JP4107662B2 - 薄膜トランジスタアレイ基板の製造方法 - Google Patents
薄膜トランジスタアレイ基板の製造方法 Download PDFInfo
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
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- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
- G02F1/136236—Active matrix addressed cells for reducing the number of lithographic steps using a grey or half tone lithographic process
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Description
また、他の発明に係る薄膜トランジスタアレイ基板の製造方法は、薄膜トランジスタアレイ基板の製造方法は、第1マスク工程を利用して基板上に薄膜トランジスタのゲート電極、ゲート電極に接続されるゲートライン、ゲートラインに接続されるゲートパッドを形成する段階と、前記ゲートパッドが形成された基板上にゲート絶縁膜を形成する段階と、第2マスク工程を利用して前記ゲート絶縁膜上に前記薄膜トランジスタのソース電極及びドレイン電極、前記ソース電極と接続されるデータライン、前記データラインと接続されるデータパッド、前記ゲートラインと重畳される領域にストレージ電極を形成する段階と、第3マスク工程を利用して前記ドレイン電極とストレージ電極に接続されると共に、前記基板上に直接位置する画素電極、前記ゲートパッドを覆うゲートパッド保護電極、前記データパッドを覆うデータパッド保護電極を含む透明電極と、前記透明電極が形成された領域を除外した領域に前記透明電極と重畳することなくゲート絶縁パターンと保護膜パターンを形成する段階とを含み、前記第3マスク工程は、前記ストレージ電極が形成された基板上に保護膜を形成する段階と、前記第3マスクを利用してフォトレジストパターンを形成する段階と、前記フォトレジストパターンを利用して前記保護膜とゲート絶縁膜をパターニングして前記ゲート絶縁パターンと保護膜パターンを形成する段階と、前記フォトレジストパターンが残っている基板の上に透明電極物質を蒸着する段階と、前記フォトレジストパターンとその上の透明電極物質をストリップ工程で除去して透明電極パターンを形成する段階とを含み、前記保護膜パターンは、前記ドレイン電極及びストレージ電極を部分的に露出させて前記画素電極と接続されるようにする段階を含むことを特徴とする。
前記目的以外の本発明の他の目的及び利点は、添付した図面を参照した本発明の好ましい実施の形態についての詳細な説明を通して明らかになる。
以下、発明の実施の形態を、添付した図4乃至図8を参照して詳しく説明する。
図4は、本発明の実施の形態に係る薄膜トランジスタアレイ基板を図示した平面図であり、図5は、図4に図示した薄膜トランジスタアレイ基板をII-II'線に沿って切断して図示した断面図である。
Claims (6)
- 第1マスク工程を利用して基板上に薄膜トランジスタのゲート電極、ゲート電極に接続されるゲートライン、ゲートラインに接続されるゲートパッドを含むゲートパターンを形成する段階と、
前記ゲートパターンが形成された基板上にゲート絶縁膜を形成する段階と、
第2マスク工程を利用して前記ゲート絶縁膜上に前記薄膜トランジスタのソース電極及びドレイン電極、前記ソース電極と接続されるデータライン、前記データラインと接続されるデータパッド、前記ゲートラインと重畳される領域に形成されたストレージ電極を含むソース/ドレインパターンと、前記ソース/ドレインパターンに沿ってその下部に位置する半導体パターンを形成する段階と、
第3マスク工程を利用して前記ドレイン電極とストレージ電極に接続されると共に、前記基板上に直接位置する画素電極、前記ゲートパッドを覆うゲートパッド保護電極、前記データパッドを覆うデータパッド保護電極を含む透明電極パターンと、前記透明電極パターンが形成された領域を除去した領域に前記透明電極パターンと重畳することなくゲート絶縁パターンと保護膜パターンを形成する段階を含み、
前記第3マスク工程は、前記ソース/ドレインパターンが形成された基板上に保護膜を形成する段階と、前記第3マスクを利用してフォトレジストパターンを形成する段階と、前記フォトレジストパターンを利用して前記保護膜とゲート絶縁膜をパターニングして前記ゲート絶縁パターンと保護膜パターンを形成する段階と、前記フォトレジストパターンが残っている基板の上に透明電極物質を蒸着する段階と、前記フォトレジストパターンと、その上の透明電極物質をストリップ工程で除去して透明電極パターンを形成する段階とみ、
前記保護膜パターンは、前記ドレイン電極及びストレージ電極を部分的に露出させて前記画素電極と接続されるようにする段階を含む
ことを特徴とする薄膜トランジスタアレイ基板の製造方法。 - 前記第2マスク工程は、前記薄膜トランジスタのチャンネル部に回折露光部を持つ回折露光マスクを利用する
ことを特徴とする請求項1記載の薄膜トランジスタアレイ基板の製造方法。 - 前記第2マスク工程は、ゲート絶縁膜上にソース/ドレイン金属層及び半導体層を形成する段階と、前記回折露光マスクを利用して薄膜トランジスタのチャンネル部のフォトレジストパターンがソース/ドレインパターン上のフォトレジストパターンより低い高さを持つようにフォトレジストパターンを形成する段階と、前記フォトレジストパターンを利用してソース/ドレイン金属層及び半導体層をパターニングする段階と、アッシング工程により相対的に低い高さを持つフォトレジストパターンを除去する段階と、前記アッシングされたフォトレジストパターンを利用して薄膜トランジスタのチャンネル部のソース/ドレイン金属層を除去する段階と、前記アッシングされたフォトレジストパターンを除去する段階と
を含むことを特徴とする請求項2記載の薄膜トランジスタアレイ基板の製造方法。 - 第1マスク工程を利用して基板上に薄膜トランジスタのゲート電極、ゲート電極に接続されるゲートライン、ゲートラインに接続されるゲートパッドを形成する段階と、前記ゲートパッドが形成された基板上にゲート絶縁膜を形成する段階と、第2マスク工程を利用して前記ゲート絶縁膜上に前記薄膜トランジスタのソース電極及びドレイン電極、前記ソース電極と接続されるデータライン、前記データラインと接続されるデータパッド、前記ゲートラインと重畳される領域にストレージ電極を形成する段階と、第3マスク工程を利用して前記ドレイン電極とストレージ電極に接続されると共に、前記基板上に直接位置する画素電極、前記ゲートパッドを覆うゲートパッド保護電極、前記データパッドを覆うデータパッド保護電極を含む透明電極と、前記透明電極が形成された領域を除外した領域に前記透明電極と重畳することなくゲート絶縁パターンと保護膜パターンを形成する段階とを含み、
前記第3マスク工程は、前記ストレージ電極が形成された基板上に保護膜を形成する段階と、前記第3マスクを利用してフォトレジストパターンを形成する段階と、前記フォトレジストパターンを利用して前記保護膜とゲート絶縁膜をパターニングして前記ゲート絶縁パターンと保護膜パターンを形成する段階と、前記フォトレジストパターンが残っている基板の上に透明電極物質を蒸着する段階と、前記フォトレジストパターンとその上の透明電極物質をストリップ工程で除去して透明電極パターンを形成する段階とを含み、
前記保護膜パターンは、前記ドレイン電極及びストレージ電極を部分的に露出させて前記画素電極と接続されるようにする段階を含む
ことを特徴とする薄膜トランジスタアレイ基板の製造方法。 - 前記第2マスク工程は、前記薄膜トランジスタのチャンネル部に回折露光部を持つ回折露光マスクを利用する
ことを特徴とする請求項4記載の薄膜トランジスタアレイ基板の製造方法。 - 前記第2マスク工程は、ゲート絶縁膜上にソース/ドレイン金属層及び半導体層を形成する段階と、前記回折露光マスクを利用して薄膜トランジスタのチャンネル部のフォトレジストパターンがストレージ電極上のフォトレジストパターンより低い高さを持つようにフォトレジストパターンを形成する段階と、前記フォトレジストパターンを利用してソース/ドレイン金属層及び半導体層をパターニングする段階と、アッシング工程により相対的に低い高さを持つフォトレジストパターンを除去する段階と、前記アッシングされたフォトレジストパターンを利用して薄膜トランジスタのチャンネル部のソース/ドレイン金属層を除去する段階と、前記アッシングされたフォトレジストパターンを除去する段階とを含む
ことを特徴とする請求項5記載の薄膜トランジスタアレイ基板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020088323A KR100904270B1 (ko) | 2002-12-31 | 2002-12-31 | 박막 트랜지스터 어레이 기판 및 그 제조 방법 |
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US (2) | US7166498B2 (ja) |
JP (1) | JP4107662B2 (ja) |
KR (1) | KR100904270B1 (ja) |
CN (1) | CN1244953C (ja) |
DE (1) | DE10355666B4 (ja) |
TW (1) | TWI278710B (ja) |
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KR100640211B1 (ko) * | 2003-04-03 | 2006-10-31 | 엘지.필립스 엘시디 주식회사 | 액정표시장치의 제조방법 |
KR100560401B1 (ko) * | 2003-11-04 | 2006-03-14 | 엘지.필립스 엘시디 주식회사 | 수평 전계 인가형 박막 트랜지스터 기판 및 그 제조 방법 |
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KR101121620B1 (ko) * | 2004-06-05 | 2012-02-28 | 엘지디스플레이 주식회사 | 표시 소자용 박막 트랜지스터 기판 및 그 제조 방법 |
KR101112538B1 (ko) * | 2004-07-27 | 2012-03-13 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
KR101056013B1 (ko) * | 2004-08-03 | 2011-08-10 | 엘지디스플레이 주식회사 | 액정표시장치용 어레이기판 제조방법 |
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TWI325638B (en) * | 2007-01-22 | 2010-06-01 | Au Optronics Corp | Method for manufacturing pixel structure |
TWI331401B (en) * | 2007-04-12 | 2010-10-01 | Au Optronics Corp | Method for fabricating a pixel structure and the pixel structure |
TW200910599A (en) * | 2007-08-21 | 2009-03-01 | Au Optronics Corp | Method for manufacturing pixel structure |
TWI466298B (zh) * | 2007-09-11 | 2014-12-21 | Au Optronics Corp | 畫素結構的製作方法 |
TWI408812B (zh) * | 2007-12-10 | 2013-09-11 | Au Optronics Corp | 畫素結構的製作方法 |
KR101801974B1 (ko) * | 2009-12-31 | 2017-11-28 | 엘지디스플레이 주식회사 | 박막 트랜지스터 어레이 기판, 이를 포함하는 액정표시장치 및 이들의 제조방법 |
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- 2003-11-18 TW TW092132296A patent/TWI278710B/zh not_active IP Right Cessation
- 2003-11-28 JP JP2003399826A patent/JP4107662B2/ja not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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DE10355666B4 (de) | 2007-07-19 |
CN1514468A (zh) | 2004-07-21 |
KR20040062013A (ko) | 2004-07-07 |
TWI278710B (en) | 2007-04-11 |
US7411217B2 (en) | 2008-08-12 |
JP2004310043A (ja) | 2004-11-04 |
US20040129943A1 (en) | 2004-07-08 |
CN1244953C (zh) | 2006-03-08 |
KR100904270B1 (ko) | 2009-06-25 |
TW200424639A (en) | 2004-11-16 |
US7166498B2 (en) | 2007-01-23 |
US20070051955A1 (en) | 2007-03-08 |
DE10355666A1 (de) | 2004-07-22 |
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