KR101104606B1 - 태양전지용 선택적 에미터의 제조방법 및 그에 사용되는마스크 패턴 제조용 페이스트. - Google Patents
태양전지용 선택적 에미터의 제조방법 및 그에 사용되는마스크 패턴 제조용 페이스트. Download PDFInfo
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- KR101104606B1 KR101104606B1 KR1020080014741A KR20080014741A KR101104606B1 KR 101104606 B1 KR101104606 B1 KR 101104606B1 KR 1020080014741 A KR1020080014741 A KR 1020080014741A KR 20080014741 A KR20080014741 A KR 20080014741A KR 101104606 B1 KR101104606 B1 KR 101104606B1
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- Prior art keywords
- mask pattern
- paste
- mask
- selective emitter
- silicon substrate
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- 238000000034 method Methods 0.000 title claims abstract description 41
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 51
- 239000010703 silicon Substances 0.000 claims abstract description 51
- 238000005530 etching Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000012535 impurity Substances 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 238000007650 screen-printing Methods 0.000 claims abstract description 14
- 229920005596 polymer binder Polymers 0.000 claims abstract description 12
- 239000002491 polymer binding agent Substances 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims description 19
- 239000002904 solvent Substances 0.000 claims description 10
- 239000003960 organic solvent Substances 0.000 claims description 8
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 7
- 239000001856 Ethyl cellulose Substances 0.000 claims description 7
- 229920001249 ethyl cellulose Polymers 0.000 claims description 7
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 7
- 150000007522 mineralic acids Chemical class 0.000 claims description 6
- 150000007524 organic acids Chemical class 0.000 claims description 6
- 150000001298 alcohols Chemical class 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 150000002902 organometallic compounds Chemical class 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 3
- 150000002170 ethers Chemical class 0.000 claims description 3
- 150000002334 glycols Chemical class 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- -1 polypropylene Polymers 0.000 claims description 3
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 2
- 150000002739 metals Chemical group 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 15
- 239000002253 acid Substances 0.000 abstract description 15
- 239000011574 phosphorus Substances 0.000 abstract description 15
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 15
- 238000009792 diffusion process Methods 0.000 abstract description 14
- 239000003513 alkali Substances 0.000 abstract description 4
- 238000000059 patterning Methods 0.000 abstract description 4
- 229920000642 polymer Polymers 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 24
- 239000000945 filler Substances 0.000 description 16
- 239000000843 powder Substances 0.000 description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 15
- 238000011156 evaluation Methods 0.000 description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 13
- 238000002474 experimental method Methods 0.000 description 11
- 239000010408 film Substances 0.000 description 9
- 239000011230 binding agent Substances 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229960004667 ethyl cellulose Drugs 0.000 description 6
- 239000012670 alkaline solution Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229940070721 polyacrylate Drugs 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229960002050 hydrofluoric acid Drugs 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
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- 238000005096 rolling process Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
Glass frit | SiO2 | SiO2 + Glass frit | |||
Ethyl-cellulose | 내산성 | △ | ○ | ○ | |
패턴 분해성 |
EtOH | ○ | ○ | ○ | |
Acetone | △ | △ | △ | ||
Poly-acrylate | 내산성 | ○ | ○ | ○ | |
패턴 분해성 |
EtOH | △ | △ | △ | |
Acetone | △ | △ | △ |
GF+SiO2 25wt% | SiO2 40wt% | SiO2 25wt% | |
인쇄두께 | < 10 ㎛ | 10 ~ 15 ㎛ | < 10 ㎛ |
마스킹된 부분 | 67.18 Ω | 62.03 Ω | 63.25 Ω |
68.91 Ω | 61.39 Ω | 65.02 Ω | |
69.14 Ω | 62.75 Ω | 68.73 Ω | |
마스킹되지 않은 부분 | 215.1 Ω | 241.8 Ω | 215.8 Ω |
205.3 Ω | 236.8 Ω | 206.7 Ω | |
220.9 Ω | 237.1 Ω | 222 Ω |
Claims (11)
- a) 제 1표면에 고농도의 불순물이 도핑된 실리콘 기재를 준비하는 단계;b) 에칭액에는 용해되지 않고, 마스크 제거액에는 용해되는 고분자 바인더; 용매; 및 무기 충진제를 포함하는 페이스트를 상기 실리콘 기재 상에 스크린 프린팅하여 마스크 패턴을 제조하는 단계;c) 상기 실리콘 기재 상의 마스크 패턴이 형성되지 않은 부분을 에칭액 중에서 에칭하여, 제 1표면의 불순물 농도보다 낮은 불순물 농도를 갖는 제 2 표면을 노출하고, 상기 제 2 표면보다 높은 불순물농도를 갖는 선택적 에미터를 형성하는 단계; 및d) 마스크 제거액 중에서 상기 선택적 에미터 상의 마스크 패턴을 제거하는 단계를 포함하며,상기 마스크 제거액은 알코올(alcohol)류, 글리콜(glycol)류, 에테르(ether)류, 에스테르(ester)류 및 케톤(Ketone)류로 구성된 군에서 선택된 유기용매를 포함하는 것이 특징인 실리콘 태양전지용 선택적 에미터(selective emitter)의 제조방법.
- 제 1항에 있어서, 상기 에칭액은 무기산 또는 유기산을 포함하는 것이 특징인 실리콘 태양전지용 선택적 에미터의 제조방법.
- 삭제
- 제 1항에 있어서, 상기 마스크 제거액은 무기산 또는 유기산을 더 포함하는 것이 특징인 실리콘 태양전지용 선택적 에미터의 제조방법.
- 제 1항에 있어서, 상기 b)단계에서 페이스트를 20 ~ 200 ℃ 범위로 건조하거나 또는 자외선 조사에 의해 경화하여 마스크 패턴을 형성하는 것이 특징인 실리콘 태양전지용 선택적 에미터의 제조방법.
- 에칭액에는 용해되지 않고, 마스크 제거액에는 용해되는 고분자 바인더; 용매; 및 무기 충진제를 포함하며,상기 마스크 제거액은 알코올(alcohol)류, 글리콜(glycol)류, 에테르(ether)류, 에스테르(ester)류 및 케톤(Ketone)류로 구성된 군에서 선택된 유기용매를 포함하는 것이 특징인 실리콘 태양전지용 선택적 에미터 형성에 사용되는 마스크 패턴 제조용 페이스트.
- 제 6항에 있어서, 상기 고분자 바인더는 100 내지 100만의 분자량을 갖는 것으로서, 에틸셀룰로스, 아크릴레이트수지, 에폭시수지, 폴리스티렌 및 폴리프로필렌으로 구성된 군에서 선택된 것이 특징인, 실리콘 태양전지용 선택적 에미터 형성에 사용되는 마스크 패턴 제조용 페이스트.
- 제 6항에 있어서, 상기 용매는 카비톨계, 터피놀계 및 텍사놀계로 구성된 군에서 선택된 것이 특징인 실리콘 태양전지용 선택적 에미터 형성에 사용되는 마스크 패턴 제조용 페이스트.
- 제 6항에 있어서, 상기 무기 충진제는 금속, 금속산화물 및 글래스 프릿(glass frit)로 구성된 군에서 선택된 것이 특징인 실리콘 태양전지용 선택적 에미터 형성에 사용되는 마스크 패턴 제조용 페이스트.
- 제 6항에 있어서, 유기금속화합물 및 용매로 구성된 SOG(spin on glass) 물질을 포함하는 것이 특징인 실리콘 태양전지용 선택적 에미터 형성에 사용되는 마스크 패턴 제조용 페이스트.
- 제 1항, 제 2항, 제 4항 및 제 5항 중 어느 한 항에 기재된 방법에 의해 선택적 에미터가 형성된 실리콘 태양전지.
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KR101206250B1 (ko) * | 2009-10-13 | 2012-11-28 | 주식회사 엘지화학 | 식각 마스크 패턴 형성용 페이스트 및 이의 스크린 인쇄법을 이용한 실리콘 태양전지의 제조방법 |
KR101154095B1 (ko) * | 2010-05-17 | 2012-06-11 | 주식회사 신성솔라에너지 | 태양 전지 및 그 제조 방법 |
KR101714779B1 (ko) | 2010-10-11 | 2017-03-09 | 엘지전자 주식회사 | 태양전지 및 이의 제조 방법 |
KR101101587B1 (ko) * | 2010-12-08 | 2012-01-02 | 현대중공업 주식회사 | 실리콘 태양전지의 선택적 에미터 형성 방법 |
KR101207504B1 (ko) * | 2010-12-16 | 2012-12-05 | 한국생산기술연구원 | 채널 구조의 유기박막 태양전지 제조방법 |
KR101729304B1 (ko) * | 2010-12-21 | 2017-04-21 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
US9368655B2 (en) | 2010-12-27 | 2016-06-14 | Lg Electronics Inc. | Solar cell and method for manufacturing the same |
CN102779898A (zh) * | 2012-06-27 | 2012-11-14 | 友达光电股份有限公司 | 制作太能阳电池的方法 |
KR101447781B1 (ko) * | 2012-09-18 | 2014-10-07 | 주식회사 세아엔지니어링 | 염료감응 태양전지 제조를 위한 자외선 처리 장치 |
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