JP2003142641A5 - - Google Patents

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Publication number
JP2003142641A5
JP2003142641A5 JP2001333946A JP2001333946A JP2003142641A5 JP 2003142641 A5 JP2003142641 A5 JP 2003142641A5 JP 2001333946 A JP2001333946 A JP 2001333946A JP 2001333946 A JP2001333946 A JP 2001333946A JP 2003142641 A5 JP2003142641 A5 JP 2003142641A5
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JP
Japan
Prior art keywords
lead frame
tie bar
punch
removal
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001333946A
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English (en)
Japanese (ja)
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JP3741995B2 (ja
JP2003142641A (ja
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Publication date
Application filed filed Critical
Priority to JP2001333946A priority Critical patent/JP3741995B2/ja
Priority claimed from JP2001333946A external-priority patent/JP3741995B2/ja
Priority to US10/281,045 priority patent/US6925922B2/en
Publication of JP2003142641A publication Critical patent/JP2003142641A/ja
Publication of JP2003142641A5 publication Critical patent/JP2003142641A5/ja
Priority to US11/156,556 priority patent/US20050230789A1/en
Application granted granted Critical
Publication of JP3741995B2 publication Critical patent/JP3741995B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2001333946A 2001-10-31 2001-10-31 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法 Expired - Lifetime JP3741995B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001333946A JP3741995B2 (ja) 2001-10-31 2001-10-31 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法
US10/281,045 US6925922B2 (en) 2001-10-31 2002-10-25 Apparatus for removing tiebars after molding of semiconductor chip
US11/156,556 US20050230789A1 (en) 2001-10-31 2005-06-21 Method for removing tiebars after molding of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001333946A JP3741995B2 (ja) 2001-10-31 2001-10-31 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2003142641A JP2003142641A (ja) 2003-05-16
JP2003142641A5 true JP2003142641A5 (enExample) 2005-06-09
JP3741995B2 JP3741995B2 (ja) 2006-02-01

Family

ID=19149147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001333946A Expired - Lifetime JP3741995B2 (ja) 2001-10-31 2001-10-31 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法

Country Status (2)

Country Link
US (2) US6925922B2 (enExample)
JP (1) JP3741995B2 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100710006B1 (ko) * 2005-04-15 2007-04-25 한미반도체 주식회사 반도체 금형장치
JP4651563B2 (ja) * 2006-03-20 2011-03-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8074486B1 (en) 2011-05-24 2011-12-13 Standard Lifters, Inc. Guided keeper assembly and method for metal forming dies
US7730757B2 (en) * 2006-09-01 2010-06-08 Standard Lifters, Llc Guided keeper assembly and method for metal forming dies
US9221092B2 (en) 2006-09-01 2015-12-29 Standard Lifters, Inc. Guided keeper assembly and method for metal forming dies
KR100795965B1 (ko) 2006-12-01 2008-01-21 한미반도체 주식회사 반도체 패키지 싱귤레이션장치
TWI355869B (en) * 2008-03-12 2012-01-01 Nan Ya Printed Circuit Board Cutting mold for rigid-flexible circuit board
US20090241329A1 (en) * 2008-03-28 2009-10-01 Utac Thai Limited Side rail remover
US8616038B2 (en) 2010-06-02 2013-12-31 Standard Lifters, Inc. Two-piece guide pin and method
WO2011159677A2 (en) 2010-06-14 2011-12-22 Standard Lifters, Inc. Guided keeper and method for metal forming dies
CN102332409B (zh) * 2010-07-13 2013-04-17 均豪精密工业股份有限公司 半导体元件的整合式制造设备及其制造方法
US8910502B2 (en) 2010-09-07 2014-12-16 Standard Lifters, Inc. Guided keeper and method for metal forming dies
US8919178B2 (en) 2010-09-07 2014-12-30 Standard Lifters, Inc. Guided keeper and method for metal forming dies
CN102592962A (zh) * 2011-01-06 2012-07-18 均豪精密工业股份有限公司 半导体组件的整合式制造设备及整合式制造方法
US9248491B2 (en) 2011-02-21 2016-02-02 Standard Lifters, Inc. Guided keeper assembly and method for metal forming dies
JP6393019B2 (ja) * 2011-09-26 2018-09-19 日産自動車株式会社 界磁極用磁石体の製造装置およびその製造方法
KR101871026B1 (ko) * 2011-10-21 2018-06-25 에이비비 슈바이쯔 아게 전력 반도체 모듈 및 다수의 전력 반도체 모듈들을 갖는 전력 반도체 모듈 어셈블리
US8939005B2 (en) 2012-03-15 2015-01-27 Standard Lifters, Inc. Guide pin assembly for metal forming dies and method
US9302311B2 (en) 2013-11-22 2016-04-05 Standard Lifters, Inc. Guide pin head
US10954984B2 (en) 2016-11-30 2021-03-23 Standard Lifters, Inc. Collar and shaft assembly
JP6783128B2 (ja) * 2016-12-06 2020-11-11 三菱電機株式会社 リード加工装置
KR102454256B1 (ko) * 2018-02-22 2022-10-17 삼성디스플레이 주식회사 기판 절단 장치
JP2019022835A (ja) * 2018-11-22 2019-02-14 株式会社ユニバーサルエンターテインメント 遊技機
US11344943B2 (en) 2019-09-05 2022-05-31 Standard Lifters, Inc. Modular guided keeper base
US12337369B2 (en) 2020-06-29 2025-06-24 Standard Lifters, Inc. Guide pin connection
US12402396B2 (en) 2020-09-01 2025-08-26 Standard Lifters, Inc. Modular guided keeper base
US20230042407A1 (en) * 2021-08-04 2023-02-09 Stmicroelectronics S.R.L. Method of manufacturing semiconductor devices and corresponding semiconductor device method of manufacturing semiconductor devices and corresponding semiconductor device

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Publication number Priority date Publication date Assignee Title
US412618A (en) * 1889-10-08 Process of and apparatus for punching and feeding blanks
US2564354A (en) * 1947-08-08 1951-08-14 Danly Mach Specialties Inc Forming apparatus
US3500710A (en) * 1967-06-16 1970-03-17 Philip Taber Apparatus for punching openings in sheet material
CH617886A5 (enExample) * 1977-05-26 1980-06-30 Bobst Fils Sa J
US4220272A (en) * 1978-10-30 1980-09-02 Danti Bernard R Precision cutting means
JPS60228099A (ja) * 1984-04-20 1985-11-13 株式会社日立製作所 打抜き加工方法
US4972572A (en) * 1985-11-13 1990-11-27 Fujitsu Limited IC sheet cutting press and IC sheet processing apparatus using the same
US4866976A (en) * 1985-12-13 1989-09-19 Aatec Assembling-Automations Technik Gmbh Apparatus for the metal working of components
JPH05102370A (ja) 1991-10-08 1993-04-23 Nec Corp タイバー切断型
JPH05347372A (ja) * 1991-12-30 1993-12-27 Richard H J Fierkens 集積回路パッケージ用リードフレーム切断方法及び装置
JP3392998B2 (ja) * 1995-12-25 2003-03-31 日本碍子株式会社 シート材の加工装置
JP2734446B2 (ja) 1996-04-25 1998-03-30 日本電気株式会社 タイバー切断金型
US6003418A (en) * 1997-07-31 1999-12-21 International Business Machines Corporation Punched slug removal system
KR100242947B1 (ko) * 1997-09-13 2000-02-01 윤종용 반도체 패키지의 타이 바 절단장치
KR100244966B1 (ko) * 1997-12-30 2000-03-02 윤종용 공기 유입구가 형성된 절단 펀치를 포함하는 게이트 잔여물절단 장치
JP3085278B2 (ja) * 1998-05-01 2000-09-04 日本電気株式会社 半導体装置の製造方法および半導体製造装置
JPH11354551A (ja) 1998-06-12 1999-12-24 Mitsubishi Electric Corp 半導体装置の樹脂パッケージにおけるゲート残りの除去装置および除去方法
US7051427B2 (en) * 2000-09-29 2006-05-30 Texas Instruments Incorporated Integrated circuit trimming device broken die sensor

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