JP2002506198A5 - 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造体の測定 - Google Patents

回折構造体、広帯域、偏光、エリプソメトリおよび下地構造体の測定 Download PDF

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JP2002506198A5
JP2002506198A5 JP2000534831A JP2000534831A JP2002506198A5 JP 2002506198 A5 JP2002506198 A5 JP 2002506198A5 JP 2000534831 A JP2000534831 A JP 2000534831A JP 2000534831 A JP2000534831 A JP 2000534831A JP 2002506198 A5 JP2002506198 A5 JP 2002506198A5
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structures
ellipsometry
broadband
polarization
measurement
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JP2000534831A 1998-03-06 1999-02-25 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定 Expired - Lifetime JP4633254B2 (ja)

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US09/036,557 1998-03-06
US09/036,557 US6483580B1 (en) 1998-03-06 1998-03-06 Spectroscopic scatterometer system
PCT/US1999/004053 WO1999045340A1 (en) 1998-03-06 1999-02-25 Measuring a diffracting structure, broadband, polarized, ellipsometric, and an underlying structure

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JP2009244175A Division JP5563803B2 (ja) 1998-03-06 2009-10-23 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定
JP2009244069A Division JP4643737B2 (ja) 1998-03-06 2009-10-23 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定
JP2009244176A Division JP5249169B2 (ja) 1998-03-06 2009-10-23 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定
JP2010131079A Division JP5102329B2 (ja) 1998-03-06 2010-06-08 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定

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JP2002506198A JP2002506198A (ja) 2002-02-26
JP2002506198A5 true JP2002506198A5 (ja) 2006-04-06
JP4633254B2 JP4633254B2 (ja) 2011-02-16

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JP2000534831A Expired - Lifetime JP4633254B2 (ja) 1998-03-06 1999-02-25 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定
JP2009244175A Expired - Lifetime JP5563803B2 (ja) 1998-03-06 2009-10-23 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定
JP2009244069A Expired - Lifetime JP4643737B2 (ja) 1998-03-06 2009-10-23 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定
JP2009244176A Expired - Lifetime JP5249169B2 (ja) 1998-03-06 2009-10-23 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定
JP2010131079A Expired - Lifetime JP5102329B2 (ja) 1998-03-06 2010-06-08 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定
JP2012267965A Pending JP2013083659A (ja) 1998-03-06 2012-12-07 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定

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JP2009244069A Expired - Lifetime JP4643737B2 (ja) 1998-03-06 2009-10-23 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定
JP2009244176A Expired - Lifetime JP5249169B2 (ja) 1998-03-06 2009-10-23 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定
JP2010131079A Expired - Lifetime JP5102329B2 (ja) 1998-03-06 2010-06-08 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定
JP2012267965A Pending JP2013083659A (ja) 1998-03-06 2012-12-07 回折構造体、広帯域、偏光、エリプソメトリおよび下地構造の測定

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US (6) US6483580B1 (ja)
EP (2) EP1073876B1 (ja)
JP (6) JP4633254B2 (ja)
AU (1) AU3310999A (ja)
DE (1) DE69922942T2 (ja)
WO (1) WO1999045340A1 (ja)

Families Citing this family (253)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483580B1 (en) * 1998-03-06 2002-11-19 Kla-Tencor Technologies Corporation Spectroscopic scatterometer system
US20020030813A1 (en) * 1999-03-29 2002-03-14 Norton Adam E. Spectroscopic measurement system using an off-axis spherical mirror and refractive elements
US6690473B1 (en) * 1999-02-01 2004-02-10 Sensys Instruments Corporation Integrated surface metrology
US6184984B1 (en) 1999-02-09 2001-02-06 Kla-Tencor Corporation System for measuring polarimetric spectrum and other properties of a sample
IL130874A (en) * 1999-07-09 2002-12-01 Nova Measuring Instr Ltd System and method for measuring pattern structures
US8531678B2 (en) 1999-07-09 2013-09-10 Nova Measuring Instruments, Ltd. Method and system for measuring patterned structures
US6432729B1 (en) * 1999-09-29 2002-08-13 Lam Research Corporation Method for characterization of microelectronic feature quality
DE19950559B4 (de) 1999-10-20 2006-08-17 Steag Eta-Optik Gmbh Verfahren zum Bestimmen von geometrischen Strukturen auf oder in einem Substrat sowie von Materialparametern
EP1257781A4 (en) * 2000-01-26 2006-12-13 Timbre Tech Inc USE OF A MEMORY IN IN-LINE LAYER CALCULATIONS FOR QUICK RIGOROUS ANALYSIS OF COUPLED WAVES
US7230699B1 (en) * 2002-10-15 2007-06-12 J.A. Woollam Co., Inc. Sample orientation system and method
US6429943B1 (en) 2000-03-29 2002-08-06 Therma-Wave, Inc. Critical dimension analysis with simultaneous multiple angle of incidence measurements
WO2001084382A1 (en) 2000-05-04 2001-11-08 Kla-Tencor, Inc. Methods and systems for lithography process control
US6462817B1 (en) 2000-05-12 2002-10-08 Carlos Strocchia-Rivera Method of monitoring ion implants by examination of an overlying masking material
EP1309849A2 (en) 2000-08-10 2003-05-14 Therma-Wave, Inc. Database interpolation method for optical measurement of diffractive microstructures
US7317531B2 (en) * 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
IL138552A (en) 2000-09-19 2006-08-01 Nova Measuring Instr Ltd Measurement of transverse displacement by optical method
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
WO2002025708A2 (en) 2000-09-20 2002-03-28 Kla-Tencor-Inc. Methods and systems for semiconductor fabrication processes
US7115858B1 (en) * 2000-09-25 2006-10-03 Nanometrics Incorporated Apparatus and method for the measurement of diffracting structures
US7099005B1 (en) * 2000-09-27 2006-08-29 Kla-Tencor Technologies Corporation System for scatterometric measurements and applications
EP1352415A2 (en) * 2000-10-23 2003-10-15 Applied Materials, Inc. Monitoring substrate processing using reflected radiation
US6831742B1 (en) 2000-10-23 2004-12-14 Applied Materials, Inc Monitoring substrate processing using reflected radiation
US6768983B1 (en) * 2000-11-28 2004-07-27 Timbre Technologies, Inc. System and method for real-time library generation of grating profiles
US6900892B2 (en) * 2000-12-19 2005-05-31 Kla-Tencor Technologies Corporation Parametric profiling using optical spectroscopic systems
WO2002065545A2 (en) * 2001-02-12 2002-08-22 Sensys Instruments Corporation Overlay alignment metrology using diffraction gratings
US6864971B2 (en) * 2001-03-27 2005-03-08 Isoa, Inc. System and method for performing optical inspection utilizing diffracted light
US20020177245A1 (en) * 2001-03-29 2002-11-28 Sonderman Thomas J. Method and apparatus for controlling feature critical dimensions based on scatterometry derived profile
US20030002043A1 (en) * 2001-04-10 2003-01-02 Kla-Tencor Corporation Periodic patterns and technique to control misalignment
US6898537B1 (en) 2001-04-27 2005-05-24 Nanometrics Incorporated Measurement of diffracting structures using one-half of the non-zero diffracted orders
US7052575B1 (en) * 2001-04-30 2006-05-30 Advanced Micro Devices, Inc. System and method for active control of etch process
US7271901B2 (en) * 2001-05-22 2007-09-18 Horiba, Ltd. Thin-film characteristic measuring method using spectroellipsometer
US7382447B2 (en) * 2001-06-26 2008-06-03 Kla-Tencor Technologies Corporation Method for determining lithographic focus and exposure
US6773939B1 (en) * 2001-07-02 2004-08-10 Advanced Micro Devices, Inc. Method and apparatus for determining critical dimension variation in a line structure
US6713753B1 (en) * 2001-07-03 2004-03-30 Nanometrics Incorporated Combination of normal and oblique incidence polarimetry for the characterization of gratings
US6704661B1 (en) * 2001-07-16 2004-03-09 Therma-Wave, Inc. Real time analysis of periodic structures on semiconductors
US6678046B2 (en) * 2001-08-28 2004-01-13 Therma-Wave, Inc. Detector configurations for optical metrology
