DE69109137D1 - Oberflächenmontage-Verfahren und Vorrichtung. - Google Patents

Oberflächenmontage-Verfahren und Vorrichtung.

Info

Publication number
DE69109137D1
DE69109137D1 DE69109137T DE69109137T DE69109137D1 DE 69109137 D1 DE69109137 D1 DE 69109137D1 DE 69109137 T DE69109137 T DE 69109137T DE 69109137 T DE69109137 T DE 69109137T DE 69109137 D1 DE69109137 D1 DE 69109137D1
Authority
DE
Germany
Prior art keywords
surface mounting
mounting method
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69109137T
Other languages
English (en)
Other versions
DE69109137T2 (de
Inventor
Scott C Mason
Robert A Slutz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69109137D1 publication Critical patent/DE69109137D1/de
Application granted granted Critical
Publication of DE69109137T2 publication Critical patent/DE69109137T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046—J-shaped leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10606—Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
DE69109137T 1990-01-17 1991-01-11 Oberflächenmontage-Verfahren und Vorrichtung. Expired - Fee Related DE69109137T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/466,169 US5007844A (en) 1990-01-17 1990-01-17 Surface mount method and device

Publications (2)

Publication Number Publication Date
DE69109137D1 true DE69109137D1 (de) 1995-06-01
DE69109137T2 DE69109137T2 (de) 1995-08-31

Family

ID=23850778

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69109137T Expired - Fee Related DE69109137T2 (de) 1990-01-17 1991-01-11 Oberflächenmontage-Verfahren und Vorrichtung.

Country Status (3)

Country Link
US (1) US5007844A (de)
EP (1) EP0438238B1 (de)
DE (1) DE69109137T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5160270A (en) * 1989-06-13 1992-11-03 General Datacomm, Inc. Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
US5425649A (en) * 1989-06-13 1995-06-20 General Datacomm, Inc. Connector system having switching and testing functions using tapered spring contact elements and actuators therefor
US5173843A (en) * 1990-09-11 1992-12-22 Texas Instruments Incorporated Fan control and diode interlock for electric heaters
DE9103607U1 (de) * 1991-03-23 1992-07-23 Robert Bosch Gmbh, 7000 Stuttgart Lötstütze zur Aufnahme eines elektrischen Bauelementes
US5161982A (en) * 1991-03-29 1992-11-10 Teledyne Kinetics Reactive base for cantilevered connector
US5096440A (en) * 1991-05-10 1992-03-17 Kel Corporation Surface mount connector with circuit board retaining plate
US5120256A (en) * 1991-07-16 1992-06-09 Walden John D Retention system for a connector housing
DE69230497T2 (de) * 1991-07-16 2000-06-21 Berg Electronics Mfg. B.V., 's-Hertogenbosch Befestigungsvorrichtung für ein verbindergehäuse
US5225897A (en) * 1991-10-02 1993-07-06 Unitrode Corporation Molded package for semiconductor devices with leadframe locking structure
US5288236A (en) * 1992-04-01 1994-02-22 Sun Microsystems, Inc. Method and apparatus for replacing electronic components on a printed circuit board
JP2598650Y2 (ja) * 1993-12-14 1999-08-16 モレックス インコーポレーテッド プリント回路基板接続用電気コネクタ
US5586891A (en) * 1994-05-04 1996-12-24 Electronic Designs Inc. Electrical socket for high-frequency applications
DE59502391D1 (de) * 1994-07-15 1998-07-09 Siemens Ag Elektrisches Relais
DE4434460A1 (de) * 1994-09-27 1996-03-28 Loewe Opta Gmbh Elektronisches Bauelement
JP3616167B2 (ja) * 1995-08-10 2005-02-02 株式会社相川プレス工業 大電流基板用コネクタ
JPH10340745A (ja) * 1997-06-04 1998-12-22 Kyoshin Kogyo Kk ワンタッチコネクタおよびワンタッチコネクタ組合せ体
US5910024A (en) * 1997-08-28 1999-06-08 Mcms, Inc. Carrier socket for receiving a damaged IC
US5874323A (en) * 1997-08-28 1999-02-23 Mcms, Inc. Method of providing electrical contact to component leads
US6270374B1 (en) 1998-01-20 2001-08-07 Berg Technology, Inc. Electrical connector with wafer for video positioning and surface mount holding feature
US6231370B1 (en) * 1998-03-19 2001-05-15 The Whitaker Corporation Electrical connector for leaded electronic component
US6042420A (en) * 1999-02-23 2000-03-28 The Whitaker Corporation Electrical connector and boardlock with minimal footprint
US6749460B2 (en) * 2001-06-29 2004-06-15 Siemens Vdo Automotive Inc. Apparatus and method for preventing soldering material migration
US6386892B1 (en) * 2001-11-21 2002-05-14 Speed Tech Corp. Tin paste overflow-protective electric connector
CN2660712Y (zh) * 2003-09-23 2004-12-01 富士康(昆山)电脑接插件有限公司 电连接器端子
JP4537732B2 (ja) * 2004-03-04 2010-09-08 住友電装株式会社 基板用コネクタ
US20070117268A1 (en) * 2005-11-23 2007-05-24 Baker Hughes, Inc. Ball grid attachment
EP1876872A1 (de) * 2006-07-07 2008-01-09 Delphi Technologies, Inc. Leiterplatte zur Bestückung mit oberflächenmontierten Bauteilen sowie Verfahren dazu
US8608217B1 (en) 2012-06-15 2013-12-17 International Business Machines Corporation Electronic component grasping tool
CN202840021U (zh) * 2012-08-14 2013-03-27 美国莫列斯股份有限公司 电连接器
WO2014142251A1 (ja) * 2013-03-15 2014-09-18 矢崎総業株式会社 電子部品の組付構造及び電子部品
WO2015029990A1 (ja) * 2013-08-30 2015-03-05 矢崎総業株式会社 電子部品と端子金具との接続構造
US9472904B2 (en) * 2014-08-18 2016-10-18 Amphenol Corporation Discrete packaging adapter for connector
US10123429B2 (en) * 2016-07-20 2018-11-06 Infineon Technologies Austria Ag Mounting of components on a printed circuit board
CN110071390B (zh) * 2018-01-23 2022-07-26 富士康(昆山)电脑接插件有限公司 电连接器及其制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1051988A (en) * 1975-05-30 1979-04-03 William S. Scheingold Electrical connector for leadless integrated circuit package
US4558397A (en) * 1983-12-19 1985-12-10 Amp Incorporated Interposer connector for surface mounting a ceramic chip carrier to a printed circuit board
DE3584532D1 (de) * 1984-02-27 1991-12-05 Amp Inc Kontakt fuer schaltungstraeger und verfahren um diesen in ein gehaeuse einzusetzen.
US4755146A (en) * 1987-06-04 1988-07-05 Molex Incorporated Heat-dissipating socket connector for leaded modules

Also Published As

Publication number Publication date
EP0438238A2 (de) 1991-07-24
EP0438238B1 (de) 1995-04-26
US5007844A (en) 1991-04-16
DE69109137T2 (de) 1995-08-31
EP0438238A3 (en) 1992-04-29

Similar Documents

Publication Publication Date Title
DE69109137D1 (de) Oberflächenmontage-Verfahren und Vorrichtung.
DE69016433D1 (de) Beschichtungsverfahren und -vorrichtung.
DE69131883D1 (de) Vorrichtung zur Rauschreduzierung
DE69023843D1 (de) Automatisches Geschäftsverfahren und Vorrichtung.
DE69130897D1 (de) Vakuum-Behandlungsverfahren und Vorrichtung
DE69119787D1 (de) Apherese verfahren und vorrichtung dafuer
DE69022762D1 (de) Vorrichtung zur Lärmverminderung.
DE3781313D1 (de) Verfahren und vorrichtung.
DE69410460D1 (de) Beheizte vorrichtung
DE69123534D1 (de) Schwenkbare Vorrichtung
DE69132328D1 (de) Substrat-Behandlungsverfahren und Vorrichtung dafür
DE59002947D1 (de) Abhaenge- und montagevorrichtung.
DE68911230D1 (de) Unterdruckgiessverfahren und Vorrichtung.
DE69007779D1 (de) Trocknungsverfahren und vorrichtung dazu.
DE69114968T3 (de) Entwicklungsverfahren und Vorrichtung.
DE69108630D1 (de) Bewuchsschutzverfahren und -einrichtung.
DE69006997D1 (de) Bilderzeugungsverfahren- und -gerät.
DE69020937D1 (de) Abbildungsverfahren und -vorrichtung.
DE69315985D1 (de) Übertragungsverfahren und vorrichtung dafür
DE69224133D1 (de) Beschichtungsmethode und Vorrichtung
DE69107229D1 (de) Ausfällungsvorrichtung und Verfahren.
DE69103084D1 (de) Vorrichtung und Verfahren zum Fördern.
DE3853296D1 (de) Blätterverteilungsverfahren und vorrichtung.
DE69229585D1 (de) Beschichtungsverfahren und Vorrichtung
DE69114246D1 (de) Diskretes wiederholungssteuerverfahren und vorrichtung dafür.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee