JPH08288244A - Optical detecting means - Google Patents

Optical detecting means

Info

Publication number
JPH08288244A
JPH08288244A JP10914395A JP10914395A JPH08288244A JP H08288244 A JPH08288244 A JP H08288244A JP 10914395 A JP10914395 A JP 10914395A JP 10914395 A JP10914395 A JP 10914395A JP H08288244 A JPH08288244 A JP H08288244A
Authority
JP
Japan
Prior art keywords
detecting means
fluid
optical detecting
optical
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10914395A
Other languages
Japanese (ja)
Inventor
Genji Araki
源司 荒木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP10914395A priority Critical patent/JPH08288244A/en
Publication of JPH08288244A publication Critical patent/JPH08288244A/en
Pending legal-status Critical Current

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  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To prevent a detector from contaminating by jetting a fluid from detecting ends of a optical detecting means having a light emitting element and receiving element disposed face to face. CONSTITUTION: An optical detecting means 2 has a holder body 3 having a recess 3a held between side walls having opposed mounting holes 3b and air, N2 gas, pure water or similar fluid feed holes 3c the top ends of which are opened at the holes 3b and lower ends of which are opened at bottom holes 3d of the body 3. At upsetting of a rotary blade 1, a spindle unit is lowered to insert the blade 1 into the recess 3a of the body 3 to detect a reference position of the blade, using a detector part of an optical fiber 5 while the fluid e.g. compressed air is jetted from fluid jetting holes 4a to prevent the deposition of mist or contaminant.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体ウェーハ等を切
削する切削装置の光学検出手段に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical detecting means of a cutting device for cutting a semiconductor wafer or the like.

【0002】[0002]

【従来の技術】半導体ウェーハ等を切削するダイサーに
おいては、図8に示すように回転ブレード1のセットア
ップ時にその基準位置を検出したり、或は使用時での回
転ブレードの摩耗等を検出したりするため、回転ブレー
ド1の外周端部を検出する光学検出手段Sが、図1に示
す如く移動台M上の領域Rに配設されている。この光学
検出手段Sは、従来例えば図9に示すようにホルダHの
上部に凹陥部Qが形成され、この凹陥部Qの内側面に発
光素子Lと受光素子Pとからなる検出部が対設され、ス
ピンドルユニットUを降下させ回転ブレード1を凹陥部
Q内に挿入して回転ブレード1の基準位置等を光学的に
検出出来るようにしてある。
2. Description of the Related Art In a dicer for cutting a semiconductor wafer or the like, as shown in FIG. 8, the reference position of the rotary blade 1 is detected when it is set up, or the wear of the rotary blade during use is detected. Therefore, the optical detecting means S for detecting the outer peripheral end of the rotary blade 1 is arranged in the region R on the moving table M as shown in FIG. In the optical detecting means S, a concave portion Q is conventionally formed in the upper portion of a holder H as shown in FIG. 9, for example, and a detecting portion composed of a light emitting element L and a light receiving element P is provided opposite to the inner side surface of the concave portion Q. Then, the spindle unit U is lowered and the rotary blade 1 is inserted into the recess Q so that the reference position and the like of the rotary blade 1 can be optically detected.

【0003】[0003]

【発明が解決しようとする課題】上記のような従来の光
学検出手段Sによると、半導体ウェーハ等の切削中に発
生するミスト及びコンタミ等が検出部に付着し、回転ブ
レード1の基準位置等を正確に検出出来ないことがあ
る。又、ブレードカバーCに取り付けられた切削液供給
管Dが、検出時にホルダHに接触することがあり、この
ため切削液供給管Dを標準より上に位置させねばならな
くなってチッピングや切れ味等に悪影響を及ぼす問題が
ある。本発明は、このような従来の問題を解決するため
になされ、検出部にコンタミが付着するのを未然に防止
し、又それと共に検出時に切削液供給管がホルダに接触
しないようにした、光学検出手段を提供することを課題
とする。
According to the conventional optical detecting means S as described above, the mist, the contamination and the like generated during the cutting of the semiconductor wafer and the like adhere to the detecting portion and the reference position of the rotary blade 1 and the like are detected. It may not be detected accurately. Further, the cutting fluid supply pipe D attached to the blade cover C may come into contact with the holder H at the time of detection. Therefore, the cutting fluid supply pipe D must be positioned above the standard, which may cause chipping or sharpness. There is a problem that has an adverse effect. The present invention has been made to solve such a conventional problem, prevents contamination from adhering to the detection portion, and prevents the cutting fluid supply pipe from coming into contact with the holder during detection. An object is to provide detection means.

