JP2003282669A5 - - Google Patents

Download PDF

Info

Publication number
JP2003282669A5
JP2003282669A5 JP2002086199A JP2002086199A JP2003282669A5 JP 2003282669 A5 JP2003282669 A5 JP 2003282669A5 JP 2002086199 A JP2002086199 A JP 2002086199A JP 2002086199 A JP2002086199 A JP 2002086199A JP 2003282669 A5 JP2003282669 A5 JP 2003282669A5
Authority
JP
Japan
Prior art keywords
substrate
line
bay
transport
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002086199A
Other languages
English (en)
Japanese (ja)
Other versions
JP4220173B2 (ja
JP2003282669A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2002086199A external-priority patent/JP4220173B2/ja
Priority to JP2002086199A priority Critical patent/JP4220173B2/ja
Priority to US10/217,405 priority patent/US6979168B2/en
Priority to TW091118306A priority patent/TW583129B/zh
Priority to CNA2004100644876A priority patent/CN1583532A/zh
Priority to CN02142211A priority patent/CN1446742A/zh
Priority to KR1020020051203A priority patent/KR20030077922A/ko
Publication of JP2003282669A publication Critical patent/JP2003282669A/ja
Priority to KR1020050001992A priority patent/KR100599987B1/ko
Publication of JP2003282669A5 publication Critical patent/JP2003282669A5/ja
Publication of JP4220173B2 publication Critical patent/JP4220173B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002086199A 2002-03-26 2002-03-26 基板の搬送方法 Expired - Fee Related JP4220173B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2002086199A JP4220173B2 (ja) 2002-03-26 2002-03-26 基板の搬送方法
US10/217,405 US6979168B2 (en) 2002-03-26 2002-08-14 Method and apparatus for transferring substrate
TW091118306A TW583129B (en) 2002-03-26 2002-08-14 Method and device for transporting substrate
CN02142211A CN1446742A (zh) 2002-03-26 2002-08-23 基板的输送方法及其装置
CNA2004100644876A CN1583532A (zh) 2002-03-26 2002-08-23 基板的输送方法及其装置
KR1020020051203A KR20030077922A (ko) 2002-03-26 2002-08-28 기판의 반송방법 및 그 장치
KR1020050001992A KR100599987B1 (ko) 2002-03-26 2005-01-10 기판의 반송방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002086199A JP4220173B2 (ja) 2002-03-26 2002-03-26 基板の搬送方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005055903A Division JP4224467B2 (ja) 2005-03-01 2005-03-01 半導体製造ライン

Publications (3)

Publication Number Publication Date
JP2003282669A JP2003282669A (ja) 2003-10-03
JP2003282669A5 true JP2003282669A5 (en:Method) 2005-09-02
JP4220173B2 JP4220173B2 (ja) 2009-02-04

Family

ID=28449293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002086199A Expired - Fee Related JP4220173B2 (ja) 2002-03-26 2002-03-26 基板の搬送方法

Country Status (5)

Country Link
US (1) US6979168B2 (en:Method)
JP (1) JP4220173B2 (en:Method)
KR (2) KR20030077922A (en:Method)
CN (2) CN1446742A (en:Method)
TW (1) TW583129B (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9570330B2 (en) 2002-07-22 2017-02-14 Brooks Automation, Inc. Substrate processing apparatus

