JP2002097424A5 - - Google Patents
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- Publication number
- JP2002097424A5 JP2002097424A5 JP2000273119A JP2000273119A JP2002097424A5 JP 2002097424 A5 JP2002097424 A5 JP 2002097424A5 JP 2000273119 A JP2000273119 A JP 2000273119A JP 2000273119 A JP2000273119 A JP 2000273119A JP 2002097424 A5 JP2002097424 A5 JP 2002097424A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- adherend
- conductive
- layer
- thermosetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000012790 adhesive layer Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 229920001187 thermosetting polymer Polymers 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000273119A JP2002097424A (ja) | 2000-09-08 | 2000-09-08 | 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法 |
| PCT/US2001/028141 WO2002020686A2 (en) | 2000-09-08 | 2001-09-07 | Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
| AU2001288925A AU2001288925A1 (en) | 2000-09-08 | 2001-09-07 | Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
| CNB018154077A CN100469851C (zh) | 2000-09-08 | 2001-09-07 | 可热固化的导电性粘合片、连接结构以及使用它们的连接方法 |
| EP01968695A EP1315780A2 (en) | 2000-09-08 | 2001-09-07 | Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
| KR1020037003369A KR100617410B1 (ko) | 2000-09-08 | 2001-09-07 | 열경화성 전기전도성 접착 시트, 이를 이용한 연결 구조체및 연결 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000273119A JP2002097424A (ja) | 2000-09-08 | 2000-09-08 | 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002097424A JP2002097424A (ja) | 2002-04-02 |
| JP2002097424A5 true JP2002097424A5 (enrdf_load_stackoverflow) | 2007-10-25 |
Family
ID=18759125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000273119A Ceased JP2002097424A (ja) | 2000-09-08 | 2000-09-08 | 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1315780A2 (enrdf_load_stackoverflow) |
| JP (1) | JP2002097424A (enrdf_load_stackoverflow) |
| KR (1) | KR100617410B1 (enrdf_load_stackoverflow) |
| CN (1) | CN100469851C (enrdf_load_stackoverflow) |
| AU (1) | AU2001288925A1 (enrdf_load_stackoverflow) |
| WO (1) | WO2002020686A2 (enrdf_load_stackoverflow) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6624187B1 (en) | 2000-06-12 | 2003-09-23 | Health Research, Inc. | Long wave length absorbing bacteriochlorin alkyl ether analogs |
| JP2007005640A (ja) | 2005-06-24 | 2007-01-11 | Three M Innovative Properties Co | 回路基板の相互接続方法 |
| CN102270669A (zh) * | 2007-05-09 | 2011-12-07 | 日立化成工业株式会社 | 导电体连接用部件、连接结构和太阳能电池组件 |
| KR101108862B1 (ko) * | 2007-09-26 | 2012-01-31 | 히다치 가세고교 가부시끼가이샤 | 도전체 접속용 부재 및 그의 제조 방법, 접속 구조, 및 태양 전지 모듈 |
| CN101755341A (zh) * | 2007-09-26 | 2010-06-23 | 日立化成工业株式会社 | 导电体连接用部件及其制造方法、连接结构及太阳能电池组件 |
| WO2009115953A2 (en) * | 2008-03-19 | 2009-09-24 | Philips Intellectual Property & Standards Gmbh | Connector for establishing an electrical connection with conductive tape |
| DE102011100457A1 (de) * | 2011-05-04 | 2012-11-08 | Osram Opto Semiconductors Gmbh | Elektronisches Bauteil mit einem Trägerelement, einer Verbindungsstruktur und einem Halbleiterchip |
| JP5952078B2 (ja) * | 2011-06-23 | 2016-07-13 | 日東電工株式会社 | 導電性熱硬化型接着テープ |
| JP2013116929A (ja) * | 2011-12-01 | 2013-06-13 | Nitto Denko Corp | 導電性接着シート、その製造方法、集電電極および太陽電池モジュール |
| US9238760B2 (en) | 2012-03-30 | 2016-01-19 | Adhesives Research, Inc. | Charge collection side adhesive tape |
| JP6920412B2 (ja) | 2016-07-28 | 2021-08-18 | スリーエム イノベイティブ プロパティズ カンパニー | 電気ケーブル |
| WO2018147426A1 (ja) * | 2017-02-13 | 2018-08-16 | タツタ電線株式会社 | シールドフィルム、シールドプリント配線板及びシールドプリント配線板の製造方法 |
| KR20210094195A (ko) | 2020-01-20 | 2021-07-29 | 삼성디스플레이 주식회사 | 접착 부재, 이를 포함한 표시장치, 및 표시장치의 제조 방법 |
| JP2023096565A (ja) * | 2021-12-27 | 2023-07-07 | 株式会社レゾナック | ランプユニットの製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3497383A (en) * | 1967-08-22 | 1970-02-24 | Minnesota Mining & Mfg | Electrically conductive adhesive tape |
| ES276990Y (es) * | 1983-01-24 | 1985-01-16 | Minnesota Mining And Manufacturing Company | Articulo laminar para efectuar conexiones electricas de union a un sustrato |
| AU588925B2 (en) * | 1985-11-06 | 1989-09-28 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
| EP0237176A3 (en) * | 1986-02-07 | 1988-12-28 | Minnesota Mining And Manufacturing Company | Connector with fine-pitched conductive passages |
| JPS62227986A (ja) * | 1986-03-31 | 1987-10-06 | Fujikura Rubber Ltd | 導電性両面テ−プ |
| WO1994024704A1 (en) * | 1993-04-12 | 1994-10-27 | Bolger Justin C | Area bonding conductive adhesive preforms |
| JP4514840B2 (ja) * | 1997-02-14 | 2010-07-28 | 日立化成工業株式会社 | 回路部材接続用接着剤 |
-
2000
- 2000-09-08 JP JP2000273119A patent/JP2002097424A/ja not_active Ceased
-
2001
- 2001-09-07 AU AU2001288925A patent/AU2001288925A1/en not_active Abandoned
- 2001-09-07 EP EP01968695A patent/EP1315780A2/en not_active Withdrawn
- 2001-09-07 WO PCT/US2001/028141 patent/WO2002020686A2/en not_active Ceased
- 2001-09-07 CN CNB018154077A patent/CN100469851C/zh not_active Expired - Fee Related
- 2001-09-07 KR KR1020037003369A patent/KR100617410B1/ko not_active Expired - Fee Related