-12 キヤノンメディカルシステムズ株式会社 超音波プローブ及び超音波診断装置
US11498096B2 (en) * 2018-11-06 2022-11-15 Siemens Medical Solutions Usa, Inc. Chip-on-array with interposer for a multidimensional transducer array
KR20230116960A (ko) 2019-03-25 2023-08-04 엑소 이미징, 인크. 핸드헬드 초음파 영상 장치
US12109591B2 (en) 2019-09-09 2024-10-08 GE Precision Healthcare LLC Ultrasound transducer array architecture and method of manufacture
US11950512B2 (en) 2020-03-23 2024-04-02 Apple Inc. Thin-film acoustic imaging system for imaging through an exterior surface of an electronic device housing
US11656355B2 (en) * 2020-07-15 2023-05-23 Siemens Medical Solutions Usa, Inc. Direct chip-on-array for a multidimensional transducer array
JP2022077181A (ja) * 2020-11-11 2022-05-23 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置及び電子機器
US12218090B2 (en) 2020-12-25 2025-02-04 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
CN112908873A (zh) * 2021-01-18 2021-06-04 上海易卜半导体有限公司 半导体组件组装方法、半导体组件和电子设备
US12154884B2 (en) 2021-02-01 2024-11-26 Yibu Semiconductor Co., Ltd. Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly
US12000967B2 (en) 2021-03-31 2024-06-04 Apple Inc. Regional gain control for segmented thin-film acoustic imaging systems
US12039800B2 (en) 2021-03-31 2024-07-16 Apple Inc. Signal processing for segmented thin-film acoustic imaging systems for portable electronic devices
US20240377544A1 (en) * 2023-05-09 2024-11-14 Redlen Technologies, Inc. Direct attach radiation detector structures including pixelated sensors and read-out circuitry having varying pitch

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05123317A (ja) * 1991-11-08 1993-05-21 Toshiba Corp ２次元アレイ超音波プローブ
US5622177A (en) * 1993-07-08 1997-04-22 Siemens Aktiengesellschaft Ultrasound imaging system having a reduced number of lines between the base unit and the probe
US5527741A (en) * 1994-10-11 1996-06-18 Martin Marietta Corporation Fabrication and structures of circuit modules with flexible interconnect layers
US7500952B1 (en) * 1995-06-29 2009-03-10 Teratech Corporation Portable ultrasound imaging system
JPH09238924A (ja) * 1996-03-12 1997-09-16 Toshiba Corp 処置具及びこの処置具を備えた医用複合診断システム
US5732706A (en) * 1996-03-22 1998-03-31 Lockheed Martin Ir Imaging Systems, Inc. Ultrasonic array with attenuating electrical interconnects
US6541896B1 (en) * 1997-12-29 2003-04-01 General Electric Company Method for manufacturing combined acoustic backing and interconnect module for ultrasonic array
US6013032A (en) * 1998-03-13 2000-01-11 Hewlett-Packard Company Beamforming methods and apparatus for three-dimensional ultrasound imaging using two-dimensional transducer array
US6380766B2 (en) * 1999-03-19 2002-04-30 Bernard J Savord Integrated circuitry for use with transducer elements in an imaging system
US6282963B1 (en) * 1999-10-12 2001-09-04 General Electric Company Numerical optimization of ultrasound beam path
US6359367B1 (en) * 1999-12-06 2002-03-19 Acuson Corporation Micromachined ultrasonic spiral arrays for medical diagnostic imaging
US6346079B1 (en) * 2000-05-25 2002-02-12 General Electric Company Method and apparatus for adaptive frame-rate adjustment in ultrasound imaging system
JP4646465B2 (ja) * 2000-09-05 2011-03-09 キヤノン株式会社 記録媒体搬送装置及び該記録媒体搬送装置を備えた記録装置
US6506160B1 (en) * 2000-09-25 2003-01-14 General Electric Company Frequency division multiplexed wireline communication for ultrasound probe
US6491634B1 (en) * 2000-10-13 2002-12-10 Koninklijke Philips Electronics N.V. Sub-beamforming apparatus and method for a portable ultrasound imaging system
US6589180B2 (en) * 2001-06-20 2003-07-08 Bae Systems Information And Electronic Systems Integration, Inc Acoustical array with multilayer substrate integrated circuits
US7285092B2 (en) * 2002-12-18 2007-10-23 Barbara Ann Karmanos Cancer Institute Computerized ultrasound risk evaluation system
US7053530B2 (en) * 2002-11-22 2006-05-30 General Electric Company Method for making electrical connection to ultrasonic transducer through acoustic backing material
US6831394B2 (en) * 2002-12-11 2004-12-14 General Electric Company Backing material for micromachined ultrasonic transducer devices
JP2006510269A (ja) 2002-12-11 2006-03-23 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 超小型化された超音波送受波器
US7257051B2 (en) * 2003-03-06 2007-08-14 General Electric Company Integrated interface electronics for reconfigurable sensor array
US6865140B2 (en) * 2003-03-06 2005-03-08 General Electric Company Mosaic arrays using micromachined ultrasound transducers
US7353056B2 (en) * 2003-03-06 2008-04-01 General Electric Company Optimized switching configurations for reconfigurable arrays of sensor elements
US7052464B2 (en) * 2004-01-01 2006-05-30 General Electric Company Alignment method for fabrication of integrated ultrasonic transducer array
CN101061392A (zh) 2004-11-22 2007-10-24 皇家飞利浦电子股份有限公司 用于超声束形成器探头的混合集成电路
US7518251B2 (en) * 2004-12-03 2009-04-14 General Electric Company Stacked electronics for sensors
US7375420B2 (en) * 2004-12-03 2008-05-20 General Electric Company Large area transducer array
US7795784B2 (en) 2005-01-11 2010-09-14 Koninklijke Philips Electronics N.V. Redistribution interconnect for microbeamforming(s) and a medical ultrasound system
KR20080021635A (ko) * 2005-06-07 2008-03-07 코닌클리케 필립스 일렉트로닉스 엔.브이. 초음파 감지기 조립체를 위한 다수성분 받침 블록
US7775979B2 (en) * 2005-06-29 2010-08-17 General Electric Company Transmit and receive interface array for highly integrated ultrasound scanner
JP5032075B2 (ja) * 2006-09-08 2012-09-26 株式会社東芝 超音波プローブシステム及び超音波診断装置
US7687976B2 (en) * 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
KR20150042870A (ko) * 2007-04-10 2015-04-21 씨. 알. 바드, 인크. 저 전력 초음파 시스템
US7892176B2 (en) * 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080315331A1 (en) * 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure
US20090182229A1 (en) * 2008-01-10 2009-07-16 Robert Gideon Wodnicki UltraSound System With Highly Integrated ASIC Architecture
US20090182233A1 (en) * 2008-01-10 2009-07-16 Robert Gideon Wodnicki Ultrasound System With Integrated Control Switches
US8345508B2 (en) * 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same