US7127098B2 (en) * 2001-09-13 2006-10-24 Hitachi, Ltd. Image detection method and its apparatus and defect detection method and its apparatus
US7061615B1 (en) 2001-09-20 2006-06-13 Nanometrics Incorporated Spectroscopically measured overlay target
CN1303477C (zh) * 2001-10-10 2007-03-07 安格盛光电科技公司 利用截面分析确定聚焦中心
US6898596B2 (en) 2001-10-23 2005-05-24 Therma-Wave, Inc. Evolution of library data sets
JP3839306B2 (ja) * 2001-11-08 2006-11-01 株式会社ルネサステクノロジ 半導体装置の製造方法および製造システム
US6746566B1 (en) 2001-12-11 2004-06-08 Kla-Tencor Technologies Corporation Transverse magnetic field voltage isolator
US6982791B2 (en) * 2001-12-19 2006-01-03 Therma-Wave, Inc. Scatterometry to simultaneously measure critical dimensions and film properties
AU2002360738A1 (en) * 2001-12-19 2003-07-09 Kla-Tencor Technologies Corporation Parametric profiling using optical spectroscopic systems
US7030018B2 (en) 2002-02-04 2006-04-18 Kla-Tencor Technologies Corp. Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
US6609086B1 (en) * 2002-02-12 2003-08-19 Timbre Technologies, Inc. Profile refinement for integrated circuit metrology
JP3878027B2 (ja) * 2002-02-18 2007-02-07 東京エレクトロン株式会社 偏光解析方法及び光学的膜厚測定装置
US6643008B1 (en) * 2002-02-26 2003-11-04 Advanced Micro Devices, Inc. Method of detecting degradation in photolithography processes based upon scatterometric measurements of grating structures, and a device comprising such structures
US7136796B2 (en) * 2002-02-28 2006-11-14 Timbre Technologies, Inc. Generation and use of integrated circuit profile-based simulation information
US6785009B1 (en) * 2002-02-28 2004-08-31 Advanced Micro Devices, Inc. Method of using high yielding spectra scatterometry measurements to control semiconductor manufacturing processes, and systems for accomplishing same
IL148484A (en) * 2002-03-04 2008-11-26 Nova Measuring Instr Ltd Optical measurements of patterned structures
US6791697B1 (en) * 2002-03-21 2004-09-14 Advanced Micro Devices, Inc. Scatterometry structure with embedded ring oscillator, and methods of using same
US6982793B1 (en) 2002-04-04 2006-01-03 Nanometrics Incorporated Method and apparatus for using an alignment target with designed in offset
US6949462B1 (en) 2002-04-04 2005-09-27 Nanometrics Incorporated Measuring an alignment target with multiple polarization states
US7322250B1 (en) * 2002-04-09 2008-01-29 Rockwell Automation Technologies, Inc. System and method for sensing torque on a rotating shaft
US20030197872A1 (en) * 2002-04-17 2003-10-23 Littau Michael E. Scatterometric measurement of undercut multi-layer diffracting signatures
US6985229B2 (en) * 2002-05-30 2006-01-10 Agere Systems, Inc. Overlay metrology using scatterometry profiling
US7216045B2 (en) * 2002-06-03 2007-05-08 Timbre Technologies, Inc. Selection of wavelengths for integrated circuit optical metrology
US6819844B2 (en) * 2002-06-20 2004-11-16 The Boeing Company Fiber-optic based surface spectroscopy
US6947135B2 (en) * 2002-07-01 2005-09-20 Therma-Wave, Inc. Reduced multicubic database interpolation method for optical measurement of diffractive microstructures
US6919964B2 (en) * 2002-07-09 2005-07-19 Therma-Wave, Inc. CD metrology analysis using a finite difference method
EP1527320A1 (en) * 2002-07-12 2005-05-04 Luka Optoscope ApS Method and apparatus for optically measuring the topography of nearly planar periodic structures
US7046363B2 (en) * 2002-09-06 2006-05-16 Infineon Technologies Ag Optical measurement system and method
US7139081B2 (en) 2002-09-09 2006-11-21 Zygo Corporation Interferometry method for ellipsometry, reflectometry, and scatterometry measurements, including characterization of thin film structures
US7869057B2 (en) 2002-09-09 2011-01-11 Zygo Corporation Multiple-angle multiple-wavelength interferometer using high-NA imaging and spectral analysis
US6992764B1 (en) 2002-09-30 2006-01-31 Nanometrics Incorporated Measuring an alignment target with a single polarization state
US7136162B1 (en) * 2002-10-15 2006-11-14 J.A. Woollam Co., Inc. Alignment of ellipsometer beam to sample surface
US20040090629A1 (en) * 2002-11-08 2004-05-13 Emmanuel Drege Diffraction order selection for optical metrology simulation
US7193715B2 (en) * 2002-11-14 2007-03-20 Tokyo Electron Limited Measurement of overlay using diffraction gratings when overlay exceeds the grating period
WO2004046655A2 (en) * 2002-11-20 2004-06-03 Mehrdad Nikoohahad System and method for characterizing three-dimensional structures
US7369233B2 (en) 2002-11-26 2008-05-06 Kla-Tencor Technologies Corporation Optical system for measuring samples using short wavelength radiation
US7440105B2 (en) * 2002-12-05 2008-10-21 Kla-Tencor Technologies Corporation Continuously varying offset mark and methods of determining overlay
AU2003298003A1 (en) 2002-12-05 2004-06-30 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
FR2849181B1 (fr) * 2002-12-23 2005-12-23 Commissariat Energie Atomique Procede d'etude des reliefs d'une structure par voie optique
US20080246951A1 (en) * 2007-04-09 2008-10-09 Phillip Walsh Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work-pieces
US7126131B2 (en) 2003-01-16 2006-10-24 Metrosol, Inc. Broad band referencing reflectometer
US8564780B2 (en) * 2003-01-16 2013-10-22 Jordan Valley Semiconductors Ltd. Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work pieces
US7352453B2 (en) * 2003-01-17 2008-04-01 Kla-Tencor Technologies Corporation Method for process optimization and control by comparison between 2 or more measured scatterometry signals
DE10302868B4 (de) * 2003-01-25 2008-07-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Bestimmung von Strukturparametern einer Oberfläche mit einem lernfähigen System
US7069153B2 (en) * 2003-01-28 2006-06-27 Therma-Wave, Inc. CD metrology method
US7072049B2 (en) * 2003-02-03 2006-07-04 Timbre Technologies, Inc. Model optimization for structures with additional materials
US7324214B2 (en) 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
US7106454B2 (en) 2003-03-06 2006-09-12 Zygo Corporation Profiling complex surface structures using scanning interferometry
US7233390B2 (en) * 2003-03-31 2007-06-19 Therma-Wave, Inc. Scatterometry for samples with non-uniform edges
US7145664B2 (en) * 2003-04-18 2006-12-05 Therma-Wave, Inc. Global shape definition method for scatterometry
US7068363B2 (en) 2003-06-06 2006-06-27 Kla-Tencor Technologies Corp. Systems for inspection of patterned or unpatterned wafers and other specimen
US7463355B1 (en) * 2003-06-12 2008-12-09 Scientific Computing International Nondestructive optical technique for simultaneously measuring optical constants and thickness of thin films
US6891628B2 (en) * 2003-06-25 2005-05-10 N & K Technology, Inc. Method and apparatus for examining features on semi-transparent and transparent substrates
US7085676B2 (en) * 2003-06-27 2006-08-01 Tokyo Electron Limited Feed forward critical dimension control
DE10333119B3 (de) * 2003-07-21 2005-05-25 Infineon Technologies Ag Nichtinvasives Verfahren zur Charakterisierung und Identifizierung eingebetteter Mikrostrukturen
US7271921B2 (en) * 2003-07-23 2007-09-18 Kla-Tencor Technologies Corporation Method and apparatus for determining surface layer thickness using continuous multi-wavelength surface scanning
US7430898B1 (en) 2003-09-04 2008-10-07 Kla-Tencor Technologies Corp. Methods and systems for analyzing a specimen using atomic force microscopy profiling in combination with an optical technique
TWI334921B (en) * 2003-09-15 2010-12-21 Zygo Corp Surface profiling using an interference pattern matching template
SE526617C2 (sv) * 2003-10-01 2005-10-18 Sick Ivp Ab System och metod för att avbilda ett objekts egenskaper
US7145654B2 (en) * 2003-10-01 2006-12-05 Tokyo Electron Limited Method and apparatus to reduce spotsize in an optical metrology instrument
JP3892843B2 (ja) * 2003-11-04 2007-03-14 株式会社東芝 寸法測定方法、寸法測定装置および測定マーク
US7256879B2 (en) * 2003-12-11 2007-08-14 Corning Incorporated Semiconductor array tester
