JP2014054681A - Processing machine, and grinding wheel outer peripheral edge detection method - Google Patents

Processing machine, and grinding wheel outer peripheral edge detection method Download PDF

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JP2014054681A
JP2014054681A JP2012199279A JP2012199279A JP2014054681A JP 2014054681 A JP2014054681 A JP 2014054681A JP 2012199279 A JP2012199279 A JP 2012199279A JP 2012199279 A JP2012199279 A JP 2012199279A JP 2014054681 A JP2014054681 A JP 2014054681A
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container
light receiving
light
receiving surface
liquid
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Daisuke Matsuoka
大輔 松岡
Osamu Fukuroi
修 袋井
Takami Sasaki
隆美 佐々木
Riichi Hirooka
利一 広岡
Yasuhiko Saito
靖彦 斉藤
Sengen Sugiyama
千元 杉山
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TDK Corp
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TDK Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a processing machine and a grinding wheel outer peripheral edge detection method capable of surely preventing a stain from sticking to a light projection surface and a light receiving surface of an optical sensor used for detecting an outer peripheral edge of a rotary grinding wheel, more than usual.SOLUTION: A shutter 26 is closed, and injection of water from a water injection port 20 is started. Processing such as cutting and grinding by a rotary grinding wheel 7 is executed in a state of submerging a light projection surface 28 of a light emission part 17 and a light receiving surface 29 of a light receiving part 18. When the processing is finished, dressing of the rotary grinding wheel 7 is executed. When the processing and the dressing are finished, a shutter 26 is opened, and the injection of the water from the water injection port 20 is stopped. When the light projection surface 28 of the light emission part 17 and the light receiving surface 29 of the light receiving part 18 are exposed from underwater, air is jetted toward the light projection surface 28 and the light receiving surface 29 from an air jetting port 25. Afterwards, the rotary grinding wheel 7 is lowered in a container 16 (between the light projection surface 28 and the light receiving surface 29), and a tip position of the rotary grinding wheel 7 is optically detected.

Description

本発明は、回転砥石による加工を行う加工機、及び回転砥石の外周縁を光センサで検出する砥石外周縁検出方法に関する。   The present invention relates to a processing machine that performs processing using a rotating grindstone, and a method for detecting an outer peripheral edge of a grindstone that detects an outer peripheral edge of the rotating grindstone with an optical sensor.

ダイヤモンドホイールなどの回転砥石を用いた水溶性研削液湿式切断機(加工機)において、回転砥石が切断、ドレス等により磨耗する。なお、ドレスは、回転砥石の目立て作業であり、加工と加工の間に行われる。切断等の加工を行う際の高さ設定には、回転砥石の磨耗量を検出する必要がある。回転砥石の磨耗量検出を非接触で行う場合、透過型の光電管などを利用して、回転砥石を上下動作させながら回転砥石で遮られる光量を電圧などに変換し電気信号として取り出すことで、回転砥石先端位置(外周縁)を検出する方法が考えられる。しかし、光電管の投光面及び受光面の汚れは透過する光量を変化させるため、回転砥石に遮られる光量を正確に特定するのが困難となる。すなわち、回転砥石先端位置の正確な検出が出来なくなる問題がある。そこで、光電管の投光面及び受光面の汚れを吹き飛ばすエアパージや水洗などの機能を付加することが考えられる。   In a water-soluble grinding fluid wet cutting machine (processing machine) using a rotating wheel such as a diamond wheel, the rotating wheel is worn by cutting or dressing. Note that dressing is a sharpening operation of a rotating grindstone, and is performed between processing. In order to set the height when processing such as cutting, it is necessary to detect the wear amount of the rotating grindstone. When performing non-contact detection of the amount of wear on the rotating wheel, use a transmissive phototube to move the rotating wheel up and down, convert the amount of light blocked by the rotating wheel to voltage, etc., and extract it as an electrical signal. A method for detecting the tip position (outer peripheral edge) of the grindstone is conceivable. However, dirt on the light emitting surface and the light receiving surface of the phototube changes the amount of light transmitted therethrough, making it difficult to accurately specify the amount of light blocked by the rotating grindstone. That is, there is a problem that it is impossible to accurately detect the tip position of the rotating grindstone. Therefore, it is conceivable to add a function such as air purge or water washing that blows away dirt on the light projecting surface and light receiving surface of the phototube.

下記特許文献1は、切削ブレードの状態検出を行う検出手段の発光面及び受光面が加工屑によって汚れるのを抑制するために、発光面及び受光面にそれぞれ流体を供給する噴出口をブレードカバーに設けている。   In Patent Document 1 below, in order to prevent the light emitting surface and the light receiving surface of the detecting means for detecting the state of the cutting blade from being soiled by processing waste, a jet port for supplying fluid to the light emitting surface and the light receiving surface is provided in the blade cover. Provided.

下記特許文献2は、環状ブレードの状態を検出するブレード検出手段を備えた切削装置において、環状ブレードの高速回転によって切削水が切削屑とともにブレード検出手段の発光体と受光体に飛散することをブラシ状仕切り部材により阻止する。   Japanese Patent Application Laid-Open No. 2004-259542 discloses that a cutting device including a blade detection unit that detects a state of an annular blade brushes that cutting water scatters to a light emitter and a light receiver of the blade detection unit together with cutting waste due to high-speed rotation of the annular blade. It is blocked by a partition member.

下記特許文献3は、回転砥石の磨耗量検出とは関係ないが、回転砥石を用いてワークに加工を行うワーク加工装置(加工機)の構成・動作の詳細を開示する。   Patent Document 3 below discloses details of the configuration and operation of a workpiece processing apparatus (processing machine) that processes a workpiece using the rotating grindstone, although it is not related to the detection of the wear amount of the rotating grindstone.

特開2011−110631号公報JP 2011-110631 A 特開2011−167800号公報JP 2011-167800 A 特許第4780356号公報(本出願人提案)Japanese Patent No. 4780356 (proposed by the present applicant)

切削液又は研削液に加工屑が混じってミスト状となった汚れが投光面及び受光面に付着すると、特許文献1のように水洗い洗浄をしても汚れが落ちないことがある。また、特許文献2のようにブラシ状仕切り部材を設けても、ミスト状の汚れの付着を防ぐのは困難である。   If dirt that has become mist due to cutting waste or grinding fluid mixed with the cutting fluid adheres to the light projecting surface and the light receiving surface, the soil may not be removed even after washing with water as in Patent Document 1. Moreover, even if a brush-like partition member is provided as in Patent Document 2, it is difficult to prevent adhesion of mist-like dirt.

本発明はこうした状況を認識してなされたものであり、その目的は、回転砥石の外周縁検出に用いる光センサの投光面及び受光面に汚れが付着することを従来と比較して確実に防止することの可能な加工機及び砥石外周縁検出方法を提供することにある。   The present invention has been made in view of such a situation, and its purpose is to ensure that dirt adheres to the light projecting surface and the light receiving surface of the optical sensor used for detecting the outer periphery of the rotating grindstone as compared with the prior art. An object of the present invention is to provide a processing machine and a method for detecting the outer periphery of a grindstone that can be prevented.

本発明のある態様は、加工機である。この加工機は、容器と、前記容器内に液体を注入する液体注入手段と、前記容器内から液体を排出する液体排出手段と、前記容器内に投光面及び受光面を有する光センサと、前記投光面及び前記受光面に向けて気体を噴出する気体噴出手段と、前記光センサの光を遮る位置に相対移動可能な回転砥石とを備え、前記光センサでの検出結果に基づいて前記回転砥石の外周縁を検出する。   One embodiment of the present invention is a processing machine. The processing machine includes a container, a liquid injecting unit for injecting a liquid into the container, a liquid discharging unit for discharging the liquid from the container, an optical sensor having a light projecting surface and a light receiving surface in the container, Gas ejecting means for ejecting gas toward the light projecting surface and the light receiving surface, and a rotating grindstone that is relatively movable to a position that blocks the light of the optical sensor, and based on the detection result of the optical sensor, The outer periphery of the rotating grindstone is detected.

前記投光面及び前記受光面は前記容器内の前記液体中に没した状態となることができ、かつ、前記液体中から露出した前記投光面及び前記受光面に前記気体を噴出することで前記投光面及び前記受光面に付着した液滴を除去可能であってもよい。   The light projecting surface and the light receiving surface can be immersed in the liquid in the container, and the gas is ejected onto the light projecting surface and the light receiving surface exposed from the liquid. It may be possible to remove droplets adhering to the light projecting surface and the light receiving surface.

前記回転砥石の加工対象となるワークを伴って加工方向に移動するスライダを備え、前記容器が前記スライダに設けられていてもよい。   A slider that moves in a processing direction with a workpiece to be processed by the rotary grindstone may be provided, and the container may be provided on the slider.

前記容器は切削液又は研削液の飛散範囲内に存在してもよい。   The container may be present in a range of scattering of cutting fluid or grinding fluid.

前記容器の上部開口を開閉可能なシャッターを備えてもよい。   You may provide the shutter which can open and close the upper opening of the said container.

本発明のもう1つの態様は、砥石外周縁検出方法である。この方法は、光センサの投光面及び受光面が内部にある容器に液体を注入して前記投光面及び前記受光面を前記液体中に浸漬した状態で回転砥石による加工あるいは回転砥石のドレスを行い、その後、前記容器から前記液体を排出して前記投光面及び前記受光面を前記液体中から露出させた状態で前記投光面及び前記受光面に向けて気体を噴出し、前記光センサの光を遮るように前記回転砥石を相対移動し、前記光センサでの検出結果に基づいて前記回転砥石の外周縁を検出する。   Another aspect of the present invention is a method for detecting the outer periphery of a grindstone. In this method, a liquid is poured into a container in which the light projecting surface and the light receiving surface of an optical sensor are placed, and the light projecting surface and the light receiving surface are immersed in the liquid. Thereafter, the liquid is discharged from the container and the light projecting surface and the light receiving surface are exposed from the liquid, and a gas is ejected toward the light projecting surface and the light receiving surface. The rotating grindstone is relatively moved so as to block the light from the sensor, and the outer peripheral edge of the rotating grindstone is detected based on the detection result of the optical sensor.