【0004】[0004]

【課題を解決するための手段】前記課題を技術的に解決
するための手段として、本発明は、半導体ウェーハ等を
切削する切削装置の回転ブレードの外周端部を検出する
光学検出手段において、この光学検出手段は発光素子、
受光素子を含み、この発光素子、受光素子の検出端部は
対向して配設されていて、その端部から流体が噴出する
ように構成されている光学検出手段を要旨とする。更
に、検出端部から発光素子、受光素子に至る経路が光フ
ァイバーで形成されており、この光ファイバーには間隙
を形成してカバーが配設され、このカバーに形成された
検出端部孔から前記間隙に供給された流体が噴出するこ
と、検出端部はサイドビュータイプであること、を要旨
とするものである。
As means for technically solving the above-mentioned problems, the present invention provides an optical detecting means for detecting an outer peripheral end portion of a rotary blade of a cutting device for cutting a semiconductor wafer or the like. The optical detection means is a light emitting element,
The gist is an optical detecting means including a light-receiving element, the light-emitting element and the light-receiving element having detection ends arranged to face each other, and a fluid ejected from the ends. Further, a path from the detection end portion to the light emitting element and the light receiving element is formed by an optical fiber, and a cover is arranged to form a gap in the optical fiber, and the gap is formed from the detection end portion hole formed in the cover. The gist of the present invention is that the fluid supplied to the nozzle is jetted out and the detection end is a side-view type.

【0005】[0005]

【作 用】検出端部からエア等の流体を噴出させること
により、コンタミ等が検出部に付着するのを未然に防止
することが出来る。又検出端部をサイドビュータイプに
形成することで、検出時における切削液供給管のホルダ
への接触を避けることが出来る。
[Operation] By ejecting a fluid such as air from the detection end, it is possible to prevent contamination and the like from adhering to the detection unit. Further, by forming the detection end portion in the side view type, it is possible to avoid contact of the cutting fluid supply pipe with the holder at the time of detection.

【0006】[0006]

【実施例】以下、本発明の実施例を添付図面に基づいて
詳説する。図1は切削装置であるダイサーの一例を示す
もので、上下動するカセット載置領域AにカセットBが
載置され、このカセットB内に収納されたウェーハW
(粘着テープNを介してフレームFに固定)が搬出入手
段Eにより待機領域Gに搬出され、旋回アームを有する
搬送手段IでチャックテーブルT上に搬送される。この
チャックテーブルTに保持されたウェーハWは、横移動
されてアライメント手段Jの真下に位置付けられ、アラ
イメントの後に切削領域Kに移動され回転ブレード1に
てダイシングされる。
Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows an example of a dicer which is a cutting device. A cassette B is placed in a cassette placement area A that moves up and down, and a wafer W stored in this cassette B is shown.
(Fixed to the frame F via the adhesive tape N) is carried out to the standby area G by the carrying-in / carrying-out means E, and is carried onto the chuck table T by the carrying means I having a turning arm. The wafer W held on the chuck table T is laterally moved and positioned directly below the alignment means J, and after alignment, moved to the cutting region K and diced by the rotary blade 1.

【0007】2は本発明に係る光学検出手段であり、前
記チャックテーブルTを保持する移動台Mの領域Rに配
設され、前記回転ブレード1のセットアップ時の基準位
置の検出及び回転ブレード1の摩耗等を検出する。
Reference numeral 2 denotes an optical detecting means according to the present invention, which is arranged in a region R of a moving table M holding the chuck table T, detects a reference position at the time of setting up the rotary blade 1, and detects the rotary blade 1. Detect wear etc.

