JP2003192900A - 耐流体性シリコーン封入剤 - Google Patents

耐流体性シリコーン封入剤

Info

Publication number
JP2003192900A
JP2003192900A JP2002319501A JP2002319501A JP2003192900A JP 2003192900 A JP2003192900 A JP 2003192900A JP 2002319501 A JP2002319501 A JP 2002319501A JP 2002319501 A JP2002319501 A JP 2002319501A JP 2003192900 A JP2003192900 A JP 2003192900A
Authority
JP
Japan
Prior art keywords
organosilicon polymer
vinyl
terminated
platinum
mol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002319501A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003192900A5 (enExample
Inventor
Elizabeth M Walker
エム．ウォーカー エリザベス
Jiazhong Luo
ルオ ジアゾン
Rose Ann Schultz
アン シュルツ ローズ
Katharine Louise Pearce
ルイーズ ピアース キャサリン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Starch and Chemical Investment Holding Corp
Original Assignee
National Starch and Chemical Investment Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch and Chemical Investment Holding Corp filed Critical National Starch and Chemical Investment Holding Corp
Publication of JP2003192900A publication Critical patent/JP2003192900A/ja
Publication of JP2003192900A5 publication Critical patent/JP2003192900A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Measuring Fluid Pressure (AREA)
JP2002319501A 2001-11-06 2002-11-01 耐流体性シリコーン封入剤 Pending JP2003192900A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/993,589 US6841647B2 (en) 2001-11-06 2001-11-06 Fluid resistant silicone encapsulant
US09/993589 2001-11-06

Publications (2)

Publication Number Publication Date
JP2003192900A true JP2003192900A (ja) 2003-07-09
JP2003192900A5 JP2003192900A5 (enExample) 2005-12-08

Family

ID=25539731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002319501A Pending JP2003192900A (ja) 2001-11-06 2002-11-01 耐流体性シリコーン封入剤

Country Status (4)

Country Link
US (4) US6841647B2 (enExample)
EP (2) EP1308479B1 (enExample)
JP (1) JP2003192900A (enExample)
DE (1) DE60227760D1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014196462A (ja) * 2013-03-07 2014-10-16 Jsr株式会社 硬化性組成物、硬化物および光半導体装置
KR101733960B1 (ko) * 2013-03-07 2017-05-10 제이에스알 가부시끼가이샤 경화성 조성물, 경화물 및 광반도체 장치

Families Citing this family (16)

* Cited by examiner, † Cited by third party
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US6841647B2 (en) * 2001-11-06 2005-01-11 National Starch And Chemical Investment Holding Corporation Fluid resistant silicone encapsulant
DE102004055690A1 (de) * 2004-11-18 2006-05-24 Wacker Chemie Ag Vernetzbare Siliconmassen mit langer Verarbeitungszeit und Lagerstabilität
JP5331962B2 (ja) * 2005-09-30 2013-10-30 ピラマル エンタープライジーズ リミテッド 炎症性疾患のための薬草組成物
US7642332B2 (en) * 2006-08-14 2010-01-05 The University Of Akron Amphiphilic networks, process for producing same, and products made therefrom
DK1978199T3 (en) * 2007-04-05 2016-09-05 Grenzebach Maschb Gmbh The vacuum insulating glass construction element as well as method and device for its production,
US7732553B2 (en) * 2008-02-28 2010-06-08 The Regents Of The University Of California Method of producing encapsulation resins
US7943719B2 (en) * 2008-02-28 2011-05-17 The Regents of the University of California; Encapsulation resins
TWI435914B (zh) * 2010-12-31 2014-05-01 Eternal Chemical Co Ltd 可固化之有機聚矽氧烷組合物及其製法
ES2764382T3 (es) * 2012-08-10 2020-06-03 Commscope Technologies Llc Geles termoplásticos híbridos y su procedimiento de preparación
JP6634201B2 (ja) * 2014-03-17 2020-01-22 矢崎総業株式会社 液面レベルセンサ
TWI663236B (zh) * 2014-10-16 2019-06-21 Dow Silicones Corporation 聚矽氧組合物及具有由該組合物製得之壓敏性黏著層的壓敏性黏著膜
US10357947B2 (en) * 2015-04-10 2019-07-23 Dow Toray Co., Ltd. Fluoroalkyl-containing curable organopolysiloxane composition, cured object obtained therefrom, and electronic component or display device including said cured object
CN110183853A (zh) * 2019-05-31 2019-08-30 宋远周 一种阻燃高导热有机硅灌封复合材料及其制备方法
CN111859786B (zh) * 2020-07-03 2022-02-15 安徽理工大学 一种全尺度梯度开采沉陷D-InSAR三维预测方法
US11752732B2 (en) * 2020-10-14 2023-09-12 Ddp Specialty Electronic Materials Us, Llc Composite metallic panel
CN113736260A (zh) * 2021-08-16 2021-12-03 歌尔股份有限公司 用于发声装置的振膜及发声装置

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JPH0711140A (ja) * 1993-04-30 1995-01-13 General Electric Co <Ge> 液状の射出成形性シリコーン組成物
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JP2001072772A (ja) * 1999-09-03 2001-03-21 Shin Etsu Chem Co Ltd 含フッ素硬化性組成物

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* Cited by examiner, † Cited by third party
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JP2014196462A (ja) * 2013-03-07 2014-10-16 Jsr株式会社 硬化性組成物、硬化物および光半導体装置
KR101733960B1 (ko) * 2013-03-07 2017-05-10 제이에스알 가부시끼가이샤 경화성 조성물, 경화물 및 광반도체 장치

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US20030187153A1 (en) 2003-10-02
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