JP2003532791A5 - - Google Patents

Download PDF

Info

Publication number
JP2003532791A5
JP2003532791A5 JP2000502233A JP2000502233A JP2003532791A5 JP 2003532791 A5 JP2003532791 A5 JP 2003532791A5 JP 2000502233 A JP2000502233 A JP 2000502233A JP 2000502233 A JP2000502233 A JP 2000502233A JP 2003532791 A5 JP2003532791 A5 JP 2003532791A5
Authority
JP
Japan
Prior art keywords
sputtering target
metal
billet
target according
forging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000502233A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003532791A (ja
Filing date
Publication date
Priority claimed from US09/098,761 external-priority patent/US6569270B2/en
Application filed filed Critical
Publication of JP2003532791A publication Critical patent/JP2003532791A/ja
Publication of JP2003532791A5 publication Critical patent/JP2003532791A5/ja
Withdrawn legal-status Critical Current

Links

JP2000502233A 1997-07-11 1998-06-26 精微で均質な構造及び表面状態を備えた金属物体並びにその製造方法 Withdrawn JP2003532791A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US5221897P 1997-07-11 1997-07-11
US60/052,218 1997-07-11
US09/098,761 1998-06-17
US09/098,761 US6569270B2 (en) 1997-07-11 1998-06-17 Process for producing a metal article
PCT/US1998/013447 WO1999002743A1 (en) 1997-07-11 1998-06-26 Metal article with fine uniform structures and textures and process of making same

Publications (2)

Publication Number Publication Date
JP2003532791A JP2003532791A (ja) 2003-11-05
JP2003532791A5 true JP2003532791A5 (https=) 2005-04-07

Family

ID=26730344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000502233A Withdrawn JP2003532791A (ja) 1997-07-11 1998-06-26 精微で均質な構造及び表面状態を備えた金属物体並びにその製造方法

Country Status (5)

Country Link
US (2) US6569270B2 (https=)
EP (1) EP1027463A4 (https=)
JP (1) JP2003532791A (https=)
KR (1) KR100528090B1 (https=)
WO (1) WO1999002743A1 (https=)

