JP2003094397A5 - - Google Patents
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- Publication number
- JP2003094397A5 JP2003094397A5 JP2002146878A JP2002146878A JP2003094397A5 JP 2003094397 A5 JP2003094397 A5 JP 2003094397A5 JP 2002146878 A JP2002146878 A JP 2002146878A JP 2002146878 A JP2002146878 A JP 2002146878A JP 2003094397 A5 JP2003094397 A5 JP 2003094397A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- depositing
- protective layer
- processing
- rotor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011241 protective layer Substances 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims 15
- 238000000151 deposition Methods 0.000 claims 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920002120 photoresistant polymer Polymers 0.000 claims 2
- 238000003860 storage Methods 0.000 claims 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 239000005368 silicate glass Substances 0.000 claims 1
- 238000001039 wet etching Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US860453 | 1977-12-14 | ||
| US09/860,453 US6436794B1 (en) | 2001-05-21 | 2001-05-21 | Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor wafer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003094397A JP2003094397A (ja) | 2003-04-03 |
| JP2003094397A5 true JP2003094397A5 (enExample) | 2005-04-07 |
| JP4064151B2 JP4064151B2 (ja) | 2008-03-19 |
Family
ID=25333259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002146878A Expired - Fee Related JP4064151B2 (ja) | 2001-05-21 | 2002-05-21 | Ａｒｓシステムを製造する方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6436794B1 (enExample) |
| EP (1) | EP1260481A3 (enExample) |
| JP (1) | JP4064151B2 (enExample) |
| CN (1) | CN1387250A (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU695236B2 (en) * | 1994-10-20 | 1998-08-13 | Matsushita Electric Industrial Co., Ltd. | High-frequency heating device |
| US6621096B2 (en) * | 2001-05-21 | 2003-09-16 | Hewlett-Packard Develpoment Company, L.P. | Device isolation process flow for ARS system |
| US20040124538A1 (en) * | 2002-12-31 | 2004-07-01 | Rafael Reif | Multi-layer integrated semiconductor structure |
| WO2004061961A1 (en) * | 2002-12-31 | 2004-07-22 | Massachusetts Institute Of Technology | Multi-layer integrated semiconductor structure having an electrical shielding portion |
| US7064055B2 (en) * | 2002-12-31 | 2006-06-20 | Massachusetts Institute Of Technology | Method of forming a multi-layer semiconductor structure having a seamless bonding interface |
| US7161875B2 (en) | 2003-06-12 | 2007-01-09 | Hewlett-Packard Development Company, L.P. | Thermal-assisted magnetic memory storage device |
| US6819587B1 (en) | 2003-06-12 | 2004-11-16 | Hewlett-Packard Development Company, L.P. | Thermal-assisted nanotip magnetic memory storage device |
| US6885582B2 (en) | 2003-06-12 | 2005-04-26 | Hewlett-Packard Development Company, L.P. | Magnetic memory storage device |
| US6930368B2 (en) * | 2003-07-31 | 2005-08-16 | Hewlett-Packard Development Company, L.P. | MEMS having a three-wafer structure |
| US7423954B2 (en) * | 2003-12-17 | 2008-09-09 | Hewlett-Packard Development Company, L.P. | Contact probe storage sensor pod |
| US7436753B2 (en) | 2003-12-17 | 2008-10-14 | Mejia Robert G | Contact probe storage FET sensor |
| US7808061B2 (en) * | 2006-07-28 | 2010-10-05 | Hewlett-Packard Development Company, L.P. | Multi-die apparatus including moveable portions |
| CN105293419B (zh) * | 2015-10-15 | 2016-12-07 | 华东光电集成器件研究所 | 一种防止悬浮层刻蚀损伤的mems器件 |
| JP6341959B2 (ja) | 2016-05-27 | 2018-06-13 | 浜松ホトニクス株式会社 | ファブリペロー干渉フィルタの製造方法 |
| CN109196405B (zh) | 2016-05-27 | 2021-09-10 | 浜松光子学株式会社 | 法布里-帕罗干涉滤光器的制造方法 |
| KR102508597B1 (ko) | 2016-08-24 | 2023-03-13 | 하마마츠 포토닉스 가부시키가이샤 | 패브리 페로 간섭 필터 |
| CN110797315B (zh) * | 2019-11-06 | 2021-06-11 | 烟台睿创微纳技术股份有限公司 | 一种晶圆级封装分割方法及晶圆级封装器件 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0472608A (ja) * | 1990-05-18 | 1992-03-06 | Toshiba Corp | 化合物半導体ウェハの製造方法および製造装置 |
| TW289837B (enExample) | 1994-01-18 | 1996-11-01 | Hwelett Packard Co | |
| US5472914A (en) * | 1994-07-14 | 1995-12-05 | The United States Of America As Represented By The Secretary Of The Air Force | Wafer joined optoelectronic integrated circuits and method |
| KR960009074A (ko) * | 1994-08-29 | 1996-03-22 | 모리시다 요이치 | 반도체 장치 및 그 제조방법 |
| US5557596A (en) | 1995-03-20 | 1996-09-17 | Gibson; Gary | Ultra-high density storage device |
| JPH08316145A (ja) * | 1995-05-12 | 1996-11-29 | Fuji Electric Co Ltd | 半導体薄膜の成膜方法 |
| US5807783A (en) * | 1996-10-07 | 1998-09-15 | Harris Corporation | Surface mount die by handle replacement |
| US6411589B1 (en) * | 1998-07-29 | 2002-06-25 | Hewlett-Packard Company | System and method for forming electrostatically actuated data storage mechanisms |
| US6346459B1 (en) * | 1999-02-05 | 2002-02-12 | Silicon Wafer Technologies, Inc. | Process for lift off and transfer of semiconductor devices onto an alien substrate |
| JP2001102523A (ja) * | 1999-09-28 | 2001-04-13 | Sony Corp | 薄膜デバイスおよびその製造方法 |
-
2001
- 2001-05-21 US US09/860,453 patent/US6436794B1/en not_active Expired - Fee Related
-
2002
- 2002-05-01 EP EP02253081A patent/EP1260481A3/en not_active Withdrawn
- 2002-05-21 JP JP2002146878A patent/JP4064151B2/ja not_active Expired - Fee Related
- 2002-05-21 CN CN02120300A patent/CN1387250A/zh active Pending
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