JP2004130371A - 接合体 - Google Patents

接合体 Download PDF

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Publication number
JP2004130371A
JP2004130371A JP2002299520A JP2002299520A JP2004130371A JP 2004130371 A JP2004130371 A JP 2004130371A JP 2002299520 A JP2002299520 A JP 2002299520A JP 2002299520 A JP2002299520 A JP 2002299520A JP 2004130371 A JP2004130371 A JP 2004130371A
Authority
JP
Japan
Prior art keywords
metal
joined body
joined
joining
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002299520A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004130371A5 (enExample
Inventor
Kaori Mikojima
神子島　かおり
Yusuke Chikamori
近森　祐介
Naoaki Kogure
小榑　直明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2002299520A priority Critical patent/JP2004130371A/ja
Priority to US10/484,454 priority patent/US20040245648A1/en
Priority to CNB038009056A priority patent/CN100337782C/zh
Priority to DE60326760T priority patent/DE60326760D1/de
Priority to TW092125572A priority patent/TWI284581B/zh
Priority to KR1020047000955A priority patent/KR20050040812A/ko
Priority to PCT/JP2003/011797 priority patent/WO2004026526A1/en
Priority to EP03788702A priority patent/EP1578559B1/en
Publication of JP2004130371A publication Critical patent/JP2004130371A/ja
Publication of JP2004130371A5 publication Critical patent/JP2004130371A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29339—Silver [Ag] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8384—Sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
JP2002299520A 2002-09-18 2002-10-11 接合体 Pending JP2004130371A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2002299520A JP2004130371A (ja) 2002-10-11 2002-10-11 接合体
US10/484,454 US20040245648A1 (en) 2002-09-18 2003-09-17 Bonding material and bonding method
CNB038009056A CN100337782C (zh) 2002-09-18 2003-09-17 接合材料
DE60326760T DE60326760D1 (de) 2002-09-18 2003-09-17 Verfahren zum verbinden
TW092125572A TWI284581B (en) 2002-09-18 2003-09-17 Bonding material and bonding method
KR1020047000955A KR20050040812A (ko) 2002-09-18 2003-09-17 본딩물질 및 본딩방법
PCT/JP2003/011797 WO2004026526A1 (en) 2002-09-18 2003-09-17 Bonding material and bonding method
EP03788702A EP1578559B1 (en) 2002-09-18 2003-09-17 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002299520A JP2004130371A (ja) 2002-10-11 2002-10-11 接合体

Publications (2)

Publication Number Publication Date
JP2004130371A true JP2004130371A (ja) 2004-04-30
JP2004130371A5 JP2004130371A5 (enExample) 2005-08-25

Family

ID=32288629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002299520A Pending JP2004130371A (ja) 2002-09-18 2002-10-11 接合体

Country Status (1)

Country Link
JP (1) JP2004130371A (enExample)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093420A (ja) * 2004-09-24 2006-04-06 Oki Electric Ind Co Ltd 半導体装置の実装方法
JP2006102810A (ja) * 2004-10-06 2006-04-20 Tadamasa Fujimura ハンダ材
KR100610988B1 (ko) 2004-01-05 2006-08-10 세이코 엡슨 가부시키가이샤 부재의 접합 구조 및 접합 방법
JP2008521591A (ja) * 2004-11-26 2008-06-26 ソウル ナショナル ユニバーシティー インダストリー ファンデーション 単分散ナノ粒子の新しい大量製造方法
WO2008096886A1 (ja) 2007-02-08 2008-08-14 Toyota Jidosha Kabushiki Kaisha 接合方法
JP2008212976A (ja) * 2007-03-05 2008-09-18 Toda Kogyo Corp 接合部材および接合方法
US7528485B2 (en) 2004-07-29 2009-05-05 Hitachi, Ltd. Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
JP2010283105A (ja) * 2009-06-04 2010-12-16 Hitachi Metals Ltd 配線基板冷却機構、その製造方法、接合構造体、およびその製造方法
WO2011007402A1 (ja) * 2009-07-14 2011-01-20 Ｄｏｗａエレクトロニクス株式会社 金属ナノ粒子を用いた接合材および接合方法
JP2011080147A (ja) * 2009-09-11 2011-04-21 Dowa Electronics Materials Co Ltd 接合材およびそれを用いた接合方法
JP2011165745A (ja) * 2010-02-05 2011-08-25 Mitsubishi Electric Corp セラミックパッケージ
JP2012124497A (ja) * 2011-12-26 2012-06-28 Hitachi Metals Ltd 半導体装置
JP2012515266A (ja) * 2009-01-14 2012-07-05 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 焼結材料、焼結接合部並びに焼結接合部の製造方法
JP2013040055A (ja) * 2011-08-11 2013-02-28 Furukawa Electric Co Ltd:The セラミック接合体
JP2013070080A (ja) * 2007-07-19 2013-04-18 Frys Metals Inc ダイを基板に取付けた装置
JP2013167002A (ja) * 2012-02-16 2013-08-29 Noritake Co Ltd 金属微粒子分散液およびその製造方法
JP2014017364A (ja) * 2012-07-09 2014-01-30 Panasonic Corp 部品実装基板の製造システム、および製造方法
US8968488B2 (en) 2006-07-05 2015-03-03 Fuji Electric Co., Ltd. Cream solder and method of soldering electronic part
JP2015057291A (ja) * 2013-08-09 2015-03-26 国立大学法人大阪大学 マイクロサイズ銀粒子を用いた接合方法
JP2016015256A (ja) * 2014-07-02 2016-01-28 積水化学工業株式会社 導電性粒子、接合用組成物、接合構造体及び接合構造体の製造方法
JP2016195126A (ja) * 2011-08-05 2016-11-17 積水化学工業株式会社 接合用組成物、接合構造体及び接合構造体の製造方法
CN107649690A (zh) * 2017-09-08 2018-02-02 苏州汉尔信电子科技有限公司 一种低温烧结用纳米锡颗粒及其制备方法
US20240189905A1 (en) * 2021-04-09 2024-06-13 Heraeus Deutschland GmbH & Co. KG Silver sintering preparation and the use thereof for the connecting of electronic components

