JP2002500829A - 薄膜トランジスタを有する電子装置 - Google Patents
薄膜トランジスタを有する電子装置Info
- Publication number
- JP2002500829A JP2002500829A JP54907699A JP54907699A JP2002500829A JP 2002500829 A JP2002500829 A JP 2002500829A JP 54907699 A JP54907699 A JP 54907699A JP 54907699 A JP54907699 A JP 54907699A JP 2002500829 A JP2002500829 A JP 2002500829A
- Authority
- JP
- Japan
- Prior art keywords
- gate
- transistor
- region
- tft
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims description 19
- 239000011159 matrix material Substances 0.000 claims abstract description 36
- 230000002093 peripheral effect Effects 0.000 claims abstract description 16
- 230000005684 electric field Effects 0.000 claims description 39
- 239000010408 film Substances 0.000 claims description 35
- 239000004065 semiconductor Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000004576 sand Substances 0.000 description 5
- 230000001419 dependent effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 238000013500 data storage Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- LFVLUOAHQIVABZ-UHFFFAOYSA-N Iodofenphos Chemical compound COP(=S)(OC)OC1=CC(Cl)=C(I)C=C1Cl LFVLUOAHQIVABZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- HPNSNYBUADCFDR-UHFFFAOYSA-N chromafenozide Chemical compound CC1=CC(C)=CC(C(=O)N(NC(=O)C=2C(=C3CCCOC3=CC=2)C)C(C)(C)C)=C1 HPNSNYBUADCFDR-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
- G09G3/3611—Control of matrices with row and column drivers
- G09G3/3685—Details of drivers for data electrodes
- G09G3/3688—Details of drivers for data electrodes suitable for active matrices only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
- H01L29/78627—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile with a significant overlap between the lightly doped drain and the gate electrode, e.g. GOLDD
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.基板上に、薄膜スイッチングトランジスタのスイッチングマトリクスと、該 マトリクスの前記スイッチングトランジスタに結合された薄膜回路トランジス タを有する周辺駆動回路とを有する電子装置において、前記薄膜スイッチング トランジスタ及び回路トランジスタの両方が結晶質半導体膜に隣接して該半導 体膜における或る導電型のソース及びドレイン領域の間の該或る導電型の導電 チャンネルを制御するための絶縁ゲートを有し、前記ドレイン領域よりも低い 前記或る導電型のドーピング濃度を有する電界解放領域が前記導電チャンネル と前記ドレイン領域との間に存在し、前記回路トランジスタの少なくとも幾つ かにおいては前記電界解放領域の少なくとも殆どが前記ゲートと重なり合って 、該電界解放領域における直列抵抗を前記ゲートとの導電率変調により減少さ せ、前記マトリクスの前記スイッチングトランジスタにおける前記ドレイン領 域は前記電界解放領域の少なくとも殆どにより前記ゲートとの重なりからオフ セットされて、前記スイッチングトランジスタがゲートの重なりを有する前記 回路トランジスタよりも少ない漏れ電流を有するようにしたことを特徴とする 電子装置。 2.請求項1に記載の装置において、前記薄膜スイッチングトランジスタ及び回 路トランジスタが、共に、ゲートを前記半導体膜上のゲート誘電体膜上に有す るような頂部ゲート構造のものであることを特徴とする装置。 3.請求項1に記載の装置において、前記薄膜スイッチングトランジスタ及び回 路トランジスタが、共に、半導体膜を前記基板上の前記ゲート上に存在するゲ ート誘電体膜上に有するような底部ゲート構造のものであることを特徴とする 装置。 4.請求項1に記載の装置において、前記スイッチングトランジスタの前記ソー ス及びドレイン領域が、ゲート重なりを有する前記回路トランジスタの前記ソ ース及びドレイン領域と同じドーピング濃度を有することを特徴とする装置。 5.請求項4に記載の装置において、前記ソース及びドレイン領域並びに前記電 界解放領域が、前記半導体膜内に存在する前記或る導電型のドープされた領域 であることを特徴とする装置。 6.請求項4に記載の装置において、前記ソース及びドレイン領域並びに前記電 界解放領域が、前記半導体膜に隣接する1以上の追加の半導体膜のドープされ た領域であることを特徴とする装置。 7.請求項4に記載の装置において、前記スイッチングトランジスタの前記電界 解放領域が、ゲート重なりを有する前記回路トランジスタの前記電界解放領域 と同じドーピング濃度を有することを特徴とする装置。 8.請求項1に記載の装置において、前記回路トランジスタの少なくとも幾つか が前記ゲートと略全体にわたり重なり合う電界解放領域を有し、該ゲートが前 記ドレイン領域の縁と略整列された縁を有していることを特徴とする装置。 9.請求項1に記載の装置において、ゲート重なりを有する前記回路トランジス タの少なくとも幾つかが、前記駆動回路においてアナログ信号を伝送する伝送 トランジスタであることを特徴とする装置。 10.請求項9に記載の装置において、ゲート重なりを有する前記伝送トランジ スタの少なくとも幾つかが、サンプルホールド回路におけるサンプリングトラ ンジスタであると共に前記アナログ信号を記憶するために当該トランジスタの ドレイン領域に結合された電荷記憶手段を有していることを特徴とする装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9806609.5A GB9806609D0 (en) | 1998-03-28 | 1998-03-28 | Electronic devices comprising thin-film transistors |
GB9806609.5 | 1998-03-28 | ||
PCT/IB1999/000252 WO1999050911A2 (en) | 1998-03-28 | 1999-02-15 | Electronic devices comprising thin-film transistors |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2002500829A true JP2002500829A (ja) | 2002-01-08 |
Family
ID=10829395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54907699A Pending JP2002500829A (ja) | 1998-03-28 | 1999-02-15 | 薄膜トランジスタを有する電子装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6046479A (ja) |
EP (1) | EP0985232A2 (ja) |
JP (1) | JP2002500829A (ja) |
KR (1) | KR100590737B1 (ja) |
GB (1) | GB9806609D0 (ja) |
WO (1) | WO1999050911A2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000216399A (ja) * | 1998-11-17 | 2000-08-04 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2003045889A (ja) * | 2001-08-01 | 2003-02-14 | Nec Corp | 電界効果型トランジスタ及びその製造方法並びに該トランジスタを使った液晶表示装置及びその製造方法 |
JP2006332551A (ja) * | 2005-05-30 | 2006-12-07 | Sharp Corp | 薄膜トランジスタ基板とその製造方法 |
US7745829B2 (en) | 1999-02-23 | 2010-06-29 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and fabrication method thereof |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100306801B1 (ko) * | 1998-06-25 | 2002-05-13 | 박종섭 | 박막트랜지스터및그의제조방법 |
GB9825314D0 (en) * | 1998-11-20 | 1999-01-13 | Koninkl Philips Electronics Nv | Active matrix liquid crystal display devices |
US6281552B1 (en) | 1999-03-23 | 2001-08-28 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistors having ldd regions |
JP2001007342A (ja) * | 1999-04-20 | 2001-01-12 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
TW463382B (en) * | 2000-05-19 | 2001-11-11 | Hannstar Display Corp | Manufacturing method of thin film transistor |
JP2002057339A (ja) * | 2000-08-10 | 2002-02-22 | Sony Corp | 薄膜半導体装置 |
JP2002076352A (ja) * | 2000-08-31 | 2002-03-15 | Semiconductor Energy Lab Co Ltd | 表示装置及びその作製方法 |
CN1423841A (zh) * | 2000-12-21 | 2003-06-11 | 皇家菲利浦电子有限公司 | 薄膜晶体管 |
TW471182B (en) * | 2001-01-20 | 2002-01-01 | Unipac Optoelectronics Corp | Thin film transistor having light guide material |
KR100437475B1 (ko) * | 2001-04-13 | 2004-06-23 | 삼성에스디아이 주식회사 | 평판 디스플레이 장치용 표시 소자 제조 방법 |
JP3961310B2 (ja) * | 2002-02-21 | 2007-08-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR100786498B1 (ko) * | 2005-09-27 | 2007-12-17 | 삼성에스디아이 주식회사 | 투명박막 트랜지스터 및 그 제조방법 |
US7719008B2 (en) * | 2006-02-03 | 2010-05-18 | Samsung Electronics Co., | Thin film transistor substrate and method of manufacturing the same and mask for manufacturing thin film transistor substrate |
KR101261609B1 (ko) * | 2006-07-06 | 2013-05-06 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 표시판 및 그 제조 방법 |
KR20090124527A (ko) | 2008-05-30 | 2009-12-03 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
TWI361492B (en) * | 2008-07-25 | 2012-04-01 | Au Optronics Corp | Thin film transistor substrate, electric apparatus, and method for fabricating the same |
US9634029B2 (en) | 2011-03-17 | 2017-04-25 | E Ink Holdings Inc. | Thin film transistor substrate and display device having same |
TWI451573B (zh) * | 2011-03-17 | 2014-09-01 | E Ink Holdings Inc | 顯示裝置及其薄膜電晶體結構 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06338615A (ja) * | 1993-05-28 | 1994-12-06 | Philips Electron Nv | 標本化回路を形成する薄膜回路素子を有する電子装置 |
JPH07111333A (ja) * | 1993-08-20 | 1995-04-25 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法並びにそれを用いた入 力または出力デバイス |
JPH07131030A (ja) * | 1993-11-05 | 1995-05-19 | Sony Corp | 表示用薄膜半導体装置及びその製造方法 |
JPH0837313A (ja) * | 1994-05-20 | 1996-02-06 | Mitsubishi Electric Corp | アクティブマトリクス液晶ディスプレイおよびその製法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2245741A (en) * | 1990-06-27 | 1992-01-08 | Philips Electronic Associated | Active matrix liquid crystal devices |
US5403762A (en) * | 1993-06-30 | 1995-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating a TFT |
JP3587537B2 (ja) * | 1992-12-09 | 2004-11-10 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP3512849B2 (ja) * | 1993-04-23 | 2004-03-31 | 株式会社東芝 | 薄膜トランジスタおよびそれを用いた表示装置 |
US5477073A (en) * | 1993-08-20 | 1995-12-19 | Casio Computer Co., Ltd. | Thin film semiconductor device including a driver and a matrix circuit |
JP3312083B2 (ja) * | 1994-06-13 | 2002-08-05 | 株式会社半導体エネルギー研究所 | 表示装置 |
JP3253808B2 (ja) * | 1994-07-07 | 2002-02-04 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
JP3526986B2 (ja) * | 1994-09-14 | 2004-05-17 | 株式会社半導体エネルギー研究所 | 半導体回路およびその作製方法 |
US5977559A (en) * | 1995-09-29 | 1999-11-02 | Semiconductor Energy Laboratory Co., Ltd. | Thin-film transistor having a catalyst element in its active regions |
-
1998
- 1998-03-28 GB GBGB9806609.5A patent/GB9806609D0/en not_active Ceased
-
1999
- 1999-02-15 JP JP54907699A patent/JP2002500829A/ja active Pending
- 1999-02-15 WO PCT/IB1999/000252 patent/WO1999050911A2/en active IP Right Grant
- 1999-02-15 KR KR1019997010979A patent/KR100590737B1/ko not_active IP Right Cessation
- 1999-02-15 EP EP99901842A patent/EP0985232A2/en not_active Withdrawn
- 1999-03-23 US US09/274,389 patent/US6046479A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06338615A (ja) * | 1993-05-28 | 1994-12-06 | Philips Electron Nv | 標本化回路を形成する薄膜回路素子を有する電子装置 |
JPH07111333A (ja) * | 1993-08-20 | 1995-04-25 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法並びにそれを用いた入 力または出力デバイス |
JPH07131030A (ja) * | 1993-11-05 | 1995-05-19 | Sony Corp | 表示用薄膜半導体装置及びその製造方法 |
JPH0837313A (ja) * | 1994-05-20 | 1996-02-06 | Mitsubishi Electric Corp | アクティブマトリクス液晶ディスプレイおよびその製法 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4536187B2 (ja) * | 1998-11-17 | 2010-09-01 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
JP2000216399A (ja) * | 1998-11-17 | 2000-08-04 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
US8030659B2 (en) | 1999-02-23 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method thereof |
US7745829B2 (en) | 1999-02-23 | 2010-06-29 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and fabrication method thereof |
US8471262B2 (en) | 1999-02-23 | 2013-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method thereof |
US8558241B2 (en) | 1999-02-23 | 2013-10-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method thereof |
US8575619B2 (en) | 1999-02-23 | 2013-11-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method thereof |
US9431431B2 (en) | 1999-02-23 | 2016-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method thereof |
US9910334B2 (en) | 1999-02-23 | 2018-03-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method thereof |
JP2018200467A (ja) * | 1999-02-23 | 2018-12-20 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
JP2003045889A (ja) * | 2001-08-01 | 2003-02-14 | Nec Corp | 電界効果型トランジスタ及びその製造方法並びに該トランジスタを使った液晶表示装置及びその製造方法 |
JP2006332551A (ja) * | 2005-05-30 | 2006-12-07 | Sharp Corp | 薄膜トランジスタ基板とその製造方法 |
JP4675680B2 (ja) * | 2005-05-30 | 2011-04-27 | シャープ株式会社 | 薄膜トランジスタ基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP0985232A2 (en) | 2000-03-15 |
KR100590737B1 (ko) | 2006-06-19 |
KR20010013006A (ko) | 2001-02-26 |
GB9806609D0 (en) | 1998-05-27 |
US6046479A (en) | 2000-04-04 |
WO1999050911A2 (en) | 1999-10-07 |
WO1999050911A3 (en) | 1999-11-18 |
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