JP2611575B2 - IC card, IC card module and IC card manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card,
The present invention relates to an IC card module mounted on a card and a method for manufacturing the IC card.

[0002]

2. Description of the Related Art As shown in FIGS.
And the IC module 2 mounted thereon.

The IC module 2 includes a printed circuit board 21
, IC chip 22, resin portion 23, external terminal 24
And a lead wire 25. The printed circuit board 21 has a rectangular plate shape, and an IC chip 22 is fixed to one surface thereof by being sealed with a resin. This resin portion 23 has a trapezoidal shape. This IC
The chip 23 is connected to a wiring pattern on the printed board 21 via a lead wire 25. This wiring pattern is further connected to an external terminal 24 provided on the other surface. Therefore, data is exchanged with an external device via the external terminal 24.

On the other hand, the card substrate 1 is made of plastic and has a flat plate shape with a thickness of about 0.76 mm.
On one surface of the card substrate 1, a concave portion into which the IC module 2 is fitted is formed. The recess is formed by a two-step recess corresponding to the shape of the IC module 2, a deep portion into which the resin portion 23 is fitted and a shallow portion into which the printed circuit board 21 is fitted.

[0005] Therefore, the IC module 2 in which the IC chip is molded with the resin, for example, a sheet-like adhesive material 121 is adhered to the surface of the printed circuit board 21 around the molded portion (trapezoidal portion), and then this is attached to the card base. Lumber 1
In the recess. As a result, the adhesive material 121
Are adhered to the shallow portion of the concave portion, and the IC module 2 is fixed to the concave portion (FIG. 12B shows a state where the IC module 2 is fitted and fixed).

[0006]

However, in such a conventional IC card 120, the card base 1
When a force is applied to the wire and it is bent, the following problem occurs.

As shown in FIG. 13A, when the IC card 120 is curved so that the upper side thereof is pulled, the bending stress concentrates on the cross section aa ′ of the card substrate 1 where the cross sectional area changes suddenly. I do. Therefore, peeling of the adhesive material 121 between the IC module 2 and the card substrate 1 may occur. If the adhesive force of the adhesive material 121 is larger than the bending stress, the IC module 2
Breakage of the printed circuit board 21, disconnection of the lead wire 25, and the like are likely to occur.

On the other hand, as shown in FIG. 13B, when the IC card 120 is bent so that the lower side is pulled, the peeling of the adhesive material 121 or the damage of the printed circuit board 21 is similarly performed. The lead wire 25 may be disconnected.

[0009]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an IC card capable of preventing peeling of an adhesive material due to bending of an IC card, breakage of an IC card module, and the like, and an IC card module. Its purpose is to provide a manufacturing method.

[0010]

An IC card according to the first aspect of the present invention has a flat plate-shaped card base having a concave portion on one surface and a flat plate-shaped IC card module base material on one surface. The IC chip is mounted, and external connection terminals electrically connected to the IC chip are formed on the other surface, and the concave portion is formed so that the external connection terminal formation surface forms substantially the same surface as one surface of the card base material. An IC card module to be fitted into the IC card module, and an elasticity interposed between the IC card module base material surface around the IC chip of the IC card module or the entire IC chip surface and the card base material. It has a buffer member, a first adhesive member for fixing the buffer member on one surface of the base material of the IC card module, and a second adhesive member for fixing the buffer member to the bottom surface of the concave portion. And

An IC card module according to a second aspect of the present invention is an IC card module mounted on an IC card, comprising: a flat IC card module base material; I on one side of the lumber
A C chip is mounted and a resin mold portion is formed, and the card base material is provided on the entire surface of the IC module base material surface surrounding the resin mold portion or the IC card module base material surface including the resin mold portion. An elastic cushioning member interposed therebetween and an adhesive member for fixing the cushioning member to one surface of the IC card module base material.

According to a third aspect of the present invention, there is provided a method of manufacturing an IC card, comprising the steps of: forming a concave portion for fitting an IC card module in a flat card base; With an IC chip on one side,
A step of forming an IC card module by resin molding; and a step of laminating a buffer member via a first adhesive member on at least a surface of the IC card module base material around the resin mold of the IC card module; A buffer member is fixed to the recess through the second adhesive member on the bottom surface of the recess formed in the card substrate, and the IC card module is fixed to the recess, and pressed against the bottom surface. Embedding the IC card module in the card base material so as to form a substantially same surface as one surface.