Similar Documents

Publication Publication Date Title
JP2011078755A5 (enExample)
JP5955537B2 (ja) タイリング可能なセンサアレイ
JP5675242B2 (ja) 大面積のモジュール式センサアレイ組立体および同組立体を作製する方法
US7451651B2 (en) Modular sensor assembly and methods of fabricating the same
TWI581397B (zh) 晶片封裝、電腦系統、和電子裝置
CN107041137B (zh) 多芯片模块及其制法
US7518251B2 (en) Stacked electronics for sensors
JP2010504639A (ja) フリップチップ相互接続貫通チップビア
JP2011199288A5 (enExample)
CN116195059B (zh) 具有无边界显示器的电子设备
KR102033787B1 (ko) 플렉시블 적층 패키지
JP2008147628A5 (enExample)
CN105027282A (zh) 启用通孔的层叠封装
CN111147989B (zh) 具有用于多维换能器阵列的中介层的阵列上芯片
US9508690B2 (en) Semiconductor TSV device package for circuit board connection
CN109478556B (zh) 检测器模块、检测器、成像设备和制造检测器模块的方法
CN101335267A (zh) 具晶粒三维堆叠结构的影像感测模块
CN101479846B (zh) 利用已形成的耦合件进行倒装互连
US20090105596A1 (en) Transducer arrays for medical ultrasound and method of making the same
JP2010258302A (ja) 超音波フリップチップ実装方法およびそれに用いられる基板
TWI329911B (en) Integrated circuit utilizing down bond to define the function of the die
Lee et al. Strategies for IC integration
Woychik et al. Packaging High Density Capactive Micro-Machined Ultrasonic Transducer (cMUT) Sensor Arrays Using Hyperbga Technology
TWI272729B (en) Multi-chip sensor package
KR20250127329A (ko) 다차원 매트릭스 트랜스듀서에 대한 연결