US7327457B2 (en) * 2003-12-19 2008-02-05 N&K Technology, Inc. Apparatus and method for optical characterization of a sample over a broadband of wavelengths while minimizing polarization changes
WO2005069082A1 (en) 2003-12-19 2005-07-28 International Business Machines Corporation Differential critical dimension and overlay metrology apparatus and measurement method
US7248364B2 (en) * 2003-12-19 2007-07-24 N&K Technology, Inc. Apparatus and method for optical characterization of a sample over a broadband of wavelengths with a small spot size
JP2010286493A (ja) * 2004-01-23 2010-12-24 Horiba Ltd 基板検査装置
US7355709B1 (en) 2004-02-23 2008-04-08 Kla-Tencor Technologies Corp. Methods and systems for optical and non-optical measurements of a substrate
US7349079B2 (en) 2004-05-14 2008-03-25 Kla-Tencor Technologies Corp. Methods for measurement or analysis of a nitrogen concentration of a specimen
JP2007537455A (ja) * 2004-05-14 2007-12-20 ケイエルエイ−テンコー・テクノロジーズ・コーポレーション 試験体の測定または分析のためのシステムおよび方法
US7067819B2 (en) 2004-05-14 2006-06-27 Kla-Tencor Technologies Corp. Systems and methods for measurement or analysis of a specimen using separated spectral peaks in light
US7564552B2 (en) 2004-05-14 2009-07-21 Kla-Tencor Technologies Corp. Systems and methods for measurement of a specimen with vacuum ultraviolet light
US7359052B2 (en) 2004-05-14 2008-04-15 Kla-Tencor Technologies Corp. Systems and methods for measurement of a specimen with vacuum ultraviolet light
IL162199A (en) * 2004-05-27 2008-04-13 Nova Measuring Instr Ltd Optical measurements of articles with periodic patterns
US7212293B1 (en) 2004-06-01 2007-05-01 N&K Technology, Inc. Optical determination of pattern feature parameters using a scalar model having effective optical properties
US7202958B1 (en) * 2004-06-01 2007-04-10 Nanometrics Incorporated Modeling a sample with an underlying complicated structure
US7804059B2 (en) * 2004-08-11 2010-09-28 Jordan Valley Semiconductors Ltd. Method and apparatus for accurate calibration of VUV reflectometer
US20060043291A1 (en) * 2004-08-26 2006-03-02 Peng Gang G Electron spectroscopic metrology system
US7274440B1 (en) * 2004-09-08 2007-09-25 Kla-Tencor Technologies Corp. Systems and methods for measuring stress in a specimen
US7391524B1 (en) 2004-09-13 2008-06-24 N&K Technology, Inc. System and method for efficient characterization of diffracting structures with incident plane parallel to grating lines
US7206070B2 (en) 2004-11-15 2007-04-17 Therma-Wave, Inc. Beam profile ellipsometer with rotating compensator
US7483133B2 (en) * 2004-12-09 2009-01-27 Kla-Tencor Technologies Corporation. Multiple angle of incidence spectroscopic scatterometer system
WO2006069255A2 (en) * 2004-12-22 2006-06-29 Kla-Tencor Technologies Corp. Methods and systems for controlling variation in dimensions of patterned features across a wafer
US20070091325A1 (en) * 2005-01-07 2007-04-26 Mehrdad Nikoonahad Multi-channel optical metrology
US7515253B2 (en) * 2005-01-12 2009-04-07 Kla-Tencor Technologies Corporation System for measuring a sample with a layer containing a periodic diffracting structure
TWI428582B (zh) 2005-01-20 2014-03-01 Zygo Corp 用於檢測物體表面之特性的干涉裝置以及干涉方法
US7884947B2 (en) 2005-01-20 2011-02-08 Zygo Corporation Interferometry for determining characteristics of an object surface, with spatially coherent illumination
US7408641B1 (en) 2005-02-14 2008-08-05 Kla-Tencor Technologies Corp. Measurement systems configured to perform measurements of a specimen and illumination subsystems configured to provide illumination for a measurement system
US7315384B2 (en) * 2005-05-10 2008-01-01 Asml Netherlands B.V. Inspection apparatus and method of inspection
US7330256B1 (en) 2005-05-16 2008-02-12 N&K Technology, Inc. Spectrophotometric system with reduced angle of incidence
DE102005023736B4 (de) 2005-05-23 2019-08-22 Vistec Semiconductor Systems Jena Gmbh Verfahren zum Bestimmen von Strukturparametern
US7277172B2 (en) * 2005-06-06 2007-10-02 Kla-Tencor Technologies, Corporation Measuring overlay and profile asymmetry using symmetric and anti-symmetric scatterometry signals
US7369235B1 (en) 2005-06-24 2008-05-06 Kla-Tencor Corporation Method and system for measuring deep trenches in silicon
US7636168B2 (en) 2005-10-11 2009-12-22 Zygo Corporation Interferometry method and system including spectral decomposition
US7430051B2 (en) * 2005-10-12 2008-09-30 Sematech Inc. Methods for characterizing semiconductor material using optical metrology
JP4807659B2 (ja) * 2006-01-31 2011-11-02 凸版印刷株式会社 セル内膜厚測定装置
US7747424B2 (en) * 2006-03-17 2010-06-29 Kla-Tencor Corporation Scatterometry multi-structure shape definition with multi-periodicity
US7561282B1 (en) 2006-03-27 2009-07-14 Kla-Tencor Technologies Corporation Techniques for determining overlay and critical dimension using a single metrology tool
JP4990548B2 (ja) * 2006-04-07 2012-08-01 株式会社日立製作所 半導体装置の製造方法
US20090306941A1 (en) * 2006-05-15 2009-12-10 Michael Kotelyanskii Structure Model description and use for scatterometry-based semiconductor manufacturing process metrology
US7623238B1 (en) 2006-06-07 2009-11-24 J.A. Woollam Co., Inc. System for and method of reducing change caused by motor vibrations in ellipsometers, polarimeters or the like
US7469164B2 (en) * 2006-06-26 2008-12-23 Nanometrics Incorporated Method and apparatus for process control with in-die metrology
US7515283B2 (en) * 2006-07-11 2009-04-07 Tokyo Electron, Ltd. Parallel profile determination in optical metrology
US7469192B2 (en) * 2006-07-11 2008-12-23 Tokyo Electron Ltd. Parallel profile determination for an optical metrology system
US7522288B2 (en) 2006-07-21 2009-04-21 Zygo Corporation Compensation of systematic effects in low coherence interferometry
US8139232B2 (en) 2006-07-27 2012-03-20 Rudolph Technologies, Inc. Multiple measurement techniques including focused beam scatterometry for characterization of samples
JP5186129B2 (ja) * 2006-08-25 2013-04-17 大日本スクリーン製造株式会社 溝パターンの深さの測定方法および測定装置
JP5145673B2 (ja) * 2006-08-30 2013-02-20 住友電気工業株式会社 レーザ加工方法およびレーザ加工装置
US7630087B2 (en) * 2006-11-22 2009-12-08 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US20080129986A1 (en) * 2006-11-30 2008-06-05 Phillip Walsh Method and apparatus for optically measuring periodic structures using orthogonal azimuthal sample orientations
EP2097713A4 (en) 2006-12-22 2010-09-15 Zygo Corp DEVICE AND METHOD FOR MEASURING SURFACE PROPERTIES
DE102006062036B4 (de) * 2006-12-29 2017-10-05 Globalfoundries Inc. Bewertung von mechanischen Spannungen in Mikrostrukturbauelementen in der Prozesslinie
US8798966B1 (en) * 2007-01-03 2014-08-05 Kla-Tencor Corporation Measuring critical dimensions of a semiconductor structure
US7596422B2 (en) * 2007-01-12 2009-09-29 Tokyo Electron Limited Determining one or more profile parameters of a structure using optical metrology and a correlation between profile models and key profile shape variables
US7889355B2 (en) 2007-01-31 2011-02-15 Zygo Corporation Interferometry for lateral metrology
TWI416096B (zh) 2007-07-11 2013-11-21 Nova Measuring Instr Ltd 用於監控圖案化結構的性質之方法及系統
US7716003B1 (en) * 2007-07-16 2010-05-11 Kla-Tencor Technologies Corporation Model-based measurement of semiconductor device features with feed forward use of data for dimensionality reduction
US7619746B2 (en) 2007-07-19 2009-11-17 Zygo Corporation Generating model signals for interferometry
US8699027B2 (en) * 2007-07-27 2014-04-15 Rudolph Technologies, Inc. Multiple measurement techniques including focused beam scatterometry for characterization of samples
US7826072B1 (en) 2007-08-16 2010-11-02 Kla-Tencor Technologies Corporation Method for optimizing the configuration of a scatterometry measurement system
JP4950813B2 (ja) * 2007-08-30 2012-06-13 大日本スクリーン製造株式会社 分光エリプソメータ、膜厚測定装置および分光エリプソメータのフォーカス調整方法
US7838309B1 (en) * 2007-09-07 2010-11-23 Kla-Tencor Corporation Measurement and control of strained devices
NL1036018A1 (nl) * 2007-10-09 2009-04-15 Asml Netherlands Bv A method of optimizing a model, a method of measuring a property, a device manufacturing method, a spectrometer and a lithographic apparatus.
