JP4590060B2 - Cutting equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cutting device such as a dicing device for cutting a workpiece such as a semiconductor wafer, and more particularly to a cutting device provided with two cutting means.
[0002]
[Prior art]
As a semiconductor wafer cutting method using a dicing apparatus, a step cut method is generally performed. This step cut method uses a V-shaped V-groove blade in the first step to form a V-groove along a cutting line (street) provided in the semiconductor wafer, and a blade for cutting in the second step. Is cut along the V-groove formed in the first step to form a chip whose surface is chamfered in a tapered shape. In order to efficiently perform the cutting by such a step cutting method, a cutting apparatus including two cutting means is disclosed in, for example, Japanese Patent Publication No. 3-11601. The cutting apparatus disclosed in this publication includes a first cutting means including a first rotating spindle, a first cutting blade mounted on the first rotating spindle, a second rotating spindle, and the first rotating spindle. And a second cutting means provided with a second cutting blade mounted on the two rotating spindles, and the first cutting means and the second cutting means are arranged in parallel.
[0003]
On the other hand, a cutting blade for cutting a workpiece such as a semiconductor wafer is worn away by use and its diameter decreases. For this reason, the dicing apparatus needs to adjust the reference position in the cutting direction of the cutting blade in response to a decrease in the diameter of the cutting blade, and includes a cutting blade detection mechanism for detecting the reference position.
[0004]
[Problems to be solved by the invention]
Thus, in the above-described cutting device in which the first cutting means and the second cutting means are arranged in parallel, the reference position in the cutting direction of the first cutting blade of the first cutting means and the second When detecting the reference position of the cutting direction of the second cutting blade of the cutting means, this detection work must be performed twice, and workability is poor. Note that two cutting blade detection mechanisms may be provided in association with each of the first cutting means and the second cutting means, but the first cutting means and the second cutting means are arranged in parallel. In such a cutting apparatus, even if two cutting blade detection mechanisms are provided, the reference positions of the two cutting blades cannot be detected at the same time, and the detection work for detecting the reference position in the cutting direction of the cutting blade is not possible. Workability cannot be improved.
[0005]
The present invention has been made in view of the above-mentioned facts, and the main technical problem thereof is a reference position in the cutting direction for two cutting blades simultaneously in a cutting apparatus including a first cutting means and a second cutting means. It is providing the cutting device which can detect.
[0006]
[Means for Solving the Problems]
  In order to solve the above-mentioned main technical problem, according to the present invention, a first cutting means comprising a first rotating spindle and a first cutting blade mounted on one end of the first rotating spindle; A second cutting means comprising a second rotating spindle and a second cutting blade mounted on one end of the second rotating spindle, the first cutting blade and the second cutting In the cutting device arranged to face the blade,
  A first cutting blade detection mechanism provided in association with the first cutting means; and a second cutting blade detection mechanism provided in association with the second cutting means.And
  The first cutting blade detection mechanism and the second cutting blade detection mechanism include a blade intrusion portion into which the cutting blade enters, a light emitting portion and a light receiving portion disposed to face the blade intrusion portion, and the light emission And a cleaning water supply nozzle for supplying cleaning water to the end face of the light receiving part, and an air supply nozzle for supplying air to the end face of the light emitting part and the light receiving part,
  The opening of the air supply nozzle is disposed adjacent to the light emitting unit and the light receiving unit, and the opening of the cleaning water supply nozzle is disposed behind the opening of the air supply nozzle.
  A cutting device is provided.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of a cutting device configured according to the present invention will be described in detail with reference to the accompanying drawings.
[0009]
FIG. 1 is a perspective view of a dicing apparatus as a cutting apparatus configured according to the present invention.
The dicing apparatus shown in FIG. 1 includes a device housing 1 having a substantially rectangular parallelepiped shape. In the apparatus housing 1, a cassette mechanism 2 for stocking a semiconductor wafer as a workpiece and a workpiece stored in the cassette mechanism 2 are unloaded and the workpiece after the cutting operation is finished is transferred to the cassette mechanism 2. A workpiece unloading / loading mechanism 3 to be loaded, a chuck table mechanism 4 for holding the workpiece unloaded by the workpiece unloading / loading mechanism 3, and a workpiece held by the chuck table mechanism 4 A cutting mechanism 5 for cutting, a cleaning mechanism 6 for cleaning the workpiece cut by the cutting mechanism 5, and a workpiece conveying mechanism 7 for conveying the workpiece between the chuck table mechanism 4 and the cleaning mechanism 6. Is arranged. The apparatus housing 1 is provided with a monitor 8 for displaying an image picked up by optical means to be described later.
[0010]
The cassette mechanism 2, chuck table mechanism 4 and cutting mechanism 5 will be described with reference to FIG.
The dicing apparatus in the illustrated embodiment includes a stationary base 10 that is disposed in the apparatus housing 1 and on which the above mechanisms are mounted. The cassette mechanism 2 includes a cassette table 22 slidably disposed on two guide rails 21, 21 provided on the side surface of the stationary base 10 in the vertical direction, and the cassette table 22 as a guide rail 21. A driving means 23 for moving in the vertical direction (the direction indicated by the arrow Z) is provided. The driving means 23 includes a male screw rod 231 disposed in parallel between the two guide rails 21 and 21, a nut (not shown) that is mounted on the cassette table 22 and screwed into the male screw rod 231, and a male screw rod 231. A drive source such as a pulse motor (not shown) for rotational driving is included. Therefore, the cassette table 22 is moved in the vertical direction (direction indicated by the arrow Z) by rotating the male screw rod 231 by a pulse motor (not shown). The cassette 24 having a plurality of storage chambers is placed on the cassette table 22 configured to be movable in the vertical direction as described above. The workpieces 25 are stored one by one in the plurality of storage chambers of the cassette 24. In the illustrated embodiment, a semiconductor wafer 250 is shown that is mounted on a frame 251 with a tape 252 as a workpiece 25.
[0011]
The chuck table mechanism 4 includes a support base 41 fixed on the stationary base 10 and two guide rails 42 and 42 disposed on the support base 41 in parallel along the direction indicated by the arrow X. A chuck table 43 is provided as workpiece holding means for holding the workpiece arranged on the guide rails 42 and 42 so as to be movable in the direction indicated by the arrow X. The chuck table 43 includes a suction chuck support base 431 movably disposed on the guide rails 42 and 42, and a suction chuck 432 mounted on the suction chuck support base 431. For example, a disk-shaped semiconductor wafer as a workpiece is held on the chuck 432 by suction means (not shown). The chuck table mechanism 4 includes a drive unit 44 for moving the chuck table 43 along the two guide rails 42 and 42 in the direction indicated by the arrow X. The drive means 44 includes a male screw rod 441 disposed in parallel between the two guide rails 42, 42, a nut (not shown) that is mounted on the suction chuck support base 431 and screwed into the male screw rod 441, and a male screw rod. A drive source such as a pulse motor (not shown) for rotationally driving 441 is included. Therefore, the chuck table 43 is moved in the direction indicated by the arrow X by rotating the male screw rod 441 by a pulse motor (not shown). That is, the chuck table 43 can move between the workpiece placement area 101 shown in FIGS. 1 and 2 and the cutting area 102. The chuck table mechanism 4 includes a rotation mechanism (not shown) that rotates the suction chuck 432.
[0012]
Next, the cutting mechanism 5 will be described.
