JP2003536258A5 - - Google Patents
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- Publication number
- JP2003536258A5 JP2003536258A5 JP2002502824A JP2002502824A JP2003536258A5 JP 2003536258 A5 JP2003536258 A5 JP 2003536258A5 JP 2002502824 A JP2002502824 A JP 2002502824A JP 2002502824 A JP2002502824 A JP 2002502824A JP 2003536258 A5 JP2003536258 A5 JP 2003536258A5
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- weight
- solution
- cleaning liquid
- ascorbic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000004140 cleaning Methods 0.000 description 44
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 27
- 239000007788 liquid Substances 0.000 description 19
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 18
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 11
- 229960005070 ascorbic acid Drugs 0.000 description 9
- 238000004377 microelectronic Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 235000010323 ascorbic acid Nutrition 0.000 description 8
- 239000011668 ascorbic acid Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- CIWBSHSKHKDKBQ-DUZGATOHSA-N D-isoascorbic acid Chemical compound OC[C@@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-DUZGATOHSA-N 0.000 description 3
- 239000002211 L-ascorbic acid Substances 0.000 description 3
- 235000000069 L-ascorbic acid Nutrition 0.000 description 3
- 150000000996 L-ascorbic acids Chemical class 0.000 description 3
- 239000000908 ammonium hydroxide Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 235000010350 erythorbic acid Nutrition 0.000 description 3
- 229940026239 isoascorbic acid Drugs 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- JPIGSMKDJQPHJC-UHFFFAOYSA-N 1-(2-aminoethoxy)ethanol Chemical compound CC(O)OCCN JPIGSMKDJQPHJC-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-SZSCBOSDSA-N 2-[(1s)-1,2-dihydroxyethyl]-3,4-dihydroxy-2h-furan-5-one Chemical compound OC[C@H](O)C1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-SZSCBOSDSA-N 0.000 description 2
- ZZZCUOFIHGPKAK-UHFFFAOYSA-N D-erythro-ascorbic acid Natural products OCC1OC(=O)C(O)=C1O ZZZCUOFIHGPKAK-UHFFFAOYSA-N 0.000 description 2
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 229930003268 Vitamin C Natural products 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 235000019154 vitamin C Nutrition 0.000 description 2
- 239000011718 vitamin C Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 description 1
- -1 tetraalkylammonium hydroxides Chemical class 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/587,883 US6492308B1 (en) | 1999-11-16 | 2000-06-06 | Post chemical-mechanical planarization (CMP) cleaning composition |
| US09/587,883 | 2000-06-06 | ||
| PCT/US2001/018402 WO2001095381A2 (en) | 2000-06-06 | 2001-06-06 | Post chemical-mechanical planarization (cmp) cleaning composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003536258A JP2003536258A (ja) | 2003-12-02 |
| JP2003536258A5 true JP2003536258A5 (https=) | 2008-08-28 |
| JP4942275B2 JP4942275B2 (ja) | 2012-05-30 |
Family
ID=24351570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002502824A Expired - Fee Related JP4942275B2 (ja) | 2000-06-06 | 2001-06-06 | 化学的機械的平坦化（ｃｍｐ）後の清浄化組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6492308B1 (https=) |
| EP (1) | EP1287550B1 (https=) |
| JP (1) | JP4942275B2 (https=) |
| KR (2) | KR100831180B1 (https=) |
| CN (1) | CN1205655C (https=) |
| AT (1) | ATE462198T1 (https=) |
| DE (1) | DE60141629D1 (https=) |
| TW (1) | TW574369B (https=) |
| WO (1) | WO2001095381A2 (https=) |
Families Citing this family (85)
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| US5498293A (en) | 1994-06-23 | 1996-03-12 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| US5567574A (en) | 1995-01-10 | 1996-10-22 | Mitsubishi Gas Chemical Company, Inc. | Removing agent composition for photoresist and method of removing |
| US6030932A (en) * | 1996-09-06 | 2000-02-29 | Olin Microelectronic Chemicals | Cleaning composition and method for removing residues |
| US5989353A (en) | 1996-10-11 | 1999-11-23 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| US6060439A (en) * | 1997-09-29 | 2000-05-09 | Kyzen Corporation | Cleaning compositions and methods for cleaning resin and polymeric materials used in manufacture |
| US5997658A (en) * | 1998-01-09 | 1999-12-07 | Ashland Inc. | Aqueous stripping and cleaning compositions |
| US6465403B1 (en) * | 1998-05-18 | 2002-10-15 | David C. Skee | Silicate-containing alkaline compositions for cleaning microelectronic substrates |
| US6152148A (en) * | 1998-09-03 | 2000-11-28 | Honeywell, Inc. | Method for cleaning semiconductor wafers containing dielectric films |
| JP4138096B2 (ja) * | 1998-09-09 | 2008-08-20 | 花王株式会社 | 剥離剤組成物 |
| JP4224651B2 (ja) | 1999-02-25 | 2009-02-18 | 三菱瓦斯化学株式会社 | レジスト剥離剤およびそれを用いた半導体素子の製造方法 |
| US6194366B1 (en) * | 1999-11-16 | 2001-02-27 | Esc, Inc. | Post chemical-mechanical planarization (CMP) cleaning composition |
| US6475966B1 (en) | 2000-02-25 | 2002-11-05 | Shipley Company, L.L.C. | Plasma etching residue removal |
-
2000
- 2000-06-06 US US09/587,883 patent/US6492308B1/en not_active Expired - Lifetime
-
2001
- 2001-06-06 WO PCT/US2001/018402 patent/WO2001095381A2/en not_active Ceased
- 2001-06-06 KR KR1020027016692A patent/KR100831180B1/ko not_active Expired - Lifetime
- 2001-06-06 EP EP01942043A patent/EP1287550B1/en not_active Expired - Lifetime
- 2001-06-06 DE DE60141629T patent/DE60141629D1/de not_active Expired - Lifetime
- 2001-06-06 JP JP2002502824A patent/JP4942275B2/ja not_active Expired - Fee Related
- 2001-06-06 CN CNB018107230A patent/CN1205655C/zh not_active Expired - Lifetime
- 2001-06-06 KR KR1020077026381A patent/KR100831182B1/ko not_active Expired - Lifetime
- 2001-06-06 AT AT01942043T patent/ATE462198T1/de not_active IP Right Cessation
- 2001-10-15 TW TW90125393A patent/TW574369B/zh not_active IP Right Cessation
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