JP6554554B2 - 半導体x線検出器 - Google Patents
半導体x線検出器 Download PDFInfo
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/247—Detector read-out circuitry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V5/00—Prospecting or detecting by the use of ionising radiation, e.g. of natural or induced radioactivity
- G01V5/20—Detecting prohibited goods, e.g. weapons, explosives, hazardous substances, contraband or smuggled objects
- G01V5/22—Active interrogation, i.e. by irradiating objects or goods using external radiation sources, e.g. using gamma rays or cosmic rays
- G01V5/222—Active interrogation, i.e. by irradiating objects or goods using external radiation sources, e.g. using gamma rays or cosmic rays measuring scattered radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/115—Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/02—Arrangements for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/03—Computed tomography [CT]
- A61B6/032—Transmission computed tomography [CT]
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K7/00—Gamma- or X-ray microscopes
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- Condensed Matter Physics & Semiconductors (AREA)
- Medical Informatics (AREA)
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- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Animal Behavior & Ethology (AREA)
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- Radiology & Medical Imaging (AREA)
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- Heart & Thoracic Surgery (AREA)
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- Measurement Of Radiation (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Solid State Image Pick-Up Elements (AREA)
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Description
Claims (29)
- 電極を含むX線吸収層と、
第1の表面および第2の表面を有する基板と、前記基板内または前記基板上にある電子システムと、前記第1の表面上の電気接点と、ビアと、前記第2の表面上の再分配層(RDL)と、を含む電子層と
を備えたX線を検出するのに適した装置であって、
前記RDLは、伝送線を備え、
前記ビアは、前記第1の表面から前記第2の表面まで延在し、
前記電極は、前記電気接点に電気的に接続され、
前記電子システムは、前記電気接点および前記ビアを介して前記伝送線に電気的に接続され、
前記電子システムは、
前記電極の電圧を第1の閾値と比較するように構成された第1の電圧比較器と、
前記電圧を第2の閾値と比較するように構成された第2の電圧比較器と、
前記X線吸収層に到達する複数のX線光子を記録するように構成されたカウンタと、
コントローラと
を備え、
前記コントローラは、前記電圧の絶対値が前記第1の閾値の絶対値以上であると前記第1の電圧比較器が判定した時点から時間遅延を開始するように構成され、
前記コントローラは、前記時間遅延の間に前記第2の電圧比較器を起動するように構成され、
前記コントローラは、前記電圧の絶対値が前記第2の閾値の絶対値以上であると前記第2の電圧比較器が判定した場合、前記カウンタによって記録された数を1だけ増加させるように構成される、
装置。 - 前記基板が200μm以下の厚さを有する、請求項1に記載の装置。
- 前記電極に電気的に接続されたコンデンサモジュールをさらに備え、前記コンデンサモジュールは、前記電極から電荷キャリアを収集するように構成されている、請求項1に記載の装置。
- 前記コントローラが、前記時間遅延の開始または終了時に前記第2の電圧比較器を起動するように構成されている、請求項1に記載の装置。
- 電圧計をさらに備え、前記コントローラは、前記時間遅延の終了時に前記電圧計に前記電圧を測定させるように構成されている、請求項1に記載の装置。
- 前記コントローラが、前記時間遅延の終了時に測定された前記電圧の値に基づいて、X線光子エネルギーを決定するように構成されている、請求項5に記載の装置。
- 前記コントローラが、前記電極を電気的接地に接続するように構成されている、請求項1に記載の装置。
- 前記電圧の変化率が、前記時間遅延の終了時に実質的にゼロである、請求項1に記載の装置。
- 前記電圧の変化率が、前記時間遅延の終了時に実質的に非ゼロである、請求項1に記載の装置。
- 前記X線吸収層がダイオードを含む、請求項1に記載の装置。
- 前記X線吸収層が、シリコン、ゲルマニウム、GaAs、CdTe、CdZnTe、またはそれらの組み合わせを含む、請求項1に記載の装置。
- 前記装置がシンチレータを含まない、請求項1に記載の装置。
- 前記装置がピクセルの配列を含む、請求項1に記載の装置。
- 請求項1に記載の装置とX線源とを備えるシステムであって、人間の胸部または腹部にX線撮影を行うように構成されているシステム。
- 請求項1に記載の装置とX線源とを備えるシステムであって、人間の口にX線撮影を行うように構成されているシステム。
- 請求項1に記載の装置とX線源とを備える貨物走査または非侵入検査(NII)システムであって、後方散乱X線を用いて画像を形成するように構成されている貨物走査または非侵入検査(NII)システム。
- 請求項1に記載の装置とX線源とを備える貨物走査または非侵入検査(NII)システムであって、検査対象物を透過したX線を用いて画像を形成するように構成されている貨物走査または非侵入検査(NII)システム。
- 請求項1に記載の装置とX線源とを備える全身スキャナシステム。
- 請求項1に記載の装置とX線源とを備えるX線コンピュータ断層撮影(X線CT)システム。
- 請求項1に記載の装置と、電子源と、電子光学システムとを備える電子顕微鏡。
- 請求項1に記載の装置を備えたシステムであって、前記システムはX線望遠鏡またはX線顕微鏡であるか、または前記システムは、マンモグラフィ、工業用欠陥検出、マイクロラジオグラフィ、鋳造検査、溶接検査、またはデジタルサブトラクション血管造影法を行うように構成されている、システム。
- 前記コントローラが、前記時間遅延の開始時に前記第1の電圧比較器を停止するように構成されている、請求項1に記載の装置。
- 前記コントローラが、前記時間遅延の終了時に、または前記電圧の絶対値が前記第2の閾値の絶対値以上であると前記第2の電圧比較器が判定したときに、あるいはその間の時間に、前記第2の電圧比較器を停止するように構成されている、請求項1に記載の装置。
- 前記電子層が、前記第1の表面上に配置されており多重化、入出力、電力供給、又は、データキャッシングを行う周辺回路をさらに含む、請求項1に記載の装置。
- 前記電子層が、前記第1の表面と前記第2の表面との間に配置されており多重化、入出力、電力供給、又は、データキャッシングを行う周辺回路をさらに備える、請求項1に記載の装置。
- 2つの層の積層体を備えるシステムであって、各層が、配列内に配置された複数の請求項1に記載の装置を含み、前記2つの層の前記配列が互いに対して互い違いに配置されている、システム。
- 電極を含むX線吸収層を取得することと、
第1の表面および第2の表面を有する基板と、前記基板内または前記基板上にある電子システムと、前記第1の表面上の電気接点と、ビアと、前記第2の表面上の再分配層(RDL)とを含む電子層を取得することと、
前記電極が前記電気接点に電気的に接続されるように前記X線吸収層と前記電子層とを接合することと、
を含み、
前記RDLは伝送線を備え、
前記ビアは、前記第1の表面から前記第2の表面まで延在し、
前記電子システムは、前記電気接点および前記ビアを介して前記伝送線に電気的に接続される、
方法。 - 前記電極は、前記電気接点に接合される、請求項1の装置。
- 前記電極は、前記電気接点に接合される、請求項27の方法。
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PCT/CN2015/075941 WO2016161542A1 (en) | 2015-04-07 | 2015-04-07 | Semiconductor x-ray detector |
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JP2018512596A JP2018512596A (ja) | 2018-05-17 |
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US (3) | US10007009B2 (ja) |
EP (1) | EP3281040B1 (ja) |
JP (1) | JP6554554B2 (ja) |
KR (1) | KR101941898B1 (ja) |
CN (1) | CN107533146B (ja) |
IL (1) | IL254538B (ja) |
SG (1) | SG11201707508PA (ja) |
TW (1) | TWI632391B (ja) |
WO (1) | WO2016161542A1 (ja) |
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SG11201707508PA (en) * | 2015-04-07 | 2017-10-30 | Shenzhen Xpectvision Tech Co Ltd | Semiconductor x-ray detector |
US10539691B2 (en) | 2015-06-10 | 2020-01-21 | Shenzhen Xpectvision Technology Co., Ltd. | Detector for X-ray fluorescence |
US10705031B2 (en) * | 2015-08-27 | 2020-07-07 | Shenzhen Xpectvision Technology Co., Ltd. | X-ray imaging with a detector capable of resolving photon energy |
