JP4648868B2 - 無機蒸着源の加熱源制御方法 - Google Patents
無機蒸着源の加熱源制御方法 Download PDFInfo
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- JP4648868B2 JP4648868B2 JP2006113737A JP2006113737A JP4648868B2 JP 4648868 B2 JP4648868 B2 JP 4648868B2 JP 2006113737 A JP2006113737 A JP 2006113737A JP 2006113737 A JP2006113737 A JP 2006113737A JP 4648868 B2 JP4648868 B2 JP 4648868B2
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- 238000010438 heat treatment Methods 0.000 title claims description 93
- 238000007740 vapor deposition Methods 0.000 title claims description 29
- 238000000034 method Methods 0.000 title claims description 19
- 230000008021 deposition Effects 0.000 claims description 88
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 14
- 229910010272 inorganic material Inorganic materials 0.000 claims description 10
- 239000011147 inorganic material Substances 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000013212 metal-organic material Substances 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 description 74
- 239000000463 material Substances 0.000 description 10
- 238000001816 cooling Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000006641 stabilisation Effects 0.000 description 4
- 238000011105 stabilization Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 or Al Substances 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/548—Controlling the composition
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
Description
30a 上部加熱部、
30b 下部加熱部、
50 ハウジング、
70 外壁、
90 ノズル部、
100 無機蒸着源、
C 制御部、
Pa 第1電力源、
Pb 第2電力源。
Claims (2)
- 金属または無機物質が含有されたるつぼの上部及び下部にそれぞれ位置され前記るつぼに熱を供給する上部加熱部及び下部加熱部をそれぞれ加熱する温度制御段階と、
前記温度制御段階で昇温がなされた後、前記上部加熱部に供給される電力を固定させ、前記下部加熱部に供給される電力を制御することにより蒸着率の制御を行う蒸着率制御段階と、
を含み、
前記温度制御段階の後、前記温度制御段階を通じて蒸発された前記金属または無機物質の蒸着率を測定する蒸着率測定段階と、
前記蒸着率測定段階で測定された前記金属または無機物質の蒸着率と設定された目標蒸着率を比較する蒸着率比較段階と、
前記測定された蒸着率が、前記設定された目標蒸着率の100%に到達する前に前記蒸着率制御段階に変換される制御変換段階と、をさらに含んでなることを特徴とする無機蒸着源の加熱源制御方法。 - 前記制御変換段階は、前記測定された蒸着率が、前記設定された目標蒸着率の10〜70%に到達した時に前記蒸着率制御段階に変換されることを特徴とする請求項1に記載の無機蒸着源の加熱源制御方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050080996A KR100711886B1 (ko) | 2005-08-31 | 2005-08-31 | 무기 증착원 및 이의 가열원 제어방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007063660A JP2007063660A (ja) | 2007-03-15 |
JP4648868B2 true JP4648868B2 (ja) | 2011-03-09 |
Family
ID=37816902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006113737A Expired - Fee Related JP4648868B2 (ja) | 2005-08-31 | 2006-04-17 | 無機蒸着源の加熱源制御方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20070077357A1 (ja) |
JP (1) | JP4648868B2 (ja) |
KR (1) | KR100711886B1 (ja) |
CN (1) | CN1924081A (ja) |
TW (1) | TW200715409A (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101196564B1 (ko) * | 2008-04-11 | 2012-11-01 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 균열 장치 |
