JP2002097424A5 - - Google Patents
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- Publication number
- JP2002097424A5 JP2002097424A5 JP2000273119A JP2000273119A JP2002097424A5 JP 2002097424 A5 JP2002097424 A5 JP 2002097424A5 JP 2000273119 A JP2000273119 A JP 2000273119A JP 2000273119 A JP2000273119 A JP 2000273119A JP 2002097424 A5 JP2002097424 A5 JP 2002097424A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- adherend
- conductive
- layer
- thermosetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000012790 adhesive layer Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 229920001187 thermosetting polymer Polymers 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Description
【特許請求の範囲】
【請求項1】 表面、及び裏面を有するシート状の導電層と導電層の表面上に設けられた接着層とを有し、
該導電層には、表面方向に隆起させた突起部が形成されており、
該接着層がエポキシ樹脂及びフェノキシ樹脂を含む熱硬化性接着剤で成り、
該接着層が被着体に加熱圧着されると、導電層の突起部が接着層を貫通して被着体と接触する、熱硬化型導電性接着シート。
【請求項2】 表面、及び裏面を有するシート状の導電層と導電層の表面上に設けられた第一の接着層と導電層の裏面上に設けられた第二の接着層とを有し、
該導電層には、表面方向に隆起させた第一の突起部及び裏面方向に隆起させた第二の突起部が形成されており、
該第一及び第二の接着層がエポキシ樹脂及びフェノキシ樹脂を含む熱硬化性接着剤で成り、
該第一及び第二の接着層が第一及び第二の被着体に加熱圧着されると、導電層の第一及び第二の突起部がそれぞれ第一及び第二の接着層を貫通してそれぞれ第一及び第二の被着体と接触する、熱硬化型導電性接着シート。
【請求項3】 請求項1又は2に記載の熱硬化型導電性接着シートと、
熱硬化型導電性接着シートの接着層上に設置された被着体とを有し、
該接着層が被着体に接着しており、
導電層の突起部が接着層を貫通して被着体と接触している、接続構造。
【請求項4】 前記被着体と前記突起部とが溶着又はろう付けされている請求項3に記載の接続構造。
【請求項5】 請求項1又は2に記載の熱硬化型導電性接着シートの接着層上に被着体を配置する工程、及び
熱硬化型導電性接着シートの接着層を加熱し、熱硬化型導電性接着シートと被着体との間に圧力を加えて、突起部をもって接着層を貫通させ、突起部と被着体とを接触させる工程、
を含む、接続方法。
[Claims]
1. A sheet-like conductive layer having a front surface and a back surface, and an adhesive layer provided on a surface of the conductive layer,
On the conductive layer, a protrusion protruding in the surface direction is formed,
The adhesive layer is made of a thermosetting adhesive containing an epoxy resin and a phenoxy resin ,
A thermosetting conductive adhesive sheet, wherein when the adhesive layer is heat-pressed to the adherend, the protrusions of the conductive layer penetrate the adhesive layer and come into contact with the adherend.
2. A sheet-like conductive layer having a front surface and a back surface, a first adhesive layer provided on the front surface of the conductive layer, and a second adhesive layer provided on the back surface of the conductive layer. ,
In the conductive layer, a first protrusion raised in the front surface direction and a second protrusion raised in the back surface direction are formed,
The first and second adhesive layer is made of a thermosetting adhesive comprising an epoxy resin and a phenoxy resin,
When the first and second adhesive layers is heat-pressed to the first and second adherend, the first and second protrusions of the conductive layer through the first and second adhesive layers, respectively A thermosetting conductive adhesive sheet that contacts the first and second adherends respectively .
3. The thermosetting conductive adhesive sheet according to claim 1 or 2 ,
Having an adherend placed on the adhesive layer of the thermosetting conductive adhesive sheet,
The adhesive layer is adhered to the adherend,
A connection structure in which a protrusion of the conductive layer penetrates the adhesive layer and is in contact with the adherend.
4. The connection structure according to claim 3, wherein the adherend and the projection are welded or brazed.
5. A step of disposing an adherend on the adhesive layer of the thermosetting conductive adhesive sheet according to claim 1 or 2 , and heating the adhesive layer of the thermosetting conductive adhesive sheet to perform thermosetting. Applying pressure between the mold conductive adhesive sheet and the adherend, causing the adhesive layer to penetrate with the protrusion, and contacting the protrusion with the adherend,
Including, the connection method.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000273119A JP2002097424A (en) | 2000-09-08 | 2000-09-08 | Thermosetting conductive adhesive sheet, and adhesion structure and adhesion method using the same |
EP01968695A EP1315780A2 (en) | 2000-09-08 | 2001-09-07 | Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
KR1020037003369A KR100617410B1 (en) | 2000-09-08 | 2001-09-07 | Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
PCT/US2001/028141 WO2002020686A2 (en) | 2000-09-08 | 2001-09-07 | Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
AU2001288925A AU2001288925A1 (en) | 2000-09-08 | 2001-09-07 | Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
CNB018154077A CN100469851C (en) | 2000-09-08 | 2001-09-07 | Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000273119A JP2002097424A (en) | 2000-09-08 | 2000-09-08 | Thermosetting conductive adhesive sheet, and adhesion structure and adhesion method using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002097424A JP2002097424A (en) | 2002-04-02 |
JP2002097424A5 true JP2002097424A5 (en) | 2007-10-25 |
Family
ID=18759125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000273119A Ceased JP2002097424A (en) | 2000-09-08 | 2000-09-08 | Thermosetting conductive adhesive sheet, and adhesion structure and adhesion method using the same |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1315780A2 (en) |
JP (1) | JP2002097424A (en) |
KR (1) | KR100617410B1 (en) |
CN (1) | CN100469851C (en) |
AU (1) | AU2001288925A1 (en) |
WO (1) | WO2002020686A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6624187B1 (en) | 2000-06-12 | 2003-09-23 | Health Research, Inc. | Long wave length absorbing bacteriochlorin alkyl ether analogs |
JP2007005640A (en) | 2005-06-24 | 2007-01-11 | Three M Innovative Properties Co | Interconnecting method for circuit board |
KR101157771B1 (en) * | 2007-05-09 | 2012-06-25 | 히다치 가세고교 가부시끼가이샤 | Conductor connection member, connection structure, and solar cell module |
CN101755341A (en) * | 2007-09-26 | 2010-06-23 | 日立化成工业株式会社 | Conductor connection member and manufacture method thereof, syndeton and solar module |
EP2200046A1 (en) * | 2007-09-26 | 2010-06-23 | Hitachi Chemical Company, Ltd. | Conductor-connecting member, method for producing the same, connection structure, and solar cell module |
WO2009115953A2 (en) * | 2008-03-19 | 2009-09-24 | Philips Intellectual Property & Standards Gmbh | Connector for establishing an electrical connection with conductive tape |
DE102011100457A1 (en) * | 2011-05-04 | 2012-11-08 | Osram Opto Semiconductors Gmbh | Electronic part, has connection structure comprising foil with front and back surfaces, where front/back surface is formed such that front/back surface contacts chip/carrier element and is spaced from chip/carrier element, respectively |
JP5952078B2 (en) * | 2011-06-23 | 2016-07-13 | 日東電工株式会社 | Conductive thermosetting adhesive tape |
JP2013116929A (en) * | 2011-12-01 | 2013-06-13 | Nitto Denko Corp | Conductive adhesive sheet, method for producing the same, collector electrode, and solar cell module |
WO2013148967A1 (en) * | 2012-03-30 | 2013-10-03 | Adhesives Research, Inc. | Charge collection tape |
CN210120253U (en) | 2016-07-28 | 2020-02-28 | 3M创新有限公司 | Cable and cable assembly |
WO2018147426A1 (en) * | 2017-02-13 | 2018-08-16 | タツタ電線株式会社 | Shield film, shielded printed circuit board, and method for manufacturing shielded printed circuit board |
KR20210094195A (en) | 2020-01-20 | 2021-07-29 | 삼성디스플레이 주식회사 | Adhesive member and display device comprising adhesive member and method for manufacturing the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3497383A (en) * | 1967-08-22 | 1970-02-24 | Minnesota Mining & Mfg | Electrically conductive adhesive tape |
AU588925B2 (en) * | 1985-11-06 | 1989-09-28 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
EP0237176A3 (en) * | 1986-02-07 | 1988-12-28 | Minnesota Mining And Manufacturing Company | Connector with fine-pitched conductive passages |
JPS62227986A (en) * | 1986-03-31 | 1987-10-06 | Fujikura Rubber Ltd | Conductive double-face self-adhesive tape |
US5667884A (en) * | 1993-04-12 | 1997-09-16 | Bolger; Justin C. | Area bonding conductive adhesive preforms |
-
2000
- 2000-09-08 JP JP2000273119A patent/JP2002097424A/en not_active Ceased
-
2001
- 2001-09-07 EP EP01968695A patent/EP1315780A2/en not_active Withdrawn
- 2001-09-07 KR KR1020037003369A patent/KR100617410B1/en not_active IP Right Cessation
- 2001-09-07 AU AU2001288925A patent/AU2001288925A1/en not_active Abandoned
- 2001-09-07 CN CNB018154077A patent/CN100469851C/en not_active Expired - Fee Related
- 2001-09-07 WO PCT/US2001/028141 patent/WO2002020686A2/en active IP Right Grant
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