The cutting mechanism 5 includes a gate-shaped support base 51 fixed on the stationary base 10. The gate-shaped support base 51 is disposed so as to straddle the cutting region 102. Two guide rails 511 and 511 arranged in parallel along the direction indicated by the arrow Y are provided on the side wall of the support base 51, and in parallel between the two guide rails 511 and 511. One male screw rod 52 is fixedly disposed. Along the guide rails 511 and 511, a first base portion 53a and a second base portion 53b are disposed so as to be slidable in the directions indicated by arrows Y, respectively. The first base 53a and the second base 53b are each provided with a drive nut (not shown) that is screwed to the common male screw rod 52, and the drive nut is rotated by a drive source such as a pulse motor (not shown). Accordingly, the first base portion 53a and the second base portion 53b can be moved along the guide rails 511 and 511 in the direction indicated by the arrow Y. Independent male threaded rods are disposed corresponding to the first base 53a and the second base 53b, respectively, and the independent male threaded rods are rotated by a pulse motor or the like, respectively. You may comprise so that the 2nd base 53b may move to the direction shown by the arrow Y, respectively. A pair of guide rails 531a and 531b are provided on the first base portion 53a and the second base portion 53b, respectively, along the direction indicated by the arrow Z, and the first support portion 54a is provided along the guide rails 531a and 531b. And the 2nd support part 54b is each arrange | positioned so that sliding to the direction shown by the arrow Z is possible. The first base portion 53a and the second base portion 53b are provided with male screw rods (not shown) that are rotated by driving sources such as pulse motors 55a and 55b, respectively, and the first support portion 54a and the second support portion 53b. Each of the parts 54b is provided with a nut that is screwed into the male screw rod. Therefore, by rotating a male screw rod (not shown) for the pulse motors 55a and 55b, the first support portion 54a and the second support portion 54b are moved along the guide rails 531a and 531b in the direction indicated by the arrow Z. it can.
[0013]
A first spindle unit 56a as a first cutting means and a second spindle unit 56b as a second cutting means are mounted on the first support portion 54a and the second support portion 54b. The first spindle unit 56a and the second spindle unit 56b will be described with reference to FIG. 3 shown in a simplified manner. The first spindle unit 56a and the second spindle unit 56b respectively include a first spindle housing 561a and a second spindle housing 561b fixed to the first support part 54a and the second support part 54b, respectively. A first rotating spindle 562a and a second rotating spindle 562b rotatably supported by one spindle housing 561a and a second spindle housing 561b, respectively, and the first rotating spindle 562a and the second rotating spindle 562b. It consists of a first cutting blade 563a and a second cutting blade 563b attached to one end. The first spindle unit 56a and the second spindle unit 56b configured as described above are disposed so that the first cutting blade 563a and the second cutting blade 563b face each other. In other words, the first spindle unit 56a and the second spindle unit 56b are aligned so that the axis is directed in the direction of the arrow Y and the positions in the direction of the arrow X are common as shown in FIG. It is arranged. In relation to the first spindle unit 56a and the second spindle unit 56b configured as described above, a first optical unit 57a and a second optical unit 57b configured by a microscope, a CCD camera, etc. are provided. ing. The first optical means 57a is fixed to the first spindle housing 561a, and the second optical means 57b is fixed to the second spindle housing 561b.
[0014]
Next, the processing operation of the above-described dicing apparatus will be briefly described.
First, the driving means 23 of the cassette mechanism 2 is operated to position the cassette 24 placed on the cassette table 22 at an appropriate height. When the cassette 24 is positioned at an appropriate height, the workpiece unloading / loading mechanism 3 is operated to unload the workpiece 25 accommodated in the cassette 24 by the clamping unit 31, and to the workpiece mounting area 101. It is mounted on the suction chuck 432 of the chuck table mechanism 4 that is positioned. The workpiece 25 placed on the suction chuck 432 is sucked and held on the suction chuck 432 by suction means (not shown). In this way, when the workpiece 25 is sucked and held on the suction chuck 432, the chuck table 43 is moved in the direction of the arrow X, and the first spindle unit 56a and the second spindle unit 56b are mounted. The base portion 53a and the second base portion 53b are moved in the direction of the arrow Y, and the workpiece 25 placed on the suction chuck 432 is positioned directly below the first optical means 57a and the second optical means 57b. Then, the surface of the semiconductor wafer 250 as the workpiece 25 is imaged by the first optical means 57a and the second optical means 57b, and at least one of the cutting lines (streets) formed on the surface of the semiconductor wafer 250 is at least one. The respective detected cutting lines are aligned with the first cutting blade 563a and the second cutting blade 563b in the arrow Y direction. At this time, the positions of the first base portion 53a and the second base portion 53b in the direction of the arrow Y are precisely controlled based on the measurement value by one linear scale 58 disposed on the support base 51. In the illustrated embodiment, since the first base 53a and the second base 53b are shared by one linear scale, the control in the arrow Y direction is performed on the same scale. The accuracy is improved compared to the case where scales are provided individually. As described above, in the illustrated embodiment, the first optical unit 57a and the second optical unit 57b are provided in association with the first spindle unit 56a and the second spindle unit 56b, respectively. The positioning operation of the first cutting blade 563a and the second cutting blade 563b in the direction of the arrow Y can be efficiently performed simultaneously.
[0015]
After that, the first support part 54a and the second support part 54b mounted with the first spindle unit 56a and the second spindle unit 56b are lowered to the cutting position, and the chuck table 43 holding the semiconductor wafer 250 by suction is cut. By moving to the cutting region 102 in the direction of arrow X, which is the feed direction, the cutting line detected as described above is received by the action of the first cutting blade 563a and the second cutting blade 563b rotating at high speed. To be cut. As described above, the indexing movement of the first base 53a and the second base 53b on which the first spindle unit 56a and the second spindle unit 56b are mounted in the direction of the arrow Y, and the chuck table 43 that holds the semiconductor wafer 250 by suction. A plurality of cutting lines formed in the semiconductor wafer 250 are sequentially cut by repeatedly executing the cutting feed in the arrow X direction. When all the cutting lines in the same direction formed on the semiconductor wafer 250 are cut, the suction chuck 332 that sucks and holds the semiconductor wafer 250 is rotated by 90 degrees, and the above-described cutting operation is performed, thereby the semiconductor All the cutting lines formed in a lattice shape on the wafer 250 are cut to form individual pellets.
[0016]
As described above, when the cutting operation is completed, the chuck table 43 located in the cutting area 102 is moved to the workpiece placement area 101. When the chuck table 43 is positioned in the workpiece placement region 101, the workpiece conveyance mechanism 7 is operated, and the frame 251 mounted with the semiconductor wafer 250 held on the chuck table 43 is sucked by the suction pad 71 to be cleaned. 6 is conveyed onto a spinner table 611. The semiconductor wafer 250 transported onto the spinner table 611 and cut as described above is cleaned with cleaning water sprayed from the cleaning water supply nozzle 612 to remove cutting waste, and the spinner table 611 is rotated to rotate the spin. It is dried by force. When the semiconductor wafer 250 is cleaned in this way, the workpiece transfer mechanism 7 is operated and the frame 251 with the semiconductor wafer 250 mounted thereon is sucked by the suction pad 71 and positioned in the workpiece mounting area 101. The chuck table 43 is placed on the suction chuck 432. Then, the workpiece unloading / loading mechanism 3 is operated, and the cleaned semiconductor wafer 250 and the frame 251 placed on the suction chuck 432 are stored in a predetermined storage chamber of the cassette 24.
[0017]
The dicing apparatus in the illustrated embodiment relates to the first cutting blade 563a and the second spindle unit 56b as the first cutting means and the second spindle unit 56b as the second cutting means, respectively. The cutting blade detection mechanisms 9 and 9 for detecting the reference position in the cutting direction of the two cutting blades 563b are provided. The cutting blade detection mechanisms 9 and 9 disposed in association with the first spindle unit 56a and the second spindle unit 56b have substantially the same configuration. The cutting blade detection mechanism 9 will be described with reference to FIGS. 5 and 6 as well. The cutting blade detection mechanism 9 includes a detector main body 90 having a blade intrusion portion 901 into which the outer periphery of the first cutting blade 563a or the second cutting blade 563b enters. The detector main body 90 is disposed on the movement line in the arrow Y direction of the first cutting blade 563a and the second cutting blade 563b on the stationary base 10. The detector main body 90 is provided with a light emitting unit 902 and a light receiving unit 903 arranged to face the blade intrusion unit 901. The light emitting unit 902 is connected to the light source 92 via the optical fiber 91a, and emits light from the light source 92 toward the light receiving unit 903. The light receiving unit 903 receives the light emitted by the light emitting unit 902 and sends the received light to the photoelectric conversion unit 93 via the optical fiber 91b. The photoelectric conversion unit 93 outputs a voltage corresponding to the amount of light transmitted from the light receiving unit 902 to the voltage comparison unit 95. On the other hand, a reference voltage (for example, 3 V) set by the reference voltage setting unit 94 is input to the voltage comparison unit 95. The voltage comparison unit 95 compares the output from the photoelectric conversion unit 93 with the reference voltage (for example, 3V) set by the reference voltage setting unit 94, and the output from the photoelectric conversion unit 93 is the reference voltage (for example, 3V). Is reached, a signal to that effect is output to the reference position detector 96.
