JP6061129B2 - 放射線検出器の製造方法 - Google Patents
放射線検出器の製造方法 Download PDFInfo
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- JP6061129B2 JP6061129B2 JP2012202723A JP2012202723A JP6061129B2 JP 6061129 B2 JP6061129 B2 JP 6061129B2 JP 2012202723 A JP2012202723 A JP 2012202723A JP 2012202723 A JP2012202723 A JP 2012202723A JP 6061129 B2 JP6061129 B2 JP 6061129B2
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- 230000005855 radiation Effects 0.000 title claims description 69
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 96
- 229910004613 CdTe Inorganic materials 0.000 claims description 67
- 230000000903 blocking effect Effects 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 37
- 239000000460 chlorine Substances 0.000 claims description 20
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 19
- 229910052801 chlorine Inorganic materials 0.000 claims description 19
- 239000011701 zinc Substances 0.000 claims description 16
- 239000011261 inert gas Substances 0.000 claims description 7
- 230000000704 physical effect Effects 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 description 123
- 238000002347 injection Methods 0.000 description 21
- 239000007924 injection Substances 0.000 description 21
- 239000013078 crystal Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 18
- 239000011159 matrix material Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 13
- 239000003990 capacitor Substances 0.000 description 12
- 125000001309 chloro group Chemical group Cl* 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 238000002474 experimental method Methods 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- 238000001514 detection method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 238000007740 vapor deposition Methods 0.000 description 7
- 229910004611 CdZnTe Inorganic materials 0.000 description 6
- 239000000969 carrier Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910007709 ZnTe Inorganic materials 0.000 description 4
- 230000008034 disappearance Effects 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- YKYOUMDCQGMQQO-UHFFFAOYSA-L cadmium dichloride Chemical compound Cl[Cd]Cl YKYOUMDCQGMQQO-UHFFFAOYSA-L 0.000 description 2
- QWUZMTJBRUASOW-UHFFFAOYSA-N cadmium tellanylidenezinc Chemical compound [Zn].[Cd].[Te] QWUZMTJBRUASOW-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000103 photoluminescence spectrum Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000005092 sublimation method Methods 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1864—Annealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14696—The active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/115—Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Measurement Of Radiation (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Description
すなわち、従来構成のようにCdTe層に塩素ドープを行っただけでは、CdTe層の性能の向上は不十分である。
すなわち、本発明に係る放射線検出器の製造方法は、基板上に電荷阻止層を生成する電荷阻止層生成工程と、電荷阻止層とヘテロ接合するとともに塩素がドープされた多結晶膜で構成されるCdTe層を基板上の電荷阻止層を覆うように生成するCdTe層生成工程と、電荷阻止層およびCdTe層が生成された基板をCdTe層がN型の半導体の物性を有するようになる温度と時間である4時間以上30時間以内の時間、250℃以上500℃以下の温度で熱処理する熱処理工程とを備えることを特徴とするものである。
続いて、変換層9の熱処理が有効であることを示す実験を行ったのでこれについて説明する。図6は、変換モジュール1に直流電流を流したときのIV特性である。図6左側は、熱処理前の変換モジュール1を表しており、図6右側は、熱処理後の変換モジュール1を表している。変換層9は、ZnがドープされたCdZnTe層である。熱処理は、350℃で4時間行った。なお、変換モジュール1には、電流を支持基板3から変換層9に向けて流すものとし、この方向の電流を正方向の電流とする。
次に、上述の実験と同様の実験を処理温度と処理時間を変えて行った結果について説明する。図7は、熱処理前の変換モジュール1と熱処理後の変換モジュール1に対して電圧を印加したときに流れた暗電流を測定したものである。この実験に用いた変換層9もCdZnTe層である。グラフ中、網掛けがされていないものは、熱処理前の試料を示し、網掛けがされているものは熱処理後の試料を示している。なお暗電流とは、変換層9に放射線が入射していないときに検出される電流であり、これが大きすぎるとノイズやダイナミックレンジ低下の原因になる。
