KR20040085002A - 증착원, 증착 장치, 유기 ｅｌ 소자 및 이 유기 ｅｌ소자의 제조 방법 - Google Patents

증착원, 증착 장치, 유기 ｅｌ 소자 및 이 유기 ｅｌ소자의 제조 방법 Download PDF

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Publication number
KR20040085002A
KR20040085002A KR1020040020632A KR20040020632A KR20040085002A KR 20040085002 A KR20040085002 A KR 20040085002A KR 1020040020632 A KR1020040020632 A KR 1020040020632A KR 20040020632 A KR20040020632 A KR 20040020632A KR 20040085002 A KR20040085002 A KR 20040085002A
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KR
South Korea
Prior art keywords
vapor deposition
container
deposition source
organic
deposition material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020040020632A
Other languages
English (en)
Korean (ko)
Inventor
다나카신수케
유키도시나오
시라하타구니히코
나이조쯔요시
나카무라마사토
나카지마유수케
Original Assignee
도호꾸 파이오니어 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도호꾸 파이오니어 가부시끼가이샤 filed Critical 도호꾸 파이오니어 가부시끼가이샤
Publication of KR20040085002A publication Critical patent/KR20040085002A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020040020632A 2003-03-26 2004-03-26 증착원, 증착 장치, 유기 ｅｌ 소자 및 이 유기 ｅｌ소자의 제조 방법 Withdrawn KR20040085002A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00085417 2003-03-26
JP2003085417A JP2004296201A (ja) 2003-03-26 2003-03-26 蒸着源、蒸着装置、有機ｅｌ素子、有機ｅｌ素子の製造方法

Publications (1)

Publication Number Publication Date
KR20040085002A true KR20040085002A (ko) 2004-10-07

Family

ID=33400347

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040020632A Withdrawn KR20040085002A (ko) 2003-03-26 2004-03-26 증착원, 증착 장치, 유기 ｅｌ 소자 및 이 유기 ｅｌ소자의 제조 방법

Country Status (3)

Country Link
JP (1) JP2004296201A (enExample)
KR (1) KR20040085002A (enExample)
TW (1) TW200423809A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100689189B1 (ko) * 2004-12-28 2007-03-09 동부일렉트로닉스 주식회사 입자 증착 시스템용 용기 및 이를 채용한 입자 증착 시스템
US20160118324A1 (en) * 2014-10-24 2016-04-28 Semiconductor Manufacturing International (Shanghai) Corporation Wafer level packaging approach for semiconductor devices

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090041316A (ko) * 2007-10-23 2009-04-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 성막 방법 및 발광 장치의 제작 방법
KR20150026011A (ko) * 2013-08-30 2015-03-11 삼성디스플레이 주식회사 증착원
CN103687240B (zh) 2013-12-17 2016-03-30 深圳市华星光电技术有限公司 过压过流保护电路及电子装置
CN103757591B (zh) * 2013-12-31 2016-03-30 深圳市华星光电技术有限公司 一种坩埚设备及其在液晶面板生产中的应用
KR101746956B1 (ko) * 2015-10-29 2017-06-14 주식회사 포스코 미립자 발생장치 및 이를 포함하는 코팅 시스템
GB2586634B (en) * 2019-08-30 2022-04-20 Dyson Technology Ltd Multizone crucible apparatus
WO2021058093A1 (en) * 2019-09-24 2021-04-01 Applied Materials, Inc. Evaporation apparatus for evaporating a material to be evaporated, evaporation source, and evaporation method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100689189B1 (ko) * 2004-12-28 2007-03-09 동부일렉트로닉스 주식회사 입자 증착 시스템용 용기 및 이를 채용한 입자 증착 시스템
US20160118324A1 (en) * 2014-10-24 2016-04-28 Semiconductor Manufacturing International (Shanghai) Corporation Wafer level packaging approach for semiconductor devices
US10574209B2 (en) * 2014-10-24 2020-02-25 Semiconductor Manufacturing International (Shanghai) Corporation Wafer level packaging approach for semiconductor devices

Also Published As

Publication number Publication date
JP2004296201A (ja) 2004-10-21
TW200423809A (en) 2004-11-01

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20040326

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid