JP2004333332A - プローブユニット及びその製造方法 - Google Patents

プローブユニット及びその製造方法 Download PDF

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Publication number
JP2004333332A
JP2004333332A JP2003130529A JP2003130529A JP2004333332A JP 2004333332 A JP2004333332 A JP 2004333332A JP 2003130529 A JP2003130529 A JP 2003130529A JP 2003130529 A JP2003130529 A JP 2003130529A JP 2004333332 A JP2004333332 A JP 2004333332A
Authority
JP
Japan
Prior art keywords
probe
probes
probe unit
configuration
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003130529A
Other languages
English (en)
Japanese (ja)
Inventor
Atsuo Hattori
敦夫 服部
Shuichi Sawada
修一 沢田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Priority to JP2003130529A priority Critical patent/JP2004333332A/ja
Priority to TW093112700A priority patent/TWI236535B/zh
Priority to KR1020040032042A priority patent/KR100593778B1/ko
Priority to CNU2004200593263U priority patent/CN2802510Y/zh
Priority to CNB2004100421596A priority patent/CN1296716C/zh
Publication of JP2004333332A publication Critical patent/JP2004333332A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2003130529A 2003-05-08 2003-05-08 プローブユニット及びその製造方法 Pending JP2004333332A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2003130529A JP2004333332A (ja) 2003-05-08 2003-05-08 プローブユニット及びその製造方法
TW093112700A TWI236535B (en) 2003-05-08 2004-05-05 Probe unit and its manufacturing method
KR1020040032042A KR100593778B1 (ko) 2003-05-08 2004-05-07 프로브 유닛 및 그 제조 방법
CNU2004200593263U CN2802510Y (zh) 2003-05-08 2004-05-08 探针装置
CNB2004100421596A CN1296716C (zh) 2003-05-08 2004-05-08 探针装置及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003130529A JP2004333332A (ja) 2003-05-08 2003-05-08 プローブユニット及びその製造方法

Publications (1)

Publication Number Publication Date
JP2004333332A true JP2004333332A (ja) 2004-11-25

Family

ID=33506027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003130529A Pending JP2004333332A (ja) 2003-05-08 2003-05-08 プローブユニット及びその製造方法

Country Status (4)

Country Link
JP (1) JP2004333332A (zh)
KR (1) KR100593778B1 (zh)
CN (2) CN2802510Y (zh)
TW (1) TWI236535B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010256256A (ja) * 2009-04-28 2010-11-11 Micronics Japan Co Ltd 電気部品の検査方法
WO2011024303A1 (ja) * 2009-08-31 2011-03-03 株式会社アドバンテスト プローブ、プローブカード及び電子部品試験装置
KR101074167B1 (ko) * 2008-11-18 2011-10-17 주식회사 코디에스 프로브 조립체
CN112730925A (zh) * 2019-10-14 2021-04-30 中华精测科技股份有限公司 交错式探针卡及导电探针
WO2023074198A1 (ja) * 2021-10-27 2023-05-04 株式会社ヨコオ 可撓性基板、検査治具

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100748393B1 (ko) * 2007-02-27 2007-08-10 주식회사 파이컴 기판 구조물 및 이를 갖는 프로브 카드
TWI392872B (zh) * 2009-04-10 2013-04-11 Chipmos Technologies Inc 探針卡組成及其中之探針座
US10410768B2 (en) * 2017-02-28 2019-09-10 Greganna Unlimited Company Probe assembly having cable assembly with wire pairs
CN106959381A (zh) * 2017-03-22 2017-07-18 京东方科技集团股份有限公司 一种面板测试装置
CN107131974B (zh) * 2017-05-08 2019-08-23 北京航空航天大学 一种带有吸气支杆结构的温度探针梳
TWI712802B (zh) * 2020-01-21 2020-12-11 中華精測科技股份有限公司 探針卡裝置及其類頸式探針
CN113848356B (zh) * 2021-10-25 2024-05-03 武汉精毅通电子技术有限公司 一种探针模组及其制备方法
CN116430088B (zh) * 2023-06-13 2023-11-24 南方科技大学 探针及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100212169B1 (ko) * 1996-02-13 1999-08-02 오쿠보 마사오 프로브, 프로브의 제조, 그리고 프로브를 사용한 수직동작형 프로브 카드 어셈블리
JP2001056346A (ja) * 1999-08-19 2001-02-27 Fujitsu Ltd プローブカード及び複数の半導体装置が形成されたウエハの試験方法
JP3440243B2 (ja) * 2000-09-26 2003-08-25 株式会社アドバンストシステムズジャパン スパイラルコンタクタ

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101074167B1 (ko) * 2008-11-18 2011-10-17 주식회사 코디에스 프로브 조립체
JP2010256256A (ja) * 2009-04-28 2010-11-11 Micronics Japan Co Ltd 電気部品の検査方法
TWI457572B (zh) * 2009-04-28 2014-10-21 Nihon Micronics Kk 電性零件之檢查方法
WO2011024303A1 (ja) * 2009-08-31 2011-03-03 株式会社アドバンテスト プローブ、プローブカード及び電子部品試験装置
JPWO2011024303A1 (ja) * 2009-08-31 2013-01-24 株式会社アドバンテスト プローブ、プローブカード及び電子部品試験装置
CN112730925A (zh) * 2019-10-14 2021-04-30 中华精测科技股份有限公司 交错式探针卡及导电探针
CN112730925B (zh) * 2019-10-14 2024-03-19 台湾中华精测科技股份有限公司 交错式探针卡
WO2023074198A1 (ja) * 2021-10-27 2023-05-04 株式会社ヨコオ 可撓性基板、検査治具

Also Published As

Publication number Publication date
CN1550785A (zh) 2004-12-01
TWI236535B (en) 2005-07-21
TW200508617A (en) 2005-03-01
KR100593778B1 (ko) 2006-06-30
CN1296716C (zh) 2007-01-24
KR20040095693A (ko) 2004-11-15
CN2802510Y (zh) 2006-08-02

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