JP2004334214A - 薄膜トランジスタ・アレイ基板及びその製造方法 - Google Patents
薄膜トランジスタ・アレイ基板及びその製造方法 Download PDFInfo
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 8
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
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- 229910052581 Si3N4 Inorganic materials 0.000 description 2
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
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- 238000001039 wet etching Methods 0.000 description 2
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- WZMARNWNQFFBKK-UHFFFAOYSA-N [In+3].[O-2].[Zn+2].[In+3].[O-2].[O-2].[O-2] Chemical compound [In+3].[O-2].[Zn+2].[In+3].[O-2].[O-2].[O-2] WZMARNWNQFFBKK-UHFFFAOYSA-N 0.000 description 1
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- 125000006850 spacer group Chemical group 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- G—PHYSICS
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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- G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
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Abstract
【課題】本発明はマスク工程数を節減することができる薄膜トランジスタ・アレイ基板及びその製造方法に関するものである。
【解決手段】本発明に係る薄膜トランジスタ・アレイ基板は、ゲートラインと、前記ゲートラインと絶縁されるように交差して画素領域を決めるデータラインと、前記ゲートライン及びデータラインの交差部に形成された薄膜トランジスタと、前記薄膜トランジスタのチャンネル部を形成する半導体層と、前記薄膜トランジスタのドレーン電極と接続されて前記画素領域に形成された画素電極と、前記データライン、前記薄膜トランジスタのチャンネル領域、ソース電極、ドレーン電極及び前記画素電極と同一なパターンに前記ゲートライン及びゲート電極を覆うように形成されたゲート絶縁パターンとを具備することを特徴とする。
【選択図】図5
Description
本発明に係る薄膜トランジスタ・アレイ基板及びその製造方法はマスク工程数を減らすために第2及び第3導電パターン群をマスクとしてゲート絶縁膜とオーミック接触層を同時に乾式食刻するようになる。
4、104・・・データライン
6、106・・・薄膜トランジスタ
8、108・・・ゲート電極
10、110・・ソース電極
12、112・・ドレーン電極
13、27、33、39・・接触ホール
14、114・・画素電極
22・・・・・・ストレ-ジ電極
26・・・・・・ゲートパッド下部電極
28・・・・・・ゲートパッド上部電極
32、132・・データパッド下部電極
34、134・・データパッド上部電極
45、145・・基板
46、143・・ゲート絶縁膜
48、148・・活性層
50、150・・オーミック接触層
52・・・・・・保護膜
146・・・・・ゲート絶縁パターン
153・・・・・配向膜
Claims (18)
- 基板上に形成されたゲートラインと、前記ゲートラインと絶縁されるように交差して画素領域を決めるデータラインと、前記ゲートライン及びデータラインの交差部に形成された薄膜トランジスタと、前記薄膜トランジスタのチャンネル部を形成する半導体層と、前記薄膜トランジスタのドレーン電極と接続されて、前記画素領域に形成された画素電極と、前記データライン、前記薄膜トランジスタのチャンネル部領域、ソース電極、ドレーン電極及び前記画素電極と同一なパターンに前記ゲートライン及びゲート電極を覆うように形成されたゲート絶縁パターン、
を具備することを特徴とする薄膜トランジスタ・アレイ基板。 - 前記データラインと接続されたデータパッド下部電極を有るデータパッドと、前記ゲートラインと接続されたゲートパッドをさらに具備することを特徴とする請求項1記載の薄膜トランジスタ・アレイ基板。
- 前記データパッドは、前記データパッド下部電極と接続されたデータパッド上部電極をさらに具備することを特徴とする請求項2記載の薄膜トランジスタ・アレイ基板。
- 前記ゲート絶縁パターンは、前記データパッド下部電極及び前記データパッド上部電極の中から少なくともいずれかと同一なパターンに形成されることを特徴とする請求項3記載の薄膜トランジスタ・アレイ基板。
- 前記薄膜トランジスタを保護するために、前記データパッドと前記ゲートパッドが形成されたパッド領域を除いた領域に形成された配向膜をさらに具備することを特徴とする請求項2記載の薄膜トランジスタ・アレイ基板。
- 前記ゲートライン、前記ゲートラインとゲート絶縁パターンを間に置いて重畳される画素電極からなるストレ-ジ・キャパシターをさらに具備することを特徴とする請求項1記載の薄膜トランジスタ・アレイ基板。
- 前記半導体層は、前記データライン、前記ソース電極、前記ドレーン電極及び前記データパッド下部電極に沿ってそれらの下部に形成されることを特徴とする請求項2記載の薄膜トランジスタ・アレイ基板。
- 基板上にゲートライン、前記ゲートラインと接続された薄膜トランジスタのゲート電極を含む第1導電パターン群を形成する段階と、前記第1導電パターン群が形成された基板上にゲート絶縁膜を形成する段階と、前記ゲートラインと絶縁されるように交差するデータライン、前記データラインと接続された前記薄膜トランジスタのソース電極、前記ソース電極と対向するドレーン電極を含む第2導電パターン群と、前記薄膜トランジスタのチャンネル部を構成する半導体層を形成する段階と、前記ドレーン電極と接続される画素電極を含む第3導電パターン群を形成する段階と、前記第2及び前記第3導電パターン群をマスクとして前記ゲート絶縁膜と前記半導体層に含まれたオーミック接触層を食刻する段階、
を含むことを特徴とする薄膜トランジスタ・アレイ基板の製造方法。 - 前記ゲート絶縁膜と前記オーミック接触層を食刻する段階は、前記ゲート絶縁膜を乾式食刻して、前記第1及び第2導電パターン群の間に前記第2及び第3導電パターン群と同一なパターンにゲート絶縁パターンを形成する段階と、前記薄膜トランジスタのオーミック接触層を乾式食刻して前記薄膜トランジスタのチャンネル部の活性層を露出させる段階、を含むことを特徴とする請求項8記載の薄膜トランジスタ・アレイ基板の製造方法。
- 前記ゲート絶縁膜と前記オーミック接触層を食刻する段階は、1:3のSF6とO2を含む食刻ガスで、1:8以上の厚さ比を持つ前記オーミック接触層と前記ゲート絶縁膜を食刻する段階を含むことを特徴とする請求項8記載の薄膜トランジスタ・アレイ基板の製造方法。
- 前記オーミック接触層を1:10のSF6とCl2を含む食刻ガスで食刻して、前記半導体層に含まれた活性層を露出させる段階をさらに含むことを特徴とする請求項10記載の薄膜トランジスタ・アレイ基板の製造方法。
- 前記ゲート絶縁膜と前記オーミック接触層を食刻する段階は、5:1のCF4とH2を含む食刻ガスで、1:10以上の厚さ比を持つ前記オーミック接触層と前記ゲート絶縁膜を食刻する段階を含むことを特徴とする請求項8記載の薄膜トランジスタ・アレイ基板の製造方法。
- 前記オーミック接触層を1:10のSF6とCl2を含む食刻ガスで食刻して、前記半導体層に含まれた活性層を露出させる段階をさらに含むことを特徴とする請求項12記載の薄膜トランジスタ・アレイ基板の製造方法。
- 前記ゲートラインと接続されるゲートパッドを形成する段階と、前記データラインと接続されたデータパッド下部電極を有るデータパッドを形成する段階をさらに含むことを特徴とする請求項9記載の薄膜トランジスタ・アレイ基板の製造方法。
- 前記データパッドを形成する段階は、前記データパッド下部電極と接続されるデータパッド上部電極を形成する段階をさらに含むことを特徴とする請求項14記載の薄膜トランジスタ・アレイ基板の製造方法。
- 前記ゲート絶縁パターンは、前記データパッド下部電極及び前記データパッド上部電極の中から少なくともいずれかと同一なパターンに形成されることを特徴とする請求項15記載の薄膜トランジスタ・アレイ基板の製造方法。
- 前記薄膜トランジスタを保護するために、前記データパッドと前記ゲートパッドが形成されたパッド領域を除いた領域に配向膜を形成する段階をさらに含むことを特徴とする請求項14記載の薄膜トランジスタ・アレイ基板の製造方法。
- 前記ゲートライン、前記ゲートラインとゲート絶縁パターンを間に置いて重畳される画素電極からなるストレージ・キャパシターをさらに形成する段階をさらに含むことを特徴とする請求項8記載の薄膜トランジスタ・アレイ基板の製造方法。
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KR1020030028642A KR100598737B1 (ko) | 2003-05-06 | 2003-05-06 | 박막 트랜지스터 어레이 기판 및 그 제조 방법 |
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JP (1) | JP4658514B2 (ja) |
KR (1) | KR100598737B1 (ja) |
CN (1) | CN100385671C (ja) |
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JP2007086197A (ja) * | 2005-09-20 | 2007-04-05 | Sharp Corp | アクティブマトリクス基板の製造方法、その製造方法により製造されたアクティブマトリクス基板を備えた表示装置 |
JP2008098606A (ja) * | 2006-10-14 | 2008-04-24 | Au Optronics Corp | 液晶表示装置の薄膜トランジスタアレイ基板及びその製造方法 |
JP2008252050A (ja) * | 2007-03-08 | 2008-10-16 | Ulvac Japan Ltd | エッチング方法 |
US7868958B2 (en) | 2006-09-05 | 2011-01-11 | Samsung Electronics Co., Ltd. | Manufacturing liquid crystal display with incremental removal of an insulating layer |
WO2011152233A1 (en) * | 2010-06-04 | 2011-12-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8216891B2 (en) | 2006-10-14 | 2012-07-10 | Au Optronics Corp. | LCD TFT array plate and fabricating method thereof |
JP2016167059A (ja) * | 2008-09-19 | 2016-09-15 | 株式会社半導体エネルギー研究所 | 表示装置 |
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- 2004-04-29 FR FR0404564A patent/FR2854732B1/fr not_active Expired - Fee Related
- 2004-04-29 DE DE102004021157A patent/DE102004021157B4/de not_active Expired - Fee Related
- 2004-04-30 GB GB0409739A patent/GB2402548B/en not_active Expired - Fee Related
- 2004-05-06 JP JP2004137480A patent/JP4658514B2/ja not_active Expired - Fee Related
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JP2008252050A (ja) * | 2007-03-08 | 2008-10-16 | Ulvac Japan Ltd | エッチング方法 |
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Also Published As
Publication number | Publication date |
---|---|
FR2854732B1 (fr) | 2007-04-13 |
TW200427098A (en) | 2004-12-01 |
GB0409739D0 (en) | 2004-06-09 |
US20040222421A1 (en) | 2004-11-11 |
US7525120B2 (en) | 2009-04-28 |
US7217586B2 (en) | 2007-05-15 |
CN1551367A (zh) | 2004-12-01 |
FR2854732A1 (fr) | 2004-11-12 |
GB2402548A (en) | 2004-12-08 |
CN100385671C (zh) | 2008-04-30 |
KR20040095045A (ko) | 2004-11-12 |
KR100598737B1 (ko) | 2006-07-10 |
DE102004021157B4 (de) | 2010-11-18 |
GB2402548B (en) | 2005-12-21 |
DE102004021157A1 (de) | 2004-12-23 |
US20070170432A1 (en) | 2007-07-26 |
JP4658514B2 (ja) | 2011-03-23 |
TWI237396B (en) | 2005-08-01 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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LAPS | Cancellation because of no payment of annual fees |