続いて、フォトルミネッセンススペクトル測定により変換層9の特性が改善された様子が観察されたのでこれについて説明する。フォトルミネッセンス分析とは、試料にレーザ光を照射し、これにより試料を構成する物質の電子を励起させ、励起された電子が標準状態に戻る過程で発する蛍光の波長と強度を測定するというものである。この測定における試料とは、熱処理前と熱処理後の変換層9である。この実験に用いた変換層9もCdZnTe層である。
図10は、変換モジュール1の断面を電子顕微鏡で観察した結果である。図10左側は、熱処理前の変換モジュール1を表しており、図10右側は、熱処理後の変換モジュール1を表している。熱処理は、処理温度350℃で4時間行った。この実験に用いた変換層9もCdZnTe層である。
以上のように、熱処理工程S3における条件の範囲は、処理時間としては4時間以上が望ましい。また実験により有効な処理時間として確認されているのは30時間までである。ではあるが、本発明のような効果を得られる条件であれば、これ以上に時間を長くすることもできる。また、処理温度としては、250℃以上が望ましい。また実験により有効な処理温度として確認されているのは350℃までである。ただし、単結晶のCdTe材料において、380℃の加熱処理により図5で説明した現象が発生することが知られている。したがって、本発明においてもこの温度まで処理温度を上昇させることができるものと考えられる。本発明における変換層9は多結晶膜で構成されるが、微視的にみれば、単結晶材料と同様のメカニズムで物性の変化が生じるものと考えられるからである。
7 電子注入阻止層(ZnTe層)
9 変換層(CdTe層)
S1 電子注入阻止層生成工程
S2 変換層生成工程(CdTe層生成工程)
S3 熱処理工程
Claims (3)
- 基板上に電荷阻止層を生成する電荷阻止層生成工程と、
前記電荷阻止層とヘテロ接合するとともに塩素がドープされた多結晶膜で構成されるCdTe層を前記基板上の前記電荷阻止層を覆うように生成するCdTe層生成工程と、
前記電荷阻止層および前記CdTe層が生成された前記基板を前記CdTe層がN型の半導体の物性を有するようになる温度と時間である4時間以上30時間以内の時間、250℃以上500℃以下の温度で熱処理する熱処理工程とを備えることを特徴とする放射線検出器の製造方法。 - 請求項1に記載の放射線検出器の製造方法において、
前記CdTe層生成工程において、前記CdTe層には、塩素に加えて亜鉛もドープされることを特徴とする放射線検出器の製造方法。 - 請求項1または請求項2に記載の放射線検出器の製造方法において、
前記熱処理工程は、不活性ガスの雰囲気中で行われることを特徴とする放射線検出器の製造方法。
Priority Applications (2)
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JP2012202723A JP6061129B2 (ja) | 2012-09-14 | 2012-09-14 | 放射線検出器の製造方法 |
US13/784,117 US8895341B2 (en) | 2012-09-14 | 2013-03-04 | Method of manufacturing radiation detector |
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JP2012202723A JP6061129B2 (ja) | 2012-09-14 | 2012-09-14 | 放射線検出器の製造方法 |
Publications (3)
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JP2014059155A JP2014059155A (ja) | 2014-04-03 |
JP2014059155A5 JP2014059155A5 (ja) | 2015-08-20 |
JP6061129B2 true JP6061129B2 (ja) | 2017-01-18 |
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JP2012202723A Expired - Fee Related JP6061129B2 (ja) | 2012-09-14 | 2012-09-14 | 放射線検出器の製造方法 |
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JP (1) | JP6061129B2 (ja) |
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EP3281040B1 (en) * | 2015-04-07 | 2021-11-24 | Shenzhen Xpectvision Technology Co., Ltd. | Semiconductor x-ray detector |
WO2016161544A1 (en) * | 2015-04-07 | 2016-10-13 | Shenzhen Xpectvision Technology Co.,Ltd. | Semiconductor x-ray detector |
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US4343881A (en) * | 1981-07-06 | 1982-08-10 | Savin Corporation | Multilayer photoconductive assembly with intermediate heterojunction |
JPH04269653A (ja) | 1991-02-25 | 1992-09-25 | Nippon Telegr & Teleph Corp <Ntt> | 漏洩磁束検出装置 |
JPH06345598A (ja) * | 1993-06-04 | 1994-12-20 | Japan Energy Corp | 放射線検出素子用CdTe結晶およびその製造方法 |
JPH09124310A (ja) * | 1995-10-27 | 1997-05-13 | Sumitomo Metal Mining Co Ltd | CdTe結晶の製造方法 |
JP4269653B2 (ja) | 2002-11-20 | 2009-05-27 | 株式会社島津製作所 | 放射線検出器の製造方法 |
CN101952966B (zh) * | 2008-02-12 | 2013-06-12 | 株式会社岛津制作所 | 放射线检测器的制造方法、放射线检测器以及放射线摄像装置 |
WO2009158547A2 (en) * | 2008-06-25 | 2009-12-30 | Michael Wang | Semiconductor heterojunction photovoltaic solar cell with a charge blocking layer |
US8563940B2 (en) * | 2009-04-03 | 2013-10-22 | Shimadzu Corporation | Radiation detector manufacturing method, a radiation detector, and a radiographic apparatus |
DE102010006452B4 (de) * | 2010-02-01 | 2012-01-26 | Siemens Aktiengesellschaft | Strahlenwandlermaterial, Strahlenwandler, Strahlendetektor, Verwendung eines Strahlenwandlermaterials und Verfahren zur Herstellung eines Strahlenwandlermaterials |
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US8895341B2 (en) | 2014-11-25 |
US20140080243A1 (en) | 2014-03-20 |
JP2014059155A (ja) | 2014-04-03 |
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