【0008】前記光学検出手段2は、図2に示すように
ホルダ本体3を有しこのホルダ本体3の上部には凹陥部
3aが形成され、この凹陥部3aを挟む両壁には図3の
ように取付孔3bが対設され、且つこれらの取付孔に上
部が開口すると共にホルダ本体の底部孔3dに下部が開
口するエア、N2 ガス、純水等の流体供給用孔3cがそ
れぞれ形成されている。
The optical detecting means 2 has a holder main body 3 as shown in FIG. 2, and a concave portion 3a is formed in the upper portion of the holder main body 3, and both walls sandwiching the concave portion 3a are shown in FIG. Mounting holes 3b are provided oppositely to each other, and a fluid supply hole 3c for air, N 2 gas, pure water, etc., whose upper portion is opened in these mounting holes and whose lower portion is opened in a bottom hole 3d of the holder body, is formed. Has been done.

【0009】4はエルボ状に曲管形成されたカバーであ
り、図4に示すように先端面に流体噴出用孔4aがあけ
られ、側面の下部には流体流入用孔4bが形成されてい
る。このカバー4は、先端部が前記ホルダ本体3の取付
孔3bに嵌着固定され、前記凹陥部3aに若干突出して
2つのカバー4の先端面が対向し、且つカバー4の流体
流入用孔4bが前記ホルダ本体3の流体供給用孔3cに
それぞれ合致するようにしてある。
Reference numeral 4 is a cover formed in a curved elbow shape. As shown in FIG. 4, a fluid ejection hole 4a is formed in the tip end surface, and a fluid inflow hole 4b is formed in the lower portion of the side surface. . The tip of the cover 4 is fitted and fixed in the mounting hole 3b of the holder body 3, slightly protrudes into the recess 3a so that the tip surfaces of the two covers 4 face each other, and the fluid inflow hole 4b of the cover 4 is provided. Correspond to the fluid supply holes 3c of the holder body 3, respectively.

【0010】前記カバー4の内部には、このカバーの内
径より細い光ファイバー5が保持部材6を介して挿着さ
れ、先端の検出部5aは前記流体噴出用孔4aに臨んで
おり、カバー4の先端部内には間隙7が形成されてい
る。従って、ホルダ本体3の底部孔3dから例えば圧縮
エアが送り込まれると、そのエアは前記流体供給用孔3
cから流入用孔4bを経て間隙7内に流入し、カバー4
の先端の流体噴出用孔4aから外部に噴出される。
An optical fiber 5 having a diameter smaller than the inner diameter of the cover 4 is inserted into the inside of the cover 4 via a holding member 6, and the detection portion 5a at the tip faces the fluid ejection hole 4a, and the cover 4 is covered. A gap 7 is formed in the tip portion. Therefore, for example, when compressed air is fed from the bottom hole 3d of the holder body 3, the air is supplied to the fluid supply hole 3d.
c into the gap 7 through the inflow hole 4b and the cover 4
Is ejected to the outside from the fluid ejection hole 4a at the tip of the.

【0011】前記2つの光ファイバー5は、図示は省略
したが一方の端部を発光素子に、他方の端部を受光素子
にそれぞれ導くことにより光学検出部を構成することが
出来る。
Although not shown, the two optical fibers 5 can constitute an optical detecting section by guiding one end to a light emitting element and the other end to a light receiving element.

【0012】本発明に係る光学検出手段2は上記のよう
に構成され、前記回転ブレード1のセットアップ時にス
ピンドルユニットを降下させ回転ブレード1をホルダ本
体3の凹陥部3aに挿入し、光ファイバー5の検出部5
aによって回転ブレード1の基準位置を検出することが
出来る。常時前記カバー4の流体噴出用孔4aから圧縮
エア(例えば0.1MPa)等の流体を噴出させれば、
ミスト及びコンタミの付着を未然に防止することが出
来、回転ブレード1の基準位置の検出を正確に行うこと
が出来る。回転ブレード1の検査(摩耗、欠け等)も、
これと同様に正確に行うことが出来る。
The optical detecting means 2 according to the present invention is constructed as described above, and when the rotary blade 1 is set up, the spindle unit is lowered to insert the rotary blade 1 into the concave portion 3a of the holder body 3 to detect the optical fiber 5. Part 5
The reference position of the rotary blade 1 can be detected by a. If a fluid such as compressed air (for example, 0.1 MPa) is constantly ejected from the fluid ejection hole 4a of the cover 4,
Adhesion of mist and contamination can be prevented, and the reference position of the rotary blade 1 can be accurately detected. Inspection of the rotating blade 1 (wear, chipping, etc.)
It can be done exactly as well.