[0018]
That is, when detecting the reference position in the cutting direction of the first cutting blade 563a and the second cutting blade 563b, the first cutting blade 563a or the second cutting blade 563b enters the blade intrusion portion 901 from above. I will let you. At this time, when the first cutting blade 563a or the second cutting blade 563b does not block between the light emitting portion 902 and the light receiving portion 903, the light amount received by the light receiving portion 903 is the maximum and corresponds to this light amount. The output from the photoelectric conversion unit 93 is set to 5 V, for example, in the illustrated embodiment. As the first cutting blade 563a or the second cutting blade 563b enters the blade intrusion portion 901, the first cutting blade 563a or the second cutting blade 563b blocks between the light emitting portion 902 and the light receiving portion 903. Since the amount increases, the output from the photoelectric conversion unit 93 gradually decreases. Then, when the first cutting blade 563a or the second cutting blade 563b reaches the position corresponding to the lower ends of the light emitting unit 902 and the light receiving unit 903, the photoelectric conversion unit 93 has an output voltage of, for example, 3V. Is set. In addition, when the output voltage from the photoelectric conversion unit 93 becomes, for example, 3V, the first cutting blade 563a or the second cutting blade 563b is set so as to be in a position in contact with the upper surface of the suction chuck 432, for example. Yes. Therefore, when the output voltage of the photoelectric conversion unit 93 reaches 3V, the voltage comparison unit 95 outputs a signal indicating that the output voltage of the photoelectric conversion unit 93 has reached the reference voltage to the reference position detection unit 96. At this time, the reference position detection unit 96 stores the value of the linear scale 59 that detects the position of the first cutting blade 563a or the second cutting blade 563b in the cutting direction (Z direction) as the reference position. As a method of setting the reference position in the cutting direction of the first cutting blade 563a and the second cutting blade 563b, the first support portion 54a on which the first spindle unit 56a and the second spindle unit 56b are mounted and A driving pulse of pulse motors 55a and 55b for moving the second support portion 54b in the direction indicated by the arrow Z may be used. That is, when the first support part 54a and the second support part 54b are lowered from the predetermined positions during the detection, the drive pulses of the pulse motors 55a and 55b are counted, and the output voltage of the photoelectric conversion part 93 is output from the voltage comparison part 95. Is output to the reference position detector 96, the counted number of drive pulses is stored as a reference position. In this manner, the cutting blade detection mechanisms 9 and 9 detect the reference positions in the cutting direction of the first cutting blade 563a and the second cutting blade 563b.
[0019]
As described above, in the illustrated embodiment, the reference positions in the cutting direction of the first cutting blade 563a and the second cutting blade 563b are related to the first spindle unit 56a and the second spindle unit 56b, respectively. Since the cutting blade detection mechanisms 9 and 9 for detecting the above are provided, the reference positions in the cutting direction can be detected simultaneously for the first and second cutting blades 563a and 563b. Therefore, in the cutting apparatus provided with two cutting means, the reference position in the cutting direction of the two cutting blades can be detected simultaneously, and the setup operation becomes efficient, so that productivity can be improved.
