JP2003229382A - Cutter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutter which comprises a first cutting means and a second cutting means provided with a first cutting blade and a second cutting blade arranged so as to face each other, and in which a notch amount is gradually deepened at the same Y coordinate value by using one cutting conditions to cut stepwise to a predetermined depth. <P>SOLUTION: A control means controls first and second indexing feed mechanisms for operating first and second cutting means in an indexing direction and first and second notching feed mechanisms which are operated in a notch direction, and the control means comprises a memory for storing a cutting condition table set in accordance with the order of cutting by the first cutting means. This control means controls the first indexing feed mechanism and the first notching feed mechanism in accordance with the order set in the cutting condition table, and turns over the order set in the cutting condition table to the second indexing feed mechanism and the second notching feed mechanism, and also controls the second notching feed mechanism from a Z coordinate value in the order of earlier times when a plurality of Z coordinate values exist in the same Y coordinate value. <P>COPYRIGHT: (C)2003,JPO

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention
First and second cutting blades provided
A first cutting means and a second cutting means provided with
Cutting device. 2. Description of the Related Art In semiconductor device manufacturing processes,
Disk-shaped semiconductor wafers are arranged in a grid on the surface.
Circuits such as ICs and LSIs are formed in a large number of
Each area where a road is formed is connected to a predetermined street (cutting line).
Dicing along the individual semiconductor chips
Manufactures glass. Dicing of this semiconductor wafer
In general, a whetstone blade made of diamond
While rotating the cutting blade configured in the street
Cutting device that cuts by relatively moving along
Is used. In recent years, in order to perform cutting efficiently,
A first cutting blade and a second cutting blade
First cutting means with cutting blade and second cutting
Cutting devices having means have been put to practical use. like this
Equipped with a first cutting means and a second cutting means
Indexing control and cutting control when cutting a workpiece
And cut control will be described with reference to FIG.
You. In FIG. 10, the workpiece W is connected to the first cutting blade B1.
The Y coordinate of the workpiece W by the second cutting blade B2
From the outside to the inside with the center of the workpiece W as the target.
An example of sending out and sending is shown. In addition, of the workpiece W
The length of the line (cutting groove) in the Z direction described in each Y coordinate value is
First cutting blade B1 and second cutting blade B2
Indicates a cutting position (Z coordinate value). Also,
In FIG. 10, n denotes a value that the first cutting blade B1 cuts.
Order. Y seat corresponding to the cutting order in this way
Controlled by a cutting condition table that sets the target value and Z coordinate value
The control means is stored in a memory of the means,
For the cutting by the blade B1, the set order (Fig.
Y coordinate value and Z according to (n0 in the example shown)
Read coordinate values and perform indexing control and cutting control
Execute. On the other hand, for cutting by the second cutting blade B2
In this case, the control means reverses the set order (example shown in the figure).
In n), the Y coordinate value and the Z coordinate value are calculated from n35.
Read and execute index control and cut control
You. [0004] However, as described above,
Is set in the cutting by the second cutting blade B2.
Read the Y coordinate value and Z coordinate value by simply reversing the order
When index control and cut control are executed,
The following problems occur. That is, sapphire and thick glass
In the case of a workpiece W such as
As shown in FIG. 9, a predetermined Y coordinate value (Y in the example of FIG. 9)
5, Y25, ... Y105, Y125)
Cutting depth gradually to a specified depth
There are cases where so-called multi-stage cutting is performed. In this case, the order of cutting
When the number is simply inverted and the Z coordinate value is read, for example, FIG.
In the example, the Y coordinate value is 125 mm in the cutting order n33.
And read the Z coordinate value (cut amount Z) as 2 μm
And cut to 2μm first in Y125mm
Resulting in. Originally, in Y125mm,
First, cutting (cutting order n31) with cutting depth Z4μm,
Next, cutting is performed at a cutting depth (Z) of 3 μm (cutting order n3).
2) After the cutting, the cutting amount (Z) is cut at 2 μm (cutting order)
Number n33). Thus, the second cut
The order set in cutting by the cutting blade B2 is simply
Just inverts to the same Y coordinate
(Z) is gradually deepened and cut to a predetermined depth stepwise
So-called multi-stage cutting cannot be performed. In order to solve the above-mentioned problem, the first
Cutting condition table for cutting blade B1 and second cutting blade
Two cutting condition tables in the cutting condition table for blade B2
Bull may be used. However, for the same workpiece
Having two sets of data requires time and effort to enter the data
Not only cuts, but also increases the possibility of
In a way that is easy for operators to operate
Absent. [0006] The present invention has been made in view of the above facts.
The main technical problem is that they are
A first cutting blade and a second cutting blade
Provided with first cutting means and second cutting means
In the apparatus, the same Y seat is used by using one cutting condition table.
Set the depth of cut gradually at the standard value and set it stepwise
To provide a cutting device that can cut to a depth of
It is in. Means for Solving the Problems The above main technical problems are solved.
According to the present invention, the chamber for holding the workpiece is
And a chuck table disposed opposite to each other.