Families Citing this family (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6569270B2 (en) 1997-07-11 2003-05-27 Honeywell International Inc. Process for producing a metal article
US6348139B1 (en) * 1998-06-17 2002-02-19 Honeywell International Inc. Tantalum-comprising articles
US6348113B1 (en) 1998-11-25 2002-02-19 Cabot Corporation High purity tantalum, products containing the same, and methods of making the same
US6858102B1 (en) * 2000-11-15 2005-02-22 Honeywell International Inc. Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets
US6423161B1 (en) 1999-10-15 2002-07-23 Honeywell International Inc. High purity aluminum materials
CN1425196A (zh) * 1999-11-24 2003-06-18 霍尼韦尔国际公司 导电互连
US6451222B1 (en) 1999-12-16 2002-09-17 Honeywell International Inc. Ferroelectric composition, ferroelectric vapor deposition target and method of making a ferroelectric vapor deposition target
US20040072009A1 (en) * 1999-12-16 2004-04-15 Segal Vladimir M. Copper sputtering targets and methods of forming copper sputtering targets
US6878250B1 (en) 1999-12-16 2005-04-12 Honeywell International Inc. Sputtering targets formed from cast materials
US7517417B2 (en) 2000-02-02 2009-04-14 Honeywell International Inc. Tantalum PVD component producing methods
US6331233B1 (en) 2000-02-02 2001-12-18 Honeywell International Inc. Tantalum sputtering target with fine grains and uniform texture and method of manufacture
US20010047838A1 (en) * 2000-03-28 2001-12-06 Segal Vladimir M. Methods of forming aluminum-comprising physical vapor deposition targets; sputtered films; and target constructions
US6585870B1 (en) * 2000-04-28 2003-07-01 Honeywell International Inc. Physical vapor deposition targets having crystallographic orientations
AU2001265309A1 (en) * 2000-06-02 2001-12-17 Honeywell International, Inc. Fine grain size material, sputtering target, methods of forming, and micro-arc reduction method
US20030227068A1 (en) * 2001-05-31 2003-12-11 Jianxing Li Sputtering target
US6946039B1 (en) 2000-11-02 2005-09-20 Honeywell International Inc. Physical vapor deposition targets, and methods of fabricating metallic materials
US6887356B2 (en) * 2000-11-27 2005-05-03 Cabot Corporation Hollow cathode target and methods of making same
IL156802A0 (en) * 2001-01-11 2004-02-08 Cabot Corp Tantalum and niobium billets and methods of producing same
CA2438819A1 (en) * 2001-02-20 2002-09-12 Peter R. Jepson Refractory metal plates with uniform texture and methods of making the same
KR20040043161A (ko) * 2001-07-19 2004-05-22 허니웰 인터내셔널 인코포레이티드 스퍼터링 타겟, 스퍼터 리액터, 주조잉곳을 제조하는 방법및 금속제품을 제조하는 방법
US8562664B2 (en) * 2001-10-25 2013-10-22 Advanced Cardiovascular Systems, Inc. Manufacture of fine-grained material for use in medical devices
IL161701A0 (en) 2001-11-13 2004-09-27 Praxair Technology Inc High-purity aluminum sputter targets
CN100350079C (zh) * 2001-11-16 2007-11-21 霍尼韦尔国际公司 用于电镀操作的阳极以及在半导体基体上形成材料的方法
WO2003064722A1 (en) * 2002-01-30 2003-08-07 Nikko Materials Company, Limited Copper alloy sputtering target and method for manufacturing the target
US7416697B2 (en) 2002-06-14 2008-08-26 General Electric Company Method for preparing a metallic article having an other additive constituent, without any melting
CN1238554C (zh) * 2002-06-24 2006-01-25 株式会社钢臂功科研 银合金溅射靶及其制造方法
US20040016635A1 (en) * 2002-07-19 2004-01-29 Ford Robert B. Monolithic sputtering target assembly
US7235143B2 (en) * 2002-08-08 2007-06-26 Praxair S.T. Technology, Inc. Controlled-grain-precious metal sputter targets
US20040123920A1 (en) * 2002-10-08 2004-07-01 Thomas Michael E. Homogenous solid solution alloys for sputter-deposited thin films
JP4794802B2 (ja) 2002-11-21 2011-10-19 Ｊｘ日鉱日石金属株式会社 銅合金スパッタリングターゲット及び半導体素子配線
US7897103B2 (en) * 2002-12-23 2011-03-01 General Electric Company Method for making and using a rod assembly
US6921470B2 (en) * 2003-02-13 2005-07-26 Cabot Corporation Method of forming metal blanks for sputtering targets
US20040186810A1 (en) * 2003-02-14 2004-09-23 Michaluk Christopher A. Method of supplying sputtering targets to fabricators and other users