US8072611B2 (en) 2007-10-12 2011-12-06 Zygo Corporation Interferometric analysis of under-resolved features
KR101274517B1 (ko) 2007-11-13 2013-06-13 지고 코포레이션 편광 스캐닝을 이용한 간섭계
US8126677B2 (en) 2007-12-14 2012-02-28 Zygo Corporation Analyzing surface structure using scanning interferometry
DE102007063415B4 (de) * 2007-12-18 2014-12-04 BAM Bundesanstalt für Materialforschung und -prüfung Verfahren und Vorrichtung zum Erkennen eines Erzeugnisses
US9006001B2 (en) * 2007-12-24 2015-04-14 Texas Instruments Incorporated Simple scatterometry structure for Si recess etch control
JP2009162494A (ja) * 2007-12-28 2009-07-23 Nec Electronics Corp 計測方法
US20090219537A1 (en) * 2008-02-28 2009-09-03 Phillip Walsh Method and apparatus for using multiple relative reflectance measurements to determine properties of a sample using vacuum ultra violet wavelengths
US8126694B2 (en) 2008-05-02 2012-02-28 Nanometrics Incorporated Modeling conductive patterns using an effective model
US20090279172A1 (en) * 2008-05-12 2009-11-12 Higashi Robert E Microelectromechanical lamellar grating
US8090558B1 (en) 2008-06-09 2012-01-03 Kla-Tencor Corporation Optical parametric model optimization
US20100059657A1 (en) * 2008-09-05 2010-03-11 Nikon Corporation System and Method Producing Data For Correcting Autofocus Error in An Imaging Optical System
US8120781B2 (en) 2008-11-26 2012-02-21 Zygo Corporation Interferometric systems and methods featuring spectral analysis of unevenly sampled data
US8195435B2 (en) * 2008-12-19 2012-06-05 Tokyo Electron Limited Hybrid diffraction modeling of diffracting structures
US8125641B2 (en) * 2009-03-27 2012-02-28 N&K Technology, Inc. Method and apparatus for phase-compensated sensitivity-enhanced spectroscopy (PCSES)
US8153987B2 (en) 2009-05-22 2012-04-10 Jordan Valley Semiconductors Ltd. Automated calibration methodology for VUV metrology system
NL2004545A (en) * 2009-06-09 2010-12-13 Asml Netherlands Bv Lithographic method and arrangement
US8441639B2 (en) * 2009-09-03 2013-05-14 Kla-Tencor Corp. Metrology systems and methods
WO2011045132A1 (en) * 2009-10-12 2011-04-21 Asml Netherlands B.V. Method, inspection apparatus and substrate for determining an approximate structure of an object on the substrate
US8467056B1 (en) * 2009-11-09 2013-06-18 The United States Of America As Represented By The Secretary Of The Navy Variable angle, fiber optic coupled, light scattering apparatus
US20110276319A1 (en) * 2010-05-06 2011-11-10 Jonathan Michael Madsen Determination of material optical properties for optical metrology of structures
KR101649015B1 (ko) * 2010-08-02 2016-08-17 다이니폰 인사츠 가부시키가이샤 광학 적층체, 편광판 및 화상 표시 장치
US8867041B2 (en) 2011-01-18 2014-10-21 Jordan Valley Semiconductor Ltd Optical vacuum ultra-violet wavelength nanoimprint metrology
US8565379B2 (en) 2011-03-14 2013-10-22 Jordan Valley Semiconductors Ltd. Combining X-ray and VUV analysis of thin film layers
US9442063B2 (en) * 2011-06-27 2016-09-13 Kla-Tencor Corporation Measurement of composition for thin films
JP2013032981A (ja) * 2011-08-02 2013-02-14 Otsuka Denshi Co Ltd 膜厚測定装置
US8468471B2 (en) 2011-09-23 2013-06-18 Kla-Tencor Corp. Process aware metrology
US10346962B2 (en) * 2012-02-10 2019-07-09 Corning Incorporated Nondestructive method to predict isostatic strength in ceramic substrates
WO2013124131A2 (en) * 2012-02-21 2013-08-29 Asml Netherlands B.V. Inspection apparatus and method
US9134807B2 (en) 2012-03-02 2015-09-15 Microsoft Technology Licensing, Llc Pressure sensitive key normalization
US9075566B2 (en) 2012-03-02 2015-07-07 Microsoft Technoogy Licensing, LLC Flexible hinge spine
US20130242303A1 (en) * 2012-03-13 2013-09-19 Nanometrics Incorporated Dual angles of incidence and azimuth angles optical metrology
KR101761735B1 (ko) 2012-03-27 2017-07-26 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법 및 장치, 리소그래피 시스템 및 디바이스 제조 방법
US10354929B2 (en) * 2012-05-08 2019-07-16 Kla-Tencor Corporation Measurement recipe optimization based on spectral sensitivity and process variation
US20130300590A1 (en) 2012-05-14 2013-11-14 Paul Henry Dietz Audio Feedback
WO2013181156A1 (en) * 2012-05-29 2013-12-05 Kla-Tencor Corporation Small spot size spectroscopic ellipsometer
WO2013188602A1 (en) * 2012-06-13 2013-12-19 Kla-Tencor Corporation Optical surface scanning systems and methods
CN103575662B (zh) * 2012-08-09 2016-05-04 北京智朗芯光科技有限公司 光学测量系统
EP2901115A4 (en) * 2012-09-24 2016-07-20 Tornado Spectral Systems Inc MULTIFUNCTION SPECTROMETER ON A CHIP WITH SINGLE DETECTOR ARRAY
US8860937B1 (en) 2012-10-24 2014-10-14 Kla-Tencor Corp. Metrology systems and methods for high aspect ratio and large lateral dimension structures
US8912495B2 (en) 2012-11-21 2014-12-16 Kla-Tencor Corp. Multi-spectral defect inspection for 3D wafers
US8994943B2 (en) * 2012-11-30 2015-03-31 Infineon Technologies Ag Selectivity by polarization
NL2011816A (en) 2012-11-30 2014-06-04 Asml Netherlands Bv Method of determining dose and focus, inspection apparatus, patterning device, substrate and device manufacturing method.
