JPS5572045A - Apparatus for removing resin burr removing of resin sealing type semiconductor device - Google Patents

Apparatus for removing resin burr removing of resin sealing type semiconductor device

Info

Publication number
JPS5572045A
JPS5572045A JP14560478A JP14560478A JPS5572045A JP S5572045 A JPS5572045 A JP S5572045A JP 14560478 A JP14560478 A JP 14560478A JP 14560478 A JP14560478 A JP 14560478A JP S5572045 A JPS5572045 A JP S5572045A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
resin burr
cutter
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14560478A
Other languages
Japanese (ja)
Inventor
Takayoshi Shimomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14560478A priority Critical patent/JPS5572045A/en
Publication of JPS5572045A publication Critical patent/JPS5572045A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To remove mechanically a resin burr without wounding the goods using a rotary cutter.
CONSTITUTION: A lead frame 8 of semiconductor device 14 is held firmly in each setting jig 16 on a conveyor 15 so as a resin burr part 11 projects out of the conveyor edge, and the cutter is rotated and the conveyor is moved. The resin burr of the semiconductor device reached the cutter place is cutted off by the cutter. This method is different to shot-blast method and also does not wound the goods.
COPYRIGHT: (C)1980,JPO&Japio
JP14560478A 1978-11-24 1978-11-24 Apparatus for removing resin burr removing of resin sealing type semiconductor device Pending JPS5572045A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14560478A JPS5572045A (en) 1978-11-24 1978-11-24 Apparatus for removing resin burr removing of resin sealing type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14560478A JPS5572045A (en) 1978-11-24 1978-11-24 Apparatus for removing resin burr removing of resin sealing type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5572045A true JPS5572045A (en) 1980-05-30

Family

ID=15388882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14560478A Pending JPS5572045A (en) 1978-11-24 1978-11-24 Apparatus for removing resin burr removing of resin sealing type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5572045A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4885837A (en) * 1988-01-13 1989-12-12 Mitsubishi Denki Kabushiki Kaisha Apparatus for forming leads of semiconductor devices
US5146662A (en) * 1991-12-30 1992-09-15 Fierkens Richard H J Lead frame cutting apparatus for various sized integrated circuit packages and method therefor
CN1324658C (en) * 2003-07-16 2007-07-04 三洋电机株式会社 Cutting method, cutting device and method of manufacturing semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4885837A (en) * 1988-01-13 1989-12-12 Mitsubishi Denki Kabushiki Kaisha Apparatus for forming leads of semiconductor devices
US5146662A (en) * 1991-12-30 1992-09-15 Fierkens Richard H J Lead frame cutting apparatus for various sized integrated circuit packages and method therefor
CN1324658C (en) * 2003-07-16 2007-07-04 三洋电机株式会社 Cutting method, cutting device and method of manufacturing semiconductor device

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