EP3482231B1 (en) * | 2016-07-05 | 2022-09-07 | Shenzhen Xpectvision Technology Co., Ltd. | Bonding of materials with dissimilar coefficients of thermal expansion |
WO2018053774A1 (en) | 2016-09-23 | 2018-03-29 | Shenzhen Xpectvision Technology Co.,Ltd. | Packaging of semiconductor x-ray detectors |
EP3532873B1 (en) * | 2016-10-27 | 2021-06-23 | Shenzhen Xpectvision Technology Co., Ltd. | Dark noise compensation in a radiation detector |
CN110178051B (zh) * | 2016-11-15 | 2023-06-13 | 深圳帧观德芯科技有限公司 | 配置成统计地确定电荷共享的成像系统 |
CN110022770A (zh) * | 2016-12-05 | 2019-07-16 | 深圳帧观德芯科技有限公司 | X射线成像系统及x射线成像方法 |
EP3558124A4 (en) * | 2016-12-20 | 2020-08-12 | Shenzhen Xpectvision Technology Co., Ltd. | IMAGE SENSORS WITH X-RAY DETECTORS |
CN110291423A (zh) | 2017-01-23 | 2019-09-27 | 深圳帧观德芯科技有限公司 | 制作半导体x射线检测器的方法 |
EP3571527A4 (en) * | 2017-01-23 | 2020-09-09 | Shenzhen Xpectvision Technology Co., Ltd. | RADIATION DETECTOR |
WO2018133087A1 (en) * | 2017-01-23 | 2018-07-26 | Shenzhen Xpectvision Technology Co., Ltd. | X-ray detectors capable of identifying and managing charge sharing |
US10162066B2 (en) * | 2017-02-06 | 2018-12-25 | General Electric Company | Coincidence-enabling photon-counting detector |
CN110418981B (zh) * | 2017-04-01 | 2023-09-22 | 深圳帧观德芯科技有限公司 | 便携式辐射检测器系统 |
CN110537111B (zh) * | 2017-05-03 | 2024-02-02 | 深圳帧观德芯科技有限公司 | 辐射检测器的制作方法 |
WO2019019042A1 (en) * | 2017-07-26 | 2019-01-31 | Shenzhen Xpectvision Technology Co., Ltd. | INTEGRATED X-RAY SOURCE |
EP3658963A4 (en) | 2017-07-26 | 2021-03-03 | Shenzhen Xpectvision Technology Co., Ltd. | X-RAY DETECTOR |
EP3658961B1 (en) | 2017-07-26 | 2022-08-17 | Shenzhen Xpectvision Technology Co., Ltd. | A radiation detector and methods of data output from it |
WO2019019048A1 (en) * | 2017-07-26 | 2019-01-31 | Shenzhen Xpectvision Technology Co., Ltd. | RADIOLOGICAL IMAGING SYSTEM AND METHOD OF MONITORING RADIOLOGICAL IMAGE |
WO2019019054A1 (en) * | 2017-07-26 | 2019-01-31 | Shenzhen Xpectvision Technology Co., Ltd. | RADIATION DETECTOR WITH INTEGRATED DEPOLARIZATION DEVICE |
EP3658033A4 (en) * | 2017-07-26 | 2021-02-24 | Shenzhen Xpectvision Technology Co., Ltd. | SYSTEM WITH A SPATIAL EXTENSION X-RAY SOURCE FOR X-RAY IMAGING |
WO2019080041A1 (en) * | 2017-10-26 | 2019-05-02 | Shenzhen Xpectvision Technology Co., Ltd. | X-RAY DETECTOR WITH COOLING SYSTEM |
WO2019080036A1 (en) | 2017-10-26 | 2019-05-02 | Shenzhen Xpectvision Technology Co., Ltd. | RADIATION DETECTOR CAPABLE OF PROCESSING NOISE |
WO2019084703A1 (en) * | 2017-10-30 | 2019-05-09 | Shenzhen Xpectvision Technology Co., Ltd. | Radiation detector with dc-to-dc converter based on mems switches |