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0524942A (ja) * 1991-07-16 1993-02-02 Hitachi Maxell Ltd 接着方法及び接着剤
JPH10505538A (ja) * 1994-08-25 1998-06-02 キューキューシー，インコーポレイテッド ナノ規模の粒子およびその用途
JPH10183207A (ja) * 1996-12-19 1998-07-14 Tomoe Seisakusho:Kk 超微粒子及びその製造方法
JP2794360B2 (ja) * 1992-03-11 1998-09-03 三ツ星ベルト株式会社 金属もしくはセラミックスから選ばれた被接合材の接合方法およびこれに用いる接合剤
JP2000512339A (ja) * 1996-03-12 2000-09-19 テクル，バーハン 超微小及び微小粒子を単離するための方法並びにその結果の粒子
JP2001144417A (ja) * 1999-11-17 2001-05-25 Ebara Corp プリント基板及びその製造方法
JP2001167633A (ja) * 1999-12-09 2001-06-22 Ebara Corp 金属成分含有溶液及び金属薄膜形成方法
JP2001176339A (ja) * 1999-12-21 2001-06-29 Ebara Corp 透明導電性基材の製造方法
JP2002126869A (ja) * 2000-10-25 2002-05-08 Harima Chem Inc 金属間のロウ付け接合方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0524942A (ja) * 1991-07-16 1993-02-02 Hitachi Maxell Ltd 接着方法及び接着剤
JP2794360B2 (ja) * 1992-03-11 1998-09-03 三ツ星ベルト株式会社 金属もしくはセラミックスから選ばれた被接合材の接合方法およびこれに用いる接合剤
JPH10505538A (ja) * 1994-08-25 1998-06-02 キューキューシー，インコーポレイテッド ナノ規模の粒子およびその用途
JP2000512339A (ja) * 1996-03-12 2000-09-19 テクル，バーハン 超微小及び微小粒子を単離するための方法並びにその結果の粒子
JPH10183207A (ja) * 1996-12-19 1998-07-14 Tomoe Seisakusho:Kk 超微粒子及びその製造方法
JP2001144417A (ja) * 1999-11-17 2001-05-25 Ebara Corp プリント基板及びその製造方法
JP2001167633A (ja) * 1999-12-09 2001-06-22 Ebara Corp 金属成分含有溶液及び金属薄膜形成方法
JP2001176339A (ja) * 1999-12-21 2001-06-29 Ebara Corp 透明導電性基材の製造方法
JP2002126869A (ja) * 2000-10-25 2002-05-08 Harima Chem Inc 金属間のロウ付け接合方法