【0013】図5は本発明に係る光学検出手段の他の実
施例を示すもので、サイドビュータイプに形成され、即
ち光ファイバーを挿着した直管型のカバー14がホルダ
本体13の上部から突出した状態で配設されている。
FIG. 5 shows another embodiment of the optical detecting means according to the present invention, in which a side-view type, that is, a straight tube type cover 14 into which an optical fiber is inserted protrudes from the upper part of the holder body 13. It is arranged in a closed state.

【0014】前記ホルダ本体13は、底部から上部に貫
通する取付孔13aが対設されると共に、これらの取付
孔13a間に位置させてT字型の流体供給用孔13bが
形成され、その上部の両端は取付孔13aの中間部に開
口し、下端部はホルダ本体13の底部に開口している。
The holder body 13 has mounting holes 13a penetrating from the bottom to the upper part, and a T-shaped fluid supply hole 13b is formed between the mounting holes 13a. Both ends of are open to the middle of the mounting hole 13a, and the lower end is open to the bottom of the holder body 13.

【0015】前記カバー14は図6に示すように、上部
の側面に流体噴出用孔14aが形成されると共に、その
下方には流体流入用孔14bが形成され、前記ホルダ本
体13の取付孔13aにそれぞれ嵌着固定され、前記流
体噴出用孔14aはホルダ本体13の上部から突出して
対向し、且つ流体流入用孔14bは前記流体供給用孔1
3bにそれぞれ合致するようにしてある。
As shown in FIG. 6, the cover 14 has a fluid ejection hole 14a formed on the upper side surface and a fluid inflow hole 14b formed below the fluid ejection hole 14a. Fluid ejecting holes 14a project from the upper part of the holder body 13 and face each other, and fluid inflow holes 14b are the fluid supplying holes 1 respectively.
3b, respectively.

【0016】前記カバー14の内部にはこのカバー14
の内径より細い光ファイバー15が保持部材16を介し
て挿着され、その先端部にはプリズム等の光線屈折部材
18が設けられ、側面には検出部15aが形成されてお
り、この検出部15aは前記流体噴出用孔14aに臨ま
せ、カバー14の先端部内に間隙17が形成されてい
る。従って、ホルダ本体13の底部から流体供給用孔1
3bに圧縮エア等が送り込まれると、前記流体流入用孔
14bを経て間隙17内に流入し、カバー4の流体噴出
用孔14aから外部に噴出される。
Inside the cover 14, the cover 14
An optical fiber 15 having a diameter smaller than the inner diameter is inserted through a holding member 16, a light refracting member 18 such as a prism is provided at the tip end thereof, and a detecting portion 15a is formed on the side surface thereof. A gap 17 is formed in the tip of the cover 14 so as to face the fluid ejection hole 14a. Therefore, from the bottom of the holder body 13 to the fluid supply hole 1
When compressed air or the like is sent to 3b, it flows into the gap 17 through the fluid inflow hole 14b and is ejected to the outside from the fluid ejection hole 14a of the cover 4.

【0017】前記2つの光ファイバー15は、前記と同
様に一方を発光素子に、他方を受光素子に導くことによ
って光学検出部を構成することが出来、前記光線屈折部
材18によって光線の向きが90度変えられる。尚、カ
バー14は図7に示すようにホルダ本体13の上部に形
成した屋根状の傾斜面部13cから斜めに突出させるよ
うにしても良い。
Similar to the above, one of the two optical fibers 15 is guided to the light emitting element and the other is guided to the light receiving element to form an optical detecting section, and the light refracting member 18 makes the direction of the light beam 90 degrees. be changed. The cover 14 may be obliquely projected from a roof-shaped inclined surface portion 13c formed on the upper portion of the holder body 13 as shown in FIG.

【0018】このように形成されたサイドビュータイプ
の光学検出手段においては、前記回転ブレード1のセッ
トアップ時にカバー14の間に回転ブレード1を挿入
し、光ファイバー15の光線によって回転ブレード1の
基準位置を検出することが出来る。常時前記カバー14
の流体噴出用孔14aから圧縮エア等が噴出されるの
で、コンタミの付着を未然に防止すると共にコンタミを
排除することが出来、光ファイバー15による基準位置
の検出を正確に行うことが出来る。これと同様に、切削
時での回転ブレード1の検査(摩耗、欠け等)も正確に
行うことが出来る。
In the side-view type optical detecting means thus formed, the rotary blade 1 is inserted between the covers 14 when the rotary blade 1 is set up, and the reference position of the rotary blade 1 is determined by the light beam of the optical fiber 15. Can be detected. Always the cover 14
Since compressed air or the like is ejected from the fluid ejection hole 14a, contamination can be prevented in advance and contamination can be eliminated, and the optical fiber 15 can accurately detect the reference position. Similarly, the inspection (wear, chipping, etc.) of the rotary blade 1 at the time of cutting can be accurately performed.

【0019】特に、この場合は回転ブレード1と切削液
供給管Dとの間に、カバー14(光ファイバー15に関
連して比較的小径に形成されている)が位置するので回
転ブレード1の降下に伴って切削液供給管Dがホルダ本
体13に接触することはなく、このため切削液供給管D
を標準位置にセットすることが出来、チッピングや切れ
味等に悪影響を及ぼすことはない。
Particularly, in this case, since the cover 14 (formed in a relatively small diameter in relation to the optical fiber 15) is located between the rotary blade 1 and the cutting fluid supply pipe D, the rotary blade 1 is lowered. Accordingly, the cutting fluid supply pipe D does not come into contact with the holder body 13, and therefore the cutting fluid supply pipe D
Can be set to the standard position and does not adversely affect chipping and sharpness.

【0020】尚、流体として純水等の液体を用い、流体
噴出用孔4a、14aから常時噴出させる場合は、検出
部のコンタミ等の付着を略完全に防止することが出来
る。しかし、ブレードを検出する際には、光が屈折して
正確な検出が出来なくなるので液体の噴出を止め、エア
等のガスの噴出に切り替えて検出部の液体を排除する必
要がある。又、前記実施例では光ファイバーを用いて検
出部を形成したが、光ファイバーを介さないで検出端部
に発光素子、受光素子をそれぞれ配設して実施すること
も可能である。但し、光ファイバーを使用する場合に比
べ大径となる欠点がある。
When a liquid such as pure water is used as the fluid and is constantly ejected from the fluid ejection holes 4a and 14a, it is possible to substantially completely prevent the contamination of the detection portion and the like. However, when the blade is detected, it is necessary to stop the ejection of the liquid and switch to the ejection of gas such as air to eliminate the liquid in the detection unit, because the light refracts and accurate detection cannot be performed. Further, in the above-mentioned embodiment, the detecting portion is formed by using the optical fiber, but it is also possible to arrange the light emitting element and the light receiving element at the detecting end portion without interposing the optical fiber. However, there is a drawback that the diameter is larger than that when an optical fiber is used.

【0021】[0021]

【発明の効果】以上説明したように、本発明によれば、
切削装置における回転ブレードのセットアップ時の基準
位置の検出又は検査に際して、検出端部から流体が噴出
していることにより検出部にコンタミが付着するのを未
然に防止することが出来る。従って、回転ブレードのセ
ットアップ又は摩耗や欠け等の検査を正確に行うことが
出来、更に検出端部をサイドビュータイプにすることで
切削液供給管のホルダ本体への接触を避け、チッピング
や切れ味に悪影響を及ぼさない等の優れた効果を奏す
る。
As described above, according to the present invention,
When detecting or inspecting the reference position at the time of setting up the rotary blade in the cutting device, it is possible to prevent contamination from adhering to the detection portion due to the fluid jetting from the detection end portion. Therefore, it is possible to accurately set up the rotating blade or inspect for wear or chipping, and to avoid contact of the cutting fluid supply pipe with the holder body by making the detection end side view type, and to prevent chipping and sharpness. It has excellent effects such as no adverse effects.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明に係る光学検出手段を配設したダイサ
ーの一例を示す斜視図である。
FIG. 1 is a perspective view showing an example of a dicer provided with an optical detection means according to the present invention.

【図2】 光学検出手段と、回転ブレード及び切削液供
給管との位置関係を示す説明図である。
FIG. 2 is an explanatory diagram showing a positional relationship between an optical detecting means, a rotary blade and a cutting fluid supply pipe.

【図3】 同、概略断面図である。FIG. 3 is a schematic sectional view of the same.

【図4】 光学検出手段の要部の断面図である。FIG. 4 is a cross-sectional view of a main part of an optical detection unit.

【図5】 光学検出手段の他の実施例を示す説明図であ
る。
FIG. 5 is an explanatory view showing another embodiment of the optical detecting means.

【図6】 (イ) はその光学検出手段の要部の断面図、
(ロ) は側面図である。
FIG. 6A is a cross-sectional view of the main part of the optical detecting means,
(B) is a side view.

【図7】 検出部を上部から斜めに突出させた例を示す
斜視図である。
FIG. 7 is a perspective view showing an example in which a detection unit is obliquely projected from the upper portion.

【図8】 従来例を示す要部の斜視図である。FIG. 8 is a perspective view of a main part showing a conventional example.

【図9】 従来の光学検出手段と、回転ブレード及び切
削液供給管との位置関係を示す説明図である。
FIG. 9 is an explanatory view showing a positional relationship between a conventional optical detecting means, a rotary blade and a cutting fluid supply pipe.

【符号の説明】[Explanation of symbols]

1…回転ブレード 2…光学検出手段 3…ホルダ
本体 3a…凹陥部 3b…取付孔 3c…流体供給用孔 3d…底部孔
4…カバー 4a…流体噴出用孔 4b…流体
流入用孔 5…光ファイバー 5a…検出部 6…保持部材 7…間隔 13…ホルダ本体 13a…取付孔 13b…流体
供給用孔 14…カバー 14a…流体噴出用孔
14b…流体流入用孔 15…光ファイバー 1
5a…検出部 16…保持部材 17…間隔 1
8…光線屈折部材
DESCRIPTION OF SYMBOLS 1 ... Rotating blade 2 ... Optical detection means 3 ... Holder main body 3a ... Recessed part 3b ... Mounting hole 3c ... Fluid supply hole 3d ... Bottom hole 4 ... Cover 4a ... Fluid ejection hole 4b ... Fluid inflow hole 5 ... Optical fiber 5a Detecting unit 6 Holding member 7 Interval 13 Holder body 13a Mounting hole 13b Fluid supply hole 14 Cover 14a Fluid ejection hole
14b ... Fluid inflow hole 15 ... Optical fiber 1
5a ... Detection unit 16 ... Holding member 17 ... Spacing 1
8 ... Ray refraction member

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 半導体ウェーハ等を切削する切削装置の
回転ブレードの外周端部を検出する光学検出手段におい
て、この光学検出手段は発光素子、受光素子を含み、こ
の発光素子、受光素子の検出端部は対向して配設されて
いて、その端部から流体が噴出するように構成されてい
ることを特徴とする光学検出手段。
1. An optical detecting means for detecting an outer peripheral end portion of a rotary blade of a cutting device for cutting a semiconductor wafer or the like, wherein the optical detecting means includes a light emitting element and a light receiving element. The optical detecting means is characterized in that the portions are arranged so as to face each other, and the fluid is ejected from the end portion.
【請求項2】 検出端部から発光素子、受光素子に至る
経路が光ファイバーで形成されており、この光ファイバ
ーには間隙を形成してカバーが配設され、このカバーに
形成された検出端部孔から前記間隙に供給された流体が
噴出する、請求項1記載の光学検出手段。
2. A path from the detection end to the light emitting element and the light receiving element is formed by an optical fiber, and a cover is arranged with a gap formed in the optical fiber, and the detection end hole formed in the cover. The optical detecting means according to claim 1, wherein the fluid supplied from the nozzle to the gap is ejected.
【請求項3】 検出端部はサイドビュータイプである、
請求項1乃至2記載の光学検出手段。
3. The detection end portion is a side view type,
The optical detecting means according to claim 1.
JP10914395A 1995-04-11 1995-04-11 Optical detecting means Pending JPH08288244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10914395A JPH08288244A (en) 1995-04-11 1995-04-11 Optical detecting means

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10914395A JPH08288244A (en) 1995-04-11 1995-04-11 Optical detecting means

Publications (1)

Publication Number Publication Date
JPH08288244A true JPH08288244A (en) 1996-11-01

Family

ID=14502700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10914395A Pending JPH08288244A (en) 1995-04-11 1995-04-11 Optical detecting means

Country Status (1)

Country Link
JP (1) JPH08288244A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001298001A (en) * 2000-04-12 2001-10-26 Disco Abrasive Syst Ltd Cutting blade detecting mechanism for cutting device
JP2001298002A (en) * 2000-04-14 2001-10-26 Disco Abrasive Syst Ltd Cutting device
WO2003061907A1 (en) * 2002-01-18 2003-07-31 Disco Corporation Cutting device
JP2006294641A (en) * 2005-04-05 2006-10-26 Apic Yamada Corp Dicing device
JP2007042855A (en) * 2005-08-03 2007-02-15 Disco Abrasive Syst Ltd Cutter with blade detection means
JP2014054681A (en) * 2012-09-11 2014-03-27 Tdk Corp Processing machine, and grinding wheel outer peripheral edge detection method
JP2014079833A (en) * 2012-10-16 2014-05-08 Disco Abrasive Syst Ltd Cutting device
TWI548500B (en) * 2014-02-10 2016-09-11 The cutting knife position sensing means
CN107813225A (en) * 2016-09-13 2018-03-20 株式会社迪思科 Topping machanism
CN109501015A (en) * 2017-09-14 2019-03-22 株式会社迪思科 Cutting apparatus
CN114102718A (en) * 2020-08-26 2022-03-01 Towa株式会社 Cutting device and method for manufacturing cut product

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001298001A (en) * 2000-04-12 2001-10-26 Disco Abrasive Syst Ltd Cutting blade detecting mechanism for cutting device
JP4590058B2 (en) * 2000-04-12 2010-12-01 株式会社ディスコ Cutting blade detection mechanism of cutting equipment
JP4590060B2 (en) * 2000-04-14 2010-12-01 株式会社ディスコ Cutting equipment
JP2001298002A (en) * 2000-04-14 2001-10-26 Disco Abrasive Syst Ltd Cutting device
WO2003061907A1 (en) * 2002-01-18 2003-07-31 Disco Corporation Cutting device
JP2006294641A (en) * 2005-04-05 2006-10-26 Apic Yamada Corp Dicing device
JP2007042855A (en) * 2005-08-03 2007-02-15 Disco Abrasive Syst Ltd Cutter with blade detection means
JP2014054681A (en) * 2012-09-11 2014-03-27 Tdk Corp Processing machine, and grinding wheel outer peripheral edge detection method
JP2014079833A (en) * 2012-10-16 2014-05-08 Disco Abrasive Syst Ltd Cutting device
TWI548500B (en) * 2014-02-10 2016-09-11 The cutting knife position sensing means
CN107813225A (en) * 2016-09-13 2018-03-20 株式会社迪思科 Topping machanism
CN109501015A (en) * 2017-09-14 2019-03-22 株式会社迪思科 Cutting apparatus
JP2019054081A (en) * 2017-09-14 2019-04-04 株式会社ディスコ Cutting device
CN114102718A (en) * 2020-08-26 2022-03-01 Towa株式会社 Cutting device and method for manufacturing cut product
CN114102718B (en) * 2020-08-26 2024-01-30 Towa株式会社 Cutting device and method for manufacturing cut product

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