DE69901827T2 - Photovernetzbare klebstoffzusammensetzung auf der basis von einem epoxidharz und einem thermoplast - Google Patents
Photovernetzbare klebstoffzusammensetzung auf der basis von einem epoxidharz und einem thermoplastInfo
- Publication number
- DE69901827T2 DE69901827T2 DE1999601827 DE69901827T DE69901827T2 DE 69901827 T2 DE69901827 T2 DE 69901827T2 DE 1999601827 DE1999601827 DE 1999601827 DE 69901827 T DE69901827 T DE 69901827T DE 69901827 T2 DE69901827 T2 DE 69901827T2
- Authority
- DE
- Germany
- Prior art keywords
- networkable
- photo
- thermoplastic
- epoxy resin
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31573—Next to addition polymer of ethylenically unsaturated monomer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31573—Next to addition polymer of ethylenically unsaturated monomer
- Y10T428/31587—Hydrocarbon polymer [polyethylene, polybutadiene, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/070,971 US6057382A (en) | 1998-05-01 | 1998-05-01 | Epoxy/thermoplastic photocurable adhesive composition |
PCT/US1999/005956 WO1999057216A1 (en) | 1998-05-01 | 1999-03-17 | Epoxy/thermoplastic photocurable adhesive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69901827D1 DE69901827D1 (de) | 2002-07-18 |
DE69901827T2 true DE69901827T2 (de) | 2003-02-06 |
Family
ID=22098471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1999601827 Expired - Lifetime DE69901827T2 (de) | 1998-05-01 | 1999-03-17 | Photovernetzbare klebstoffzusammensetzung auf der basis von einem epoxidharz und einem thermoplast |
Country Status (6)
Country | Link |
---|---|
US (3) | US6057382A (de) |
EP (1) | EP1073697B1 (de) |
JP (1) | JP2002513841A (de) |
AU (1) | AU3191899A (de) |
DE (1) | DE69901827T2 (de) |
WO (1) | WO1999057216A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1997608A2 (de) | 2007-05-16 | 2008-12-03 | Entex Rust & Mitschke GmbH | Verfahren zur Verarbeitung von zu entgasenden Produkten |
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DE19857237A1 (de) * | 1997-12-23 | 1999-06-24 | Henkel Kgaa | Strahlenhärtbare Kaschierklebestoffe |
US6077601A (en) | 1998-05-01 | 2000-06-20 | 3M Innovative Properties Company | Coated abrasive article |
US6437090B1 (en) * | 1998-06-17 | 2002-08-20 | Kabushiki Kaisha Toshiba | Curing catalyst, resin composition, resin-sealed semiconductor device and coating material |
MXPA02003966A (es) * | 1999-10-19 | 2002-10-23 | Akzo Nobel Nv | Composicion de masa fundida caliente curable por radiacion y un procedimiento para la aplicacion de la misma. |
WO2001057130A1 (en) * | 2000-02-02 | 2001-08-09 | Denovus Llc | Polymeric blends and composites and laminates thereof |
US6569494B1 (en) * | 2000-05-09 | 2003-05-27 | 3M Innovative Properties Company | Method and apparatus for making particle-embedded webs |
US6620501B1 (en) | 2000-08-07 | 2003-09-16 | L&L Products, Inc. | Paintable seal system |
US20020182955A1 (en) * | 2001-03-29 | 2002-12-05 | Weglewski James T. | Structural bonding tapes and articles containing the same |
US20040063804A1 (en) * | 2001-03-30 | 2004-04-01 | Masaaki Takeda | Thermosetting adhesive |
JP2002294196A (ja) * | 2001-03-30 | 2002-10-09 | Three M Innovative Properties Co | 熱硬化性接着剤 |
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-
1998
- 1998-05-01 US US09/070,971 patent/US6057382A/en not_active Expired - Lifetime
-
1999
- 1999-03-17 WO PCT/US1999/005956 patent/WO1999057216A1/en active IP Right Grant
- 1999-03-17 DE DE1999601827 patent/DE69901827T2/de not_active Expired - Lifetime
- 1999-03-17 AU AU31918/99A patent/AU3191899A/en not_active Abandoned
- 1999-03-17 JP JP2000547175A patent/JP2002513841A/ja active Pending
- 1999-03-17 EP EP19990913959 patent/EP1073697B1/de not_active Expired - Lifetime
-
2000
- 2000-02-29 US US09/515,441 patent/US6153302A/en not_active Expired - Lifetime
- 2000-02-29 US US09/515,433 patent/US6136384A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1997608A2 (de) | 2007-05-16 | 2008-12-03 | Entex Rust & Mitschke GmbH | Verfahren zur Verarbeitung von zu entgasenden Produkten |
EP2289687A1 (de) | 2007-05-16 | 2011-03-02 | Entex Rust & Mitschke GmbH | Verfahren zur Verarbeitung von zu entgasenden Produkten |
Also Published As
Publication number | Publication date |
---|---|
EP1073697A1 (de) | 2001-02-07 |
US6153302A (en) | 2000-11-28 |
DE69901827D1 (de) | 2002-07-18 |
WO1999057216A1 (en) | 1999-11-11 |
EP1073697B1 (de) | 2002-06-12 |
AU3191899A (en) | 1999-11-23 |
US6136384A (en) | 2000-10-24 |
US6057382A (en) | 2000-05-02 |
JP2002513841A (ja) | 2002-05-14 |
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