CA2522844A1 (en) * 2003-04-23 2004-11-04 H.C. Starck Inc. Molybdenum alloy x-ray targets having uniform grain structure
US20040221929A1 (en) 2003-05-09 2004-11-11 Hebda John J. Processing of titanium-aluminum-vanadium alloys and products made thereby
US7228722B2 (en) * 2003-06-09 2007-06-12 Cabot Corporation Method of forming sputtering articles by multidirectional deformation
EP1639620A2 (en) * 2003-06-20 2006-03-29 Cabot Corporation Method and design for sputter target attachment to a backing plate
JP4384453B2 (ja) * 2003-07-16 2009-12-16 株式会社神戸製鋼所 Ａｇ系スパッタリングターゲット及びその製造方法
CN1839213A (zh) * 2003-08-21 2006-09-27 霍尼韦尔国际公司 在三元混合物中包含铜的pvd靶和形成含铜pvd靶的方法
US6964600B2 (en) * 2003-11-21 2005-11-15 Praxair Technology, Inc. High selectivity colloidal silica slurry
US20050252268A1 (en) * 2003-12-22 2005-11-17 Michaluk Christopher A High integrity sputtering target material and method for producing bulk quantities of same
EP1704266A2 (en) * 2003-12-22 2006-09-27 Cabot Corporation High integrity sputtering target material and method for producing bulk quantities of same
EP1721997B1 (en) * 2004-03-01 2012-03-28 JX Nippon Mining & Metals Corporation Method of manufacturing a Ni-Pt ALLOY.
MXPA06010835A (es) * 2004-03-26 2006-12-15 Starck H C Inc Crisoles de metales refractarios.
US7837812B2 (en) 2004-05-21 2010-11-23 Ati Properties, Inc. Metastable beta-titanium alloys and methods of processing the same by direct aging
US20060213592A1 (en) * 2004-06-29 2006-09-28 Postech Foundation Nanocrystalline titanium alloy, and method and apparatus for manufacturing the same
US20060042728A1 (en) * 2004-08-31 2006-03-02 Brad Lemon Molybdenum sputtering targets
US8088232B2 (en) * 2004-08-31 2012-01-03 H.C. Starck Inc. Molybdenum tubular sputtering targets with uniform grain size and texture
US7531021B2 (en) 2004-11-12 2009-05-12 General Electric Company Article having a dispersion of ultrafine titanium boride particles in a titanium-base matrix
US7998287B2 (en) 2005-02-10 2011-08-16 Cabot Corporation Tantalum sputtering target and method of fabrication
US20060201589A1 (en) * 2005-03-11 2006-09-14 Honeywell International Inc. Components comprising metallic material, physical vapor deposition targets, thin films, and methods of forming metallic components
EP1877592A2 (en) * 2005-04-21 2008-01-16 Honeywell International Inc. Novel ruthenium-based materials and ruthenium alloys, their use in vapor deposition or atomic layer deposition and films produced therefrom
US20060259126A1 (en) * 2005-05-05 2006-11-16 Jason Lenz Medical devices and methods of making the same
CN101374611B (zh) * 2006-03-07 2015-04-08 卡伯特公司 制备变形金属制品的方法
US20070251819A1 (en) * 2006-05-01 2007-11-01 Kardokus Janine K Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targets
US20070251818A1 (en) * 2006-05-01 2007-11-01 Wuwen Yi Copper physical vapor deposition targets and methods of making copper physical vapor deposition targets
US9358000B2 (en) 2006-12-15 2016-06-07 Ethicon, Inc. Tungsten alloy suture needles
US20080300552A1 (en) 2007-06-01 2008-12-04 Cichocki Frank R Thermal forming of refractory alloy surgical needles
US8062437B2 (en) * 2007-06-01 2011-11-22 Ethicon, Inc. Thermal forming of refractory alloy surgical needles and fixture and apparatus
US8250895B2 (en) 2007-08-06 2012-08-28 H.C. Starck Inc. Methods and apparatus for controlling texture of plates and sheets by tilt rolling
EP2185300B1 (en) 2007-08-06 2018-10-24 H. C. Starck, Inc. Refractory metal plates with improved uniformity of texture
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
JP5685201B2 (ja) 2009-01-22 2015-03-18 トーソー エスエムディー，インク． 一体構造のアルミニウム合金ターゲットとそれを製造する方法
US10053758B2 (en) * 2010-01-22 2018-08-21 Ati Properties Llc Production of high strength titanium
US8230899B2 (en) 2010-02-05 2012-07-31 Ati Properties, Inc. Systems and methods for forming and processing alloy ingots
US9267184B2 (en) 2010-02-05 2016-02-23 Ati Properties, Inc. Systems and methods for processing alloy ingots
KR101967945B1 (ko) 2010-04-26 2019-04-10 제이엑스금속주식회사 Ｓｂ-Ｔｅ기 합금 소결체 스퍼터링 타깃
KR101226483B1 (ko) * 2010-05-24 2013-01-25 국방과학연구소 균질하고 초미립의 미세조직을 갖는 구리 라이너 제조 방법
US10207312B2 (en) 2010-06-14 2019-02-19 Ati Properties Llc Lubrication processes for enhanced forgeability
US9255316B2 (en) 2010-07-19 2016-02-09 Ati Properties, Inc. Processing of α+β titanium alloys
US8499605B2 (en) 2010-07-28 2013-08-06 Ati Properties, Inc. Hot stretch straightening of high strength α/β processed titanium
US9206497B2 (en) 2010-09-15 2015-12-08 Ati Properties, Inc. Methods for processing titanium alloys
US8613818B2 (en) 2010-09-15 2013-12-24 Ati Properties, Inc. Processing routes for titanium and titanium alloys
US10513755B2 (en) 2010-09-23 2019-12-24 Ati Properties Llc High strength alpha/beta titanium alloy fasteners and fastener stock
US8789254B2 (en) 2011-01-17 2014-07-29 Ati Properties, Inc. Modifying hot workability of metal alloys via surface coating
US8652400B2 (en) 2011-06-01 2014-02-18 Ati Properties, Inc. Thermo-mechanical processing of nickel-base alloys
JP5159962B1 (ja) 2012-01-10 2013-03-13 三菱マテリアル株式会社 導電性膜形成用銀合金スパッタリングターゲットおよびその製造方法
US9050647B2 (en) 2013-03-15 2015-06-09 Ati Properties, Inc. Split-pass open-die forging for hard-to-forge, strain-path sensitive titanium-base and nickel-base alloys
US9869003B2 (en) 2013-02-26 2018-01-16 Ati Properties Llc Methods for processing alloys
CN104937133A (zh) * 2013-03-04 2015-09-23 吉坤日矿日石金属株式会社 钽溅射靶及其制造方法
US9192981B2 (en) 2013-03-11 2015-11-24 Ati Properties, Inc. Thermomechanical processing of high strength non-magnetic corrosion resistant material
US9027374B2 (en) 2013-03-15 2015-05-12 Ati Properties, Inc. Methods to improve hot workability of metal alloys
US9539636B2 (en) 2013-03-15 2017-01-10 Ati Properties Llc Articles, systems, and methods for forging alloys
US9777361B2 (en) 2013-03-15 2017-10-03 Ati Properties Llc Thermomechanical processing of alpha-beta titanium alloys
KR101282229B1 (ko) * 2013-03-28 2013-07-09 국방과학연구소 성형작약탄용 몰리브데늄 라이너의 제조방법 및 그 제조방법에 의해 제조된 성형작약탄용 몰리브데늄 라이너
US11111552B2 (en) 2013-11-12 2021-09-07 Ati Properties Llc Methods for processing metal alloys
DE102013225187B4 (de) * 2013-12-06 2018-07-19 Heraeus Deutschland GmbH & Co. KG Verfahren zur Bearbeitung einer dispersionsgehärteten Platinzusammensetzung
US10011895B2 (en) 2014-05-06 2018-07-03 Gyrus Acmi, Inc. Assembly fabrication and modification of elasticity in materials
US10094003B2 (en) 2015-01-12 2018-10-09 Ati Properties Llc Titanium alloy
CN108026634A (zh) * 2015-08-03 2018-05-11 霍尼韦尔国际公司 具有改善性质的无摩擦锻造铝合金溅射靶
US10502252B2 (en) 2015-11-23 2019-12-10 Ati Properties Llc Processing of alpha-beta titanium alloys
US10900102B2 (en) 2016-09-30 2021-01-26 Honeywell International Inc. High strength aluminum alloy backing plate and methods of making
CA3060609A1 (en) * 2017-04-21 2018-10-25 Oerlikon Surface Solutions Ag, Pfaffikon Superalloy target
US11062889B2 (en) 2017-06-26 2021-07-13 Tosoh Smd, Inc. Method of production of uniform metal plates and sputtering targets made thereby
US10760156B2 (en) 2017-10-13 2020-09-01 Honeywell International Inc. Copper manganese sputtering target
JP7308013B2 (ja) * 2017-11-10 2023-07-13 Ｊｘ金属株式会社 タングステンスパッタリングターゲット及びその製造方法
US11035036B2 (en) 2018-02-01 2021-06-15 Honeywell International Inc. Method of forming copper alloy sputtering targets with refined shape and microstructure
KR20210047343A (ko) * 2018-09-26 2021-04-29 제이엑스금속주식회사 스퍼터링 타깃 및 그 제조 방법
CN112084924B (zh) * 2020-09-02 2022-05-24 燕山大学 晶粒组织均匀性的评价方法、锻造成形工艺选择方法
CN112481565B (zh) * 2020-11-12 2021-10-26 贵州航宇科技发展股份有限公司 一种Waspaloy合金的锻造方法
CN113231465B (zh) * 2021-05-13 2022-05-13 太原理工大学 一种大尺寸Ni-Ni3Al-NiAl层状结构复合板的制备方法
CN115283431B (zh) * 2022-08-04 2025-08-19 南京理工大学 一种高强高韧等轴超细晶纯钛的制备方法
CN116005085A (zh) * 2023-03-17 2023-04-25 内蒙金属材料研究所 一种用于含钪铝合金板材的大辊径板厚比的冷轧制备工艺
US12344918B2 (en) 2023-07-12 2025-07-01 Ati Properties Llc Titanium alloys
CN118497645B (zh) * 2024-07-18 2024-12-17 东北大学 一种阳极氧化外观用铝合金带材的制备方法及铝合金带材
CN120755295B (zh) * 2025-09-05 2025-11-18 宝武特种冶金有限公司 一种精确控制航空发动机钛合金机匣的超塑成形方法