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100610988B1 (ko) 2004-01-05 2006-08-10 세이코 엡슨 가부시키가이샤 부재의 접합 구조 및 접합 방법
US7528485B2 (en) 2004-07-29 2009-05-05 Hitachi, Ltd. Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
JP2006093420A (ja) * 2004-09-24 2006-04-06 Oki Electric Ind Co Ltd 半導体装置の実装方法
JP2006102810A (ja) * 2004-10-06 2006-04-20 Tadamasa Fujimura ハンダ材
JP2008521591A (ja) * 2004-11-26 2008-06-26 ソウル ナショナル ユニバーシティー インダストリー ファンデーション 単分散ナノ粒子の新しい大量製造方法
JP2011224558A (ja) * 2004-11-26 2011-11-10 Seoul National Univ Industry Foundation 単分散ナノ粒子の新しい大量製造方法
US9301403B2 (en) 2006-07-05 2016-03-29 Fuji Electric Co., Ltd. Method of soldering electronic part
US8968488B2 (en) 2006-07-05 2015-03-03 Fuji Electric Co., Ltd. Cream solder and method of soldering electronic part
WO2008096886A1 (ja) 2007-02-08 2008-08-14 Toyota Jidosha Kabushiki Kaisha 接合方法
JP2008195974A (ja) * 2007-02-08 2008-08-28 Toyota Motor Corp 接合方法
US7770781B2 (en) 2007-02-08 2010-08-10 Toyota Jidosha Kabushiki Kaisha Bonding method
JP2008212976A (ja) * 2007-03-05 2008-09-18 Toda Kogyo Corp 接合部材および接合方法
US10905041B2 (en) 2007-07-19 2021-01-26 Alpha Assembly Solutions Inc. Methods for attachment and devices produced using the methods
US11699632B2 (en) 2007-07-19 2023-07-11 Alpha Assembly Solutions Inc. Methods for attachment and devices produced using the methods
JP2013070080A (ja) * 2007-07-19 2013-04-18 Frys Metals Inc ダイを基板に取付けた装置
JP2012515266A (ja) * 2009-01-14 2012-07-05 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 焼結材料、焼結接合部並びに焼結接合部の製造方法
JP2010283105A (ja) * 2009-06-04 2010-12-16 Hitachi Metals Ltd 配線基板冷却機構、その製造方法、接合構造体、およびその製造方法
CN102470490B (zh) * 2009-07-14 2015-08-05 同和电子科技有限公司 使用金属纳米粒子的接合材料及接合方法
CN102470490A (zh) * 2009-07-14 2012-05-23 同和电子科技有限公司 使用金属纳米粒子的接合材料及接合方法
US8858700B2 (en) 2009-07-14 2014-10-14 Dowa Electronics Materials Co., Ltd. Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method
JP5651113B2 (ja) * 2009-07-14 2015-01-07 Ｄｏｗａエレクトロニクス株式会社 金属ナノ粒子を用いた接合材および接合方法
WO2011007402A1 (ja) * 2009-07-14 2011-01-20 Ｄｏｗａエレクトロニクス株式会社 金属ナノ粒子を用いた接合材および接合方法
KR101623449B1 (ko) 2009-07-14 2016-05-23 도와 일렉트로닉스 가부시키가이샤 금속 나노 입자를 이용한 접합재 및 접합 방법
JP2011080147A (ja) * 2009-09-11 2011-04-21 Dowa Electronics Materials Co Ltd 接合材およびそれを用いた接合方法
JP2011165745A (ja) * 2010-02-05 2011-08-25 Mitsubishi Electric Corp セラミックパッケージ
JP2016195126A (ja) * 2011-08-05 2016-11-17 積水化学工業株式会社 接合用組成物、接合構造体及び接合構造体の製造方法
JP2013040055A (ja) * 2011-08-11 2013-02-28 Furukawa Electric Co Ltd:The セラミック接合体
JP2012124497A (ja) * 2011-12-26 2012-06-28 Hitachi Metals Ltd 半導体装置
JP2013167002A (ja) * 2012-02-16 2013-08-29 Noritake Co Ltd 金属微粒子分散液およびその製造方法
JP2014017364A (ja) * 2012-07-09 2014-01-30 Panasonic Corp 部品実装基板の製造システム、および製造方法
JP2015057291A (ja) * 2013-08-09 2015-03-26 国立大学法人大阪大学 マイクロサイズ銀粒子を用いた接合方法
JP2016015256A (ja) * 2014-07-02 2016-01-28 積水化学工業株式会社 導電性粒子、接合用組成物、接合構造体及び接合構造体の製造方法
CN107649690A (zh) * 2017-09-08 2018-02-02 苏州汉尔信电子科技有限公司 一种低温烧结用纳米锡颗粒及其制备方法
US20240189905A1 (en) * 2021-04-09 2024-06-13 Heraeus Deutschland GmbH & Co. KG Silver sintering preparation and the use thereof for the connecting of electronic components

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