液体の注入を継続して前記容器内の液体を入れ替えながら前記加工あるいは前記ドレスを行ってもよい。   The processing or the dressing may be performed while continuing the liquid injection and replacing the liquid in the container.

前記加工あるいは前記ドレスを行っているときは前記容器の上部開口をシャッターで閉じておき、前記光センサによる検出を行うときに前記シャッターを開けてもよい。   When performing the processing or dressing, the upper opening of the container may be closed with a shutter, and the shutter may be opened when detection by the optical sensor is performed.

前記回転砥石の加工対象となるワークを伴って加工方向に移動するスライダに前記容器が設けられていてもよい。   The said container may be provided in the slider which moves to a process direction with the workpiece | work used as the process target of the said rotating grindstone.

なお、以上の構成要素の任意の組合せ、本発明の表現をシステムなどの間で変換したものもまた、本発明の態様として有効である。   It should be noted that any combination of the above-described constituent elements, or a conversion of the expression of the present invention between systems or the like is also effective as an aspect of the present invention.

本発明によれば、回転砥石の外周縁検出に用いる光センサの投光面及び受光面に汚れが付着することを従来と比較して確実に防止することができる。   ADVANTAGE OF THE INVENTION According to this invention, it can prevent reliably that a dirt adheres to the light projection surface and light-receiving surface of the optical sensor used for the outer periphery detection of a rotating grindstone compared with the past.

本発明の実施の形態に係る加工機1の概略平面図。1 is a schematic plan view of a processing machine 1 according to an embodiment of the present invention. 加工機1の概略正面図。The schematic front view of the processing machine 1. FIG. 図1に示す容器16の平面図。The top view of the container 16 shown in FIG. 図3のA−A断面図。AA sectional drawing of FIG. 図3のB−B断面図。BB sectional drawing of FIG. 実施の形態における回転砥石7の先端位置検出の動作説明図。Explanatory drawing of operation | movement of the front-end | tip position detection of the rotating grindstone 7 in embodiment. 同フローチャート。The flowchart.

以下、図面を参照しながら本発明の好適な実施の形態を詳述する。なお、各図面に示される同一または同等の構成要素、部材、処理等には同一の符号を付し、適宜重複した説明は省略する。また、実施の形態は発明を限定するものではなく例示であり、実施の形態に記述されるすべての特徴やその組み合わせは必ずしも発明の本質的なものであるとは限らない。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or equivalent component, member, process, etc. which are shown by each drawing, and the overlapping description is abbreviate | omitted suitably. In addition, the embodiments do not limit the invention but are exemplifications, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

図1は、本発明の実施の形態に係る加工機1の概略平面図である。図2は、加工機1の概略正面図である。これらの図において相互に直交する3方向であるXYZ方向を定義する。   FIG. 1 is a schematic plan view of a processing machine 1 according to an embodiment of the present invention. FIG. 2 is a schematic front view of the processing machine 1. In these figures, XYZ directions, which are three directions orthogonal to each other, are defined.

まず加工機1の全体構成について簡単に説明する。不図示の装置基台にX軸スライドガイド2が固定される。X軸スライドガイド2にはXスライダ3がX方向にスライド可能に支持される。θ軸部4は、Xスライダ3と共にX方向に移動し、かつ不図示のモータに駆動されてZ方向と平行な回転軸で回転自在である。θテーブル5はθ軸部4に支持されてθ軸部4と一体に回転する。θテーブル5上には加工対象となるワーク6が載置される。このためワーク6はX方向に移動可能かつZ方向を軸に回転可能である。ワーク6は、特に限定されないが、例えば多数個の素子を一括形成したシリコンウェハや基板である。   First, the overall configuration of the processing machine 1 will be briefly described. The X-axis slide guide 2 is fixed to a device base (not shown). An X slider 3 is supported on the X axis slide guide 2 so as to be slidable in the X direction. The θ-axis part 4 moves in the X direction together with the X slider 3 and is driven by a motor (not shown) so as to be rotatable around a rotation axis parallel to the Z direction. The θ table 5 is supported by the θ shaft portion 4 and rotates integrally with the θ shaft portion 4. A workpiece 6 to be machined is placed on the θ table 5. Therefore, the workpiece 6 can move in the X direction and can rotate about the Z direction. Although the workpiece | work 6 is not specifically limited, For example, it is the silicon wafer and board | substrate which formed many elements collectively.

Xスライダ3には支持脚14が立設固定され、支持脚14の上端部には支持台15が固定され、支持台15上には金属製もしくは樹脂製の容器16が固定される。このため容器16はXスライダ3と共にX方向に移動する。容器16内には光センサを成す発光部17及び受光部18が配置される。容器16内の詳細は図3〜図5で後述する。   A support leg 14 is erected and fixed to the X slider 3, a support base 15 is fixed to the upper end portion of the support leg 14, and a metal or resin container 16 is fixed on the support base 15. For this reason, the container 16 moves in the X direction together with the X slider 3. A light emitting unit 17 and a light receiving unit 18 constituting an optical sensor are arranged in the container 16. Details in the container 16 will be described later with reference to FIGS.

Y軸スライドガイド12は不図示の装置基台に固定される。Yスライダ11はY軸スライドガイド12に支持されてY方向にスライド可能である。Zスライダ10はYスライダ11に支持されてZ方向にスライド可能である。スピンドル軸9は、Y方向と平行な回転軸であり、Zスライダ10と共にZ方向に移動し、かつ不図示のモータにより回転駆動される。回転砥石7は、フランジ8によってスピンドル軸9に取り付けられ、スピンドル軸9の回転に伴って回転する。このため回転砥石7はY方向及びZ方向に移動可能である。切削液供給ノズル30は、回転砥石7と一体にY方向及びZ方向に移動可能であり、加工時に切削液(あるいは研削液)を回転砥石7とワーク6に供給する。加工室27は、不図示の装置基台に固定されて回転砥石7の周囲を囲み、加工屑や切削液の周囲への飛散を防止する。制御部19は、プロセッサやメモリ、プログラムその他、加工機1全体の動作制御及び各種演算に必要な要素を包含する。カメラ13は、ワーク6のアライメント用であり、例えばYスライダ11に固定される。   The Y-axis slide guide 12 is fixed to a device base (not shown). The Y slider 11 is supported by the Y axis slide guide 12 and is slidable in the Y direction. The Z slider 10 is supported by the Y slider 11 and can slide in the Z direction. The spindle shaft 9 is a rotation shaft parallel to the Y direction, moves in the Z direction together with the Z slider 10, and is rotationally driven by a motor (not shown). The rotating grindstone 7 is attached to the spindle shaft 9 by a flange 8 and rotates as the spindle shaft 9 rotates. For this reason, the rotating grindstone 7 is movable in the Y direction and the Z direction. The cutting fluid supply nozzle 30 is movable in the Y direction and the Z direction integrally with the rotating grindstone 7, and supplies the cutting fluid (or grinding fluid) to the rotating grindstone 7 and the workpiece 6 during processing. The processing chamber 27 is fixed to a device base (not shown) and surrounds the periphery of the rotating grindstone 7 to prevent scattering of processing waste and cutting fluid to the periphery. The control unit 19 includes a processor, a memory, a program, and other elements necessary for operation control of the entire processing machine 1 and various calculations. The camera 13 is for alignment of the workpiece 6 and is fixed to the Y slider 11, for example.

なお、加工機1において、回転砥石7の先端位置検出に係る構成以外は本出願人提案の特許文献3と同様でよいため、更なる詳細な説明は省略する。   Since the processing machine 1 may be the same as Patent Document 3 proposed by the applicant except for the configuration related to the tip position detection of the rotating grindstone 7, further detailed description is omitted.

図3は、図1に示す容器16の平面図である。図4は、図3のA−A断面図である。図5は、図3のB−B断面図である。これらの図の例では容器16は上面が開口した直方体形状である。容器16の底面には発光側ホルダ23及び受光側ホルダ24が固定され、発光側ホルダ23及び受光側ホルダ24には光センサの発光部17及び受光部18がそれぞれ支持され、発光部17の投光面28と受光部18の受光面29とが相互に対向する。発光部17は、LED(発光ダイオード)やLD(レーザーダイオード)等の発光素子を含み、投光面28から光を受光部18の受光面29に向けて照射する。受光部18は、受光面29を通して受光した光を、フォトトランジスタやフォトダイオード等の半導体受光素子あるいは光電管により受光して電気信号に変換する。発光部17及び受光部18は防水対策を施したものを使用する。容器16の底面からはエア噴出管22がL字状に延び、エア噴出口25(エア噴出管22の先端開口)は投光面28と受光面29との中間位置側方にあって投光面28及び受光面29にエアを噴出可能である。エア噴出口25からのエア噴出は例えば制御部19により不図示の電磁弁(開閉手段)を開閉することで制御される。容器16の底面には水注入口20と水排出口21が開口する。水注入口20は水排出口21より大径である。水注入口20の開口位置は好ましくは平面視で投光面28及び受光面29の中間位置とする。水注入口20からの水の注入は例えば制御部19により不図示の電磁弁を開閉することで制御される。注入する水はスピンドルの冷却液などを流用することができる。水排出口21側には電磁弁等の開閉手段を設ける必要はない。シャッター26は、金属製もしくは樹脂製であり、容器16の上部開口を開閉可能に設けられる。シャッター26の開閉は例えば制御部19により不図示のエアシリンダ等を駆動することで制御される。シャッター26を閉じることで投光面28及び受光面29に切削液が直接かかることが防止される。   FIG. 3 is a plan view of the container 16 shown in FIG. 4 is a cross-sectional view taken along line AA in FIG. 5 is a cross-sectional view taken along the line BB in FIG. In the example of these drawings, the container 16 has a rectangular parallelepiped shape with an upper surface opened. The light emitting side holder 23 and the light receiving side holder 24 are fixed to the bottom surface of the container 16, and the light emitting side holder 23 and the light receiving side holder 24 support the light emitting part 17 and the light receiving part 18 of the optical sensor, respectively. The light surface 28 and the light receiving surface 29 of the light receiving unit 18 face each other. The light emitting unit 17 includes a light emitting element such as an LED (light emitting diode) or an LD (laser diode), and irradiates light from the light projecting surface 28 toward the light receiving surface 29 of the light receiving unit 18. The light receiving unit 18 receives light received through the light receiving surface 29 by a semiconductor light receiving element such as a phototransistor or a photodiode or a photoelectric tube and converts the light into an electric signal. The light emitting unit 17 and the light receiving unit 18 are provided with waterproof measures. An air ejection pipe 22 extends in an L shape from the bottom surface of the container 16, and an air ejection outlet 25 (a front end opening of the air ejection pipe 22) is on the side of an intermediate position between the light projecting surface 28 and the light receiving surface 29. Air can be ejected to the surface 28 and the light receiving surface 29. Air ejection from the air ejection port 25 is controlled, for example, by opening and closing a solenoid valve (opening / closing means) (not shown) by the control unit 19. A water inlet 20 and a water outlet 21 are opened at the bottom of the container 16. The water inlet 20 has a larger diameter than the water outlet 21. The opening position of the water inlet 20 is preferably an intermediate position between the light projecting surface 28 and the light receiving surface 29 in plan view. Water injection from the water injection port 20 is controlled by, for example, opening and closing a solenoid valve (not shown) by the control unit 19. As the water to be injected, a spindle coolant or the like can be used. It is not necessary to provide opening / closing means such as a solenoid valve on the water discharge port 21 side. The shutter 26 is made of metal or resin, and is provided so that the upper opening of the container 16 can be opened and closed. The opening and closing of the shutter 26 is controlled, for example, by driving an air cylinder (not shown) by the control unit 19. By closing the shutter 26, it is possible to prevent the cutting fluid from being directly applied to the light projecting surface 28 and the light receiving surface 29.

図6は、本実施の形態における回転砥石7の先端位置検出(すなわち磨耗量検出)の動作説明図であり、図7はそのフローチャートである。制御部19は、まず、図6(A)に示すようにシャッター26を閉じ(S1)、不図示の電磁弁を開いて水注入口20からの水の注入を開始する(S2)。シャッター26の閉鎖と水の注入開始はいずれを先に行ってもよく、並行して行ってもよい。水注入口20からの水の注入と水排出口21からの水の排出は並行して行われるが、単位時間あたりの水の注入量が水の排出量よりも多いため、トータルで見れば時間の経過と共に水の注入が進み、図6(B)に示すように容器16内の水位が上昇して発光部17の投光面28と受光部18の受光面29が水没する(水中に浸漬される)。この状態で回転砥石7による切断、切削、研削、研磨等の加工を行う(S3)。加工が終了すると回転砥石7のドレスを行う(S4)。加工及びドレスの動作は周知なのでここでは説明を省略する。加工及びドレスはいずれか一方を省略してもよい。加工及びドレスの際も水の注入は継続されており、排出量を上回る注入分は容器16とシャッター26の隙間からあふれて外に出る。加工及びドレスが終了すると、制御部19は、図6(C)に示すようにシャッター26を開け(S5)、不図示の電磁弁を閉じて水注入口20からの水の注入を停止する(S6)。シャッター26の開放と水の注入停止はいずれを先に行ってもよく、並行して行ってもよい。水の注入を停止すると水排出口21からの水の排出が進み、図6(C)に示すように発光部17の投光面28と受光部18の受光面29が水中から露出する。この状態で、制御部19は、不図示の電磁弁を開いてエア噴出口25から投光面28及び受光面29に向けてエアを噴出する(S7)。これにより投光面28及び受光面29に付着した水滴(液滴)が除去される。制御部19の制御により容器16は図6(D)に示すように回転砥石7の真下となる位置に移動しており、図6(E)に示すように回転砥石7を容器16内(投光面28及び受光面29の間)に降下させることで回転砥石7により投光面28から受光面29に至る光が遮られ、回転砥石7の先端位置が光学的に検出される。光センサによる回転砥石の先端位置検出自体は周知なのでここでは説明は省略する。   FIG. 6 is an operation explanatory diagram of tip position detection (that is, wear amount detection) of the rotating grindstone 7 in the present embodiment, and FIG. 7 is a flowchart thereof. First, as shown in FIG. 6A, the control unit 19 closes the shutter 26 (S1), opens an unillustrated electromagnetic valve, and starts water injection from the water inlet 20 (S2). Either the closing of the shutter 26 or the start of water injection may be performed first or in parallel. Water injection from the water injection port 20 and water discharge from the water discharge port 21 are performed in parallel. However, since the amount of water injection per unit time is larger than the amount of water discharge, it is time in total. As shown in FIG. 6 (B), the water level in the container 16 rises and the light projecting surface 28 of the light emitting unit 17 and the light receiving surface 29 of the light receiving unit 18 are submerged (immersed in water). ) In this state, cutting, cutting, grinding, polishing and the like are performed by the rotating grindstone 7 (S3). When the processing is completed, the rotary grindstone 7 is dressed (S4). Since processing and dressing operations are well known, description thereof is omitted here. Either processing or dressing may be omitted. Water injection is continued during processing and dressing, and the injection amount exceeding the discharge amount overflows from the gap between the container 16 and the shutter 26 and goes out. When the processing and dressing are completed, the control unit 19 opens the shutter 26 as shown in FIG. 6C (S5), closes the electromagnetic valve (not shown), and stops water injection from the water inlet 20 ( S6). Either the opening of the shutter 26 or the stop of water injection may be performed first or in parallel. When the water injection is stopped, the water discharge from the water discharge port 21 proceeds, and the light projecting surface 28 of the light emitting unit 17 and the light receiving surface 29 of the light receiving unit 18 are exposed from the water as shown in FIG. 6C. In this state, the control unit 19 opens a solenoid valve (not shown) and ejects air from the air ejection port 25 toward the light projecting surface 28 and the light receiving surface 29 (S7). As a result, water droplets (droplets) attached to the light projecting surface 28 and the light receiving surface 29 are removed. As shown in FIG. 6D, the container 16 is moved to a position directly below the rotating grindstone 7 as shown in FIG. 6D, and the rotating grindstone 7 is placed in the container 16 (throwing) as shown in FIG. The light from the light projecting surface 28 to the light receiving surface 29 is blocked by the rotating grindstone 7, and the tip position of the rotating grindstone 7 is optically detected. Since the tip position detection of the rotating grindstone by the optical sensor is well known, the description thereof is omitted here.

本実施の形態によれば、下記の効果を奏することができる。   According to the present embodiment, the following effects can be achieved.

(1) 回転砥石7による加工あるいは回転砥石7のドレスの際は発光部17の投光面28と受光部18の受光面29が水没しているため、切削液又は研削液に加工屑が混じってミスト状となった汚れがシャッター26を回り込んで容器16内に入ってきてもミスト状の汚れは水と混ざり合って薄まり、投光面28及び受光面29の汚染が防止され、回転砥石7の先端位置検出(径の測定)を正確に実施できる。 (1) When machining with the rotating grindstone 7 or dressing the rotating grindstone 7, the light projecting surface 28 of the light emitting unit 17 and the light receiving surface 29 of the light receiving unit 18 are submerged, so that machining waste is mixed with the cutting fluid or the grinding fluid. Even if the mist-like dirt moves around the shutter 26 and enters the container 16, the mist-like dirt is mixed with water and thinned to prevent contamination of the light projecting surface 28 and the light receiving surface 29, and the rotating grindstone 7 position detection (diameter measurement) can be performed accurately.

(2) 加工とドレスの動作中に容器16内への水の注入を継続して容器16内の水を継続的に入れ替えているため、ミスト状の汚れによる容器16内の水の汚染濃度上昇が抑制される。ここで、水注入口20が投光面28及び受光面29の近傍にあり、投光面28及び受光面29には新しい水(汚染されていない水)が継続的に送り込まれるため、投光面28及び受光面29の近傍の水は汚染濃度が上昇しにくくて好ましい。また、汚れは容器16内の水面付近に溜まりやすいため、水の注入を継続して水を容器16からあふれさせることで、水面付近に溜まった汚れを好適に外部に排出することができる。 (2) Since the water in the container 16 is continuously replaced by continuously injecting water into the container 16 during processing and dressing operation, the contamination concentration of the water in the container 16 increases due to mist-like dirt. Is suppressed. Here, since the water injection port 20 is in the vicinity of the light projecting surface 28 and the light receiving surface 29 and new water (uncontaminated water) is continuously fed into the light projecting surface 28 and the light receiving surface 29, Water in the vicinity of the surface 28 and the light receiving surface 29 is preferable because the contamination concentration hardly increases. Further, since dirt easily collects near the water surface in the container 16, the dirt accumulated near the water surface can be suitably discharged to the outside by continuing to inject water and causing the water to overflow from the container 16.

(3) 回転砥石7の先端位置検出の前にエア噴出口25からのエアパージにより投光面28及び受光面29の水滴を除去、乾燥するので、水滴の影響を無くして正確な検出を実施できる。 (3) Since the water droplets on the light projecting surface 28 and the light receiving surface 29 are removed and dried by air purge from the air outlet 25 before detecting the tip position of the rotating grindstone 7, accurate detection can be performed without the influence of water droplets. .

(4) 上記の汚れ対策は、厳重な密閉開閉容器で保護する場合と比較して構造が単純でコスト安である。 (4) The above-mentioned contamination countermeasures are simple in structure and low in cost as compared with the case of protection with a strict sealed open / close container.

(5) 上記のとおり汚れ対策を施しているため、光センサを成す発光部17及び受光部18は、環境の悪い(汚染されやすい)加工室27内に設置可能であり、本実施の形態では発光部17及び受光部18を収容した容器16をXスライダ3に固定している。固定位置はXスライダ3のX方向一方側であり、通常の切削ストロークの範囲内で回転砥石7の先端位置検出が可能となっている。このため、回転砥石7の先端位置検出のために切削ストロークを超えてストローク範囲を広げる必要が無く、大幅な装置設計の変更が不要で、またワーク6の載置面(θテーブル5の上面)の剛性確保や小型化、コスト低減の観点で好ましい。また、発光部17及び受光部18を収容した容器16を加工室27外に設置する場合と比較して装置が小型で済みコスト安である。 (5) Since the anti-smudge measures are taken as described above, the light-emitting unit 17 and the light-receiving unit 18 constituting the optical sensor can be installed in the processing chamber 27 having a poor environment (which is easily contaminated). The container 16 containing the light emitting unit 17 and the light receiving unit 18 is fixed to the X slider 3. The fixed position is one side in the X direction of the X slider 3, and the tip position of the rotating grindstone 7 can be detected within the range of the normal cutting stroke. For this reason, it is not necessary to extend the stroke range beyond the cutting stroke in order to detect the tip position of the rotating grindstone 7, and it is not necessary to significantly change the device design, and the work surface (the upper surface of the θ table 5) on which the work 6 is placed. From the viewpoint of securing rigidity, downsizing, and cost reduction. In addition, the apparatus can be smaller and less expensive than the case where the container 16 containing the light emitting unit 17 and the light receiving unit 18 is installed outside the processing chamber 27.

以上、実施の形態を例に本発明を説明したが、実施の形態の各構成要素や各処理プロセスには請求項に記載の範囲で種々の変形が可能であることは当業者に理解されるところである。以下、変形例について触れる。   The present invention has been described above by taking the embodiment as an example. However, it is understood by those skilled in the art that various modifications can be made to each component and each processing process of the embodiment within the scope of the claims. By the way. Hereinafter, modifications will be described.

容器16に注入する液体は水に限定されず、またエア噴出口25から噴出する気体は空気に限定されない。シャッター26は省略してもよい。水排出口21にも電磁弁を設け、水注入時には制御部19は電磁弁を閉じて水排出口21からの排水を止めてもよい。   The liquid injected into the container 16 is not limited to water, and the gas ejected from the air outlet 25 is not limited to air. The shutter 26 may be omitted. The water discharge port 21 may be provided with an electromagnetic valve, and the controller 19 may close the electromagnetic valve and stop drainage from the water discharge port 21 when water is injected.

1 加工機、2 X軸スライドガイド、3 Xスライダ、4 θ軸部、5 θテーブル、6 ワーク、7 回転砥石、8 フランジ、9 スピンドル軸、10 Zスライダ、11 Yスライダ、12 Y軸スライドガイド、13 カメラ、14 支持脚、15 支持台、16 容器、17 発光部、18 受光部、19 制御部、20 水注入口、21 水排出口、22 エア噴出管、23 発光側ホルダ、24 受光側ホルダ、25 エア噴出口、26 シャッター、27 加工室、28 投光面、29 受光面、30 切削液供給ノズル 1 Processing Machine, 2 X-Axis Slide Guide, 3 X Slider, 4 θ Axis, 5 θ Table, 6 Workpiece, 7 Rotary Wheel, 8 Flange, 9 Spindle Axis, 10 Z Slider, 11 Y Slider, 12 Y Axis Slide Guide , 13 Camera, 14 Support leg, 15 Support base, 16 Container, 17 Light emitting part, 18 Light receiving part, 19 Control part, 20 Water inlet, 21 Water outlet, 22 Air ejection pipe, 23 Light emitting side holder, 24 Light receiving side Holder, 25 Air outlet, 26 Shutter, 27 Processing chamber, 28 Light emitting surface, 29 Light receiving surface, 30 Cutting fluid supply nozzle

Claims (9)

容器と、前記容器内に液体を注入する液体注入手段と、前記容器内から液体を排出する液体排出手段と、前記容器内に投光面及び受光面を有する光センサと、前記投光面及び前記受光面に向けて気体を噴出する気体噴出手段と、前記光センサの光を遮る位置に相対移動可能な回転砥石とを備え、前記光センサでの検出結果に基づいて前記回転砥石の外周縁を検出する、加工機。   A container, liquid injection means for injecting liquid into the container, liquid discharge means for discharging liquid from the container, an optical sensor having a light projecting surface and a light receiving surface in the container, the light projecting surface, Gas jetting means for jetting gas toward the light receiving surface, and a rotating grindstone that is relatively movable to a position where the light of the optical sensor is blocked, and an outer peripheral edge of the rotating grindstone based on a detection result of the optical sensor Detecting the processing machine. 前記投光面及び前記受光面は前記容器内の前記液体中に没した状態となることができ、かつ、前記液体中から露出した前記投光面及び前記受光面に前記気体を噴出することで前記投光面及び前記受光面に付着した液滴を除去可能である、請求項1に記載の加工機。   The light projecting surface and the light receiving surface can be immersed in the liquid in the container, and the gas is ejected onto the light projecting surface and the light receiving surface exposed from the liquid. The processing machine according to claim 1, wherein droplets adhering to the light projecting surface and the light receiving surface can be removed. 前記回転砥石の加工対象となるワークを伴って加工方向に移動するスライダを備え、前記容器が前記スライダに設けられている、請求項1又は2に記載の加工機。   The processing machine according to claim 1, further comprising a slider that moves in a processing direction along with a workpiece to be processed by the rotary grindstone, wherein the container is provided on the slider. 前記容器は切削液又は研削液の飛散範囲内に存在する請求項1から3のいずれか一項に記載の加工機。   The processing machine according to any one of claims 1 to 3, wherein the container is present within a scattering range of a cutting fluid or a grinding fluid. 前記容器の上部開口を開閉可能なシャッターを備える請求項1から4のいずれか一項に記載の加工機。   The processing machine as described in any one of Claim 1 to 4 provided with the shutter which can open and close the upper opening of the said container. 光センサの投光面及び受光面が内部にある容器に液体を注入して前記投光面及び前記受光面を前記液体中に浸漬した状態で回転砥石による加工あるいは回転砥石のドレスを行い、その後、前記容器から前記液体を排出して前記投光面及び前記受光面を前記液体中から露出させた状態で前記投光面及び前記受光面に向けて気体を噴出し、前記光センサの光を遮るように前記回転砥石を相対移動し、前記光センサでの検出結果に基づいて前記回転砥石の外周縁を検出する、砥石外周縁検出方法。   A liquid is poured into a container in which the light projecting surface and the light receiving surface of the optical sensor are placed, and the light projecting surface and the light receiving surface are immersed in the liquid, and then processing with a rotating grindstone or dressing of the rotating grindstone is performed. The liquid is discharged from the container and the light projecting surface and the light receiving surface are exposed from the liquid, and a gas is ejected toward the light projecting surface and the light receiving surface to emit light from the light sensor. A method for detecting the outer periphery of a grindstone, wherein the outer peripheral edge of the rotating grindstone is detected based on a detection result of the optical sensor by relatively moving the rotating grindstone so as to block. 液体の注入を継続して前記容器内の液体を入れ替えながら前記加工あるいは前記ドレスを行う請求項6に記載の砥石外周縁検出方法。   The grindstone outer periphery detection method according to claim 6, wherein the processing or the dressing is performed while continuously injecting liquid and replacing the liquid in the container. 前記加工あるいは前記ドレスを行っているときは前記容器の上部開口をシャッターで閉じておき、前記光センサによる検出を行うときに前記シャッターを開ける、請求項6又は7に記載の砥石外周縁検出方法。   The method for detecting the outer periphery of a grindstone according to claim 6 or 7, wherein when performing the processing or dressing, the upper opening of the container is closed with a shutter, and the shutter is opened when detection by the optical sensor is performed. . 前記回転砥石の加工対象となるワークを伴って加工方向に移動するスライダに前記容器が設けられている請求項6から8のいずれか一項に記載の砥石外周縁検出方法。   The method for detecting an outer periphery of a grindstone according to any one of claims 6 to 8, wherein the container is provided on a slider that moves in a machining direction along with a workpiece to be machined by the rotating grindstone.
JP2012199279A 2012-09-11 2012-09-11 Processing machine, and grinding wheel outer peripheral edge detection method Pending JP2014054681A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108574024A (en) * 2018-02-01 2018-09-25 横店集团东磁股份有限公司 A kind of water squeezing idler wheel for wet etching
CN110303385A (en) * 2019-06-28 2019-10-08 中国人民解放军国防科技大学 Monocrystalline silicon nondestructive polishing method based on liquid phase polishing environment regulation and control

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JPH08288244A (en) * 1995-04-11 1996-11-01 Disco Abrasive Syst Ltd Optical detecting means
US7495759B1 (en) * 2007-10-23 2009-02-24 Asm Assembly Automation Ltd. Damage and wear detection for rotary cutting blades
JP2009231555A (en) * 2008-03-24 2009-10-08 Disco Abrasive Syst Ltd Cutting device and chip manufacturing method

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH08288244A (en) * 1995-04-11 1996-11-01 Disco Abrasive Syst Ltd Optical detecting means
US7495759B1 (en) * 2007-10-23 2009-02-24 Asm Assembly Automation Ltd. Damage and wear detection for rotary cutting blades
JP2009231555A (en) * 2008-03-24 2009-10-08 Disco Abrasive Syst Ltd Cutting device and chip manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108574024A (en) * 2018-02-01 2018-09-25 横店集团东磁股份有限公司 A kind of water squeezing idler wheel for wet etching
CN110303385A (en) * 2019-06-28 2019-10-08 中国人民解放军国防科技大学 Monocrystalline silicon nondestructive polishing method based on liquid phase polishing environment regulation and control

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