JP2004520713A - 選択エミッター層を有する太陽電池 - Google Patents
選択エミッター層を有する太陽電池 Download PDFInfo
- Publication number
- JP2004520713A JP2004520713A JP2002561294A JP2002561294A JP2004520713A JP 2004520713 A JP2004520713 A JP 2004520713A JP 2002561294 A JP2002561294 A JP 2002561294A JP 2002561294 A JP2002561294 A JP 2002561294A JP 2004520713 A JP2004520713 A JP 2004520713A
- Authority
- JP
- Japan
- Prior art keywords
- doping
- layer
- solar cell
- paste
- oxide layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- 238000005530 etching Methods 0.000 claims abstract description 35
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- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 32
- 238000009792 diffusion process Methods 0.000 claims description 32
- 229910052710 silicon Inorganic materials 0.000 claims description 23
- 239000010703 silicon Substances 0.000 claims description 23
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 22
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 21
- 229910052796 boron Inorganic materials 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 19
- 229910052698 phosphorus Inorganic materials 0.000 claims description 18
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- 238000004519 manufacturing process Methods 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 239000004922 lacquer Substances 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 10
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 8
- LDDQLRUQCUTJBB-UHFFFAOYSA-O azanium;hydrofluoride Chemical compound [NH4+].F LDDQLRUQCUTJBB-UHFFFAOYSA-O 0.000 claims description 6
- 238000002161 passivation Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 claims 3
- 229910017855 NH 4 F Inorganic materials 0.000 claims 2
- 239000010410 layer Substances 0.000 description 96
- 210000004027 cell Anatomy 0.000 description 67
- 235000012431 wafers Nutrition 0.000 description 28
- 235000010210 aluminium Nutrition 0.000 description 15
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 10
- 230000000873 masking effect Effects 0.000 description 8
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001639 boron compounds Chemical class 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- IJJWOSAXNHWBPR-HUBLWGQQSA-N 5-[(3as,4s,6ar)-2-oxo-1,3,3a,4,6,6a-hexahydrothieno[3,4-d]imidazol-4-yl]-n-(6-hydrazinyl-6-oxohexyl)pentanamide Chemical compound N1C(=O)N[C@@H]2[C@H](CCCCC(=O)NCCCCCC(=O)NN)SC[C@@H]21 IJJWOSAXNHWBPR-HUBLWGQQSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
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- 230000009969 flowable effect Effects 0.000 description 1
- 239000003349 gelling agent Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
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- 239000003607 modifier Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
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- 238000011160 research Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
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- 239000002344 surface layer Substances 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B10/00—Integration of renewable energy sources in buildings
- Y02B10/10—Photovoltaic [PV]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Printing Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10104726A DE10104726A1 (de) | 2001-02-02 | 2001-02-02 | Verfahren zur Strukturierung einer auf einem Trägermaterial aufgebrachten Oxidschicht |
| PCT/EP2002/001096 WO2002061854A2 (de) | 2001-02-02 | 2002-02-01 | Verfahren zur strukturierung einer auf einem trägermaterial aufgebrachten oxidschicht |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004520713A true JP2004520713A (ja) | 2004-07-08 |
| JP2004520713A5 JP2004520713A5 (cg-RX-API-DMAC7.html) | 2005-06-23 |
Family
ID=7672635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002561294A Pending JP2004520713A (ja) | 2001-02-02 | 2002-02-01 | 選択エミッター層を有する太陽電池 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7129109B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP1390987B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2004520713A (cg-RX-API-DMAC7.html) |
| CN (1) | CN1316638C (cg-RX-API-DMAC7.html) |
| AT (1) | ATE346382T1 (cg-RX-API-DMAC7.html) |
| AU (1) | AU2002244699B2 (cg-RX-API-DMAC7.html) |
| DE (2) | DE10104726A1 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2002061854A2 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011023690A (ja) * | 2009-07-20 | 2011-02-03 | E-Ton Solar Tech Co Ltd | 選択エミッタ構造の電極パターンのアラインメント方法 |
| JP4845742B2 (ja) * | 2004-02-13 | 2011-12-28 | シェル ゾーラー ゲーエムベーハー | ウエハに液状ドーパント溶液を塗布するための機器 |
Families Citing this family (92)
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| ES2289168T3 (es) * | 2001-11-26 | 2008-02-01 | Shell Solar Gmbh | Celula solar con contactos en la parte posterior y su procedimiento de fabricacion. |
| JP4582538B2 (ja) * | 2004-10-21 | 2010-11-17 | Okiセミコンダクタ株式会社 | 導電性インクの印刷方法及び導電性インクの印刷装置 |
| KR101188425B1 (ko) * | 2005-08-24 | 2012-10-05 | 엘지디스플레이 주식회사 | 식각 테이프 및 이를 이용한 액정 표시 장치용 어레이기판의 제조 방법 |
| CA2640649A1 (en) * | 2006-02-28 | 2007-09-07 | Ciba Holding Inc. | Antimicrobial compounds |
| ATE441156T1 (de) * | 2006-05-04 | 2009-09-15 | Elektrobit Wireless Comm Ltd | Verfahren zum betrieb eines rfid-netzwerks |
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| US20080014661A1 (en) * | 2006-07-11 | 2008-01-17 | Michael Haag | Method for the manufacture of solar panels and special transport carrier |
| FR2906405B1 (fr) * | 2006-09-22 | 2008-12-19 | Commissariat Energie Atomique | Procede de realisation de regions dopees dans un substrat et de cellule photovoltaique |
| WO2008070087A2 (en) * | 2006-12-05 | 2008-06-12 | Nano Terra Inc. | Method for patterning a surface |
| US8608972B2 (en) * | 2006-12-05 | 2013-12-17 | Nano Terra Inc. | Method for patterning a surface |
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- 2002-02-01 US US10/470,896 patent/US7129109B2/en not_active Expired - Fee Related
- 2002-02-01 AT AT02712887T patent/ATE346382T1/de not_active IP Right Cessation
- 2002-02-01 JP JP2002561294A patent/JP2004520713A/ja active Pending
- 2002-02-01 WO PCT/EP2002/001096 patent/WO2002061854A2/de not_active Ceased
- 2002-02-01 AU AU2002244699A patent/AU2002244699B2/en not_active Ceased
- 2002-02-01 DE DE50208787T patent/DE50208787D1/de not_active Expired - Lifetime
- 2002-02-01 CN CNB028044479A patent/CN1316638C/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4845742B2 (ja) * | 2004-02-13 | 2011-12-28 | シェル ゾーラー ゲーエムベーハー | ウエハに液状ドーパント溶液を塗布するための機器 |
| JP2011023690A (ja) * | 2009-07-20 | 2011-02-03 | E-Ton Solar Tech Co Ltd | 選択エミッタ構造の電極パターンのアラインメント方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1316638C (zh) | 2007-05-16 |
| US7129109B2 (en) | 2006-10-31 |
| EP1390987A2 (de) | 2004-02-25 |
| US20040110393A1 (en) | 2004-06-10 |
| DE50208787D1 (de) | 2007-01-04 |
| EP1390987B1 (de) | 2006-11-22 |
| CN1537334A (zh) | 2004-10-13 |
| WO2002061854A2 (de) | 2002-08-08 |
| DE10104726A1 (de) | 2002-08-08 |
| ATE346382T1 (de) | 2006-12-15 |
| AU2002244699B2 (en) | 2006-08-31 |
| WO2002061854A3 (de) | 2003-12-11 |
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