KR101084234B1 (ko) | 2009-11-30 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 증착원, 이를 구비하는 증착 장치 및 박막 형성 방법 |
KR101094299B1 (ko) | 2009-12-17 | 2011-12-19 | 삼성모바일디스플레이주식회사 | 선형 증발원 및 이를 포함하는 증착 장치 |
KR101182265B1 (ko) * | 2009-12-22 | 2012-09-12 | 삼성디스플레이 주식회사 | 증발원 및 이를 포함하는 증착 장치 |
JP5520871B2 (ja) * | 2011-03-31 | 2014-06-11 | 株式会社日立ハイテクノロジーズ | 蒸着装置 |
KR102124588B1 (ko) | 2012-10-22 | 2020-06-22 | 삼성디스플레이 주식회사 | 선형 증착원 및 이를 포함하는 진공 증착 장치 |
KR101489366B1 (ko) * | 2012-12-11 | 2015-02-03 | (주)알파플러스 | 진공 증발원 |
KR20140078284A (ko) * | 2012-12-17 | 2014-06-25 | 삼성디스플레이 주식회사 | 증착원 및 이를 포함하는 증착 장치 |
KR101885092B1 (ko) * | 2016-12-09 | 2018-08-03 | 주식회사 선익시스템 | 리플렉터실드의 온도상승을 억제시키는 증착챔버 |
KR101895795B1 (ko) * | 2016-12-09 | 2018-09-07 | 주식회사 선익시스템 | 열차단실드가 구비된 증착챔버 |
JP6436544B1 (ja) * | 2017-08-07 | 2018-12-12 | キヤノントッキ株式会社 | 蒸発源装置およびその制御方法 |
WO2019054530A1 (ko) * | 2017-09-14 | 2019-03-21 | (주)알파플러스 | 진공 증발원 |
DE102018131944A1 (de) * | 2018-12-12 | 2020-06-18 | VON ARDENNE Asset GmbH & Co. KG | Verdampfungsanordnung und Verfahren |
KR102319130B1 (ko) | 2020-03-11 | 2021-10-29 | 티오에스주식회사 | 가변 온도조절 장치를 구비한 금속-산화물 전자빔 증발원 |
Citations (4)
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JPH01159369A (ja) * | 1987-12-16 | 1989-06-22 | Ulvac Corp | 真空蒸着装置 |
JPH09111441A (ja) * | 1995-10-20 | 1997-04-28 | Nisshin Steel Co Ltd | Mg蒸発方法 |
JP2000012218A (ja) * | 1998-06-23 | 2000-01-14 | Tdk Corp | 有機el素子の製造装置および製造方法 |
JP2000160328A (ja) * | 1998-11-30 | 2000-06-13 | Idemitsu Kosan Co Ltd | 素子用薄膜層の蒸着方法、蒸着装置および有機エレクトロルミネッセンス素子 |
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-
2005
- 2005-08-31 KR KR1020050080996A patent/KR100711886B1/ko not_active IP Right Cessation
-
2006
- 2006-04-17 JP JP2006113737A patent/JP4648868B2/ja not_active Expired - Fee Related
- 2006-08-24 TW TW095131101A patent/TW200715409A/zh unknown
- 2006-08-30 US US11/514,318 patent/US20070077357A1/en not_active Abandoned
- 2006-08-31 CN CNA200610112370XA patent/CN1924081A/zh active Pending
-
2011
- 2011-02-28 US US13/037,150 patent/US20110151106A1/en not_active Abandoned
Patent Citations (4)
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JPH01159369A (ja) * | 1987-12-16 | 1989-06-22 | Ulvac Corp | 真空蒸着装置 |
JPH09111441A (ja) * | 1995-10-20 | 1997-04-28 | Nisshin Steel Co Ltd | Mg蒸発方法 |
JP2000012218A (ja) * | 1998-06-23 | 2000-01-14 | Tdk Corp | 有機el素子の製造装置および製造方法 |
JP2000160328A (ja) * | 1998-11-30 | 2000-06-13 | Idemitsu Kosan Co Ltd | 素子用薄膜層の蒸着方法、蒸着装置および有機エレクトロルミネッセンス素子 |
Also Published As
Publication number | Publication date |
---|---|
KR20070025163A (ko) | 2007-03-08 |
US20070077357A1 (en) | 2007-04-05 |
US20110151106A1 (en) | 2011-06-23 |
CN1924081A (zh) | 2007-03-07 |
KR100711886B1 (ko) | 2007-04-25 |
JP2007063660A (ja) | 2007-03-15 |
TW200715409A (en) | 2007-04-16 |
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