JP3741995B2 - 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法 - Google Patents

半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法 Download PDF

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Publication number
JP3741995B2
JP3741995B2 JP2001333946A JP2001333946A JP3741995B2 JP 3741995 B2 JP3741995 B2 JP 3741995B2 JP 2001333946 A JP2001333946 A JP 2001333946A JP 2001333946 A JP2001333946 A JP 2001333946A JP 3741995 B2 JP3741995 B2 JP 3741995B2
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JP
Japan
Prior art keywords
tie bar
punch
support member
lead frame
removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001333946A
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English (en)
Japanese (ja)
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JP2003142641A5 (enExample
JP2003142641A (ja
Inventor
秀一 真鍋
健太 松永
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Renesas Technology Corp
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Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2001333946A priority Critical patent/JP3741995B2/ja
Priority to US10/281,045 priority patent/US6925922B2/en
Publication of JP2003142641A publication Critical patent/JP2003142641A/ja
Publication of JP2003142641A5 publication Critical patent/JP2003142641A5/ja
Priority to US11/156,556 priority patent/US20050230789A1/en
Application granted granted Critical
Publication of JP3741995B2 publication Critical patent/JP3741995B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/329—Plural breakers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9411—Cutting couple type
    • Y10T83/9447—Shear type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9411—Cutting couple type
    • Y10T83/9449—Spaced cut forming tool

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Punching Or Piercing (AREA)
JP2001333946A 2001-10-31 2001-10-31 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法 Expired - Lifetime JP3741995B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001333946A JP3741995B2 (ja) 2001-10-31 2001-10-31 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法
US10/281,045 US6925922B2 (en) 2001-10-31 2002-10-25 Apparatus for removing tiebars after molding of semiconductor chip
US11/156,556 US20050230789A1 (en) 2001-10-31 2005-06-21 Method for removing tiebars after molding of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001333946A JP3741995B2 (ja) 2001-10-31 2001-10-31 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2003142641A JP2003142641A (ja) 2003-05-16
JP2003142641A5 JP2003142641A5 (enExample) 2005-06-09
JP3741995B2 true JP3741995B2 (ja) 2006-02-01

Family

ID=19149147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001333946A Expired - Lifetime JP3741995B2 (ja) 2001-10-31 2001-10-31 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法

Country Status (2)

Country Link
US (2) US6925922B2 (enExample)
JP (1) JP3741995B2 (enExample)

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* Cited by examiner, † Cited by third party
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KR100710006B1 (ko) * 2005-04-15 2007-04-25 한미반도체 주식회사 반도체 금형장치
JP4651563B2 (ja) * 2006-03-20 2011-03-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US7730757B2 (en) * 2006-09-01 2010-06-08 Standard Lifters, Llc Guided keeper assembly and method for metal forming dies
US8074486B1 (en) 2011-05-24 2011-12-13 Standard Lifters, Inc. Guided keeper assembly and method for metal forming dies
US9221092B2 (en) 2006-09-01 2015-12-29 Standard Lifters, Inc. Guided keeper assembly and method for metal forming dies
KR100795965B1 (ko) 2006-12-01 2008-01-21 한미반도체 주식회사 반도체 패키지 싱귤레이션장치
TWI355869B (en) * 2008-03-12 2012-01-01 Nan Ya Printed Circuit Board Cutting mold for rigid-flexible circuit board
US20090241329A1 (en) * 2008-03-28 2009-10-01 Utac Thai Limited Side rail remover
US8616038B2 (en) 2010-06-02 2013-12-31 Standard Lifters, Inc. Two-piece guide pin and method
US9272321B2 (en) 2010-06-14 2016-03-01 Standard Lifters, Inc. Guided keeper and method for metal forming dies
CN102332409B (zh) * 2010-07-13 2013-04-17 均豪精密工业股份有限公司 半导体元件的整合式制造设备及其制造方法
US8910502B2 (en) 2010-09-07 2014-12-16 Standard Lifters, Inc. Guided keeper and method for metal forming dies
US8919178B2 (en) 2010-09-07 2014-12-30 Standard Lifters, Inc. Guided keeper and method for metal forming dies
CN102592962A (zh) * 2011-01-06 2012-07-18 均豪精密工业股份有限公司 半导体组件的整合式制造设备及整合式制造方法
US9248491B2 (en) 2011-02-21 2016-02-02 Standard Lifters, Inc. Guided keeper assembly and method for metal forming dies
JP6393019B2 (ja) * 2011-09-26 2018-09-19 日産自動車株式会社 界磁極用磁石体の製造装置およびその製造方法
JP6109181B2 (ja) * 2011-10-21 2017-04-05 アーベーベー テクノロジー アクチエンゲゼルシャフトＡＢＢ Ｔｅｃｈｎｏｌｏｇｙ ＡＧ パワー半導体モジュール及び複数のパワー半導体モジュールを備えたパワー半導体モジュールアセンブリ
US8939005B2 (en) 2012-03-15 2015-01-27 Standard Lifters, Inc. Guide pin assembly for metal forming dies and method
WO2015077585A1 (en) 2013-11-22 2015-05-28 Standard Lifters, Inc. Guide pin head
US10954984B2 (en) 2016-11-30 2021-03-23 Standard Lifters, Inc. Collar and shaft assembly
JP6783128B2 (ja) * 2016-12-06 2020-11-11 三菱電機株式会社 リード加工装置
KR102454256B1 (ko) * 2018-02-22 2022-10-17 삼성디스플레이 주식회사 기판 절단 장치
JP2019022835A (ja) * 2018-11-22 2019-02-14 株式会社ユニバーサルエンターテインメント 遊技機
US11344943B2 (en) 2019-09-05 2022-05-31 Standard Lifters, Inc. Modular guided keeper base
US12337369B2 (en) 2020-06-29 2025-06-24 Standard Lifters, Inc. Guide pin connection
US12402396B2 (en) 2020-09-01 2025-08-26 Standard Lifters, Inc. Modular guided keeper base
US20230042407A1 (en) * 2021-08-04 2023-02-09 Stmicroelectronics S.R.L. Method of manufacturing semiconductor devices and corresponding semiconductor device method of manufacturing semiconductor devices and corresponding semiconductor device
US12697650B2 (en) 2021-10-08 2026-08-04 Standard Lifters, Inc. Wiper cap assembly

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
US412618A (en) * 1889-10-08 Process of and apparatus for punching and feeding blanks
US2564354A (en) * 1947-08-08 1951-08-14 Danly Mach Specialties Inc Forming apparatus
US3500710A (en) * 1967-06-16 1970-03-17 Philip Taber Apparatus for punching openings in sheet material
CH617886A5 (enExample) * 1977-05-26 1980-06-30 Bobst Fils Sa J
US4220272A (en) * 1978-10-30 1980-09-02 Danti Bernard R Precision cutting means
JPS60228099A (ja) * 1984-04-20 1985-11-13 株式会社日立製作所 打抜き加工方法
KR910001118B1 (ko) * 1985-11-13 1991-02-23 후지쓰 가부시끼가이샤 Ic 시이트 절단 프레스 및 이를 이용한 ic 시이트 가공장치
US4866976A (en) * 1985-12-13 1989-09-19 Aatec Assembling-Automations Technik Gmbh Apparatus for the metal working of components
JPH05102370A (ja) 1991-10-08 1993-04-23 Nec Corp タイバー切断型
FR2685814B1 (fr) * 1991-12-30 1995-03-10 Fierkens Richard Dispositif perfectionne de coupe de cadre de conducteurs pour boitiers de circuit integre et procede de preparation.
JP3392998B2 (ja) * 1995-12-25 2003-03-31 日本碍子株式会社 シート材の加工装置
JP2734446B2 (ja) 1996-04-25 1998-03-30 日本電気株式会社 タイバー切断金型
US6003418A (en) * 1997-07-31 1999-12-21 International Business Machines Corporation Punched slug removal system
KR100242947B1 (ko) * 1997-09-13 2000-02-01 윤종용 반도체 패키지의 타이 바 절단장치
KR100244966B1 (ko) * 1997-12-30 2000-03-02 윤종용 공기 유입구가 형성된 절단 펀치를 포함하는 게이트 잔여물절단 장치
JP3085278B2 (ja) * 1998-05-01 2000-09-04 日本電気株式会社 半導体装置の製造方法および半導体製造装置
JPH11354551A (ja) 1998-06-12 1999-12-24 Mitsubishi Electric Corp 半導体装置の樹脂パッケージにおけるゲート残りの除去装置および除去方法
US7051427B2 (en) * 2000-09-29 2006-05-30 Texas Instruments Incorporated Integrated circuit trimming device broken die sensor

Also Published As

Publication number Publication date
US6925922B2 (en) 2005-08-09
JP2003142641A (ja) 2003-05-16
US20030079734A1 (en) 2003-05-01
US20050230789A1 (en) 2005-10-20

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