FR2685815B1 - Dispositif de coupe de cadre de conducteurs pour des boitiers de circuit integre de diverses dimensions et procede pour sa preparation. - Google Patents

Dispositif de coupe de cadre de conducteurs pour des boitiers de circuit integre de diverses dimensions et procede pour sa preparation.

Info

Publication number
FR2685815B1
FR2685815B1 FR9215762A FR9215762A FR2685815B1 FR 2685815 B1 FR2685815 B1 FR 2685815B1 FR 9215762 A FR9215762 A FR 9215762A FR 9215762 A FR9215762 A FR 9215762A FR 2685815 B1 FR2685815 B1 FR 2685815B1
Authority
FR
France
Prior art keywords
preparing
integrated circuit
cutting device
same
various dimensions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9215762A
Other languages
English (en)
Other versions
FR2685815A1 (fr
Inventor
Richard H J Fierkens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FIERKENS RICHARD
Original Assignee
FIERKENS RICHARD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FIERKENS RICHARD filed Critical FIERKENS RICHARD
Publication of FR2685815A1 publication Critical patent/FR2685815A1/fr
Application granted granted Critical
Publication of FR2685815B1 publication Critical patent/FR2685815B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Punching Or Piercing (AREA)
  • Shearing Machines (AREA)
FR9215762A 1991-12-30 1992-12-28 Dispositif de coupe de cadre de conducteurs pour des boitiers de circuit integre de diverses dimensions et procede pour sa preparation. Expired - Fee Related FR2685815B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/814,504 US5146662A (en) 1991-12-30 1991-12-30 Lead frame cutting apparatus for various sized integrated circuit packages and method therefor

Publications (2)

Publication Number Publication Date
FR2685815A1 FR2685815A1 (fr) 1993-07-02
FR2685815B1 true FR2685815B1 (fr) 1995-11-10

Family

ID=25215245

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9215762A Expired - Fee Related FR2685815B1 (fr) 1991-12-30 1992-12-28 Dispositif de coupe de cadre de conducteurs pour des boitiers de circuit integre de diverses dimensions et procede pour sa preparation.

Country Status (4)

Country Link
US (1) US5146662A (fr)
JP (1) JP3166050B2 (fr)
DE (1) DE4244538A1 (fr)
FR (1) FR2685815B1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9100470A (nl) * 1991-03-15 1992-10-01 Asm Fico Tooling Werkwijze en inrichting voor het uit op een leadframe opgenomen geintegreerde schakelingen vervaardigen van een enkelvoudig produkt.
SE470501B (sv) * 1992-10-07 1994-06-06 Ericsson Telefon Ab L M Förfarande vid montering på ett substrat av en TAB-krets, varvid TAB-strukturens anslutningar utgörs av ett elektriskt ledande anslutningsmönster som framställts på en filmremsa och vilket är anslutet till TAB-strukturens halvledarkretsbricka
JPH06236820A (ja) * 1993-01-11 1994-08-23 Boam R & D Co Ltd フェライト磁性体チップビードアレイの製造方法
US20090241329A1 (en) * 2008-03-28 2009-10-01 Utac Thai Limited Side rail remover
SG169913A1 (en) * 2009-09-28 2011-04-29 Rokko Technology Pte Ltd Punch singulation system and method
US10415162B2 (en) * 2016-08-24 2019-09-17 Federal-Mogul Powertrain Llc Impact resistant, shrinkable knitted tubular sleeve and method of construction thereof
US20190201963A1 (en) * 2017-12-29 2019-07-04 Texas Instruments Incorporated Component forming machine with jammed component mitigation

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD112380A1 (fr) * 1973-07-06 1975-04-12
JPS5572045A (en) * 1978-11-24 1980-05-30 Mitsubishi Electric Corp Apparatus for removing resin burr removing of resin sealing type semiconductor device
US4642876A (en) * 1983-04-18 1987-02-17 Murray Myles N Apparatus useful in the manufacture of electrolytic capacitors
JPS58202544A (ja) * 1983-04-25 1983-11-25 Matsushita Electronics Corp 半導体ペレツトの位置決め装置
JPS61212031A (ja) * 1985-03-15 1986-09-20 Matsushita Electric Ind Co Ltd デイスプレイパネルの実装体
JPS6248050A (ja) * 1985-08-28 1987-03-02 Seiei Kosan Kk 半導体デバイス等のパツケ−ジング方法
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
US4738173A (en) * 1986-11-03 1988-04-19 U.S. Amada Limited Shearing in punch press and die therefor
JPH0636393B2 (ja) * 1987-04-15 1994-05-11 松下電器産業株式会社 電子部品の製造方法
FR2616995A1 (fr) * 1987-06-22 1988-12-23 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques
US4859632A (en) * 1987-12-28 1989-08-22 Siemens Corporate Research And Support, Inc. Method for manufacturing the same
US4885837A (en) * 1988-01-13 1989-12-12 Mitsubishi Denki Kabushiki Kaisha Apparatus for forming leads of semiconductor devices
US4852250A (en) * 1988-01-19 1989-08-01 Microelectronics And Computer Technology Corporation Hermetically sealed package having an electronic component and method of making
JPH0810719B2 (ja) * 1988-11-15 1996-01-31 株式会社新川 外部リード接合方法及び装置
US5054188A (en) * 1990-02-20 1991-10-08 Micron Technology, Inc. Trim cut and form machine
JPH04164598A (ja) * 1990-10-25 1992-06-10 Nikko Kyodo Co Ltd 極薄板の二側打ち抜き連続プレス方法及び装置

Also Published As

Publication number Publication date
DE4244538A1 (fr) 1993-07-01
US5146662A (en) 1992-09-15
JPH05259340A (ja) 1993-10-08
FR2685815A1 (fr) 1993-07-02
JP3166050B2 (ja) 2001-05-14

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse

Effective date: 20060831