[0020]
The cutting blade detection mechanisms 9 and 9 for detecting the reference positions in the cutting direction of the first cutting blade 563a and the second cutting blade 563b in the illustrated embodiment are provided with cleaning water on the end surfaces of the light emitting unit 902 and the light receiving unit 903, respectively. Cleaning water supply nozzles 97a and 97b for supplying the air, and air supply nozzles 98a and 98b for supplying air to the end surfaces of the light emitting unit 902 and the light receiving unit 903. In the illustrated embodiment, the cleaning water supply nozzles 97a and 97b and the air supply nozzles 98a and 98b are provided with the openings of the air supply nozzles 98a and 98b adjacent to the light emitting unit 902 and the light receiving unit 903, respectively. The openings of the nozzles 97a and 97b are disposed behind the air supply nozzles 98a and 98b. The cleaning water supply nozzles 97a and 97b are connected to a cleaning water supply source via a flexible hose (not shown), and the air supply nozzles 98a and 98b are connected to a compressed air supply source via a flexible hose (not shown). In the cutting blade detection mechanism 9 in the illustrated embodiment, the cleaning water ejected from the cleaning water supply nozzles 97a and 97b always emits light during the cutting operation by the first cutting blade 563a and the second cutting blade 563b. 902 and the light receiving unit 903. On the other hand, the air ejected from the air supply nozzles 98a and 98b is supplied to the light emitting unit 902 and the light receiving unit 903 when the cutting operation is completed and the supply of the cleaning water from the cleaning water supply nozzles 97a and 97b is stopped. It is like that.
[0021]
As described above, the cutting blade detection mechanism 9 for detecting the reference position in the cutting direction of the first cutting blade 563a and the second cutting blade 563b in the illustrated embodiment is the end face of the light emitting unit 902 and the light receiving unit 903. Since cleaning water is constantly supplied from the cleaning water supply nozzles 97a and 97b, contamination that is scattered when a workpiece such as a semiconductor wafer is cut by the first cutting blade 563a and the second cutting blade 563b emits light. It does not adhere to the part 902 and the light receiving part 903. Therefore, the cutting blade detection mechanism 9 in the illustrated embodiment is caused by contamination adhering to the light emitting unit 902 when detecting the reference position in the cutting direction of the first cutting blade 563a and the second cutting blade 563b. A decrease in the amount of emitted light and a decrease in the amount of received light caused by contamination adhering to the light receiving portion 903 can be prevented, and the cutting direction of the first cutting blade 563a and the second cutting blade 563b is always stable and accurate. The reference position can be detected. Further, the cutting blade detection mechanism 9 in the illustrated embodiment supplies cleaning water to the light emitting unit 902 and the light receiving unit 903 during a cutting operation, and then ejects air from the air supply nozzles 98a and 98b to thereby emit the light emitting unit 902 and the light receiving unit 902. Since the cleaning water adhering to the part 903 is blown off, the reference position in the cutting direction of the first cutting blade 563a and the second cutting blade 563b can be detected constantly and accurately without being affected by the cleaning water. .
[0022]
Further, in the cutting blade detection mechanism 9 in the illustrated embodiment, the air supply nozzles 98a and 98b are disposed adjacent to the light emitting unit 902 and the light receiving unit 903, and the openings of the cleaning water supply nozzles 97a and 97b are supplied with air. Since it is disposed behind the nozzles 98a and 98b, when supplying the air after stopping the supply of the cleaning water, the cleaning water remaining in the cleaning water supply nozzles 97a and 97b is aspirated and atomized. Absent. That is, when the air supply nozzles 98a and 98b are disposed behind the cleaning water supply nozzles 97a and 97b, contrary to the illustrated embodiment, the cleaning water supply nozzles 97a and 97b are provided by the air supply nozzles 98a and 98b. The opening of the cleaning water supply nozzles 97a and 97b becomes negative pressure due to the action of the air flow ejected from behind, and as a result, the cleaning water remaining in the cleaning water supply nozzles 97a and 97b is sucked and atomized. May adhere to the end surfaces of the light emitting unit 902 and the light receiving unit 903. However, in the cutting blade detection mechanism 9 in the illustrated embodiment, since the openings of the cleaning water supply nozzles 97a and 97b are disposed behind the air supply nozzles 98a and 98b as described above, the air supply nozzles 98a and 98b are provided. When the air is supplied, the cleaning water remaining in the cleaning water supply nozzles 97a and 97b is not sucked and atomized. Therefore, it is possible to effectively perform the operation of blowing off the cleaning water adhering to the light emitting unit 902 and the light receiving unit 903 by the air supplied from the air supply nozzles 98a and 98b.