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3246361A1 (de) 1982-02-27 1983-09-08 Philips Patentverwaltung Gmbh, 2000 Hamburg Kohlenstoff enthaltende gleitschicht
JPS6066425A (ja) 1983-09-22 1985-04-16 Nippon Telegr & Teleph Corp <Ntt> Ｌｓｉ電極用の高純度モリブデンタ−ゲツトならびに高純度モリブデンシリサイドタ−ゲツトおよびその製造方法
US4663130A (en) 1983-11-14 1987-05-05 Cabot Corporation Process for dissolving tantalum/columbium materials containing alkali metal impurities
US4663120A (en) 1985-04-15 1987-05-05 Gte Products Corporation Refractory metal silicide sputtering target
JPH0621346B2 (ja) 1986-06-11 1994-03-23 日本鉱業株式会社 高純度金属タンタル製ターゲットの製造方法
US4889745A (en) 1986-11-28 1989-12-26 Japan As Represented By Director General Of Agency Of Industrial Science And Technology Method for reactive preparation of a shaped body of inorganic compound of metal
JPS63216966A (ja) * 1987-03-06 1988-09-09 Toshiba Corp スパツタタ−ゲツト
JPS63244727A (ja) * 1987-03-31 1988-10-12 Nkk Corp スパツタリング用タ−ゲツトの製造方法
US4762558A (en) 1987-05-15 1988-08-09 Rensselaer Polytechnic Institute Production of reactive sintered nickel aluminide material
US4960163A (en) * 1988-11-21 1990-10-02 Aluminum Company Of America Fine grain casting by mechanical stirring
FR2648404B1 (fr) 1989-06-14 1991-09-13 Faiveley Sa Pantographe a coussin d'air
US5468401A (en) 1989-06-16 1995-11-21 Chem-Trend, Incorporated Carrier-free metalworking lubricant and method of making and using same
US5074907A (en) 1989-08-16 1991-12-24 General Electric Company Method for developing enhanced texture in titanium alloys, and articles made thereby
EP0483375B1 (en) 1990-05-15 1996-03-13 Kabushiki Kaisha Toshiba Sputtering target and production thereof
WO1992001080A1 (en) 1990-07-03 1992-01-23 Tosoh Smd, Inc. Improved sputter target for coating compact discs, methods of use thereof, and methods of manufacture of the targets
US5087297A (en) 1991-01-17 1992-02-11 Johnson Matthey Inc. Aluminum target for magnetron sputtering and method of making same
EP0535314A1 (en) 1991-08-30 1993-04-07 Mitsubishi Materials Corporation Platinum-cobalt alloy sputtering target and method for manufacturing same
US5231306A (en) 1992-01-31 1993-07-27 Micron Technology, Inc. Titanium/aluminum/nitrogen material for semiconductor devices
JPH05214523A (ja) 1992-02-05 1993-08-24 Toshiba Corp スパッタリングターゲットおよびその製造方法
US5330701A (en) 1992-02-28 1994-07-19 Xform, Inc. Process for making finely divided intermetallic
JP3338476B2 (ja) 1992-06-29 2002-10-28 住友チタニウム株式会社 スパッタリング用の金属Ｔｉターゲットの製造方法
JPH0693400A (ja) 1992-09-16 1994-04-05 Nkk Corp チタン製電着ドラムの製造方法
US5693203A (en) 1992-09-29 1997-12-02 Japan Energy Corporation Sputtering target assembly having solid-phase bonded interface
TW234767B (zh) 1992-09-29 1994-11-21 Nippon En Kk 擴散接合之噴濺靶組立體及其製法
JPH06256919A (ja) 1993-03-01 1994-09-13 Seiko Instr Inc チタン合金の加工方法
JPH06264232A (ja) 1993-03-12 1994-09-20 Nikko Kinzoku Kk Ｔａ製スパッタリングタ−ゲットとその製造方法
US5400633A (en) 1993-09-03 1995-03-28 The Texas A&M University System Apparatus and method for deformation processing of metals, ceramics, plastics and other materials
US5772860A (en) 1993-09-27 1998-06-30 Japan Energy Corporation High purity titanium sputtering targets
US5513512A (en) 1994-06-17 1996-05-07 Segal; Vladimir Plastic deformation of crystalline materials
JP3506782B2 (ja) 1994-11-24 2004-03-15 オリンパス株式会社 光学薄膜の製造方法
US5590389A (en) 1994-12-23 1996-12-31 Johnson Matthey Electronics, Inc. Sputtering target with ultra-fine, oriented grains and method of making same
JP2984778B2 (ja) 1995-02-27 1999-11-29 株式会社住友シチックス尼崎 高純度チタン材の鍛造方法
JP3413782B2 (ja) 1995-03-31 2003-06-09 日立金属株式会社 スパッタリング用チタンタ−ゲットおよびその製造方法
US5600989A (en) 1995-06-14 1997-02-11 Segal; Vladimir Method of and apparatus for processing tungsten heavy alloys for kinetic energy penetrators
US5673581A (en) 1995-10-03 1997-10-07 Segal; Vladimir Method and apparatus for forming thin parts of large length and width
JP3713332B2 (ja) 1996-06-21 2005-11-09 同和鉱業株式会社 単結晶銅ターゲット及びその製造方法
US5766380A (en) 1996-11-05 1998-06-16 Sony Corporation Method for fabricating randomly oriented aluminum alloy sputtering targets with fine grains and fine precipitates
JPH10158829A (ja) 1996-12-04 1998-06-16 Sony Corp スパッタリングターゲット組立体の製造方法
JP3867328B2 (ja) 1996-12-04 2007-01-10 ソニー株式会社 スパッタリングターゲット及びその製造方法
US6569270B2 (en) 1997-07-11 2003-05-27 Honeywell International Inc. Process for producing a metal article
US5993621A (en) 1997-07-11 1999-11-30 Johnson Matthey Electronics, Inc. Titanium sputtering target
US6001227A (en) 1997-11-26 1999-12-14 Applied Materials, Inc. Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target
US6348139B1 (en) 1998-06-17 2002-02-19 Honeywell International Inc. Tantalum-comprising articles
US6193821B1 (en) 1998-08-19 2001-02-27 Tosoh Smd, Inc. Fine grain tantalum sputtering target and fabrication process
US6348113B1 (en) 1998-11-25 2002-02-19 Cabot Corporation High purity tantalum, products containing the same, and methods of making the same
US6423161B1 (en) 1999-10-15 2002-07-23 Honeywell International Inc. High purity aluminum materials

Similar Documents

Publication Publication Date Title
JP2003532791A5 (https=)
KR100512295B1 (ko) 미세균일 구조 및 조직을 갖는 금속재 및 그 제조방법
KR100528090B1 (ko) 미세한 균일 구조 및 조직을 가지는 금속 물품 및 그의 제조방법
JP5239022B2 (ja) 高強度高靭性マグネシウム合金及びその製造方法
US5590389A (en) Sputtering target with ultra-fine, oriented grains and method of making same
JP2002518593A5 (https=)
TWI507552B (zh) 單塊鋁合金靶和製造方法
JPS60228659A (ja) ニツケル基超合金の可鍛性の改良
WO1996020055A9 (en) Sputtering target with ultra-fine, oriented grains and method of making same
US20170113259A1 (en) Method of manufacturing pure niobium plate end-group components for superconducting high frequency accelerator cavity
JP2002339028A (ja) 電気電子部品用銅合金及び電気電子部品
US6908588B2 (en) Process for manufacturing an evaporation source
EP0535167A4 (en) Metallurgical products improved by deformation processing
JP2002003963A (ja) 疲労特性に優れたＣｕ−Ｃｒ−Ｚｒ系合金、その製造方法及び連続鋳造用冷却ロール
JP2000225412A (ja) アルミニウム合金の塑性加工方法及びそれによる高強度高延性アルミニウム合金材
WO2000044944A2 (en) Processes for continuously producing fine grained metal compositions and for semi-solid forming of shaped articles
JP2004523657A5 (https=)
Stevens Daugherty Direct roll compacting sheet from particles
JPS60149751A (ja) 金属組成物
DE1224049B (de) Verfahren und Vorrichtung zur Herstellung von duktilen und zugleich festen, insbesondere warmfesten Aluminiumlegierungen
JP3113893B2 (ja) 塑性加工用材の製造法並びに塑性加工材の製造法
RU2087257C1 (ru) Электрод для контактной сварки
JPH0417724B2 (https=)
JPH03243702A (ja) 高強度アルミニウム合金成形体の製造方法
JP2006297421A (ja) 鍛造加工用アルミニウムもしくはマグネシウムまたはこれらの合金素材の製造方法