JP2002097424A5 - - Google Patents

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Publication number
JP2002097424A5
JP2002097424A5 JP2000273119A JP2000273119A JP2002097424A5 JP 2002097424 A5 JP2002097424 A5 JP 2002097424A5 JP 2000273119 A JP2000273119 A JP 2000273119A JP 2000273119 A JP2000273119 A JP 2000273119A JP 2002097424 A5 JP2002097424 A5 JP 2002097424A5
Authority
JP
Japan
Prior art keywords
adhesive
adherend
conductive
layer
thermosetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2000273119A
Other languages
Japanese (ja)
Other versions
JP2002097424A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2000273119A priority Critical patent/JP2002097424A/en
Priority claimed from JP2000273119A external-priority patent/JP2002097424A/en
Priority to EP01968695A priority patent/EP1315780A2/en
Priority to KR1020037003369A priority patent/KR100617410B1/en
Priority to PCT/US2001/028141 priority patent/WO2002020686A2/en
Priority to AU2001288925A priority patent/AU2001288925A1/en
Priority to CNB018154077A priority patent/CN100469851C/en
Publication of JP2002097424A publication Critical patent/JP2002097424A/en
Publication of JP2002097424A5 publication Critical patent/JP2002097424A5/ja
Ceased legal-status Critical Current

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Description

【特許請求の範囲】
【請求項1】 表面、及び裏面を有するシート状の導電層と導電層の表面上に設けられた接着層とを有し、
該導電層には、表面方向に隆起させた突起部が形成されており、
該接着層がエポキシ樹脂及びフェノキシ樹脂を含む熱硬化性接着剤で成り、
該接着層が被着体に加熱圧着されると、導電層の突起部が接着層を貫通して被着体と接触する、熱硬化型導電性接着シート。
【請求項2】 表面、及び裏面を有するシート状の導電層と導電層の表面上に設けられた第一の接着層と導電層の裏面上に設けられた第二の接着層とを有し、
該導電層には、表面方向に隆起させた第一の突起部及び裏面方向に隆起させた第二の突起部が形成されており、
第一及び第二の接着層がエポキシ樹脂及びフェノキシ樹脂を含む熱硬化性接着剤で成り、
第一及び第二の接着層が第一及び第二の被着体に加熱圧着されると、導電層の第一及び第二の突起部がそれぞれ第一及び第二の接着層を貫通してそれぞれ第一及び第二の被着体と接触する、熱硬化型導電性接着シート。
【請求項3】 請求項1又は2に記載の熱硬化型導電性接着シートと、
熱硬化型導電性接着シートの接着層上に設置された被着体とを有し、
該接着層が被着体に接着しており、
導電層の突起部が接着層を貫通して被着体と接触している、接続構造。
【請求項4】 前記被着体と前記突起部とが溶着又はろう付けされている請求項3に記載の接続構造。
【請求項5】 請求項1又は2に記載の熱硬化型導電性接着シートの接着層上に被着体を配置する工程、及び
熱硬化型導電性接着シートの接着層を加熱し、熱硬化型導電性接着シートと被着体との間に圧力を加えて、突起部をもって接着層を貫通させ、突起部と被着体とを接触させる工程、
含む、接続方法。
[Claims]
1. A sheet-like conductive layer having a front surface and a back surface, and an adhesive layer provided on a surface of the conductive layer,
On the conductive layer, a protrusion protruding in the surface direction is formed,
The adhesive layer is made of a thermosetting adhesive containing an epoxy resin and a phenoxy resin ,
A thermosetting conductive adhesive sheet, wherein when the adhesive layer is heat-pressed to the adherend, the protrusions of the conductive layer penetrate the adhesive layer and come into contact with the adherend.
2. A sheet-like conductive layer having a front surface and a back surface, a first adhesive layer provided on the front surface of the conductive layer, and a second adhesive layer provided on the back surface of the conductive layer. ,
In the conductive layer, a first protrusion raised in the front surface direction and a second protrusion raised in the back surface direction are formed,
The first and second adhesive layer is made of a thermosetting adhesive comprising an epoxy resin and a phenoxy resin,
When the first and second adhesive layers is heat-pressed to the first and second adherend, the first and second protrusions of the conductive layer through the first and second adhesive layers, respectively A thermosetting conductive adhesive sheet that contacts the first and second adherends respectively .
3. The thermosetting conductive adhesive sheet according to claim 1 or 2 ,
Having an adherend placed on the adhesive layer of the thermosetting conductive adhesive sheet,
The adhesive layer is adhered to the adherend,
A connection structure in which a protrusion of the conductive layer penetrates the adhesive layer and is in contact with the adherend.
4. The connection structure according to claim 3, wherein the adherend and the projection are welded or brazed.
5. A step of disposing an adherend on the adhesive layer of the thermosetting conductive adhesive sheet according to claim 1 or 2 , and heating the adhesive layer of the thermosetting conductive adhesive sheet to perform thermosetting. Applying pressure between the mold conductive adhesive sheet and the adherend, causing the adhesive layer to penetrate with the protrusion, and contacting the protrusion with the adherend,
Including, the connection method.