CN103323403B (zh) * 2013-05-27 2015-04-15 浙江大学 一种低辐射镀膜玻璃的光学参数检测方法
US10481088B2 (en) * 2013-06-04 2019-11-19 Kla-Tencor Corporation Automatic determination of fourier harmonic order for computation of spectral information for diffraction structures
US10079183B2 (en) * 2013-06-26 2018-09-18 Kla-Tenor Corporation Calculated electrical performance metrics for process monitoring and yield management
KR101830850B1 (ko) * 2013-07-03 2018-02-21 에이에스엠엘 네델란즈 비.브이. 검사 장치 및 방법, 리소그래피 장치, 리소그래피 처리 셀 및 디바이스 제조 방법
KR20150085956A (ko) 2014-01-17 2015-07-27 삼성전자주식회사 반도체 소자의 계측 방법, 반도체 계측 시스템, 및 이들을 이용한 반도체 소자의 제조방법
US9546962B2 (en) 2014-02-12 2017-01-17 Kla-Tencor Corporation Multi-spot scanning collection optics
JP6267550B2 (ja) * 2014-03-12 2018-01-24 キヤノン株式会社 測定装置および測定方法
EP3132467A4 (en) 2014-04-17 2017-11-01 Femtometrix, Inc. Wafer metrology technologies
US9494535B2 (en) * 2014-04-21 2016-11-15 Kla-Tencor Corporation Scatterometry-based imaging and critical dimension metrology
JP6035279B2 (ja) 2014-05-08 2016-11-30 東京エレクトロン株式会社 膜厚測定装置、膜厚測定方法、プログラム及びコンピュータ記憶媒体
KR20170015984A (ko) 2014-06-30 2017-02-10 에이에스엠엘 네델란즈 비.브이. 선량 결정 방법, 검사 장치, 패터닝 디바이스, 기판, 및 디바이스 제조 방법
US10151986B2 (en) * 2014-07-07 2018-12-11 Kla-Tencor Corporation Signal response metrology based on measurements of proxy structures
US9304235B2 (en) 2014-07-30 2016-04-05 Microsoft Technology Licensing, Llc Microfabrication
US10324733B2 (en) 2014-07-30 2019-06-18 Microsoft Technology Licensing, Llc Shutdown notifications
US10678412B2 (en) 2014-07-31 2020-06-09 Microsoft Technology Licensing, Llc Dynamic joint dividers for application windows
US10254942B2 (en) 2014-07-31 2019-04-09 Microsoft Technology Licensing, Llc Adaptive sizing and positioning of application windows
US10592080B2 (en) 2014-07-31 2020-03-17 Microsoft Technology Licensing, Llc Assisted presentation of application windows
US9787576B2 (en) 2014-07-31 2017-10-10 Microsoft Technology Licensing, Llc Propagating routing awareness for autonomous networks
EP3218924B1 (en) * 2014-11-12 2020-02-12 Femtometrix, Inc. Systems for parsing material properties from within shg signals
US10151634B2 (en) 2014-11-16 2018-12-11 Ibrahim Abdulhalim Multi-spectral polarimetric variable optical device and imager
KR20160066448A (ko) 2014-12-02 2016-06-10 삼성전자주식회사 표면 검사 방법
US10018844B2 (en) 2015-02-09 2018-07-10 Microsoft Technology Licensing, Llc Wearable image display system
US11086216B2 (en) 2015-02-09 2021-08-10 Microsoft Technology Licensing, Llc Generating electronic components
US9535253B2 (en) 2015-02-09 2017-01-03 Microsoft Technology Licensing, Llc Display system
US10317677B2 (en) 2015-02-09 2019-06-11 Microsoft Technology Licensing, Llc Display system
US9429692B1 (en) 2015-02-09 2016-08-30 Microsoft Technology Licensing, Llc Optical components
US9423360B1 (en) 2015-02-09 2016-08-23 Microsoft Technology Licensing, Llc Optical components
US9827209B2 (en) 2015-02-09 2017-11-28 Microsoft Technology Licensing, Llc Display system
US9513480B2 (en) 2015-02-09 2016-12-06 Microsoft Technology Licensing, Llc Waveguide
US9372347B1 (en) 2015-02-09 2016-06-21 Microsoft Technology Licensing, Llc Display system
US9970863B2 (en) * 2015-02-22 2018-05-15 Kla-Tencor Corporation Optical metrology with reduced focus error sensitivity
US20170045355A1 (en) * 2015-08-12 2017-02-16 Industrial Technology Research Institute Scattering measurement system and method
US10094774B2 (en) * 2015-08-12 2018-10-09 Industrial Technology Research Institute Scattering measurement system and method
US10989664B2 (en) 2015-09-03 2021-04-27 California Institute Of Technology Optical systems and methods of characterizing high-k dielectrics
CN105277500B (zh) * 2015-12-08 2018-05-25 上海老盛昌配送有限公司 一种苏丹红紫外固化检测装置与方法
US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry
US9728470B1 (en) * 2016-05-10 2017-08-08 Infineon Technologies Austria Ag Semiconductor structure and methods
KR20180028787A (ko) * 2016-09-09 2018-03-19 삼성전자주식회사 디펙 검사 시스템과 방법, 및 그 검사 방법을 이용한 반도체 소자 제조방법
TWI716684B (zh) * 2018-05-09 2021-01-21 華邦電子股份有限公司 臨界尺寸量測方法及用於量測臨界尺寸的影像處理裝置
KR20210021308A (ko) 2018-05-15 2021-02-25 펨토매트릭스, 인코포레이티드. 제2고조파 발생(ｓｈｇ) 광학 검사 시스템 설계
IL280200B2 (en) * 2018-07-25 2024-02-01 Nova Ltd Optical technique for material characterization
CN108965735B (zh) * 2018-09-27 2023-11-03 武汉华星光电技术有限公司 对焦补偿的方法及其设备
KR102139995B1 (ko) * 2018-10-24 2020-07-31 한국표준과학연구원 수직입사 및 경사입사 결합형 타원계측기 및 이를 이용한 시편의 광물성 측정 방법
CN109405815B (zh) * 2018-12-05 2024-03-19 长安大学 一种用于隧道内测量周边收敛的快速固定装置及方法
US10804167B2 (en) 2019-01-24 2020-10-13 Kla-Tencor Corporation Methods and systems for co-located metrology
US11060982B2 (en) * 2019-03-17 2021-07-13 Kla Corporation Multi-dimensional model of optical dispersion
US10921721B1 (en) * 2019-09-13 2021-02-16 Applied Materials, Inc. Measurement system and grating pattern array
KR20210032663A (ko) 2019-09-17 2021-03-25 삼성전자주식회사 웨이퍼 검사 장치
JP7083856B2 (ja) * 2020-01-07 2022-06-13 日本電子株式会社 高さ測定装置、荷電粒子線装置、および高さ測定方法
US11939665B2 (en) * 2020-03-10 2024-03-26 Tokyo Electron Limted Film thickness measuring apparatus and film thickness measuring method, and film forming system and film forming method
US20220290974A1 (en) * 2021-03-11 2022-09-15 Applied Materials Israel Ltd. Optical metrology models for in-line film thickness measurements
CN113310907B (zh) * 2021-06-09 2022-07-05 华中科技大学 一种磁性椭偏测量装置
EP4202409A1 (en) * 2021-12-22 2023-06-28 Munster Technological University Resonant scattering spectroscopy based wafer scale testing

Family Cites Families (172)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3426201A (en) * 1965-10-12 1969-02-04 Texas Instruments Inc Method and apparatus for measuring the thickness of films by means of elliptical polarization of reflected infrared radiation
US3547074A (en) 1967-04-13 1970-12-15 Block Engineering Apparatus for forming microelements
US3667846A (en) * 1969-07-28 1972-06-06 Charles Nater Optical surface inspection apparatus
US3671126A (en) * 1970-02-19 1972-06-20 Ati Inc Noncontacting optical probe
US4171917A (en) 1974-07-02 1979-10-23 Centre De Recherches Metallurgiques-Centrum Voor Research In De Metallurgie Determining the profile of a surface of an object
US4039370A (en) 1975-06-23 1977-08-02 Rca Corporation Optically monitoring the undercutting of a layer being etched
CA1043463A (en) * 1975-12-05 1978-11-28 Paul A. Mueller Lumber inspection and optimization system
JPS5335567A (en) 1976-09-13 1978-04-03 Shinetsu Chem Ind Co Apparatus for measuring thickness of semiconductor wafer
US4173788A (en) 1976-09-27 1979-11-06 Atmospheric Sciences, Inc. Method and apparatus for measuring dimensions
US4146327A (en) * 1976-12-27 1979-03-27 Autech Optical triangulation gauging system
US4303341A (en) 1977-12-19 1981-12-01 Rca Corporation Optically testing the lateral dimensions of a pattern
US4200396A (en) 1977-12-19 1980-04-29 Rca Corporation Optically testing the lateral dimensions of a pattern
US4141780A (en) 1977-12-19 1979-02-27 Rca Corporation Optically monitoring the thickness of a depositing layer
US5280179A (en) * 1979-04-30 1994-01-18 Sensor Adaptive Machines Incorporated Method and apparatus utilizing an orientation code for automatically guiding a robot
US5164579A (en) 1979-04-30 1992-11-17 Diffracto Ltd. Method and apparatus for electro-optically determining the dimension, location and attitude of objects including light spot centroid determination
US4373804A (en) * 1979-04-30 1983-02-15 Diffracto Ltd. Method and apparatus for electro-optically determining the dimension, location and attitude of objects
HU186726B (en) 1979-06-08 1985-09-30 Energiagazdalkodasi Intezet Hybrid heat pump
US4330213A (en) 1980-02-14 1982-05-18 Rca Corporation Optical line width measuring apparatus and method
US5112131A (en) 1981-02-27 1992-05-12 Diffracto, Ltd. Controlled machining of combustion chambers, gears and other surfaces
EP0061237B1 (en) 1981-03-16 1986-04-16 Energy Conversion Devices, Inc. Optical methods for controlling layer thickness
US4516855A (en) * 1981-04-03 1985-05-14 International Business Machines Corporation Method and apparatus for determining the polarization state of a light wave field
JPS57187604A (en) 1981-05-14 1982-11-18 Toshiba Corp Measurement device of profile
US4408884A (en) 1981-06-29 1983-10-11 Rca Corporation Optical measurements of fine line parameters in integrated circuit processes
JPS58206120A (ja) 1982-05-26 1983-12-01 Hitachi Ltd 半導体形成プロセス制御方式
JPS5999304A (ja) * 1982-11-30 1984-06-08 Asahi Optical Co Ltd 顕微鏡系のレーザ光による比較測長装置
JPS59140420A (ja) * 1983-02-01 1984-08-11 Canon Inc 半導体レ−ザ−を用いた光源装置
SU1146549A1 (ru) 1983-04-08 1985-03-23 Предприятие П/Я В-2892 Способ измерени линейного размера элементов топологического рисунка микросхем
JPH0750664B2 (ja) * 1983-06-23 1995-05-31 富士通株式会社 レチクルの検査方法
JPS6033003A (ja) 1983-08-03 1985-02-20 Hitachi Ltd 形状測定装置
JPS6074528A (ja) 1983-09-30 1985-04-26 Fujitsu Ltd レジストパタ−ン検査装置
JPS6086843A (ja) 1983-10-19 1985-05-16 Hitachi Ltd 偏光解析装置を有する加工装置
JPS60128602A (ja) 1983-12-16 1985-07-09 株式会社日立製作所 多連多回転ボリウム
US4615620A (en) 1983-12-26 1986-10-07 Hitachi, Ltd. Apparatus for measuring the depth of fine engraved patterns
USRE33424E (en) 1983-12-26 1990-11-06 Hitachi, Ltd. Apparatus and method for measuring the depth of fine engraved patterns
US4672196A (en) * 1984-02-02 1987-06-09 Canino Lawrence S Method and apparatus for measuring properties of thin materials using polarized light
JPS60166808A (ja) 1984-02-10 1985-08-30 Toshiba Corp 形状測定装置
JPS60236005A (ja) 1984-05-09 1985-11-22 Nec Corp 線巾測定方法
US4695162A (en) * 1984-05-24 1987-09-22 Victor Company Of Japan, Ltd. Film thickness measuring apparatus
US4653924A (en) * 1984-06-12 1987-03-31 Victor Company Of Japan, Ltd. Rotating analyzer type ellipsometer
JPS614905A (ja) 1984-06-19 1986-01-10 Nec Corp 線幅測定方法
JPS614906A (ja) 1984-06-19 1986-01-10 Nec Corp 線幅測定方法
JPS6139852A (ja) 1984-07-31 1986-02-26 Toshiba Electric Equip Corp 位相制御回路の保護回路
SU1226042A1 (ru) 1984-08-18 1986-04-23 Предприятие П/Я В-2892 Способ измерени толщины пленок на подложках
DE3434575C1 (de) * 1984-09-20 1986-03-13 Sagax Instrument AB, Sundbyberg Ellipsometrische Vorrichtung zur Untersuchung der physikalischen Eigenschaften der Oberflaeche einer Probe
US4687325A (en) * 1985-03-28 1987-08-18 General Electric Company Three-dimensional range camera
US4689491A (en) * 1985-04-19 1987-08-25 Datasonics Corp. Semiconductor wafer scanning system
US4710642A (en) 1985-08-20 1987-12-01 Mcneil John R Optical scatterometer having improved sensitivity and bandwidth
US4668860A (en) * 1985-10-09 1987-05-26 Optical Coating Laboratory, Inc. Scattermeter using polarized light to distinguish between bulk and surface scatter
JPS62150251A (ja) 1985-12-24 1987-07-04 Nec Corp デ−タベ−ス型フオトマスク検査装置
US5329357A (en) 1986-03-06 1994-07-12 Sopra-Societe De Production Et De Recherches Appliquees Spectroscopic ellipsometry apparatus including an optical fiber
FR2597976B1 (fr) 1986-04-24 1990-11-09 Tissier Annie Procede de mesure de parametres caracteristiques d'une couche mince et appareil pour la mise en oeuvre de ce procede
FR2605100B1 (fr) * 1986-10-10 1988-12-09 Labo Electronique Physique Dispositif optique d'eclairement d'un echantillon pour un ellipsometre spectroscopique a haute resolution laterale
JPH0769154B2 (ja) 1987-06-10 1995-07-26 富士写真フイルム株式会社 レジストパタ−ンの形状計測方法
JPS6428509A (en) 1987-07-23 1989-01-31 Nippon Kokan Kk Apparatus for measuring thickness of film
US4905170A (en) 1987-11-12 1990-02-27 Forouhi Abdul R Method and apparatus of determining optical constants of amorphous semiconductors and dielectrics
US5087121A (en) * 1987-12-01 1992-02-11 Canon Kabushiki Kaisha Depth/height measuring device
JPH0663745B2 (ja) 1988-01-13 1994-08-22 日本電気株式会社 格子周期測定装置
FR2628211B1 (fr) * 1988-03-04 1993-05-14 Vareille Aime Analyseur par ellipsometrie, procede d'analyse ellipsometrique d'un echantillon et application a la mesure de variation d'epaisseur des couches minces
US5007708A (en) * 1988-07-26 1991-04-16 Georgia Tech Research Corporation Technique for producing antireflection grating surfaces on dielectrics, semiconductors and metals
US5393624A (en) * 1988-07-29 1995-02-28 Tokyo Electron Limited Method and apparatus for manufacturing a semiconductor device
SU1695145A1 (ru) 1988-08-03 1991-11-30 Институт Радиотехники И Электроники Ан Ссср Эллипсометр
US4964726A (en) 1988-09-27 1990-10-23 General Electric Company Apparatus and method for optical dimension measurement using interference of scattered electromagnetic energy
NL8802920A (nl) 1988-11-28 1990-06-18 Hoogovens Groep Bv Laagdiktemeter.