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100265287B1 (ko) 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
US8960099B2 (en) 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
KR20040110391A (ko) * 2003-06-19 2004-12-31 삼성전자주식회사 기판 처리 장치
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
TWI274710B (en) * 2004-02-13 2007-03-01 Advanced Display Proc Eng Co Apparatus for manufacturing flat-panel display
US7905960B2 (en) 2004-03-24 2011-03-15 Jusung Engineering Co., Ltd. Apparatus for manufacturing substrate
TWI280220B (en) 2004-10-25 2007-05-01 Tokyo Electron Ltd Carrying system, substrate treating device, and carrying method
US7959984B2 (en) * 2004-12-22 2011-06-14 Lam Research Corporation Methods and arrangement for the reduction of byproduct deposition in a plasma processing system
US20060218680A1 (en) * 2005-03-28 2006-09-28 Bailey Andrew D Iii Apparatus for servicing a plasma processing system with a robot
JP4221603B2 (ja) * 2005-03-31 2009-02-12 村田機械株式会社 天井走行車システム
KR100945983B1 (ko) * 2005-04-22 2010-03-09 로제 가부시키가이샤 카세트 반송 시스템
EP1883958A2 (en) * 2005-05-16 2008-02-06 Asyst Technologies, Inc. Modular terminal for high-throughput amhs
KR20070029032A (ko) * 2005-09-08 2007-03-13 주성엔지니어링(주) 이동식 이송챔버와 이를 포함하는 기판처리장치
KR20080075164A (ko) * 2005-11-07 2008-08-14 브룩스 오토메이션 인코퍼레이티드 저감된 용량의 캐리어, 이송부, 로드 포트, 버퍼 시스템
US8272827B2 (en) 2005-11-07 2012-09-25 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
WO2007107983A2 (en) * 2006-03-17 2007-09-27 Shlomo Shmuelov Storage and purge system for semiconductor wafers
JP4200387B2 (ja) * 2006-04-14 2008-12-24 村田機械株式会社 搬送システム
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7925502B2 (en) * 2007-03-01 2011-04-12 Microsoft Corporation Pitch model for noise estimation
KR20100086490A (ko) * 2007-10-24 2010-07-30 오씨 외를리콘 발처스 악티엔게젤샤프트 작업편 제조방법 및 장치
TWI368271B (en) * 2008-07-02 2012-07-11 Powertech Technology Inc Equipment and method for cutting big size wafer
US8602706B2 (en) 2009-08-17 2013-12-10 Brooks Automation, Inc. Substrate processing apparatus
JP5835722B2 (ja) * 2009-12-10 2015-12-24 オルボテック エルティ ソラー，エルエルシー 自動順位付け多方向直列型処理装置
JP5361002B2 (ja) 2010-09-01 2013-12-04 独立行政法人産業技術総合研究所 デバイス製造装置および方法
US8459276B2 (en) 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
JP5877016B2 (ja) * 2011-08-26 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置および基板処理装置
CN104507832B (zh) * 2012-04-16 2016-06-29 弗拉基米尔·阿鲁秋尼杨 重力输送机
US20140119858A1 (en) * 2012-10-31 2014-05-01 Sandisk 3D Llc Semiconductor Device Manufacturing Line
CN103101704B (zh) * 2013-02-28 2015-10-21 上海和辉光电有限公司 自动派工方法
US9685357B2 (en) * 2013-10-31 2017-06-20 Semes Co., Ltd. Apparatus for treating substrate
US9411332B2 (en) * 2014-02-14 2016-08-09 GlobalFoundries, Inc. Automated mechanical handling systems for integrated circuit fabrication, system computers programmed for use therein, and methods of handling a wafer carrier having an inlet port and an outlet port
JP6330596B2 (ja) * 2014-09-16 2018-05-30 株式会社デンソー 搬送システム
DE102015211941A1 (de) * 2015-06-26 2016-12-29 Zf Friedrichshafen Ag Verfahren und Vorrichtung zur Reduzierung eines Energiebedarfs einer Werkzeugmaschine und Werkzeugmaschinensystem
JP6539558B2 (ja) * 2015-10-05 2019-07-03 リンテック株式会社 処理装置
JP6493339B2 (ja) * 2016-08-26 2019-04-03 村田機械株式会社 搬送容器、及び収容物の移載方法
JP6987693B2 (ja) * 2018-04-27 2022-01-05 株式会社荏原製作所 検査方法、検査装置、及びこれを備えためっき装置
KR102827421B1 (ko) * 2020-01-14 2025-07-01 로제 가부시키가이샤 Foup 이송 장치
WO2021156985A1 (ja) * 2020-02-05 2021-08-12 株式会社安川電機 搬送システム、搬送方法および搬送装置
WO2021234928A1 (ja) * 2020-05-21 2021-11-25 株式会社安川電機 搬送装置、搬送方法および搬送システム
DE102020207676A1 (de) * 2020-06-22 2021-12-23 Krones Aktiengesellschaft Verfahren und Vorrichtung zum Puffern von Behältern in einer Behälterbehandlungsanlage
CN114220754B (zh) * 2021-12-14 2025-04-22 拓荆科技股份有限公司 一种基片处理装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3812947A (en) * 1969-07-29 1974-05-28 Texas Instruments Inc Automatic slice processing
US4178113A (en) * 1977-12-05 1979-12-11 Macronetics, Inc. Buffer storage apparatus for semiconductor wafer processing
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
US5658115A (en) * 1991-09-05 1997-08-19 Hitachi, Ltd. Transfer apparatus
JPH0616206A (ja) * 1992-07-03 1994-01-25 Shinko Electric Co Ltd クリーンルーム内搬送システム
EP0582018B1 (en) * 1992-08-04 1995-10-18 International Business Machines Corporation Pressurized interface apparatus for transferring a semiconductor wafer between a pressurized sealable transportable container and a processing equipment
US5417537A (en) * 1993-05-07 1995-05-23 Miller; Kenneth C. Wafer transport device
US5830272A (en) * 1995-11-07 1998-11-03 Sputtered Films, Inc. System for and method of providing a controlled deposition on wafers
US5855465A (en) * 1996-04-16 1999-01-05 Gasonics International Semiconductor wafer processing carousel
US6517303B1 (en) * 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
US6282459B1 (en) * 1998-09-01 2001-08-28 International Business Machines Corporation Structure and method for detection of physical interference during transport of an article
US6449522B1 (en) * 1998-11-17 2002-09-10 Micro Devices, Inc. Managing a semiconductor fabrication facility using wafer lot and cassette attributes
JP3193026B2 (ja) * 1999-11-25 2001-07-30 株式会社半導体先端テクノロジーズ 基板処理装置のロードポートシステム及び基板の処理方法
US6413356B1 (en) * 2000-05-02 2002-07-02 Applied Materials, Inc. Substrate loader for a semiconductor processing system
US6599763B1 (en) * 2000-06-20 2003-07-29 Advanced Micro Devices, Inc. Wafer randomization and alignment system integrated into a multiple chamber wafer processing system
EP1303729B1 (en) * 2000-07-06 2007-11-21 Brooks Automation, Inc. Item storage and retrieval system
US6568896B2 (en) * 2001-03-21 2003-05-27 Applied Materials, Inc. Transfer chamber with side wall port
US6519502B2 (en) * 2001-03-28 2003-02-11 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for positioning a cassette pod onto a loadport by an overhead hoist transport system
JP4190161B2 (ja) * 2001-05-08 2008-12-03 株式会社新川 ウェーハリングの供給返送装置
JP2003188229A (ja) * 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
US6663340B1 (en) * 2002-08-30 2003-12-16 Motorola, Inc. Wafer carrier transport system for tool bays
US6848882B2 (en) * 2003-03-31 2005-02-01 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for positioning a cassette pod onto a loadport by an overhead hoist transport system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9570330B2 (en) 2002-07-22 2017-02-14 Brooks Automation, Inc. Substrate processing apparatus

