FR2685814B1 - Dispositif perfectionne de coupe de cadre de conducteurs pour boitiers de circuit integre et procede de preparation. - Google Patents

Dispositif perfectionne de coupe de cadre de conducteurs pour boitiers de circuit integre et procede de preparation.

Info

Publication number
FR2685814B1
FR2685814B1 FR9215761A FR9215761A FR2685814B1 FR 2685814 B1 FR2685814 B1 FR 2685814B1 FR 9215761 A FR9215761 A FR 9215761A FR 9215761 A FR9215761 A FR 9215761A FR 2685814 B1 FR2685814 B1 FR 2685814B1
Authority
FR
France
Prior art keywords
preparation
integrated circuit
cutting device
conductor frame
frame cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9215761A
Other languages
English (en)
Other versions
FR2685814A1 (fr
Inventor
Richard H J Fierkens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FIERKENS RICHARD
Original Assignee
FIERKENS RICHARD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FIERKENS RICHARD filed Critical FIERKENS RICHARD
Publication of FR2685814A1 publication Critical patent/FR2685814A1/fr
Application granted granted Critical
Publication of FR2685814B1 publication Critical patent/FR2685814B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S83/00—Cutting
    • Y10S83/955—Cutter edge shiftable to present different portion of edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/06—Blanking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9411—Cutting couple type
    • Y10T83/9423—Punching tool
    • Y10T83/9425—Tool pair
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9411—Cutting couple type
    • Y10T83/9423—Punching tool
    • Y10T83/944—Multiple punchings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9457—Joint or connection
    • Y10T83/9473—For rectilinearly reciprocating tool
    • Y10T83/9476—Tool is single element with continuous cutting edge [e.g., punch, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Punching Or Piercing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR9215761A 1991-12-30 1992-12-28 Dispositif perfectionne de coupe de cadre de conducteurs pour boitiers de circuit integre et procede de preparation. Expired - Fee Related FR2685814B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81450391A 1991-12-30 1991-12-30

Publications (2)

Publication Number Publication Date
FR2685814A1 FR2685814A1 (fr) 1993-07-02
FR2685814B1 true FR2685814B1 (fr) 1995-03-10

Family

ID=25215241

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9215761A Expired - Fee Related FR2685814B1 (fr) 1991-12-30 1992-12-28 Dispositif perfectionne de coupe de cadre de conducteurs pour boitiers de circuit integre et procede de preparation.

Country Status (4)

Country Link
US (1) US5291814A (fr)
JP (1) JPH05347372A (fr)
DE (1) DE4244544A1 (fr)
FR (1) FR2685814B1 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1283800B1 (it) * 1995-09-01 1998-04-30 Burr Oak Tool & Gauge Dispositivo di taglio stazionario e spostabile in modo graduato
US6069406A (en) 1997-05-20 2000-05-30 Shinko Electric Industries Co., Ltd. Wiring patterned film and production thereof
US6269723B1 (en) * 1997-10-20 2001-08-07 Integrated Packaging Assembly Corporation Method and apparatus for enhancement of a punch guide/receptor tool in a dambar removal system
KR19990046901A (ko) * 1997-12-01 1999-07-05 윤종용 댐바 절단 장치
KR100244966B1 (ko) * 1997-12-30 2000-03-02 윤종용 공기 유입구가 형성된 절단 펀치를 포함하는 게이트 잔여물절단 장치
US6173632B1 (en) * 1998-11-23 2001-01-16 Semiconductor Technologies & Instruments, Inc. Single station cutting apparatus for separating semiconductor packages
IES20000537A2 (en) * 2000-07-05 2002-02-06 Paul Mcgrath A device for use in preparation of animation cells
US7051427B2 (en) * 2000-09-29 2006-05-30 Texas Instruments Incorporated Integrated circuit trimming device broken die sensor
NL1018511C2 (nl) * 2001-07-11 2003-01-14 Fico Bv Werkwijze en inrichting voor het met een enkele bewerking uit een drager verwijderen van een dragerdeel, en een uit een drager verwijderd product.
JP3741995B2 (ja) * 2001-10-31 2006-02-01 株式会社ルネサステクノロジ 半導体装置の樹脂封止後におけるタイバーの除去装置及び方法、並びに半導体装置の製造方法
GB2385550A (en) * 2002-02-20 2003-08-27 Colin Maxwell Wade Punch for a ductile material joining tool
TW536460B (en) * 2002-03-13 2003-06-11 Hon Hai Prec Ind Co Ltd Method and die to remove the waste from metal die-casting products
US20060112566A1 (en) * 2004-11-30 2006-06-01 Peterson Eric L Fiber cement shear
GB2431608A (en) * 2005-10-26 2007-05-02 John Mckellar Zero contact die cutting
TWM289953U (en) * 2005-11-24 2006-04-21 Inventec Corp Cutting tool of circuit board disposed with electronic devices
JP2009253216A (ja) * 2008-04-10 2009-10-29 Nec Electronics Corp リード切断装置およびリード切断方法
CN103991104A (zh) * 2014-05-28 2014-08-20 广州美维电子有限公司 软硬结合线路板的半固化片开窗装置及方法
JP2017087224A (ja) * 2015-11-04 2017-05-25 凸版印刷株式会社 パンチ装置および打ち抜き加工方法
US11618231B2 (en) * 2018-08-09 2023-04-04 Asmpt Singapore Pte, Ltd. Apparatus and method for detecting failure in a mechanical press
CN110586744B (zh) * 2019-08-27 2021-03-23 昆山精诚得精密五金模具有限公司 一种汽车交流发电机罩盖连续冲压模具
CN114986165B (zh) * 2022-08-04 2024-04-05 宁波德洲精密电子有限公司 引线框架的制造装置及其制造方法以及引线框架

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US402381A (en) * 1889-04-30 Shear-knife
US490777A (en) * 1893-01-31 trethewey
US1302249A (en) * 1919-01-15 1919-04-29 Duplex Machine Co Punch for perforating films.
US1663092A (en) * 1926-05-04 1928-03-20 Parys Andy Shearing machine
US2180204A (en) * 1937-11-27 1939-11-14 Hallden Machine Company Rotary cutting device
US2304771A (en) * 1941-04-16 1942-12-08 Ascote Inc Cutter
US2825407A (en) * 1955-03-24 1958-03-04 Plastic Binding Corp Gang punch
US3150551A (en) * 1959-01-06 1964-09-29 W A Whitney Mfg Co Convertible hydraulically operated shear unit
US3392617A (en) * 1966-03-02 1968-07-16 Henn Harry Walther Punch assembly for perforating materials
US3500710A (en) * 1967-06-16 1970-03-17 Philip Taber Apparatus for punching openings in sheet material
JPS5844758A (ja) * 1981-09-11 1983-03-15 Nec Corp 集積回路製造装置
US4646601A (en) * 1985-08-07 1987-03-03 Alpha Industries, Inc. Indexible cross-cut blade and blade holder for tube cut-off machines
JPS62128163A (ja) * 1985-11-29 1987-06-10 Nec Corp リ−ドフレ−ム
US4995289A (en) * 1989-07-07 1991-02-26 Amp Incorporated Die assembly having improved insert retaining system and having reversible die inserts

Also Published As

Publication number Publication date
DE4244544A1 (en) 1993-07-01
FR2685814A1 (fr) 1993-07-02
US5291814A (en) 1994-03-08
JPH05347372A (ja) 1993-12-27

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Legal Events

Date Code Title Description
TP Transmission of property
TP Transmission of property
ST Notification of lapse