JP2002513841A - エポキシ／熱可塑性光硬化性接着性組成物 - Google Patents
エポキシ／熱可塑性光硬化性接着性組成物Info
- Publication number
- JP2002513841A JP2002513841A JP2000547175A JP2000547175A JP2002513841A JP 2002513841 A JP2002513841 A JP 2002513841A JP 2000547175 A JP2000547175 A JP 2000547175A JP 2000547175 A JP2000547175 A JP 2000547175A JP 2002513841 A JP2002513841 A JP 2002513841A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- curable composition
- product
- vinyl acetate
- curable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
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- 239000011777 magnesium Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- HVYVMSPIJIWUNA-UHFFFAOYSA-N triphenylstibine Chemical compound C1=CC=CC=C1[Sb](C=1C=CC=CC=1)C1=CC=CC=C1 HVYVMSPIJIWUNA-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31573—Next to addition polymer of ethylenically unsaturated monomer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31573—Next to addition polymer of ethylenically unsaturated monomer
- Y10T428/31587—Hydrocarbon polymer [polyethylene, polybutadiene, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/070,971 US6057382A (en) | 1998-05-01 | 1998-05-01 | Epoxy/thermoplastic photocurable adhesive composition |
| US09/070,971 | 1998-05-01 | ||
| PCT/US1999/005956 WO1999057216A1 (en) | 1998-05-01 | 1999-03-17 | Epoxy/thermoplastic photocurable adhesive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002513841A true JP2002513841A (ja) | 2002-05-14 |
| JP2002513841A5 JP2002513841A5 (enExample) | 2006-05-18 |
Family
ID=22098471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000547175A Pending JP2002513841A (ja) | 1998-05-01 | 1999-03-17 | エポキシ／熱可塑性光硬化性接着性組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US6057382A (enExample) |
| EP (1) | EP1073697B1 (enExample) |
| JP (1) | JP2002513841A (enExample) |
| AU (1) | AU3191899A (enExample) |
| DE (1) | DE69901827T2 (enExample) |
| WO (1) | WO1999057216A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009075971A3 (en) * | 2007-12-12 | 2009-08-27 | 3M Innovative Properties Company | Nozzle sealing composition and method |
| JP2011077236A (ja) * | 2009-09-30 | 2011-04-14 | Achilles Corp | 太陽電池封止材料、並びにそれを用いた太陽電池封止シート及び太陽電池 |
| JP2015507674A (ja) * | 2011-12-30 | 2015-03-12 | ヘンケル・チャイナ・カンパニー・リミテッドＨｅｎｋｅｌ Ｃｈｉｎａｃｏ． Ｌｔｄ． | ウエハーの製造における一時的結合に使用される接着剤組成物 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6858260B2 (en) * | 1997-05-21 | 2005-02-22 | Denovus Llc | Curable sealant composition |
| US6461691B1 (en) * | 1997-05-21 | 2002-10-08 | Denovus Llc | Curable sealant composition |
| DE19857237A1 (de) * | 1997-12-23 | 1999-06-24 | Henkel Kgaa | Strahlenhärtbare Kaschierklebestoffe |
| US6077601A (en) * | 1998-05-01 | 2000-06-20 | 3M Innovative Properties Company | Coated abrasive article |
| US6437090B1 (en) * | 1998-06-17 | 2002-08-20 | Kabushiki Kaisha Toshiba | Curing catalyst, resin composition, resin-sealed semiconductor device and coating material |
| EP1232194A1 (en) * | 1999-10-19 | 2002-08-21 | Akzo Nobel N.V. | Radiation curable hot melt composition and a process for the application thereof |
| AU2001233314A1 (en) * | 2000-02-02 | 2001-08-14 | Denovus L.L.C. | Polymeric blends and composites and laminates thereof |
| US6569494B1 (en) * | 2000-05-09 | 2003-05-27 | 3M Innovative Properties Company | Method and apparatus for making particle-embedded webs |
| US6620501B1 (en) | 2000-08-07 | 2003-09-16 | L&L Products, Inc. | Paintable seal system |
| US20020182955A1 (en) * | 2001-03-29 | 2002-12-05 | Weglewski James T. | Structural bonding tapes and articles containing the same |
| JP2002294196A (ja) * | 2001-03-30 | 2002-10-09 | Three M Innovative Properties Co | 熱硬化性接着剤 |
| US20040063804A1 (en) * | 2001-03-30 | 2004-04-01 | Masaaki Takeda | Thermosetting adhesive |
| US6787579B2 (en) | 2001-05-02 | 2004-09-07 | L&L Products, Inc. | Two-component (epoxy/amine) structural foam-in-place material |
| US7473715B2 (en) * | 2001-05-02 | 2009-01-06 | Zephyros, Inc. | Two component (epoxy/amine) structural foam-in-place material |
| US6682818B2 (en) * | 2001-08-24 | 2004-01-27 | L&L Products, Inc. | Paintable material |
| US20030050352A1 (en) * | 2001-09-04 | 2003-03-13 | Symyx Technologies, Inc. | Foamed Polymer System employing blowing agent performance enhancer |
| US6887914B2 (en) * | 2001-09-07 | 2005-05-03 | L&L Products, Inc. | Structural hot melt material and methods |
| US6730713B2 (en) * | 2001-09-24 | 2004-05-04 | L&L Products, Inc. | Creation of epoxy-based foam-in-place material using encapsulated metal carbonate |
| US6890964B2 (en) * | 2001-09-24 | 2005-05-10 | L&L Products, Inc. | Homopolymerized epoxy-based form-in-place material |
| US6774171B2 (en) | 2002-01-25 | 2004-08-10 | L&L Products, Inc. | Magnetic composition |
| US20040188262A1 (en) * | 2002-02-05 | 2004-09-30 | Heimann Robert L. | Method for treating metallic surfaces and products formed thereby |
| US6846559B2 (en) * | 2002-04-01 | 2005-01-25 | L&L Products, Inc. | Activatable material |
| JP2005527690A (ja) * | 2002-05-28 | 2005-09-15 | スリーエム イノベイティブ プロパティズ カンパニー | 接着テープ |
| US6811864B2 (en) * | 2002-08-13 | 2004-11-02 | L&L Products, Inc. | Tacky base material with powder thereon |
| US20040076831A1 (en) * | 2002-10-02 | 2004-04-22 | L&L Products, Inc. | Synthetic material and methods of forming and applying same |
| US20040204551A1 (en) * | 2003-03-04 | 2004-10-14 | L&L Products, Inc. | Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith |
| DE10310722A1 (de) | 2003-03-10 | 2004-09-23 | Tesa Ag | Elektrisch erwärmbare Haftklebemasse |
| US20040197571A1 (en) * | 2003-04-03 | 2004-10-07 | Yuji Hiroshige | Thermosetting composition, and sealing article and sealing structure using the same |
| US7125461B2 (en) * | 2003-05-07 | 2006-10-24 | L & L Products, Inc. | Activatable material for sealing, baffling or reinforcing and method of forming same |
| US7199165B2 (en) * | 2003-06-26 | 2007-04-03 | L & L Products, Inc. | Expandable material |
| US20050159531A1 (en) * | 2004-01-20 | 2005-07-21 | L&L Products, Inc. | Adhesive material and use therefor |
| EP1557449A1 (en) * | 2004-01-22 | 2005-07-27 | 3M Innovative Properties Company | Adhesive tape for structural bonding |
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- 1999-03-17 DE DE69901827T patent/DE69901827T2/de not_active Expired - Lifetime
- 1999-03-17 JP JP2000547175A patent/JP2002513841A/ja active Pending
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2000
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009075971A3 (en) * | 2007-12-12 | 2009-08-27 | 3M Innovative Properties Company | Nozzle sealing composition and method |
| JP2011077236A (ja) * | 2009-09-30 | 2011-04-14 | Achilles Corp | 太陽電池封止材料、並びにそれを用いた太陽電池封止シート及び太陽電池 |
| JP2015507674A (ja) * | 2011-12-30 | 2015-03-12 | ヘンケル・チャイナ・カンパニー・リミテッドＨｅｎｋｅｌ Ｃｈｉｎａｃｏ． Ｌｔｄ． | ウエハーの製造における一時的結合に使用される接着剤組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6057382A (en) | 2000-05-02 |
| DE69901827D1 (de) | 2002-07-18 |
| AU3191899A (en) | 1999-11-23 |
| EP1073697B1 (en) | 2002-06-12 |
| DE69901827T2 (de) | 2003-02-06 |
| US6153302A (en) | 2000-11-28 |
| US6136384A (en) | 2000-10-24 |
| EP1073697A1 (en) | 2001-02-07 |
| WO1999057216A1 (en) | 1999-11-11 |
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