Cutting shake for cutting the workpiece held by the cable
Cutting means comprising a blade and a second cutting blade
And the second cutting means, and the chuck table
A cutting feed mechanism that moves in the cutting direction,
And a first for moving the second cutting means in the indexing direction.
An index feed mechanism and a second index feed mechanism;
Cutting direction of the first cutting means and the second cutting means
Notch feed mechanism and second notch moving to
Feed mechanism, the cutting feed mechanism, and the first indexing feed
Mechanism, the second index feed mechanism, and the first slit feed
Control for controlling the cutting mechanism and the second slit feed mechanism
Means, the control means,
Each division is performed according to the cutting order by the first cutting means.
The Y coordinate value for which the output position is set and the cutoff at each Y coordinate value
Cutting condition table consisting of the Z coordinate value
The first index
The feed mechanism and the first cut feed mechanism
Control according to the order set in the cutting condition table,
Second index feed mechanism and second cut feeder
For the structure, reverse the order set in the cutting condition table.
At the same time, there are multiple Z coordinate values for the same Y coordinate value.
If there is, the second cut from the Z-coordinate value in the earlier order
The cutting device is characterized by controlling the feed mechanism.
Provided. [0008] [Embodiment of the invention below]
Preferred embodiments of the cutting device will be described with reference to the accompanying drawings.
This will be described in detail. FIG. 1 shows a cutting machine constructed in accordance with the present invention.
A perspective view of the device is shown. Cutting device shown in FIG.
Includes a substantially rectangular parallelepiped device housing 1. This
A workpiece such as a semiconductor wafer is placed in the device housing 1
And a cassette mechanism 2 for stocking
After unloading the stored workpiece and after cutting
Unloading and loading the workpiece into the cassette mechanism 2
The loading mechanism 3 and the workpiece unloading and loading mechanism 3
Chuck table mechanism 4 for holding the output workpiece
And the workpiece held by the chuck table mechanism 4
A cutting mechanism 5 for cutting, and cutting by the cutting mechanism 5
Cleaning mechanism 6 for cleaning the workpiece, and a chuck table
Work that transports the work between the mechanism 4 and the cleaning mechanism 6
An object transport mechanism 7 is provided. Also the equipment housing
Reference numeral 1 denotes an image captured by an optical unit described later.
The monitor 8 shown is provided. The above-mentioned cassette mechanism 2, chuck table machine
The structure 4 and the cutting mechanism 5 will be described with reference to FIG.
You. The cutting apparatus in the illustrated embodiment is an apparatus housing.
The stationary base 10 which is disposed in the
I have it. The cassette mechanism 2 includes a stationary base 10
Two guide rails 21 provided on the side in the vertical direction,
A cassette table 22 slidably disposed at 21;
Raise the cassette table 22 along the guide rail 21
Driving hand for moving downward (direction indicated by arrow Z)
Step 23 is provided. The driving means 23 is provided with the two
Male screw thread arranged in parallel between idrails 21 and 21
231 and a male screw attached to the cassette table 22
A female screw block (not shown) screwed to the rod 231;
A not-shown path for rotationally driving the male screw rod 231 is provided.
A driving source such as a loose motor is included. Therefore,
The male screw rod 231 is rotated by a pulse motor
As a result, the cassette table 22 moves vertically (arrow Z).
(In the direction indicated by). Up and down
On the cassette table 22 configured to be movable
A cassette 24 having a tiered accommodation chamber is placed. This mosquito
The workpieces 25 are placed one by one in the plurality of storage chambers of the set 24.
Will be accommodated. In the illustrated embodiment, the workpiece
An object 25 is attached to an annular frame 251 by a tape 252.
The semiconductor wafer 250 is shown mounted thereon. The chuck table mechanism 4 includes a stationary base.
10, a support table 41 fixed on the support table 41, and an arrow
Two guides arranged in parallel along the direction indicated by mark X
Rails 42, 42 and arrows on the guide rails 42, 42
Holds workpieces movably arranged in the direction indicated by mark X
Chuck table 43 as a workpiece holding means
I have it. This chuck table 43 is
Chucks movably disposed on the rollers 42, 42
A support table 431 and mounted on the suction chuck support table 431
And a suction chuck 432 provided.
A workpiece, for example, a disc-shaped semiconductor, is placed on the jack 432.
Hold the wafer by suction means (not shown)
Has become. Note that the chuck table mechanism 4 is
Table 43 along the two guide rails 42, 42
Drive means 44 for moving in the direction indicated by arrow X
I have it. The driving means 44 is provided with the two guide rails.
Male screw rod 44 disposed in parallel between the
And a male screw lock attached to the suction chuck support base 431.
Female screw block (not shown)
A pulse (not shown) for rotationally driving the dirod 441
A driving source such as a motor is included. Therefore, a not-shown
Drive the screw motor forward or reverse to rotate the male screw rod 44
1 by rotating the chuck table 43,
It is moved in the direction indicated by X. That is, the chuck
The bull 43 is a work placement area 10 shown in FIGS.
1 to the cutting area 102. Subordinate
Thus, the two guide rails 42, 42 and the driving hand
The step 44 moves the chuck table 43 in the cutting feed direction (X direction).
Function as a cutting feed mechanism that moves in the direction In addition, above
The chuck table mechanism 4 rotates the suction chuck 432.
It has a rotating mechanism (not shown) that rotates. Next, the cutting mechanism 5 will be described.
The cutting mechanism 5 has a portal type fixed on the stationary base 10.
A support table 51 is provided. This portal support 51 is
It is arranged so as to straddle the cutting area 102. support
Arranged parallel to the side wall of the table 51 along the direction indicated by the arrow Y
Provided two guide rails 511 and 511 are provided.
And will be described later along the guide rails 511 and 511.
Of a first support mechanism 52a for supporting the first cutting means
A plate supporting the plate 521a and a second cutting means described later
The substrates 521b of the second support mechanism 52b are indicated by arrows Y, respectively.
It is slidably disposed in the direction shown. The first support is mounted on the support table 51.
Holding mechanism 52a and second support mechanism 52b
Arrow Y along guide rails 511 and 511, respectively.
The first driving means 53a for moving in the direction shown
And a second driving means 53b. First drive
The means 53a and the second driving means 53b are respectively
It is disposed between the two guide rails 511 and 511.
Male screw rods 531a and 531b,
531a and 531b are driven to rotate, respectively.
Pulse motors 532a (M1) and 532b (M
2) etc. are included. Male screw rod 531a
And 531b have their inner ends facing each other
Rotatably supported by receivers 533a and 533b
And the outer end is a pulse motor 532a (M1)
And 532b (M2). This
In the middle part of the male screw rods 531a and 531b,
The substrate 521a of the first support mechanism 52a and the second
FIG. 2 is a view showing the support mechanism 52b mounted on the substrate 521b.
A female screw block (not shown) is screwed. As a result,
Sumer 532a (M1) and 532b (M2)
The male screw rods 531 a and 53
1b, the base of the first support mechanism 52a is rotated.
Plate 521a and Substrate 521b of Second Support Mechanism 52b
Is the direction indicated by arrow Y along guide rails 511 and 511
It is moved in the direction. Therefore, the guide rail 51
1, 511 and the first driving means 53a and the second drive
The moving means 53b includes a first cutting means and a second
First indexing feed for moving the cutting means in the indexing direction
It functions as a mechanism and a second index feed mechanism. The substrate 521a of the first support mechanism 52a
And a substrate 521b of the second support mechanism 52b.
The first guide rail 522a and the second guide rail
522b is set along the cut feed direction indicated by arrow Z.
This first guide rail 522a and
A first suspension bracket along the second guide rail 522b
523a and the second suspension bracket 523b.
Arranged slidably in the cutting feed direction indicated by arrow Z
Have been. Also, the substrate 521 of the first support mechanism 52a
a and the substrate 521b of the second support mechanism 52b
The first suspension bracket 523a and the second suspension bracket
To the first guide rails 522a and 522b, respectively.
The direction indicated by arrow Z along the second guide rail 522b
Driving means 54a for moving the
Of the driving means 54b. First drive means 5
4a and the second driving means 54b
Guide rail 522a and second guide rail 522b
And a male screw rod (not shown)
A pulse motor 5 for rotating each of the rods
41a (M3) and 541b (M4).
It is. The first suspension bracket 523a and the
And the second suspension bracket 523b, respectively,
A female screw block to be screwed into the male screw rod is attached.
You. As a result, the pulse motors 541a (M3) and 5
41b (M4) is driven forward or reverse to drive a male (not shown).
By rotating the screw rod, the first suspension bracket
523a and the second suspension bracket 523b
Guide rail 522a and second guide rail 52
2b along the cutting feed direction indicated by arrow Z
Can be. Therefore, the first guide rail 522a
And the second guide rail 522b and the first driving hand
The step 54a and the second driving means 54b are connected to a first
Moving the cutting means and the second cutting means in the cutting direction
First infeed mechanism and second infeed mechanism
Functions as a mechanism. The first suspension mechanism of the first support mechanism 52a
The racket 523a and the second support mechanism 52b
The suspension bracket 523b has a first cutting means
As the first spindle unit 55a and the second cutting means
All of the second spindle units 55b are mounted.
You. The first spindle unit 55a and the second spindle unit 55a
The spindle unit 55b is shown in a simplified manner.
This will be described with reference to FIG. First spindle unit
And the second spindle unit 55b
The first suspension bracket 523a and the second suspension bracket 523a respectively
Spindle housing fixed to vertical bracket 523b
551a and 551b and the spindle housing
551a and 551b rotatably supported respectively
Rotating spindles 552a and 552b,
Attached to one end of pindles 552a and 552b
First cutting blade 553a and second cutting blade
553b and rotating spindles 552a and 552b
Servo motors 554a (M5) and 55 for rotational driving
4b (M6). Configured like this
First spindle unit 55a and second spindle unit
Unit 55b is connected to the first cutting blade 553a and the
2 cutting blades 553b are arranged to face each other
Have been. That is, the first spindle unit 55a and
The second spindle unit 55b has an axis
Arrange in a straight line to face the indexing feed direction indicated by mark Y.
Is established. The above-mentioned first spindle unit 55a
2 and the second spindle unit 55b shown in FIG.
Each consists of a microscope, CCD camera, etc.
First optical means 56a (AM1) and second optical means
56b (AM2) is provided. First optical means 5
6a (AM1) is the first spindle housing 551a
And the second optical means 56b (AM2) is
It is fixed to the spindle housing 551b. What
In addition, the cutting device in the illustrated embodiment
Two guide rails 511 and 511 are arranged in parallel.
A linear scale 57 (LS) is provided. This linear
The scale 57 (LS) is the first cutting blade 553
a and the indexing position of the second cutting blade 553b
Control means for detecting a Y-coordinate value and outputting the detected signal
Output to The cutting device in the illustrated embodiment is
First spindle unit 55a as one cutting means
And a second spindle unit as a second cutting means.
In connection with the first cutting blade 55
3a and the cutting depth of the second cutting blade 553b
Reference position of cutting direction of cutting blade to adjust
Cutting blade detector 58a for detecting the position
(BD1) and the second cutting blade detector 58b (B
D2). This first cutting blade detector
58a (BD1) and second cutting blade detector 58
b (BD2) may have a conventionally well-known configuration, and each cutting
A blade entry portion into which the outer peripheral portion of the blade enters, and the blade
A light-emitting part and a light-receiving part
The first cutting shake on the stationary base 10.
Arrows of the blade 553a and the second cutting blade 553b.
It is arranged on the movement line in the index feed direction indicated by Y.
You. First cutting blade detector 5 thus configured
8a (BD1) and second cutting blade detector 58b
(BD2) shows the outer peripheral portion of the cutting blade as the blade entry portion.
The amount of light received by the light receiving
Out, the cutting direction of the cutting blade
The reference position is detected and the detection signal is output to the control means described later.
Power. The cutting device in the illustrated embodiment is shown in FIG.
The control means 200 is provided as shown in FIG. Control means
200 is constituted by a microcomputer,
Central processing unit that performs arithmetic processing according to the control program
(CPU) 201 and a lead for storing a control program and the like.
Do-only memory (ROM) 202 and cutting conditions described later
A readable and writable lander that stores tables, calculation results, etc.
Access memory (RAM) 203 and an input interface
Interface 204 and an output interface 205.
I have. The input of the control means 200 thus configured
The interface 204 includes the first optical unit 56
a (AM1), the second optical means 56b (AM2),
Ascale 57 (LS), first cutting blade detector 5
8a (BD1), the second cutting blade detector 58b (B
D2) and the like are input. Also, output in
Each of the pulse motors 532a from the interface 205
(M1), 532b (M2), 541a (M3), 54
1b (M4) and servo motor 554a (M5), 5
54b (M6), and outputs the control signal.
Setting mechanism 2, Workpiece unloading / loading mechanism 3, Chuck
Cable mechanism 4, cleaning mechanism 6, workpiece transfer mechanism 7, monitor
The control signal is output to the monitor 8 or the like. Next, the cutting processing operation of the above-described cutting device will be described.
The operation will be briefly described with reference to FIGS.
First, the drive means 23 of the cassette mechanism 2 is operated to set the cassette.
The cassette 24 placed on the table 22 to an appropriate height.
Position. Cassette 24 is positioned at an appropriate height
Then, the work unloading / loading mechanism 3 is operated to operate the cassette 2
4. The work 25 stored in 4 is carried out by the holding portion 31,
A chuck positioned in the workpiece mounting area 101
It is placed on the suction chuck 432 of the table mechanism 4. Sucking
The workpiece 25 placed on the attachment chuck 432 is shown
Suction is maintained on the suction chuck 432 by suction means that does not
Be held. In this way, the object is placed on the suction chuck 432.
When the workpiece 25 is sucked and held, the chuck table 43
In the direction of arrow X, and as shown in FIG.
First spindle unit 55a and second spindle
First suspension bracket 523 equipped with unit 55b
a and the second suspension bracket 523b are attached
The first base 521a and the second base 521b
It moves in the direction of the arrow Y and is placed on the suction chuck 432.
The workpiece 25 is moved to the first optical means 56a (AM1) and
And immediately below the second optical means 56b (AM2)
You. Workpiece placed on suction chuck 432
The object 25 is connected to the first optical means 56a (AM1) and the second
If positioned just below the optical means 56b (AM2)
For example, the first optical means 56a (AM1) and the second optical
By means 56b (AM2), the semiconductor
The surface of the body wafer 250 is imaged, and the semiconductor wafer 2
Street (cut line) formed on the surface of 50
At least one of each is detected and
The detected cutting line and the first cutting blade 563a and 563a
And the position of the second cutting blade 563b in the direction of arrow Y.
(Indexing control) is performed. At this time,
In the embodiment, the first base 53a and the second base 5
The position of the arrow 3b in the direction of the arrow Y corresponds to the position of the 1
Based on the value measured by the linear scale 57 (LS)
Is precisely controlled. In the illustrated embodiment,
The first base 53a and the second
Since it is shared with the base 53b, the arrow is on the same scale
Since the control in the Y direction is performed,
Accuracy is improved as compared with the case where it is separately provided. Thus, the figure
In the illustrated embodiment, the first spindle unit 5
5a and the second spindle unit 55b
The first optical means 56a (AM1) and the second
Since the optical means 56b (AM2) is provided, the first
Cutting blade 553a and second cutting blade 55
3b simultaneously perform the alignment work in the direction of the arrow Y efficiently.
I can. Thereafter, the first spindle unit 55a
And the first supporting the second spindle unit 55b
Suspension bracket 523a and second suspension bracket
523b is lowered to the cutting position, and the semiconductor wafer 2
How to feed the chuck table 43 holding the suction 50 by cutting
To the cutting area 102 in the direction of the arrow X
As a result, the first cutting blade 553a rotating at a high speed
And under the action of the second cutting blade 553b,
The cutting line thus detected is cut. This
Thus, the first spindle unit 55a and the second spindle unit 55a
First suspension bracket with pindle unit 55b
523a and the second suspension bracket 523b
Attached first base 521a and second base 5
Indexing movement of arrow 21b of arrow 21b and semiconductor wafer
Arrow X of chuck table 43 holding suction 250
The semiconductor wafer is repeatedly executed by
The plurality of cutting lines formed on the wafer 250 are sequentially cut.
It is. Then, the same wafer formed on the semiconductor wafer 250 is formed.
When all the cutting lines in the directions are cut, the semiconductor wafer 2
The suction chuck 432 holding the suction 50 is rotated 90 degrees.
By performing the same cutting work as above,
All the cutting laminations formed in a grid on the conductor wafer 250
The ins are cut to form individual pellets. When the cutting operation is completed as described above,
Chuck table located in the cutting area 102 shown in FIG.
The tool 43 is moved to the work placement area 101. Chuck
The table 43 is positioned in the workpiece placement area 101.
Then, the workpiece transfer mechanism 7 is operated to operate the chuck table 4.
3 mounted with the semiconductor wafer 250 held in
The cleaning mechanism 6 by sucking the system 251 by the suction pad 71.
On the spinner table 611. Spinner
Conveyed on table 611 and cut as described above
The semiconductor wafer 250 is supplied from the cleaning water supply nozzle 612.
Cleaning water is removed by the sprayed cleaning water to remove cutting chips
At the same time, the spinner table 611 rotates
It is dried by the centrifugal force. Like this
After the semiconductor wafer 250 has been cleaned, the workpiece is transferred.
The transfer mechanism 7 is operated to set the frame on which the semiconductor wafer 250 is mounted.
The workpiece 251 is sucked by the suction pad 71 and
Chuck table positioned in mounting area 101
43 is mounted on the suction chuck 432. And add
Activate the work unloading / loading mechanism 3 and move the suction chuck 432
Semiconductor wafer 250 and the frame
The cassette 251 is stored in a predetermined storage chamber of the cassette 24. Next, the above-described drawing
A first cutting means for cutting the workpiece W indicated by 9;
For indexing and cutting feed control of the second cutting means
The flowcharts shown in FIGS. 5 to 7 and FIG.
This will be described based on the cutting condition table shown in FIG. The figure
8 is the cutting of the first cutting means with respect to the workpiece W shown in FIG.
Indexing position (Y coordinate value) in cutting order (n) and
Cutting condition table with cutting position (Z coordinate value) set
Then, the random access memory (RA
M) 203. First, the first cutting means
FIG. 7 shows the control of the first spindle unit 55a.
This will be described with reference to FIG. The control means 200 determines in step S
In step 1, the cutting order (n) is set to 0th, and step S2
To the n-th (now
Time is 0) Y coordinate value (0mm) and Z coordinate value (0μ)
m) is read and stored in a random access memory (RA).
M) Temporarily store in 203. And the control means 200
Proceeding to step S3, Yn read in step S2
Position the first cutting blade 553a at the coordinate value. What
Note that the Yn coordinate value of the first cutting blade 553a is
Positioning is performed by executing the index control described above.
It is done. The first cutting blade 553a is positioned on the Yn coordinate.
If the position is determined as the value, the control means 200 proceeds to step S4
To the Zn coordinate value read in step S2.
Of the cutting blade 553a. In addition, this first
The position of the cutting blade 553a in the Zn coordinate value is
In the cutting direction of the first cutting blade 553a described above,
Pulse the number of pulses corresponding to the Zn coordinate value from the reference position
Applying (cutting control) to the motor 541a (M3)
And done by. In this manner, the first cutting blade 55
If 3a is positioned at Yn coordinate value and Zn coordinate value
If so, the control means 200 proceeds to step Q0,
Execute This cutting control is performed by a second cutting means described later.
After indexing and feed control of
Robot motors 554a (M5) and 554b (M6)
Drive the first cutting blade 553a and the second cutting
While rotating the blade 553b, the chuck table 43 is
This is done by cutting and feeding in the direction indicated by arrow X.
You. Then, the control means 200 proceeds to step S5,
The cutting order (n) is increased by 1 (n + 1), and the above steps are performed.
Return to S2 and repeat steps S2 to S5
Execute. In the cutting condition table shown in FIG.
Is the first, second, and third cutting order (n) is the Y coordinate value
Are the same, and the Y coordinate value (5 mm) is cut in three stages.
Cutting is performed, but the first Zn coordinate value, that is, the cutting feed position
(The upper surface of the chuck table 43 was set to a reference value of zero (0).
The upper position, that is, the position up to the lower surface of the workpiece W) is 4 μm.
Position, the second Zn coordinate value is the cutting feed position 3 μm
Position, the third Zn coordinate value is the cutting feed position is 2μ
m, the first cutting blade 5
Cutting stepwise according to cutting order (n) by 53a
be able to. Next, the second cutting means, that is, the first spindle
6 and 7 for the control of the module unit 55b.
It will be described in the light of the above. The cutting by the second cutting means is shown in FIG.
Reverses the order set in the cutting condition table shown and executes
I do. The control means 200 determines the cutting order in Step P1.
Number (n) is the Nth (in the cutting condition table shown in FIG. 8)
35th), and proceeds to step P2 to be shown in FIG.
No. n (No. 35 this time) Y-coordinate in the cutting condition table
The standard value (140 mm) is read, and
Temporarily stored in the storage memory (RAM) 203. And the system
The control means 200 proceeds to Step P3 and determines the cutting order (n).
-1 (n-1), and then proceed to Step P4.
(N) in the cutting condition table shown in FIG.
34th) Y coordinate value (135 mm)
This is temporarily stored in the random access memory (RAM) 203.
Store. Next, the control means 200 proceeds to Step P5
Then, the Y coordinate value (1
40 mm) and the Y coordinate value read in step P4
Check whether (135 mm) is the same. S
Y coordinate value read in step P2 and step P4
If the read Y coordinate values are the same,
The control means 200 determines that it is necessary to cut in stages,
The program shifts to Step P12 described later. In step P5, the process proceeds to step P2.
And read in step P4
If the Y coordinate values are not the same, the control means 200
It is determined that there is no need to cut in steps, and
The cutting order (n) is increased by 1 (n + 1), and
Proceeding to step P7, the cutting order (n) (the cutting shown in FIG. 8)
35th Y coordinate value (14 in the cutting condition table).
0 mm) and Z coordinate value (0 μm this time)
This is temporarily stored in the random access memory (RAM) 203.
Store. Then, the control means 200 proceeds to Step P8.
Then, the second offset is applied to the Yn coordinate value read in step P7.
Position the cutting blade 553b. This second cut
The positioning of the cutting blade 553b to the Yn coordinate value is described above.
This is performed by executing the determined index control. No.
No. 2 cutting blade 553b was positioned at the Yn coordinate value.
If so, the control means 200 proceeds to step P8, and
The second cutting blade 5 is added to the Zn coordinate value
Position 53b. The second cutting blade 5
Positioning of 53b on the Zn coordinate value is based on the second
From the reference position in the cutting direction of the cutting blade 553b, Zn
The number of pulses corresponding to the coordinate value is output to the pulse motor 541b.
(M4) (cut control)
It is. In this manner, the second cutting blade 55
If 3b is positioned at Yn coordinate value and Zn coordinate value
If so, the control means 200 proceeds to step Q0,
Execute This cutting control is performed by the first cutting means described above.
Servo motor 554a (M5) and cutting control
And 554b (M6) to drive the first cutting blade 55
3a and the second cutting blade 553b while rotating.
Feeds the rack table 43 in the direction indicated by the arrow X
It is done by things. Then, the control means 200
Proceeding to Step P10, the cutting order (n) is set to minus 1 (n
-1) to return to the above-described step P2, and the next cutting order
The indexing and cutting control of (n) is executed. What
In this indexing and cutting control,
In step P5, the Y coordinate read in step P2
Unless the value and the Y coordinate value read in step P4 are the same
Steps P2 to P10 are repeatedly executed.
You. Next, in step P5,
Y coordinate value read in P2 and read in step P4
When the Y coordinate value is the same, that is, it is necessary to cut in steps
In the cutting condition table shown in FIG.
The 33rd, 32nd, 31st of the cutting order (n)
An example will be described. In the above step P5, step P2
Y coordinate value read in step and Y coordinate read in step P4
If the target values are the same, the Y coordinate value of the 33rd cutting order
(125 mm) and the Y-coordinate value (125
mm) is the same, the control means 200
Judge that it is necessary to cut, and proceed to Step P11
The cutting order (n) is reduced by 1 (n-1), and further
Proceeding to Step P12, the cutting order (n) (the cutting order shown in FIG. 8)
The 31st Y coordinate value (125 in the condition table)
mm) and read it into a random access memory (R
AM) 203. Next, the control means 200
Proceeding to step P13, the disconnection read in step P4
32nd Y coordinate value (125 mm) of cutting order and step P
The Y coordinate value of the 31st cutting order (125
mm) are the same. In step P13, the read in step P4
The Y coordinate value (125 mm) of the 32nd cutting order
Y coordinate of the 31st cutting order read in step P12
When the values (125 mm) are the same (the cutting shown in FIG. 8)
(The same is true in the condition table.)
