JPS5572045A - Apparatus for removing resin burr removing of resin sealing type semiconductor device - Google Patents
Apparatus for removing resin burr removing of resin sealing type semiconductor deviceInfo
- Publication number
- JPS5572045A JPS5572045A JP14560478A JP14560478A JPS5572045A JP S5572045 A JPS5572045 A JP S5572045A JP 14560478 A JP14560478 A JP 14560478A JP 14560478 A JP14560478 A JP 14560478A JP S5572045 A JPS5572045 A JP S5572045A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- resin burr
- cutter
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To remove mechanically a resin burr without wounding the goods using a rotary cutter.
CONSTITUTION: A lead frame 8 of semiconductor device 14 is held firmly in each setting jig 16 on a conveyor 15 so as a resin burr part 11 projects out of the conveyor edge, and the cutter is rotated and the conveyor is moved. The resin burr of the semiconductor device reached the cutter place is cutted off by the cutter. This method is different to shot-blast method and also does not wound the goods.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14560478A JPS5572045A (en) | 1978-11-24 | 1978-11-24 | Apparatus for removing resin burr removing of resin sealing type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14560478A JPS5572045A (en) | 1978-11-24 | 1978-11-24 | Apparatus for removing resin burr removing of resin sealing type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5572045A true JPS5572045A (en) | 1980-05-30 |
Family
ID=15388882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14560478A Pending JPS5572045A (en) | 1978-11-24 | 1978-11-24 | Apparatus for removing resin burr removing of resin sealing type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5572045A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4885837A (en) * | 1988-01-13 | 1989-12-12 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for forming leads of semiconductor devices |
US5146662A (en) * | 1991-12-30 | 1992-09-15 | Fierkens Richard H J | Lead frame cutting apparatus for various sized integrated circuit packages and method therefor |
CN1324658C (en) * | 2003-07-16 | 2007-07-04 | 三洋电机株式会社 | Cutting method, cutting device and method of manufacturing semiconductor device |
-
1978
- 1978-11-24 JP JP14560478A patent/JPS5572045A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4885837A (en) * | 1988-01-13 | 1989-12-12 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for forming leads of semiconductor devices |
US5146662A (en) * | 1991-12-30 | 1992-09-15 | Fierkens Richard H J | Lead frame cutting apparatus for various sized integrated circuit packages and method therefor |
CN1324658C (en) * | 2003-07-16 | 2007-07-04 | 三洋电机株式会社 | Cutting method, cutting device and method of manufacturing semiconductor device |
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