EP3704516A4 (en) | 2017-10-30 | 2021-05-19 | Shenzhen Genorivision Technology Co. Ltd. | HIGH TIME RESOLUTION LIDAR DETECTOR |
CN111602071B (zh) * | 2018-01-24 | 2023-07-18 | 深圳帧观德芯科技有限公司 | 图像传感器中的辐射检测器的封装 |
EP3743738A4 (en) * | 2018-01-24 | 2021-07-28 | Shenzhen Xpectvision Technology Co., Ltd. | STRIPE PIXEL DETECTOR |
CN111587388B (zh) * | 2018-01-24 | 2024-06-14 | 深圳帧观德芯科技有限公司 | 制作辐射检测器的方法 |
EP3743744A4 (en) * | 2018-01-25 | 2021-07-28 | Shenzhen Xpectvision Technology Co., Ltd. | RADIATION DETECTOR PACKAGING |
EP3743741A4 (en) * | 2018-01-25 | 2021-08-04 | Shenzhen Xpectvision Technology Co., Ltd. | RADIATION DETECTOR WITH QUANTUM POINT SCINTILLATOR |
CN111587084B (zh) * | 2018-02-03 | 2024-03-15 | 深圳帧观德芯科技有限公司 | 内窥镜 |
WO2019218105A1 (en) * | 2018-05-14 | 2019-11-21 | Shenzhen Xpectvision Technology Co., Ltd. | An apparatus for imaging the prostate |
CN112470038B (zh) * | 2018-07-12 | 2024-07-12 | 深圳帧观德芯科技有限公司 | 辐射检测器 |
WO2020010591A1 (en) * | 2018-07-12 | 2020-01-16 | Shenzhen Xpectvision Technology Co., Ltd. | A radiation detector |
CN112368602B (zh) | 2018-07-12 | 2023-03-14 | 深圳帧观德芯科技有限公司 | 具有高时间分辨率的光学雷达 |
WO2020019285A1 (en) | 2018-07-27 | 2020-01-30 | Shenzhen Xpectvision Technology Co., Ltd. | Multi-source cone beam computed tomography |
CN112703427A (zh) * | 2018-09-21 | 2021-04-23 | 深圳帧观德芯科技有限公司 | 一种成像系统 |
CN112955787B (zh) * | 2018-11-06 | 2023-05-30 | 深圳帧观德芯科技有限公司 | 一种辐射检测器 |
EP3877780A4 (en) | 2018-11-06 | 2022-06-22 | Shenzhen Xpectvision Technology Co., Ltd. | IMAGE SENSORS WITH RADIATION DETECTORS AND MASKS |
JP7292868B2 (ja) * | 2018-12-18 | 2023-06-19 | キヤノン株式会社 | 検出器 |
CN113302485A (zh) * | 2019-01-10 | 2021-08-24 | 深圳帧观德芯科技有限公司 | 基于外延层的x射线检测器及其制备方法 |
EP3690490A1 (en) * | 2019-02-04 | 2020-08-05 | ams International AG | X-ray detector component, x-ray detection module, imaging device and method for manufacturing an x-ray detector component |
US10955568B2 (en) | 2019-02-08 | 2021-03-23 | International Business Machines Corporation | X-ray sensitive device to detect an inspection |
WO2020198934A1 (en) | 2019-03-29 | 2020-10-08 | Shenzhen Xpectvision Technology Co., Ltd. | Semiconductor x-ray detector |
WO2021016746A1 (en) * | 2019-07-26 | 2021-02-04 | Shenzhen Xpectvision Technology Co., Ltd. | Radiation detector with quantum dot scintillators |
CN114072703A (zh) * | 2019-07-29 | 2022-02-18 | 深圳帧观德芯科技有限公司 | 用于暗噪声补偿的放大器 |
WO2021168685A1 (en) * | 2020-02-26 | 2021-09-02 | Shenzhen Xpectvision Technology Co., Ltd. | Semiconductor radiation detector |
CN114902081A (zh) * | 2020-02-26 | 2022-08-12 | 深圳帧观德芯科技有限公司 | 辐射检测器 |
CN114945844A (zh) * | 2020-02-27 | 2022-08-26 | 深圳帧观德芯科技有限公司 | 用于血糖水平检测的装置 |
US20240096589A1 (en) * | 2020-11-23 | 2024-03-21 | Asml Netherlands B.V. | Semiconductor charged particle detector for microscopy |
WO2023122921A1 (en) * | 2021-12-28 | 2023-07-06 | Shenzhen Xpectvision Technology Co., Ltd. | Image sensors with small and thin integrated circuit chips |
Family Cites Families (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56103379A (en) * | 1980-01-22 | 1981-08-18 | Horiba Ltd | Semiconductor x-ray detector |
JP3220500B2 (ja) | 1992-03-16 | 2001-10-22 | オリンパス光学工業株式会社 | 軟x線検出器 |
US5245191A (en) | 1992-04-14 | 1993-09-14 | The Board Of Regents Of The University Of Arizona | Semiconductor sensor for gamma-ray tomographic imaging system |
US5389792A (en) | 1993-01-04 | 1995-02-14 | Grumman Aerospace Corporation | Electron microprobe utilizing thermal detector arrays |
EP0778983B1 (en) | 1994-07-27 | 2000-05-31 | 1294339 Ontario, Inc. | Radiation imaginging system |
US5635718A (en) * | 1996-01-16 | 1997-06-03 | Minnesota Mining And Manufacturing Company | Multi-module radiation detecting device and fabrication method |
JP2002217444A (ja) | 2001-01-22 | 2002-08-02 | Canon Inc | 放射線検出装置 |
US6791091B2 (en) | 2001-06-19 | 2004-09-14 | Brian Rodricks | Wide dynamic range digital imaging system and method |
GB2392308B (en) | 2002-08-15 | 2006-10-25 | Detection Technology Oy | Packaging structure for imaging detectors |
JP4414646B2 (ja) | 2002-11-18 | 2010-02-10 | 浜松ホトニクス株式会社 | 光検出装置 |
JP4365108B2 (ja) * | 2003-01-08 | 2009-11-18 | 浜松ホトニクス株式会社 | 配線基板、及びそれを用いた放射線検出器 |
JP2004362905A (ja) * | 2003-06-04 | 2004-12-24 | Nippon Telegr & Teleph Corp <Ntt> | 直接メタノール型燃料電池用電解質膜の製造方法 |
US20060289777A1 (en) | 2005-06-29 | 2006-12-28 | Wen Li | Detector with electrically isolated pixels |
US7231017B2 (en) | 2005-07-27 | 2007-06-12 | Physical Optics Corporation | Lobster eye X-ray imaging system and method of fabrication thereof |
US7456409B2 (en) | 2005-07-28 | 2008-11-25 | Carestream Health, Inc. | Low noise image data capture for digital radiography |
CN1947660B (zh) | 2005-10-14 | 2010-09-29 | 通用电气公司 | 用于多管芯背光照明二极管的系统、方法和模块组件 |
US7480362B2 (en) | 2005-10-28 | 2009-01-20 | Koninklijke Philips Electronics N.V. | Method and apparatus for spectral computed tomography |
WO2008008663A2 (en) | 2006-07-10 | 2008-01-17 | Koninklijke Philips Electronics, N.V. | Energy spectrum reconstruction |
WO2008050283A2 (en) * | 2006-10-25 | 2008-05-02 | Koninklijke Philips Electronics N.V. | Apparatus, imaging device and method for detecting x-ray radiation |
US8237128B2 (en) | 2006-12-13 | 2012-08-07 | Koninklijke Philips Electronics N.V. | Apparatus, imaging device and method for counting X-ray photons |