The cutting order (n) is shifted to minus 1 (n-
1) Then, the process further proceeds to Step P12 and the cutting order
(N) (No. 30 in the cutting condition table shown in FIG. 8)
Read the Y coordinate value (120 mm) of
The data is temporarily stored in a dumb access memory (RAM) 203.
Then, the control means 200 proceeds to Step P13,
31st cutting order read in step P12
Y coordinate value (125 mm) and this time in step P13
Y coordinate value of the 30th cutting order (120m
Check if m) is the same. Note that
In P13, the cutting read in the previous step P12
The Y coordinate value of the order and the cutting read in this step P12
If the Y coordinate values of the order are the same, the process proceeds to Step P11
To Step P13 are repeatedly executed. In step P13, the previous step P
The Y coordinate value of the 31st cutting order (125
mm) and the cutting order 30 read this time in step P12.
If the second Y coordinate value (120 mm) is not the same (Fig.
8 are not the same), control means
The program 200 proceeds to Step P14 and sets the cutting order (n).
1 (n + 1), and then goes to step P15 to cut
Number (n) (31st this time) checks whether or not it has been cut
I do. In step P15, the cutting order (n) has been cut.
If not (the 31st is not already cut), control
Means 100 proceeds to Step P16 and cutting order (n)
(This time 31st) Y coordinate value (125mm) and Z
Read the coordinate value (4 μm in this case),
Access memory (RAM) 203. Soshi
Then, the control means 200 proceeds to step P17,
The Yn coordinate value (125 mm) read in
Of the cutting blade 553b. Second cutting blur
When the code 553b is positioned at the Yn coordinate value, the control
The stage 200 proceeds to step P18 and proceeds to step P16.
The second cutting block is added to the read Zn coordinate value (4 μm this time).
Position the blade 553b. Thus, the second
The cutting blade 553b is moved to the Yn coordinate value (125 mm) and
And positioned on the Zn coordinate value (4 μm this time)
The control means 200 proceeds to step Q0, as described above.
Execute cutting control. Next, the control means 200 proceeds to step P14.
Return and increase the cutting order (n) by 1 (n + 1).
Proceed to step P15 to cut (n) (this time No. 32
Eye) checks if it has been cut. To step P15
If the cutting order (n) is not already cut (3
(The second is not already cut.)
Go to No. 16 and cut Y (32)
The standard value (125 mm) and the Z coordinate value (3 μm this time)
Read and store this in random access memory (RAM) 2
03 is temporarily stored. Then, the control means 200
Proceed to step P17 and read the Yn seat in step P16
Position the second cutting blade 553b at the benchmark. Second
If the cutting blade 553b of No. is positioned at the Yn coordinate value
If the control means 200 proceeds to step P18,
To the Zn coordinate value (3 μm this time) read in step P16
Position the second cutting blade 553b. Like this
Then, the second cutting blade 553b is moved to the Yn coordinate value (125
mm) and Zn coordinate value (3 μm in this case)
If so, the control means 100 proceeds to step Q0, and
The cutting control is executed as described above. Then, the control means 200 determines in step P14
And the cutting order (n) is increased by 1 (n + 1).
Proceeding to step P15, the cutting order (n) (this time
Eye) checks if it has been cut. To step P15
If the cutting order (n) is not already cut (3
(The third is not already cut.)
Go to No. 16 and cut Y (33rd)
The standard value (125 mm) and the Z coordinate value (2 μm this time)
Read and store this in random access memory (RAM) 2
03 is temporarily stored. Then, the control means 200
Proceed to step P17 and read the Yn seat in step P16
Position the second cutting blade 553b at the benchmark. Second
If the cutting blade 553b of No. is positioned at the Yn coordinate value
If the control means 200 proceeds to step P18,
To the Zn coordinate value (2 μm this time) read in step P16
Position the second cutting blade 553b. Like this
Then, the second cutting blade 553b is moved to the Yn coordinate value (125
mm) and Zn coordinate value (2 μm in this case)
If so, the control means 200 proceeds to step Q0, and
The cutting control is executed as described above. As mentioned above,
When the cutting order (n) has the same Y coordinate value, that is, the same
If there are multiple Z coordinate values in the Y coordinate value,
Since the cutting is performed from the Z-coordinate value in the order (n) which is earlier,
Can be cut in stages. Next, the control means 200 proceeds to step P14.
Return and increase the cutting order (n) by 1 (n + 1).
Proceed to step P15 to cut (n) (this time No. 34
Eye) checks if it has been cut or not. 34th cutting order
Is already cut in the example of the cutting condition table shown in FIG.
Control means 200 proceeds to step P19.