[0013]

According to the first aspect of the present invention, when a force is applied to the IC card and the IC card is bent, stress concentrates on the concave portion of the IC card. Stress is applied to the buffer member fixed to the recess of the card base via the second adhesive member.
The shape of the cushioning member having elasticity changes due to stress. Therefore, since the stress applied to the buffer member is absorbed by the buffer member, the stress applied to the IC card module fixed via the first adhesive member is reduced. When no force is applied to the IC card, the shape of the concave portion of the card substrate returns to the state before the stress was applied.
Then, the shape of the cushioning member fixed to the concave portion via the second adhesive member is also restored by its elasticity.

According to the present invention, the IC card module is mounted on the IC card, and a force is applied from outside the IC card. When the IC card is bent, stress concentrates on the concave portion of the IC card. The second in the recess of the card base
The stress is applied to the cushioning member fixed through the adhesive member. The shape of the cushioning member having elasticity changes due to stress. Therefore, since the stress applied to the buffer member is absorbed by the buffer member, the stress applied to the IC card module fixed via the first adhesive member is reduced. When no force is applied to the IC card, the shape of the concave portion of the card substrate returns to the state before the stress was applied. Then, the shape of the cushioning member fixed to the concave portion via the second adhesive member is also restored by its elasticity.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing the structure of an IC card 10 according to a first embodiment of the present invention.

The IC card 10 according to the first embodiment includes a card base 1, an IC module 2, and a cushioning material 12.

The card substrate 1 is made of, for example, vinyl chloride, AB
It is made of a plastic resin such as S resin, polyester, polypropylene, styrene resin, acryl, polycarbonate, vinyl chloride / vinyl acetate copolymer, and has a thickness of about 0.1 when a single layer or a plurality of layers are laminated by heat lamination or an adhesive. It has a flat plate shape of 76 mm. In the drawing, a single-layer state is described. On one surface of the card substrate 1, a concave portion for fitting the IC module 2 is formed. The angle θ (15 ° to 25 °)
゜) is provided. This taper facilitates the work of mounting the IC module 2 on the card substrate 1 and has a function of preventing the bending stress from being concentrated on the IC module 2 when the bending force of the IC card 10 is applied. doing.

The IC module 2 includes a printed circuit board 21
, IC chip 22, resin mold part 23, external terminal 24, bonding wire 25, printed circuit board 2
One of the IC chip 22 mounting sides includes a wiring pattern 26, and a through hole 27 that is electrically connected to the wiring pattern 26 and the external terminal 24. The printed circuit board 21 has a rectangular shape, and the IC chip 2
2 are fixed and mounted. The IC chip 22 is connected to a wiring pattern 26 on the printed circuit board 21 by a bonding wire 25. This wiring pattern 26 is further connected to an external terminal 24 through a through hole 27. Data is exchanged with an external device via the external terminal 24. Bonding wire 25
The IC chip 22 is sealed with a molding resin to form a trapezoidal resin mold portion 23, which protrudes from the printed circuit board 21. Also,
Although not shown, a structure may be used in which the flat plate-shaped base for the IC module is made of a lead frame-shaped conductor and directly connected to the IC chip, thereby eliminating the need for a through hole and also serving as an external connection terminal.

The cushioning member 12 has a sheet shape, and a rectangular window is provided at a central portion thereof so that the resin mold portion 23 of the IC module 2 is fitted. The cushioning material 12 is made of, for example, a synthetic rubber-based material such as SBR rubber or silicon rubber, a polymer synthetic resin material such as PVC, PET, PP, or PE, a nonwoven fabric, a paper material such as synthetic paper, or aluminum. It is configured using a material having a predetermined elasticity such as an elastic metal material. Note that the rectangular window may be larger than the size of the IC module 2, and the shape of the window may be circular or polygonal.
It may be a recess for accommodating the module 2, and the shape of the recess may be rectangular, circular, or polygonal.

Reference numeral 11 denotes a sheet-like adhesive material, which is interposed between the printed board 21 of the IC module 2 and the cushioning material 12. Reference numeral 13 denotes a sheet-like adhesive material formed in the same manner.
In the recess. These adhesive materials 11,
13, a rectangular window of a predetermined size is provided in the center portion,
The IC module 2 is fitted into this window. These adhesive materials 11 and 13 are configured to use, for example, a thermal adhesive film such as acrylic or SBR, or a synthetic rubber adhesive such as silicon. Note that the window formed in the adhesive material 11 may be larger than the size of the IC module 2, and the shape of the window may be circular or polygonal. When it is in the shape, the window may not be provided.

Therefore, the cushioning material 1 is attached to the IC module 2.
2 are adhered by the adhesive material 11, the trapezoidal resin mold portion 23 becomes the adhesive material 11 and the cushioning material 12.
In each of the windows. In this case, the flat top surface of the resin mold portion 23 and the exposed surface of the cushioning material 12 may have the same height. In addition, this resin mold part 2
3 is tm, the thickness of the adhesive material 11 is t1, and the cushioning material 1 is
2, the thickness of the adhesive material 13 is represented by t2, and the thickness of the adhesive material 13 is represented by tm−t1−t2−t3 = tg>.
It is desirable to have a relational expression of zero. According to this relational expression, the cross section of the IC card 10 is as shown in FIG. 2A, and the top surface of the resin mold portion 23 and the card base 1
A space tg is provided between the bottom surface of the recess. For this reason, when the IC module 2 is pressed against the concave portion of the card base material 1 and bonded, the pressing force acts on the adhesive materials 11 and 13, and the IC module 2 and the cushioning material 1 are pressed.
2, and the cushioning material 12 and the card base material 1 are fixed with a stronger adhesive force. Note that the interval tg may be zero (FIG. 2B).

FIGS. 3 to 5 are views for explaining a method of manufacturing the IC card 10 according to the first embodiment of the present invention. The manufacturing method will be described with reference to these drawings.

First, as shown in FIG. 3A, a roll-shaped cushioning material 12 having a predetermined width and a roll-shaped adhesive material 11 having the same width are prepared. On one surface of the adhesive material 11, a release paper 11A that is easy to peel off is adhered. Note that the cushioning material 12 and the adhesive material 11 may not be in the form of a roll. Next, the adhesive material 11 is applied to one surface of the cushioning material 12.
The surfaces on which the release paper 11A is not adhered are overlapped, heated or pressed. As a result, the adhesive material 11 is fixed to the cushioning material 12 (FIG. 4B shows this state).

Then, the cushioning material 12 thus laminated
The adhesive material 11 is stamped out by a predetermined die and formed into a predetermined shape. That is, FIG.
As shown in FIG. 5, the cushioning material 12 and the adhesive material 11 after the punching have a rectangular flat plate shape, and have a rectangular window of a predetermined size at the center thereof. Thus, the cushioning material 12
Preparation is completed.

Next, as shown in FIG. 4, the cushioning material 12 is bonded to the IC module 2. At this time, the IC module 2 is prepared as a resin-molded IC chip on the printed circuit board 21. That is, first, in the cushioning material 12 shown in FIG.
Then, the release paper 11A is peeled off, and then, the adhesive material 11 is superposed on one surface (the surface on which the IC chip is molded) of the printed circuit board 21 of the IC module 2 so as to be in contact therewith. Then, by heating and / or pressurizing these, the cushioning material 12 is fixed to the printed board 21 of the IC module 2. FIG. 4A shows a state in which the cushioning material 12 is superimposed on the IC module 2, and FIG. 4B shows a state after fixing. Further, FIG. 4C shows a cross section of the IC module 2 and the cushioning material 12 taken along the line CC in FIG. 4B. That is, the adhesive material 11 is fixed to one surface of the printed circuit board 21, and the resin mold portion 23 is fitted into the windows of the adhesive material 11 and the cushioning material 12. The top surface of the resin mold portion 23 has substantially the same height as the surface of the cushioning material 12.

On the other hand, the card substrate 1 is provided with an end mill cutter 8.
At 0, it is cut. Therefore, a concave portion having a predetermined depth and a predetermined size is formed on one surface of the card substrate 1. At this time, a taper with an angle θ is formed on the side wall surface of the concave portion (FIG. 5A). Thus, the card base material 1
Preparations have also been completed.

Then, the IC module 2 prepared as described above is fitted and fixed in the concave portion of the card base material. That is, as shown in FIG. 4C, in the IC module 2 to which the cushioning material 12 is adhered, an adhesive material 13 is disposed on the surface of the cushioning material 12 and is fitted into the recess through the adhesive material 13. , Sticking.

In this case, a sheet-like material can be used as the adhesive material 13, and the adhesive material 13 can be used as shown in FIG.
As shown in (D), a paste-like adhesive material 13 can be used. When this paste-like adhesive material 13 is used, first, the adhesive material 13 is applied to a predetermined thickness on the bottom surface of the concave portion by the application device 81 (FIG. 5B). Next, the IC module 2 is fitted into the concave portion of the card base 1 with the cushioning material 12 facing down, that is, with the cushioning material 12 facing the adhesive material 13 (FIG. 5C). Then, when the surface of the cushioning material 12 comes into contact with the adhesive material 13, a predetermined force is applied to press it. As a result, the IC module 2 is fitted into and fixed to the concave portion of the card base 1 via the cushioning material 12 (FIG. 8D). Through the above steps, the IC card 10 according to the first embodiment is manufactured.

A bending force may be applied to the IC card 10 having the above configuration so that the upper end thereof is pulled (FIG. 6A). At this time, the bending stress concentrated on the cross section AA of the card base 1 is transmitted to the cushioning material 12 via the adhesive material 13. Since the cushioning material 12 has a predetermined elasticity, the cushioning material 12 itself elastically deforms under the bending force. Therefore, the bending stress is absorbed by the cushioning material 12 and the stress acting on the adhesive material 11 and further on the printed circuit board 21 of the IC module 2 is reduced. For this reason, peeling at the adhesive materials 11 and 13 and IC
The printed circuit board 21 of the module 2 can be prevented from being damaged.

On the other hand, as shown in FIG. 6B, even when a bending force is applied from the outside so that the upper end of the card base 1 is compressed, a cross section taken along the line BB of the card base 1 is obtained. The bending stress concentrated on the portion is absorbed by the cushioning material 12 as in the case described above. At this time, since the side wall surface of the concave portion of the card base 1 is provided with a taper having an angle θ, the side wall surface of the concave portion of the card base 1 is
Even if the side wall is deformed in the direction in which it contacts the end face, the side wall face does not come into contact with and press the end face. The gap formed between these surfaces by this taper makes it possible to avoid contact and compression. Therefore, peeling of the adhesive materials 11 and 13 and breakage of the IC module can be prevented. When the bending force is removed, the cushioning material 12 is restored.

FIGS. 7 and 8 show an I-mode according to a second embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating a configuration of a C card 100.

The IC card 100 according to the second embodiment is
The same as the IC card 10 according to the first embodiment except that the cushioning material 30 is used instead of the adhesive materials 11 and 13 (in the IC card 10) and the cushioning material 12 according to the first embodiment. Configuration. Therefore, the description will be focused on the cushioning material 30, and the description of the other components will be omitted.

The cushioning material 30 has an elastic material 32 having a predetermined elasticity similar to that of the cushioning material 12, and adhesive materials 31 and 33 fixed to both surfaces thereof by temporary bonding. The bonding materials 31 and 33 are made of a heat bonding film such as acrylic or SBR. The cushioning member 30 has a sheet shape, and has a rectangular window at the center thereof so that the resin mold portion 23 of the IC module 2 can be fitted therein. At least a similar window is provided for the adhesive material 31.

[0035] The IC module 2
Is fitted and fixed in the recess of the card base 1 (FIG. 8).

FIGS. 9 to 11 are views for explaining a method of manufacturing the IC card 100 according to the second embodiment of the present invention. Since the method of manufacturing the IC card 100 according to the second embodiment has a part that overlaps with the method of manufacturing the IC card 10 according to the first embodiment, the IC card 1 according to the first embodiment
0 will be mainly described.

As shown in FIG. 9A, a release paper 31A is easily adhered to one surface of the adhesive material 31. The adhesive material 33 and the release paper 33A are similarly configured. First, as shown in FIG. 9B, these adhesive materials 3 are applied to both sides of a sheet-like cushioning material 32.
1, 33 are overlapped and pressurized or heated. As a result, the adhesive material 31 is fixed to one surface of the cushioning material 32 and the adhesive material 33 is fixed to the other surface. In this step, the release papers 31A and 33A respectively
1, 33 remain.

The release papers 33A thus laminated,
The release paper 31A, the adhesive materials 31, 33, and the cushioning material 32 are stamped and molded into a predetermined shape (FIG. 9C).
These cross sections DD are shown in FIG.

Next, the release paper 31A is peeled off from the adhesive material 31. The IC module 2 is placed on the adhesive material 31 and fixed to the cushioning material 32 (FIG. 10A). These ICs
A cross section of the module 2, the cushioning material 32, the adhesive materials 31, 33, and the release paper 33A is shown in FIG. As a result, the module preparation step is completed.

On the other hand, the card base material 1 corresponds to FIG.
In the same manner as described above, a cutting process is performed by the end mill cutter 80 to form a concave portion on one surface of the card base material 1 and a taper of an angle θ is formed on the side wall surface of the concave portion (FIG. 11A )). Therefore, a concave portion having a predetermined depth and a predetermined size is formed on one surface of the card base 1. Thus, the preparation of the card base 1 is also completed.

Next, the release paper 33A is peeled off from the adhesive material 33 in the IC module 2, the buffer material 32 and the like laminated in the step of FIG. The adhesive material 33 from which the release paper 33A has been peeled is fitted into the concave portion of the card base material 1 and fixed (FIG. 11B). Therefore, the IC card 100 according to the second embodiment is manufactured through the above steps. Therefore, according to this embodiment, since the adhesive material is attached to the front and back surfaces of the cushioning material at a time and molded, the number of steps is reduced, and there is an advantage that the production is further facilitated.

[0042]

As described above, according to the present invention, peeling of an adhesive material, breakage of an IC module and the like can be prevented in an IC card. Furthermore, according to the present invention, it is possible to manufacture an IC card free from such peeling, breakage and the like. At the same time, since the cushioning material is bonded to the base material, the concave portion can be formed without a step, and the production efficiency can be improved as compared with the case where the cushioning material is bonded to the concave portion of the card base material.

[Brief description of the drawings]

FIG. 1 is an exploded sectional view showing an IC card according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing the IC card according to the first embodiment of the present invention.

FIG. 3 is a view illustrating a method of manufacturing an IC card according to a first embodiment of the present invention.

FIG. 4 is a view illustrating a method of manufacturing an IC card according to a first embodiment of the present invention.

FIG. 5 is a view illustrating a method of manufacturing an IC card according to a first embodiment of the present invention.

FIG. 6 is a sectional view of the IC card when the IC card is curved.

FIG. 7 is a sectional view showing a configuration of an IC card according to a second embodiment of the present invention.

FIG. 8 is a sectional view showing a configuration of an IC card according to a second embodiment of the present invention.

FIG. 9 is a view illustrating a method of manufacturing an IC card according to a second embodiment of the present invention.

FIG. 10 is a view illustrating a method of manufacturing an IC card according to a second embodiment of the present invention.

FIG. 11 is a view illustrating a method of manufacturing an IC card according to a second embodiment of the present invention.

FIG. 12 is a cross-sectional view showing a configuration of a conventional IC card.

FIG. 13 is a sectional view of an IC card when a conventional IC card is bent.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Card base material 2 IC module (IC card module) 10 IC card 11 Adhesive material (first adhesive member) 12 Buffer material (first cushion member) 13 Adhesive material (second adhesive member) 31 Adhesive material ( First adhesive member) 32 Buffer material (buffer member) 33 Adhesive material (second adhesive member) 100 IC card

Claims (3)

(57) [Claims] An external connection comprising a flat plate-shaped card base having a concave portion on one surface thereof, and an IC chip mounted on one side of a flat IC card module base and electrically connected thereto. An IC card module which is inserted into the recess so that a terminal for external connection is formed on the other surface, and a surface on which the external connection terminal is formed forms substantially the same surface as one surface of the card substrate; and an IC of the IC card module. IC around the chip
An elastic buffer member interposed between the card module machine substrate surface or the entire surface of the IC chip and the card substrate, and the buffer member is fixed to one surface of the IC card module substrate. An IC card comprising: a first adhesive member; and a second adhesive member for fixing the buffer member to the bottom surface of the concave portion. 2. An IC card module to be mounted on an IC card, comprising: a flat IC card module substrate; and an IC chip mounted on one surface of the IC card module substrate. A part is formed, and is interposed between the card base and the entire surface of the IC module base material surface including the resin mold portion or the IC module base material surface including the resin mold portion. An elastic cushioning member; and an adhesive member for fixing the cushioning member to one surface of the IC card module base material.
Module for C card. 3. A step of forming a concave portion for fitting an IC card module in a flat card base material, mounting an IC chip on one surface of the flat IC card module base material, and resin-molding the IC chip. A step of forming a card module; a step of laminating a buffer member via a first adhesive member on at least a surface of the IC card module base material around a resin mold of the IC card module; A buffer member is fixed to the bottom of the recessed portion via a second adhesive member, and an IC card module is fixed to the recessed portion, pressed against the bottom surface, and substantially flush with the IC card module substrate and one surface of the card substrate. To form an IC
Burying the card module in the card base material;
A method for manufacturing an IC card, comprising: