JP2004282083A - ノッチゲートを利用したローカルsonos構造を有するフラッシュメモリ及びその製造方法 - Google Patents
ノッチゲートを利用したローカルsonos構造を有するフラッシュメモリ及びその製造方法 Download PDFInfo
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Abstract
【解決手段】 ソース/ドレーン領域612/636を有する半導体基板602と、ソース/ドレーン領域612/636間の基板上に形成されたゲート絶縁膜608と、ゲート絶縁膜608上に形成されて少なくとも1つのノッチを有するノッチゲート構造606と、ゲート構造の少なくとも1つのノッチそれぞれに備わった少なくとも1つのONOクサビ構造622/624/622を含むノッチゲートSONOSトランジスタ500である。
【選択図】 図5
Description
図3のONO構造34/36/38の長さを定義するのにはフォトリソグラフィが利用される。ところで、フォトリソグラフィ工程でフォト段階の間には、相当なオーバラップ変動となる位置合わせずれ(misalignment)が起こりうる。
本発明がなそうとする他の技術的課題は、初期Vthが低くて変動の少ないSONOS型セルを有したフラッシュメモリを構成できるようにSONOSトランジスタのゲート構造を製造する方法を提供することである。
その他実施例の具体的事項は詳細な説明及び図面に含まれている。
本発明の実施例はノッチゲート電極を有したローカルSONOS型構造の製造方法も提供する。
ゲート電極物質層604は多結晶シリコンまたは多結晶シリコンとSiGe層との二重層またはTiN層下にW層を有している二重層または多結晶SiGeまたは非晶質シリコンでありうる。
図9Aはほとんど図6Aに対応する。図9Bはほとんど図6Bに対応する。図9Cは図6Dに対応して図9Dは図6Eに対応する。図9Eは図6Fに対応する。簡潔性のために、図9系列は図6Cに対応する図面を含まない。
以上、本発明を望ましい実施例を例に詳細に説明したが、本発明は前記実施例に限定されず、本発明の技術的思想内で当分野の当業者によってさまざまな多くの変形が可能であることは明白である。
602 基板
606 ノッチゲート電極
608 ゲート酸化膜
612 低濃度ドーピング領域
622 酸化膜
624 窒化膜
634 側壁スペース
636 高濃度ドーピング領域
H 高さ
Claims (22)
- ソース/ドレーン領域を有する半導体基板と、
前記ソース/ドレーン領域間の前記基板上に形成されたゲート絶縁膜と、
前記ゲート絶縁膜上に形成されて少なくとも1つのノッチを有するノッチゲート構造と、
前記ゲート構造の前記少なくとも1つのノッチそれぞれに備わった少なくとも1つのONOクサビ構造とを含むノッチゲートSONOSトランジスタ。 - 前記ノッチそれぞれの表面は、前記基板表面の一部、前記ゲート絶縁膜の側面一部及び前記ゲート構造の表面の一部を含むことを特徴とする請求項1に記載のノッチゲートSONOSトランジスタ。
- 前記ONOクサビ構造は、
前記ノッチ内の前記基板表面、前記ノッチ内の前記ゲート絶縁膜の側面及び前記ノッチ内の前記ゲート構造の表面と直接接触する酸化膜と、
前記酸化膜に対して形成された窒化膜とを含むことを特徴とする請求項2に記載のノッチゲートSONOSトランジスタ。 - 前記ONOクサビ構造は切頭型三角形であることを特徴とする請求項1に記載のノッチゲートSONOSトランジスタ。
- 前記ゲート構造は、前記ゲート絶縁膜上の第1導電層及び前記第1導電層上の第2導電層を含むことを特徴とする請求項1に記載のノッチゲートSONOSトランジスタ。
- 前記少なくとも1つのノッチは少なくとも前記第1導電層の中に形成されたことを特徴とする請求項5に記載のノッチゲートSONOSトランジスタ。
- 前記少なくとも1つのノッチは前記第1導電層と第2導電層の中に形成され、前記ノッチの大部分は前記第1導電層の中に形成されたことを特徴とする請求項6に記載のノッチゲートSONOSトランジスタ。
- 前記第1導電層は前記第2導電層より容易にエッチングされる物質より形成されたことを特徴とする請求項5に記載のノッチゲートSONOSトランジスタ。
- 前記第1導電層は少なくとも2つの半導体物質を含み、前記第2導電層は1つの半導体物質を含むことを特徴とする請求項5に記載のノッチゲートSONOSトランジスタ。
- 前記第1導電層は第1導電体であり、前記第2導電層は前記第1導電体と異なる第2導電体であることを特徴とする請求項5に記載のノッチゲートSONOSトランジスタ。
- 前記ノッチゲート構造は少なくとも2つのノッチを有し、前記トランジスタは前記少なくとも2つのノッチ内にそれぞれ形成された少なくとも2つのONOクサビ構造を含むことを特徴とする請求項1に記載のノッチゲートSONOSトランジスタ。
- 基板を提供する段階と、
前記基板上にゲート絶縁膜を形成する段階と、
前記ゲート絶縁膜上に少なくとも1つのノッチを有するノッチゲート構造を形成する段階と、
前記ゲート構造の前記少なくとも1つのノッチそれぞれに少なくとも1つのONOクサビ構造を形成する段階とを含むSONOSトランジスタ用ノッチゲート構造の製造方法。 - 前記ノッチゲート構造を形成する段階は、
前記ゲート絶縁膜上にゲート導電層を形成する段階と、
前記ゲート絶縁膜と前記ゲート導電層の一部を除去して少なくとも1つのノッチを定義するが、各ノッチの表面は前記基板表面の一部、前記ゲート絶縁膜の側面一部及び前記ゲート構造の表面の一部を含ませる段階とを含むことを特徴とする請求項12に記載のSONOSトランジスタ用ノッチゲート構造の製造方法。 - 前記少なくとも1つのONOクサビ構造を形成する段階は、
前記ノッチ内の前記基板表面、前記ノッチ内の前記ゲート絶縁膜の側面及び前記ノッチ内の前記ゲート構造の表面と直接接触する酸化膜を形成する段階と、
前記酸化膜に対して窒化膜を形成する段階とを含むことを特徴とする請求項13に記載のSONOSトランジスタ用ノッチゲート構造の製造方法。 - 前記ONOクサビ構造は切頭型三角形であることを特徴とする請求項12に記載のSONOSトランジスタ用ノッチゲート構造の製造方法。
- 前記ノッチゲート構造を形成する段階は、
前記ゲート絶縁膜上に第1導電層を形成する段階と、
前記第1導電層上に第2導電層を形成する段階とを含むことを特徴とする請求項12に記載のSONOSトランジスタ用ノッチゲート構造の製造方法。 - 前記ノッチゲート構造を形成する段階は、前記少なくとも1つのノッチを少なくとも前記第1導電層の中に位置させることを特徴とする請求項16に記載のSONOSトランジスタ用ノッチゲート構造の製造方法。
- 前記ノッチゲート構造を形成する段階は、前記少なくとも1つのノッチを前記第1導電層と第2導電層の中に位置させるが、前記ノッチの大部分を前記第1導電層の中に位置させることを特徴とする請求項17に記載のSONOSトランジスタ用ノッチゲート構造の製造方法。
- 前記ノッチゲート構造を形成する段階は、前記第1導電層として前記第2導電層に使われた物質より容易にエッチングされる物質を使用する段階を含むことを特徴とする請求項16に記載のSONOSトランジスタ用ノッチゲート構造の製造方法。
- 前記第1及び第2導電層を形成する段階は、前記第1導電層として少なくとも2つの半導体物質を使用し、前記第2導電層として1つの半導体物質を使用する段階を含むことを特徴とする請求項16に記載のSONOSトランジスタ用ノッチゲート構造の製造方法。
- 前記第1及び第2導電層を形成する段階は、前記第1導電層として第1導電体を使用し、前記第2導電層として前記第1導電体と異なる第2導電体を使用することを特徴とする請求項16に記載のSONOSトランジスタ用ノッチゲート構造の製造方法。
- 前記ノッチゲート構造は少なくとも2つのノッチを有し、前記方法は前記少なくとも2つのノッチ内にそれぞれ形成された少なくとも2つのONOクサビ構造を含ませることを特徴とする請求項12に記載のSONOSトランジスタ用ノッチゲート構造の製造方法。
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US10/388,427 US6806517B2 (en) | 2003-03-17 | 2003-03-17 | Flash memory having local SONOS structure using notched gate and manufacturing method thereof |
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KR (1) | KR100546352B1 (ja) |
CN (1) | CN100385678C (ja) |
FR (1) | FR2852734B1 (ja) |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004312019A (ja) * | 2003-04-07 | 2004-11-04 | Silicon Storage Technology Inc | 窪み中に形成された浮遊ゲートを持つ不揮発性浮遊ゲート・メモリセル及びその配列及び製造方法 |
JP2004343014A (ja) * | 2003-05-19 | 2004-12-02 | Sharp Corp | 半導体記憶装置、半導体装置、及びそれらの製造方法、並びに携帯電子機器、並びにicカード |
JP2009152556A (ja) * | 2007-11-28 | 2009-07-09 | Sharp Corp | 不揮発性半導体記憶装置及びその製造方法 |
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JP2004312019A (ja) * | 2003-04-07 | 2004-11-04 | Silicon Storage Technology Inc | 窪み中に形成された浮遊ゲートを持つ不揮発性浮遊ゲート・メモリセル及びその配列及び製造方法 |
JP2004343014A (ja) * | 2003-05-19 | 2004-12-02 | Sharp Corp | 半導体記憶装置、半導体装置、及びそれらの製造方法、並びに携帯電子機器、並びにicカード |
JP2009152556A (ja) * | 2007-11-28 | 2009-07-09 | Sharp Corp | 不揮発性半導体記憶装置及びその製造方法 |
JP2009152504A (ja) * | 2007-12-24 | 2009-07-09 | Oki Semiconductor Co Ltd | 不揮発性メモリデバイス及びその製造方法 |
US10163922B2 (en) | 2016-03-28 | 2018-12-25 | Renesas Electronics Corporation | Semiconductor device and method of manufacturing the semiconductor device |
Also Published As
Publication number | Publication date |
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TWI231600B (en) | 2005-04-21 |
KR20040082018A (ko) | 2004-09-23 |
JP4417145B2 (ja) | 2010-02-17 |
TW200419788A (en) | 2004-10-01 |
US6806517B2 (en) | 2004-10-19 |
US20040183106A1 (en) | 2004-09-23 |
CN1531107A (zh) | 2004-09-22 |
CN100385678C (zh) | 2008-04-30 |
KR100546352B1 (ko) | 2006-01-26 |
FR2852734B1 (fr) | 2008-02-29 |
FR2852734A1 (fr) | 2004-09-24 |
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