JP4734224B2 (ja) * | 2006-12-18 | 2011-07-27 | 本田技研工業株式会社 | バッファ層膜厚測定方法 |
US8050385B2 (en) | 2007-02-01 | 2011-11-01 | Koninklijke Philips Electronics N.V. | Event sharing restoration for photon counting detectors |
US7696483B2 (en) | 2007-08-10 | 2010-04-13 | General Electric Company | High DQE photon counting detector using statistical recovery of pile-up events |
CN101796429A (zh) | 2007-09-07 | 2010-08-04 | 皇家飞利浦电子股份有限公司 | 具有若干转换层的辐射探测器 |
US7916836B2 (en) * | 2007-09-26 | 2011-03-29 | General Electric Company | Method and apparatus for flexibly binning energy discriminating data |
CN102124372B (zh) | 2007-09-27 | 2014-12-17 | 皇家飞利浦电子股份有限公司 | 用于确定计数结果的处理电子器件和方法以及用于x射线成像设备的探测器 |
CN101903802B (zh) | 2007-12-20 | 2013-09-11 | 皇家飞利浦电子股份有限公司 | 直接转换探测器 |
JP2011521212A (ja) | 2008-04-30 | 2011-07-21 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 計数検出器 |
CN101644780A (zh) | 2008-08-04 | 2010-02-10 | 北京大学 | 一种闪烁晶体阵列探测装置 |
CA2650066A1 (en) | 2009-01-16 | 2010-07-16 | Karim S. Karim | Photon counting and integrating pixel readout architecture with dynamic switching operation |
JP2010237643A (ja) * | 2009-03-09 | 2010-10-21 | Fuji Xerox Co Ltd | 表示媒体、書込装置、及び表示装置 |
US8384038B2 (en) * | 2009-06-24 | 2013-02-26 | General Electric Company | Readout electronics for photon counting and energy discriminating detectors |
DE102009055807B4 (de) | 2009-11-26 | 2016-11-24 | Siemens Healthcare Gmbh | Schaltungsanordnung zur Zählung von Röntgenquanten einer Röntgenstrahlung mittels quantenzählender Detektoren sowie anwendungsspezifische integrierte Schaltung und Strahler-Detektor-System |
CN101862200B (zh) | 2010-05-12 | 2012-07-04 | 中国科学院上海应用物理研究所 | 一种快速x射线荧光ct方法 |
KR101634250B1 (ko) * | 2010-06-21 | 2016-06-28 | 삼성전자주식회사 | 대면적 엑스선 검출기 및 제조방법 |
JP5208186B2 (ja) | 2010-11-26 | 2013-06-12 | 富士フイルム株式会社 | 放射線画像検出装置およびその駆動制御方法 |
US8659148B2 (en) * | 2010-11-30 | 2014-02-25 | General Electric Company | Tileable sensor array |
EP2490441A1 (en) | 2011-02-16 | 2012-08-22 | Paul Scherrer Institut | Single photon counting detector system having improved counter architecture |
KR101761817B1 (ko) * | 2011-03-04 | 2017-07-26 | 삼성전자주식회사 | 대면적 엑스선 검출기 |
JP5508340B2 (ja) | 2011-05-30 | 2014-05-28 | 富士フイルム株式会社 | 放射線画像検出装置及び放射線画像検出装置の制御方法 |
JP5875790B2 (ja) | 2011-07-07 | 2016-03-02 | 株式会社東芝 | 光子計数型画像検出器、x線診断装置、及びx線コンピュータ断層装置 |
WO2013012809A1 (en) | 2011-07-15 | 2013-01-24 | Brookhaven Science Associates, Llc | Radiation detector modules based on multi-layer cross strip semiconductor detectors |
WO2013015350A1 (ja) | 2011-07-26 | 2013-01-31 | 富士フイルム株式会社 | 放射線撮影装置及びその制御方法、並びに放射線画像検出装置 |
US8929507B2 (en) | 2011-10-19 | 2015-01-06 | Kabushiki Kaisha Toshiba | Method and system for substantially reducing ring artifact based upon ring statistics |
WO2013057803A1 (ja) | 2011-10-19 | 2013-04-25 | Oya Nagato | 補正装置と解析表示装置を具備する放射線およびイオン検出装置および解析表示方法 |
JPWO2013084839A1 (ja) | 2011-12-09 | 2015-04-27 | ソニー株式会社 | 撮像装置、電子機器、輝尽発光検出スキャナーおよび撮像方法 |
JP2013142578A (ja) * | 2012-01-10 | 2013-07-22 | Shimadzu Corp | 放射線検出器 |
CN103296035B (zh) | 2012-02-29 | 2016-06-08 | 中国科学院微电子研究所 | X射线平板探测器及其制造方法 |
US8933412B2 (en) * | 2012-06-21 | 2015-01-13 | Honeywell International Inc. | Integrated comparative radiation sensitive circuit |
DE102012213494A1 (de) * | 2012-07-31 | 2014-02-06 | Siemens Aktiengesellschaft | Detektion von Röntgenstrahlung und Röntgendetektorsystem |
DE102012213404B3 (de) | 2012-07-31 | 2014-01-23 | Siemens Aktiengesellschaft | Verfahren zur Temperaturstabilisierung, Röntgenstrahlungsdetektor und CT-System |
DE102012215041A1 (de) | 2012-08-23 | 2014-02-27 | Siemens Aktiengesellschaft | Verfahren zur Herstellung eines Halbleiterelementes eines direktkonvertierenden Röntgendetektors |
DE102012215818A1 (de) * | 2012-09-06 | 2014-03-06 | Siemens Aktiengesellschaft | Strahlungsdetektor und Verfahren zur Herstellung eines Strahlungsdetektors |
JP6061129B2 (ja) | 2012-09-14 | 2017-01-18 | 株式会社島津製作所 | 放射線検出器の製造方法 |
KR101410736B1 (ko) * | 2012-11-26 | 2014-06-24 | 한국전기연구원 | 면 광원 일체형의 다층 구조를 가지는 디지털 엑스-선 영상 검출기 |
US9024269B2 (en) * | 2012-12-27 | 2015-05-05 | General Electric Company | High yield complementary metal-oxide semiconductor X-ray detector |
US9791590B2 (en) * | 2013-01-31 | 2017-10-17 | Rapiscan Systems, Inc. | Portable security inspection system |
KR20140132098A (ko) | 2013-05-07 | 2014-11-17 | 삼성전자주식회사 | 엑스선 검출기, 이를 포함하는 엑스선 영상 장치 및 그 제어 방법 |
JP2015011018A (ja) | 2013-07-02 | 2015-01-19 | 株式会社東芝 | 試料分析方法、プログラムおよび試料分析装置 |
JP6214031B2 (ja) | 2013-07-19 | 2017-10-18 | 国立研究開発法人理化学研究所 | 放射線検出器のための信号データ処理方法、信号データ処理装置、および放射線検出システム |
JP6108575B2 (ja) | 2013-09-18 | 2017-04-05 | 株式会社吉田製作所 | 画像処理装置及びx線撮影装置 |
US9520439B2 (en) | 2013-09-23 | 2016-12-13 | Omnivision Technologies, Inc. | X-ray and optical image sensor |
CN103715214A (zh) | 2013-12-02 | 2014-04-09 | 江苏龙信电子科技有限公司 | 一种高清晰度数字x射线平板探测器的制造方法 |
EP3281041B1 (en) * | 2015-04-07 | 2020-06-10 | Shenzhen Xpectvision Technology Co., Ltd. | Methods of making semiconductor x-ray detector |
SG11201707508PA (en) * | 2015-04-07 | 2017-10-30 | Shenzhen Xpectvision Tech Co Ltd | Semiconductor x-ray detector |
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TWI632391B (zh) | 2018-08-11 |
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CN107533146B (zh) | 2019-06-18 |
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