JP2000273119A 2000-09-08 2000-09-08 Thermosetting conductive adhesive sheet, and adhesion structure and adhesion method using the same Ceased JP2002097424A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2000273119A JP2002097424A (en) 2000-09-08 2000-09-08 Thermosetting conductive adhesive sheet, and adhesion structure and adhesion method using the same
EP01968695A EP1315780A2 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
KR1020037003369A KR100617410B1 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
PCT/US2001/028141 WO2002020686A2 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
AU2001288925A AU2001288925A1 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
CNB018154077A CN100469851C (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000273119A JP2002097424A (en) 2000-09-08 2000-09-08 Thermosetting conductive adhesive sheet, and adhesion structure and adhesion method using the same

Publications (2)

Publication Number Publication Date
JP2002097424A JP2002097424A (en) 2002-04-02
JP2002097424A5 true JP2002097424A5 (en) 2007-10-25

Family

ID=18759125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000273119A Ceased JP2002097424A (en) 2000-09-08 2000-09-08 Thermosetting conductive adhesive sheet, and adhesion structure and adhesion method using the same

Country Status (6)

Country Link
EP (1) EP1315780A2 (en)
JP (1) JP2002097424A (en)
KR (1) KR100617410B1 (en)
CN (1) CN100469851C (en)
AU (1) AU2001288925A1 (en)
WO (1) WO2002020686A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624187B1 (en) 2000-06-12 2003-09-23 Health Research, Inc. Long wave length absorbing bacteriochlorin alkyl ether analogs
JP2007005640A (en) 2005-06-24 2007-01-11 Three M Innovative Properties Co Interconnecting method for circuit board
KR101157771B1 (en) * 2007-05-09 2012-06-25 히다치 가세고교 가부시끼가이샤 Conductor connection member, connection structure, and solar cell module
CN101755341A (en) * 2007-09-26 2010-06-23 日立化成工业株式会社 Conductor connection member and manufacture method thereof, syndeton and solar module
EP2200046A1 (en) * 2007-09-26 2010-06-23 Hitachi Chemical Company, Ltd. Conductor-connecting member, method for producing the same, connection structure, and solar cell module
WO2009115953A2 (en) * 2008-03-19 2009-09-24 Philips Intellectual Property & Standards Gmbh Connector for establishing an electrical connection with conductive tape
DE102011100457A1 (en) * 2011-05-04 2012-11-08 Osram Opto Semiconductors Gmbh Electronic part, has connection structure comprising foil with front and back surfaces, where front/back surface is formed such that front/back surface contacts chip/carrier element and is spaced from chip/carrier element, respectively
JP5952078B2 (en) * 2011-06-23 2016-07-13 日東電工株式会社 Conductive thermosetting adhesive tape
JP2013116929A (en) * 2011-12-01 2013-06-13 Nitto Denko Corp Conductive adhesive sheet, method for producing the same, collector electrode, and solar cell module
WO2013148967A1 (en) * 2012-03-30 2013-10-03 Adhesives Research, Inc. Charge collection tape
CN210120253U (en) 2016-07-28 2020-02-28 3M创新有限公司 Cable and cable assembly
WO2018147426A1 (en) * 2017-02-13 2018-08-16 タツタ電線株式会社 Shield film, shielded printed circuit board, and method for manufacturing shielded printed circuit board
KR20210094195A (en) 2020-01-20 2021-07-29 삼성디스플레이 주식회사 Adhesive member and display device comprising adhesive member and method for manufacturing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497383A (en) * 1967-08-22 1970-02-24 Minnesota Mining & Mfg Electrically conductive adhesive tape
AU588925B2 (en) * 1985-11-06 1989-09-28 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
EP0237176A3 (en) * 1986-02-07 1988-12-28 Minnesota Mining And Manufacturing Company Connector with fine-pitched conductive passages
JPS62227986A (en) * 1986-03-31 1987-10-06 Fujikura Rubber Ltd Conductive double-face self-adhesive tape
US5667884A (en) * 1993-04-12 1997-09-16 Bolger; Justin C. Area bonding conductive adhesive preforms

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