JP2004296201A - 蒸着源、蒸着装置、有機ｅｌ素子、有機ｅｌ素子の製造方法 - Google Patents

蒸着源、蒸着装置、有機ｅｌ素子、有機ｅｌ素子の製造方法 Download PDF

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Publication number
JP2004296201A
JP2004296201A JP2003085417A JP2003085417A JP2004296201A JP 2004296201 A JP2004296201 A JP 2004296201A JP 2003085417 A JP2003085417 A JP 2003085417A JP 2003085417 A JP2003085417 A JP 2003085417A JP 2004296201 A JP2004296201 A JP 2004296201A
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Japan
Prior art keywords
container
vapor deposition
flow
organic
deposition material
Prior art date
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Pending
Application number
JP2003085417A
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English (en)
Japanese (ja)
Other versions
JP2004296201A5 (enExample
Inventor
Shinsuke Tanaka
信介 田中
Toshihisa Yuki
敏尚 結城
Kunihiko Shirahata
邦彦 白幡
Tsutomu Uchijo
強 内城
Masahito Nakamura
将人 中村
Yusuke Nakajima
裕介 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku Pioneer Corp
Original Assignee
Tohoku Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Pioneer Corp filed Critical Tohoku Pioneer Corp
Priority to JP2003085417A priority Critical patent/JP2004296201A/ja
Priority to TW093107925A priority patent/TW200423809A/zh
Priority to KR1020040020632A priority patent/KR20040085002A/ko
Publication of JP2004296201A publication Critical patent/JP2004296201A/ja
Publication of JP2004296201A5 publication Critical patent/JP2004296201A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2003085417A 2003-03-26 2003-03-26 蒸着源、蒸着装置、有機ｅｌ素子、有機ｅｌ素子の製造方法 Pending JP2004296201A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003085417A JP2004296201A (ja) 2003-03-26 2003-03-26 蒸着源、蒸着装置、有機ｅｌ素子、有機ｅｌ素子の製造方法
TW093107925A TW200423809A (en) 2003-03-26 2004-03-24 Vapor deposition source, vapor deposition apparatus, organic EL device, and method of manufacturing organic EL device
KR1020040020632A KR20040085002A (ko) 2003-03-26 2004-03-26 증착원, 증착 장치, 유기 ｅｌ 소자 및 이 유기 ｅｌ소자의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003085417A JP2004296201A (ja) 2003-03-26 2003-03-26 蒸着源、蒸着装置、有機ｅｌ素子、有機ｅｌ素子の製造方法

Publications (2)

Publication Number Publication Date
JP2004296201A true JP2004296201A (ja) 2004-10-21
JP2004296201A5 JP2004296201A5 (enExample) 2005-10-27

Family

ID=33400347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003085417A Pending JP2004296201A (ja) 2003-03-26 2003-03-26 蒸着源、蒸着装置、有機ｅｌ素子、有機ｅｌ素子の製造方法

Country Status (3)

Country Link
JP (1) JP2004296201A (enExample)
KR (1) KR20040085002A (enExample)
TW (1) TW200423809A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009120946A (ja) * 2007-10-23 2009-06-04 Semiconductor Energy Lab Co Ltd 成膜方法および発光装置の作製方法
CN108350556A (zh) * 2015-10-29 2018-07-31 Posco公司 微粒子发生装置及包括该装置的涂覆系统
WO2021058093A1 (en) * 2019-09-24 2021-04-01 Applied Materials, Inc. Evaporation apparatus for evaporating a material to be evaporated, evaporation source, and evaporation method
JP2022546458A (ja) * 2019-08-30 2022-11-04 ダイソン・テクノロジー・リミテッド マルチゾーンるつぼ装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100689189B1 (ko) * 2004-12-28 2007-03-09 동부일렉트로닉스 주식회사 입자 증착 시스템용 용기 및 이를 채용한 입자 증착 시스템
KR20150026011A (ko) * 2013-08-30 2015-03-11 삼성디스플레이 주식회사 증착원
CN103687240B (zh) 2013-12-17 2016-03-30 深圳市华星光电技术有限公司 过压过流保护电路及电子装置
CN103757591B (zh) * 2013-12-31 2016-03-30 深圳市华星光电技术有限公司 一种坩埚设备及其在液晶面板生产中的应用
CN105590869A (zh) * 2014-10-24 2016-05-18 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制作方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009120946A (ja) * 2007-10-23 2009-06-04 Semiconductor Energy Lab Co Ltd 成膜方法および発光装置の作製方法
CN108350556A (zh) * 2015-10-29 2018-07-31 Posco公司 微粒子发生装置及包括该装置的涂覆系统
JP2022546458A (ja) * 2019-08-30 2022-11-04 ダイソン・テクノロジー・リミテッド マルチゾーンるつぼ装置
WO2021058093A1 (en) * 2019-09-24 2021-04-01 Applied Materials, Inc. Evaporation apparatus for evaporating a material to be evaporated, evaporation source, and evaporation method

Also Published As

Publication number Publication date
KR20040085002A (ko) 2004-10-07
TW200423809A (en) 2004-11-01

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