JP2003229382A - 切削装置 - Google Patents
切削装置Info
- Publication number
- JP2003229382A JP2003229382A JP2002028100A JP2002028100A JP2003229382A JP 2003229382 A JP2003229382 A JP 2003229382A JP 2002028100 A JP2002028100 A JP 2002028100A JP 2002028100 A JP2002028100 A JP 2002028100A JP 2003229382 A JP2003229382 A JP 2003229382A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- coordinate value
- order
- cut
- blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002028100A JP2003229382A (ja) | 2002-02-05 | 2002-02-05 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002028100A JP2003229382A (ja) | 2002-02-05 | 2002-02-05 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003229382A true JP2003229382A (ja) | 2003-08-15 |
JP2003229382A5 JP2003229382A5 (enrdf_load_stackoverflow) | 2007-05-17 |
Family
ID=27749423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002028100A Pending JP2003229382A (ja) | 2002-02-05 | 2002-02-05 | 切削装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2003229382A (enrdf_load_stackoverflow) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006005257A (ja) * | 2004-06-18 | 2006-01-05 | Apic Yamada Corp | 半導体装置の製造装置 |
JP2009188296A (ja) * | 2008-02-08 | 2009-08-20 | Disco Abrasive Syst Ltd | ウエーハの洗浄装置 |
JP2014172150A (ja) * | 2013-03-12 | 2014-09-22 | Disco Abrasive Syst Ltd | 切削方法 |
JP2020136555A (ja) * | 2019-02-22 | 2020-08-31 | 株式会社ディスコ | 加工装置 |
KR20230018319A (ko) | 2021-07-29 | 2023-02-07 | 가부시기가이샤 디스코 | 세정 장치 |
KR20230120098A (ko) | 2022-02-08 | 2023-08-16 | 가부시기가이샤 디스코 | 세정 장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07156133A (ja) * | 1993-12-08 | 1995-06-20 | Yamaha Fine Tec Kk | スクライバー |
JPH1126402A (ja) * | 1997-07-02 | 1999-01-29 | Disco Abrasive Syst Ltd | 精密切削装置及び切削方法 |
JPH1174228A (ja) * | 1997-08-28 | 1999-03-16 | Disco Abrasive Syst Ltd | 精密切削装置 |
-
2002
- 2002-02-05 JP JP2002028100A patent/JP2003229382A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07156133A (ja) * | 1993-12-08 | 1995-06-20 | Yamaha Fine Tec Kk | スクライバー |
JPH1126402A (ja) * | 1997-07-02 | 1999-01-29 | Disco Abrasive Syst Ltd | 精密切削装置及び切削方法 |
JPH1174228A (ja) * | 1997-08-28 | 1999-03-16 | Disco Abrasive Syst Ltd | 精密切削装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006005257A (ja) * | 2004-06-18 | 2006-01-05 | Apic Yamada Corp | 半導体装置の製造装置 |
JP2009188296A (ja) * | 2008-02-08 | 2009-08-20 | Disco Abrasive Syst Ltd | ウエーハの洗浄装置 |
JP2014172150A (ja) * | 2013-03-12 | 2014-09-22 | Disco Abrasive Syst Ltd | 切削方法 |
JP2020136555A (ja) * | 2019-02-22 | 2020-08-31 | 株式会社ディスコ | 加工装置 |
JP7232077B2 (ja) | 2019-02-22 | 2023-03-02 | 株式会社ディスコ | 加工装置 |
KR20230018319A (ko) | 2021-07-29 | 2023-02-07 | 가부시기가이샤 디스코 | 세정 장치 |
KR20230120098A (ko) | 2022-02-08 | 2023-08-16 | 가부시기가이샤 디스코 | 세정 장치 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4447074B2 (ja) | 切削装置 | |
CN101131921B (zh) | 晶片的加工方法 | |
KR101266373B1 (ko) | 절삭장치 | |
US7329079B2 (en) | Semiconductor wafer processing machine | |
CN106956370B (zh) | 加工装置的搬送机构 | |
JP2003211354A (ja) | 切削装置 | |
JP2011066233A (ja) | 切削装置 | |
KR20180113165A (ko) | 절삭 장치 | |
CN1931551A (zh) | 切削装置和加工方法 | |
CN113246324A (zh) | 切削装置和切削方法 | |
JP2004303855A (ja) | 切削装置 | |
JP2003229382A (ja) | 切削装置 | |
US8289388B2 (en) | Alignment method for singulation system | |
JP4542223B2 (ja) | 切削装置 | |
JP2005203540A (ja) | ウエーハの切削方法 | |
JP2003173986A (ja) | 2スピンドル切削装置における切削方法 | |
JP4427299B2 (ja) | 板状物の加工方法 | |
KR20180131970A (ko) | 부채형 웨이퍼편의 가공 방법 | |
JP4342861B2 (ja) | 半導体ウエーハの加工装置 | |
JP5389540B2 (ja) | 切削装置 | |
JP4590060B2 (ja) | 切削装置 | |
JP2014033122A (ja) | 被加工物の加工方法 | |
JP2013000777A (ja) | レーザー加工装置 | |
JP2018032825A (ja) | 被加工物のアライメント方法 | |
JP3222726U (ja) | 切削装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041102 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070115 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070323 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070731 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20071127 |