[0023]
【The invention's effect】
Since the cutting device according to the present invention is configured as described above, the following operational effects can be obtained.
[0024]
That is, according to the present invention, the first cutting blade detection mechanism provided in association with the first cutting means, the first cutting means and the second cutting means, and the second cutting means Since the second cutting blade detection mechanism provided in association with the cutting means is provided, the reference position in the cutting direction of the two cutting blades can be detected at the same time, and the setup work becomes efficient. Productivity can be improved.
[Brief description of the drawings]
FIG. 1 is a perspective view of a dicing apparatus which is a cutting apparatus configured according to the present invention.
FIG. 2 is a perspective view of main parts of the dicing apparatus shown in FIG.
FIG. 3 is an explanatory diagram showing, in a simplified manner, a first spindle unit and a second spindle unit that constitute the dicing apparatus shown in FIG. 1;
FIG. 4 is an explanatory diagram showing, in a simplified manner, the first spindle unit, the second spindle unit, the first optical means, and the second optical means that constitute the dicing apparatus shown in FIG. 1;
FIG. 5 is a perspective view of a main part of a cutting blade detection mechanism for detecting a reference position in a cutting direction of a cutting blade configured according to the present invention.
FIG. 6 is a block diagram of a cutting blade detection mechanism for detecting a reference position in a cutting direction of a cutting blade configured according to the present invention.
[Explanation of symbols]
1: Device housing
10: Stationary base
2: Cassette mechanism
21: Guide rail
22: Cassette table
23: Driving means
24: Cassette
25: Workpiece
250: Semiconductor wafer
251: Frame
252: Tape
3: Workpiece unloading / loading mechanism
31: Clamping part of workpiece unloading / loading mechanism
4: Chuck table mechanism
41: Support stand
42: Guide rail
43: Chuck table
431: Adsorption chuck support
432: Suction chuck
44: Driving means
5: Cutting mechanism
51: Support stand
511: Guide rail
53a: first base
531a: Guide rail
53b: second base
531b: Guide rail
54a: 1st support part
54b: second support part
55a: Pulse motor
55b: Pulse motor
56a: first spindle unit
561a: first spindle housing
562a: first rotating spindle
563a: first cutting blade
56b: second spindle unit
561b: second spindle housing
562b: second rotating spindle
563b: second cutting blade
57a: first optical means
57b: Second optical means
6: Cleaning mechanism
661: Spinner table
662: Washing water supply nozzle
7: Workpiece transport mechanism
71: Suction pad of workpiece transfer mechanism
8: Monitor
9: Cutting blade detection mechanism
90: Detector main body of the cutting blade detection mechanism
901: Blade intrusion
902: Light emitting unit
903: Light receiver
92: Light source
93: Photoelectric conversion unit
94: Reference voltage setting section
95: Voltage comparison unit
96: Reference position detector
97a, 97b: Washing water supply nozzle
88a, 98b: Air supply nozzle
59: Linear scale

Claims (1)

A first cutting means comprising a first rotating spindle and a first cutting blade mounted on one end of the first rotating spindle; a second rotating spindle; and one end of the second rotating spindle And a second cutting means provided with a second cutting blade mounted on the cutting device, wherein the first cutting blade and the second cutting blade are arranged to face each other.
A first cutting blade detection mechanism provided in association with the first cutting means, and a second cutting blade detection mechanism provided in association with the second cutting means ,
The first cutting blade detection mechanism and the second cutting blade detection mechanism include a blade intrusion portion into which the cutting blade enters, a light emitting portion and a light receiving portion disposed to face the blade intrusion portion, and the light emission And a cleaning water supply nozzle for supplying cleaning water to the end face of the light receiving part, and an air supply nozzle for supplying air to the end face of the light emitting part and the light receiving part,
The opening of the air supply nozzle is disposed adjacent to the light emitting unit and the light receiving unit, and the opening of the cleaning water supply nozzle is disposed behind the opening of the air supply nozzle.
The cutting device characterized by the above.

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