To reduce the cutting order (n) by 1 (n-1),
Proceed to step P20 to cut order (n) (this time 33rd)
Checks if it has been cut. 33rd cutting order is now
Since the round has been cut, the control means 200 returns to step P1
9, the cutting order (n) is subtracted by 1 (n-1).
Further, the process proceeds to Step P20, and the cutting order (n) (this time, 3
The second) checks whether or not cutting has been completed. Cutting order 32
The control means 200 has already
Returning to step P19, the cutting order (n) is set to minus 1 (n-
1) Then, the process further proceeds to Step P20 and the cutting order (n)
(This time, the 31st) checks whether or not cutting has been completed. Off
Since the 31st cutting order has already been cut this time, the control means 2
00 returns to step P19 to change the cutting order (n)
1 (n-1), and further proceeds to Step P20 to execute the cutting order.
Check number (n) (30th in this case)
I do. Since the cutting order 30 was not cut this time,
The control means 200 returns to Step P2. The cutting device according to the present invention is constructed as described above.
Cutting means for the first cutting means.
Invert the order set in the cutting condition table,
When there are a plurality of Z coordinate values for the same Y coordinate value,
The cutting order (n) starts from the Z-coordinate value in the earlier order.
To set the cutting condition table for the second cutting means.
It can be cut step by step. Therefore, the second
Data for setting a cutting condition table for cutting means
Input can be omitted, and workpiece damage due to input error
Can be avoided beforehand.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a cutting device that is a cutting device configured according to the present invention. FIG. 2 is a perspective view of a main part of the cutting device shown in FIG. FIG. 3 is an explanatory view schematically showing a first cutting means and a second cutting means constituting the cutting device shown in FIG. 1; FIG. 4 is a block diagram of control means provided in the cutting device shown in FIG. FIG. 5 is a partial flowchart showing an operation procedure of a control unit shown in FIG. 4; FIG. 6 is a partial flowchart showing an operation procedure of a control unit shown in FIG. 4; FIG. 7 is a partial flowchart showing the operation procedure of the control means shown in FIG. 4; FIG. 8 is a cutting condition table in which an index position (Y coordinate value) and a cutting position (Z coordinate value) in a cutting order (n) of a first cutting means included in the cutting device shown in FIG. 1 are set. FIG. 9 is an explanatory diagram showing an example of an indexing position, a cutting position, and a cutting order for a workpiece. FIG. 10 is an explanatory diagram showing another example of an indexing position, a cutting position, and a cutting order for a workpiece. [Description of Signs] 1: Device housing 10: Stationary base 2: Cassette mechanism 21: Guide rail 22: Cassette table 23: Driving means 24: Cassette 25: Workpiece 3: Workpiece unloading / loading mechanism 4: Chuck Table mechanism 41: support base 42: guide rail 43: chuck table 44: driving means 5: cutting mechanism 51: support base 511: guide rail 52a: first support mechanism 52b: second support mechanism 523a: first suspension. Bracket 523b: Second suspension bracket 53a: First drive means 53b: Second drive means 532a: Pulse motor (M1) 532b: Pulse motor (M2) 54a: First drive means 54b: Second drive means 541a: Pulse motor (M3) 541b: Pulse motor (M4) 55a: First spindle unit 551a: First Spindle housing 552a: first rotating spindle 553a: first cutting blade 55b: second spindle unit 551b: second spindle housing 552b: second rotating spindle 553b: second cutting blade 554a: servo motor (M5 554b: servo motor (M6) 56a: first optical means (AM1) 56b: second optical means (AM2) 57: linear scale (LS) 58a: first cutting blade detector (BD1) 58b: first 2. Cutting blade detector (BD2) 6: Cleaning mechanism 661: Spinner table 662: Cleaning water supply nozzle 7: Workpiece transfer mechanism 71: Suction pad 8 of workpiece transfer mechanism 8: Monitor 200: Control means

Claims (1)

Claims: 1. A chuck table for holding a workpiece, a first cutting blade arranged opposite to each other for cutting the workpiece held by the chuck table, and a second cutting blade. A first cutting unit and a second cutting unit having a cutting blade, a cutting feed mechanism for moving the chuck table in a cutting feed direction, and a first cutting unit and a second cutting unit in the indexing direction. A moving first indexing mechanism and a second indexing mechanism, and a first cutting mechanism and a second cutting mechanism for moving the first cutting means and the second cutting means in the cutting direction; Control means for controlling the cutting feed mechanism, the first index feed mechanism, the second index feed mechanism, the first cut feed mechanism and the second cut feed mechanism. In the cutting apparatus, the control means includes: a cutting condition including a Y coordinate value in which each index position is set according to an order of cutting by the first cutting means, and a Z coordinate value in which a cutting position in each Y coordinate value is set. A memory for storing a table, wherein the first indexing mechanism and the first cutting mechanism are controlled in accordance with the order set in the cutting condition table, and the second indexing mechanism and the second indexing mechanism are controlled. For the second cutting feed mechanism, the order set in the cutting condition table is reversed, and when a plurality of Z coordinate values are present at the same Y coordinate value, the second cutting is performed from the Z coordinate value in the earlier order. A cutting device for controlling a feed mechanism.