Similar Documents

Publication Publication Date Title
JP2003282669A5 (en:Method)
JP4739532B2 (ja) Ｌｃｄガラス基板の搬送システム
TWI233628B (en) Coating and developing system
JPH0616206A (ja) クリーンルーム内搬送システム
CN102064126B (zh) 基板运输处理方法
JP2003124284A5 (en:Method)
JP2014138041A5 (ja) 処理装置、処理方法、及びデバイスの製造方法
TW201044482A (en) Process module facility
JP4096359B2 (ja) 製造対象物の製造装置
TW457615B (en) Mechanism and method for supporting substrate to be coated with film
JP2005340425A (ja) 真空処理装置
JP6049367B2 (ja) 基板処理装置および基板処理システム
JPWO2020209269A5 (en:Method)
JP2003257945A5 (en:Method)
JP2002237512A (ja) ウエハー枚葉搬送用コンベヤの移載装置
JP2004281475A (ja) 枚葉搬送装置および枚葉搬送方法
TWI714472B (zh) 晶圓載具運輸系統
JP2011201677A (ja) 板状基板の搬送方法および板状基板の搬送装置
JP2000332080A (ja) 被処理物の製造方法と製造装置
JP2005026554A (ja) 基板処理方法および基板処理装置
JP7399552B2 (ja) 収納体搬送装置及びレーザ加工装置
CN112792717B (zh) 基板玻璃面抛光生产线系统和基板玻璃面抛光生产方法
JP2004182378A (ja) 大型基板の搬送方法及び固定方法
JPH01247311A (ja) 半導体製造装置
CN104907288A (zh) 清洁电子元件的清洁设备及工艺