US4991971A (en) * 1989-02-13 1991-02-12 United Technologies Corporation Fiber optic scatterometer for measuring optical surface roughness
US5076696A (en) * 1989-03-16 1991-12-31 The Johns Hopkins University Dynamic imaging microellipsometry
DE3914631A1 (de) 1989-05-03 1990-11-08 Basf Ag Verfahren zur untersuchung der physikalischen eigenschaften duenner schichten
US4999014A (en) * 1989-05-04 1991-03-12 Therma-Wave, Inc. Method and apparatus for measuring thickness of thin films
US5042951A (en) * 1989-09-19 1991-08-27 Therma-Wave, Inc. High resolution ellipsometric apparatus
DD289541A5 (de) 1989-08-04 1991-05-02 ��@�K@�������������@�K@��������������@��������k�� Verfahren zur herstellung von 11beta-aryl-16 alpha, 17 alph-cyclohexanoestra-4,9-dienen
JP3187827B2 (ja) 1989-12-20 2001-07-16 株式会社日立製作所 パターン検査方法および装置
US5166752A (en) * 1990-01-11 1992-11-24 Rudolph Research Corporation Simultaneous multiple angle/multiple wavelength ellipsometer and method
DE4105192C2 (de) 1990-02-26 1996-07-04 Stefan Oelckers Verfahren zum Bestimmen von Oberflächenrauhigkeiten und dergleichen
JPH0424541A (ja) 1990-05-21 1992-01-28 Mitsui Mining & Smelting Co Ltd 内部欠陥測定方法および装置
US5091320A (en) * 1990-06-15 1992-02-25 Bell Communications Research, Inc. Ellipsometric control of material growth
US5241369A (en) 1990-10-01 1993-08-31 Mcneil John R Two-dimensional optical scatterometer apparatus and process
US5114233A (en) 1990-10-09 1992-05-19 At&T Bell Laboratories Method for inspecting etched workpieces
US5032734A (en) * 1990-10-15 1991-07-16 Vti, Inc. Method and apparatus for nondestructively measuring micro defects in materials
JP2927934B2 (ja) * 1990-11-16 1999-07-28 株式会社リコー 薄膜測定方法および装置
US5411760A (en) * 1990-11-16 1995-05-02 Cal-West Equipment Company, Inc. Protective coating and method of using such coating
IL96483A (en) 1990-11-27 1995-07-31 Orbotech Ltd Optical inspection method and apparatus
EP0527230B1 (en) * 1991-01-30 1996-06-05 Nkk Corporation Ellipsometer
US5164790A (en) 1991-02-27 1992-11-17 Mcneil John R Simple CD measurement of periodic structures on photomasks
US5674652A (en) 1991-02-28 1997-10-07 University Of New Mexico Diffracted light from latent images in photoresist for exposure control
DE4108329C2 (de) 1991-03-14 1993-10-14 Plasmos Gmbh Prozesstechnik Verfahren zum Bestimmen von Materialparametern, nämlich Dicke, Brechungsindex und Absorptionskoeffizient, einzelner Schichten
JP3323537B2 (ja) 1991-07-09 2002-09-09 キヤノン株式会社 微細構造評価装置及び微細構造評価法
US5337146A (en) * 1992-03-30 1994-08-09 University Of New Orleans Diffraction-grating photopolarimeters and spectrophotopolarimeters
US5486919A (en) * 1992-04-27 1996-01-23 Canon Kabushiki Kaisha Inspection method and apparatus for inspecting a particle, if any, on a substrate having a pattern
US5313044A (en) * 1992-04-28 1994-05-17 Duke University Method and apparatus for real-time wafer temperature and thin film growth measurement and control in a lamp-heated rapid thermal processor
US5386317A (en) * 1992-05-13 1995-01-31 Prometrix Corporation Method and apparatus for imaging dense linewidth features using an optical microscope
US5747813A (en) * 1992-06-16 1998-05-05 Kla-Tencop. Corporation Broadband microspectro-reflectometer
US5494829A (en) * 1992-07-31 1996-02-27 Biostar, Inc. Devices and methods for detection of an analyte based upon light interference
US5337150A (en) * 1992-08-04 1994-08-09 Hughes Aircraft Company Apparatus and method for performing thin film layer thickness metrology using a correlation reflectometer
US5361137A (en) 1992-08-31 1994-11-01 Texas Instruments Incorporated Process control for submicron linewidth measurement
US5521706A (en) * 1992-09-18 1996-05-28 J. A. Woollam Co. Inc. System and method for compensating polarization-dependent sensitivity of dispersive optics in a rotating analyzer ellipsometer system
US5504582A (en) * 1992-09-18 1996-04-02 J. A. Woollam Co. Inc. System and method for compensating polarization-dependent sensitivity of dispersive optics in a rotating analyzer ellipsometer system
US5666201A (en) * 1992-09-18 1997-09-09 J.A. Woollam Co. Inc. Multiple order dispersive optics system and method of use
US5519793A (en) * 1992-11-05 1996-05-21 The United States Of America As Represented By The Secretary Of The Interior Apparatus and method for computer vision measurements
US5365340A (en) * 1992-12-10 1994-11-15 Hughes Aircraft Company Apparatus and method for measuring the thickness of thin films
DE4301889A1 (de) * 1993-01-14 1994-07-21 Sentech Instr Gmbh Verfahren zum Bestimmen charakteristischer Größen transparenter Schichten mit Hilfe der Ellipsometrie
IL104708A (en) 1993-02-12 1995-12-31 Orbotech Ltd Device and method for optical inspection of items
US5432607A (en) * 1993-02-22 1995-07-11 International Business Machines Corporation Method and apparatus for inspecting patterned thin films using diffracted beam ellipsometry
US5381233A (en) 1993-03-03 1995-01-10 National Tsing Hua University Polarized-light scatterometer for measuring the thickness of a film coated on the partial of a substrate
EP0622624B1 (en) * 1993-04-23 1999-12-01 Research Development Corporation Of Japan A method for observing film thickness and/or refractive index
US5408322A (en) * 1993-04-26 1995-04-18 Materials Research Corporation Self aligning in-situ ellipsometer and method of using for process monitoring
US5399229A (en) * 1993-05-13 1995-03-21 Texas Instruments Incorporated System and method for monitoring and evaluating semiconductor wafer fabrication
US5412473A (en) * 1993-07-16 1995-05-02 Therma-Wave, Inc. Multiple angle spectroscopic analyzer utilizing interferometric and ellipsometric devices
US5355212A (en) 1993-07-19 1994-10-11 Tencor Instruments Process for inspecting patterned wafers
US5416594A (en) 1993-07-20 1995-05-16 Tencor Instruments Surface scanner with thin film gauge
US5363171A (en) 1993-07-29 1994-11-08 The United States Of America As Represented By The Director, National Security Agency Photolithography exposure tool and method for in situ photoresist measurments and exposure control
US5503707A (en) * 1993-09-22 1996-04-02 Texas Instruments Incorporated Method and apparatus for process endpoint prediction based on actual thickness measurements
US5625453A (en) * 1993-10-26 1997-04-29 Canon Kabushiki Kaisha System and method for detecting the relative positional deviation between diffraction gratings and for measuring the width of a line constituting a diffraction grating
IL107549A (en) * 1993-11-09 1996-01-31 Nova Measuring Instr Ltd Device for measuring the thickness of thin films
US5494697A (en) * 1993-11-15 1996-02-27 At&T Corp. Process for fabricating a device using an ellipsometric technique
US5555472A (en) 1993-12-22 1996-09-10 Integrated Process Equipment Corp. Method and apparatus for measuring film thickness in multilayer thin film stack by comparison to a reference library of theoretical signatures
GB9326247D0 (en) 1993-12-23 1994-02-23 British Petroleum Co Plc Method of determining thickness of coating
JPH07181438A (ja) * 1993-12-24 1995-07-21 Sharp Corp 液晶表示装置及びその欠陥修正方法
US5666199A (en) * 1994-07-11 1997-09-09 Phillips Petroleum Company Apparatus and process for detecting the presence of gel defects in oriented sheets or films based on polarization detection
US5604581A (en) * 1994-10-07 1997-02-18 On-Line Technologies, Inc. Film thickness and free carrier concentration analysis method and apparatus
KR960015001A (ko) * 1994-10-07 1996-05-22 가나이 쓰토무 반도체 기판의 제조방법과 피검사체상의 패턴결함을 검사하기 위한 방법 및 장치
WO1996012941A1 (en) * 1994-10-21 1996-05-02 Therma-Wave, Inc. Spectroscopic ellipsometer
US5555474A (en) * 1994-12-21 1996-09-10 Integrated Process Equipment Corp. Automatic rejection of diffraction effects in thin film metrology
US5608526A (en) 1995-01-19 1997-03-04 Tencor Instruments Focused beam spectroscopic ellipsometry method and system
US5607800A (en) 1995-02-15 1997-03-04 Lucent Technologies Inc. Method and arrangement for characterizing micro-size patterns
FR2731074B1 (fr) 1995-02-27 1997-05-16 Instruments Sa Procede de mesure ellipsometrique, ellipsometre et dispositif de controle d'elaboration de couches les mettant en oeuvre
US6118525A (en) 1995-03-06 2000-09-12 Ade Optical Systems Corporation Wafer inspection system for distinguishing pits and particles
JPH10501072A (ja) * 1995-03-20 1998-01-27 カンサス ステイト ユニバーシティ リサーチ フアウンデーション エリプソメトリー顕微鏡
US5777744A (en) * 1995-05-16 1998-07-07 Canon Kabushiki Kaisha Exposure state detecting system and exposure apparatus using the same
US5625455A (en) * 1995-06-06 1997-04-29 Board Of Regents, The University Of Texas System Rotating analyzer ellipsometer and ellipsometry technique
FR2737572B1 (fr) * 1995-08-03 1997-10-24 Centre Nat Rech Scient Ellipsometre multi-detecteurs et procede de mesure ellipsometrique multi-detecteurs
US5703692A (en) 1995-08-03 1997-12-30 Bio-Rad Laboratories, Inc. Lens scatterometer system employing source light beam scanning means
US5638178A (en) * 1995-09-01 1997-06-10 Phase Metrics Imaging polarimeter detector for measurement of small spacings
US5739909A (en) 1995-10-10 1998-04-14 Lucent Technologies Inc. Measurement and control of linewidths in periodic structures using spectroscopic ellipsometry
US5835221A (en) * 1995-10-16 1998-11-10 Lucent Technologies Inc. Process for fabricating a device using polarized light to determine film thickness
US5835220A (en) 1995-10-27 1998-11-10 Nkk Corporation Method and apparatus for detecting surface flaws
US5654903A (en) * 1995-11-07 1997-08-05 Lucent Technologies Inc. Method and apparatus for real time monitoring of wafer attributes in a plasma etch process
US6104486A (en) * 1995-12-28 2000-08-15 Fujitsu Limited Fabrication process of a semiconductor device using ellipsometry
JP3712481B2 (ja) * 1995-12-28 2005-11-02 富士通株式会社 半導体装置の製造方法
US5825498A (en) * 1996-02-05 1998-10-20 Micron Technology, Inc. Ultraviolet light reflectance method for evaluating the surface characteristics of opaque materials
US5982496A (en) 1996-03-11 1999-11-09 Vlsi Technology, Inc. Thin film thickness and optimal focus measuring using reflectivity
US5805290A (en) * 1996-05-02 1998-09-08 International Business Machines Corporation Method of optical metrology of unresolved pattern arrays
JP3602646B2 (ja) 1996-05-21 2004-12-15 株式会社日立製作所 試料の寸法測定装置
US5880838A (en) * 1996-06-05 1999-03-09 California Institute Of California System and method for optically measuring a structure
US6594012B2 (en) * 1996-07-05 2003-07-15 Canon Kabushiki Kaisha Exposure apparatus
US5923423A (en) 1996-09-12 1999-07-13 Sentec Corporation Heterodyne scatterometer for detecting and analyzing wafer surface defects
US5956148A (en) * 1996-12-20 1999-09-21 Texas Instruments Incorporated Semiconductor surface measurement system and method
US5867276A (en) 1997-03-07 1999-02-02 Bio-Rad Laboratories, Inc. Method for broad wavelength scatterometry
US6278519B1 (en) * 1998-01-29 2001-08-21 Therma-Wave, Inc. Apparatus for analyzing multi-layer thin film stacks on semiconductors
US6031615A (en) * 1997-09-22 2000-02-29 Candela Instruments System and method for simultaneously measuring lubricant thickness and degradation, thin film thickness and wear, and surface roughness
US5963329A (en) 1997-10-31 1999-10-05 International Business Machines Corporation Method and apparatus for measuring the profile of small repeating lines
US6483580B1 (en) 1998-03-06 2002-11-19 Kla-Tencor Technologies Corporation Spectroscopic scatterometer system
US6476920B1 (en) 1998-03-18 2002-11-05 Nova Measuring Instruments, Ltd. Method and apparatus for measurements of patterned structures
IL123727A (en) * 1998-03-18 2002-05-23 Nova Measuring Instr Ltd Method and apparatus for measurement of patterned structures
US6836324B2 (en) 1998-03-18 2004-12-28 Nova Measuring Instruments Ltd. Method and apparatus for measurements of patterned structures
US5917594A (en) * 1998-04-08 1999-06-29 Kla-Tencor Corporation Spectroscopic measurement system using an off-axis spherical mirror and refractive elements
US6271047B1 (en) * 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
IL143478A (en) 1998-12-04 2005-09-25 Fraunhofer Ges Forschung Method and device for optically monitoring processes for manufacturing microstructured surfaces in the production of semiconductors
IL130874A (en) * 1999-07-09 2002-12-01 Nova Measuring Instr Ltd System and method for measuring pattern structures
US6525818B1 (en) 2000-02-08 2003-02-25 Infineon Technologies Ag Overlay alignment system using polarization schemes
US6982792B1 (en) * 2000-03-21 2006-01-03 J.A. Woollam Co. Inc Spectrophotometer, ellipsometer, polarimeter and the like systems
US6429943B1 (en) * 2000-03-29 2002-08-06 Therma-Wave, Inc. Critical dimension analysis with simultaneous multiple angle of incidence measurements
US6603542B1 (en) * 2000-06-14 2003-08-05 Qc Optics, Inc. High sensitivity optical inspection system and method for detecting flaws on a diffractive surface
US7317531B2 (en) 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US6728663B2 (en) * 2000-09-13 2004-04-27 Accent Optical Technologies, Inc. Structure identification using scattering signatures
US7099005B1 (en) 2000-09-27 2006-08-29 Kla-Tencor Technologies Corporation System for scatterometric measurements and applications
US6678043B1 (en) * 2000-10-31 2004-01-13 Gerard H. Vurens Methods and apparatus for surface analysis
US6900892B2 (en) * 2000-12-19 2005-05-31 Kla-Tencor Technologies Corporation Parametric profiling using optical spectroscopic systems
WO2002065545A2 (en) 2001-02-12 2002-08-22 Sensys Instruments Corporation Overlay alignment metrology using diffraction gratings
US6614540B1 (en) 2001-06-28 2003-09-02 Advanced Micro Devices, Inc. Method and apparatus for determining feature characteristics using scatterometry
AU2002360738A1 (en) * 2001-12-19 2003-07-09 Kla-Tencor Technologies Corporation Parametric profiling using optical spectroscopic systems
KR100689743B1 (ko) 2004-10-01 2007-03-08 삼성전자주식회사 저잡음 증폭기의 정전기 보호 및 입력 임피던스 정합 회로및 저잡음 증폭기
US7515253B2 (en) * 2005-01-12 2009-04-07 Kla-Tencor Technologies Corporation System for measuring a sample with a layer containing a periodic diffracting structure
US7372579B2 (en) * 2006-04-20 2008-05-13 Infineon Technologies, Ag Apparatus and method for monitoring trench profiles and for spectrometrologic analysis

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