JP3106777B2 - IC card - Google Patents
IC cardInfo
- Publication number
- JP3106777B2 JP3106777B2 JP05164495A JP16449593A JP3106777B2 JP 3106777 B2 JP3106777 B2 JP 3106777B2 JP 05164495 A JP05164495 A JP 05164495A JP 16449593 A JP16449593 A JP 16449593A JP 3106777 B2 JP3106777 B2 JP 3106777B2
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- circuit board
- printed circuit
- forming portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、カード基材にＩＣ
モジュールを埋め込んだＩＣカードに係わる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention
It relates to an IC card in which a module is embedded.
【０００２】[0002]
【従来の技術】ＩＣカードは、記憶容量が大きく、ま
た、偽造、贋造をすることが困難であることから、磁気
カードに代わるカード媒体として注目されている。2. Description of the Related Art Since an IC card has a large storage capacity and is difficult to forge or counterfeit, it has attracted attention as a card medium replacing a magnetic card.
【０００３】前記ＩＣカードは、例えば図１に記載の様
に、カード基材６に、矩形のプリント基板１の表面に接
続端子部２を形成し、裏面に接続端子部２と電気的に接
続されたＩＣチップ３を樹脂にて封入してなるプリント
基板より小さいＩＣ形成部４を有するＩＣモジュール５
を略同一面となるように埋め込み、接着固定したもので
ある。In the IC card, for example, as shown in FIG. 1, a connection terminal portion 2 is formed on a surface of a rectangular printed circuit board 1 on a card base material 6 and electrically connected to the connection terminal portion 2 on a back surface. Module 5 having an IC forming portion 4 smaller than a printed board formed by encapsulating the filled IC chip 3 with resin.
Are embedded and adhered and fixed so as to be substantially on the same surface.
【０００４】ところで、カード基材６は、厚さ０．７６
ｍｍ程度の塩化ビニルであり、可撓性を有している。他
方、ＩＣモジュールは、ガラスエポキシ等からなるプリ
ント基板を有することから可撓性をほとんど有していな
い。よって、ＩＣカードに曲げ応力が加わると、ＩＣモ
ジュール５の図２(a)、(b)中○で示した部分に変形が生
じたり、更にプリント基板とＩＣ形成部が剥離する場合
がある。The card base material 6 has a thickness of 0.76.
It is vinyl chloride of about mm and has flexibility. On the other hand, the IC module has little flexibility since it has a printed circuit board made of glass epoxy or the like. Therefore, when a bending stress is applied to the IC card, deformation may occur in the portion of the IC module 5 indicated by a circle in FIGS. 2A and 2B, or the printed circuit board and the IC forming portion may be separated.
【０００５】他方、特開昭６１−７５９８６号公報に
は、カード基材のＩＣチップ（集積回路素子）を埋め込
んだ周囲に貫通孔あるいは貫通しない孔を設け、その部
分で曲げ応力を吸収する構造のＩＣカードが記載されて
いる。On the other hand, Japanese Patent Application Laid-Open No. 61-75986 discloses a structure in which a through hole or a non-penetrating hole is provided around a card substrate in which an IC chip (integrated circuit element) is embedded, and a bending stress is absorbed at that portion. IC card is described.
【０００６】しかしながら、前記ＩＣカードでは、貫通
孔あるいは貫通しない孔が、表面あるいは裏面に露出し
ており、見栄えの悪いものであった。However, in the IC card, a through hole or a hole that does not penetrate is exposed on the front surface or the back surface, and has a poor appearance.
【０００７】[0007]
【発明が解決しようとする課題】本発明は上記の課題に
鑑みてなされたものであって、曲げ応力が加わっても、
ＩＣモジュールの変形やプリント基板とＩＣ形成部の剥
離が起こらず、かつ、見栄えの良いＩＣカードを提供す
ることを課題とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made even if bending stress is applied.
An object of the present invention is to provide an IC card which does not deform an IC module or peeling of a printed circuit board from an IC forming portion and has a good appearance.
【０００８】[0008]
【課題を解決するための手段】請求項１に係わる発明
は、カード基材に、矩形のプリント基板の表面に接続端
子部を有し、裏面に接続端子部と電気的に接続されたＩ
Ｃチップを樹脂にて封止してなるプリント基板より小さ
いＩＣ形成部を有するＩＣモジュールを略同一面となる
ように埋め込んだＩＣカードにおいて、少なくともカー
ド基材のＩＣモジュール裏面の４つの角部に相対する部
分に、ＩＣ形成部に相対する凹部と連続した形状で、プ
リント基板の厚さより深い凹部が形成され、かつ、カー
ド基材とＩＣモジュール裏面の４つの角部が接着固定さ
れていないことを特徴とするＩＣカードである。According to a first aspect of the present invention, a card substrate has a connection terminal on the front surface of a rectangular printed circuit board, and a back surface electrically connected to the connection terminal on the back surface.
In an IC card in which an IC module having an IC formation portion smaller than a printed board formed by sealing a C chip with a resin is embedded so as to be substantially flush with each other, at least four corners on the back surface of the IC module on the card base material. A concave portion deeper than the thickness of the printed circuit board is formed at a portion opposite to the concave portion facing the IC forming portion, and the four corners of the card substrate and the back surface of the IC module are not bonded and fixed. An IC card characterized by the following.
【０００９】請求項２に係わる発明は、請求項１記載の
発明を前提とし、カード基材とＩＣモジュール裏面の非
ＩＣ形成部が接着テープにより接着固定されていること
を特徴とするＩＣカードである。According to a second aspect of the present invention, based on the first aspect, an IC card is characterized in that the card base and the non-IC forming portion on the back surface of the IC module are bonded and fixed with an adhesive tape. is there.
【００１０】[0010]
【作用】請求項１に係わる発明によれば、少なくともカ
ード基材のＩＣモジュール裏面の４つの角部に相対する
部分に、ＩＣ形成部に相対する凹部と連続した形状で、
プリント基板の厚さより深い凹部が形成され、かつ、カ
ード基材とＩＣモジュール裏面の４つの角部が接着固定
されていないので、ＩＣモジュール裏面より応力が加わ
ると、図５(a)記載の様にＩＣモジュール裏面の４つの
角部がカード基材から若干突出するものの、ＩＣモジュ
ールに応力が加わらず変形、剥離しない。他方、ＩＣモ
ジュール表面より応力が加わると、図５(b)記載の様に
ＩＣモジュール裏面の４つの角部がカード基材の凹部に
若干挿入するものの、ＩＣモジュールに応力が加わらず
変形、剥離しない。また、プリント基板とＩＣ形成部が
剥離することもない。更に、ＩＣ形成部でない部分（非
ＩＣ形成部）がほぼ凹部を隠蔽する。According to the first aspect of the present invention, at least a portion of the card substrate opposite to the four corners on the back surface of the IC module has a shape continuous with the concave portion facing the IC forming portion.
Since a concave portion deeper than the thickness of the printed circuit board is formed and the four corners of the card substrate and the back surface of the IC module are not bonded and fixed, when stress is applied from the back surface of the IC module, as shown in FIG. Although the four corners on the back of the IC module slightly protrude from the card base material, the IC module is not deformed or peeled without stress. On the other hand, when stress is applied from the surface of the IC module, the four corners on the back surface of the IC module are slightly inserted into the recesses of the card base as shown in FIG. do not do. Further, the printed circuit board and the IC forming portion do not peel off. Further, a portion other than the IC forming portion (non-IC forming portion) almost covers the concave portion.
【００１１】請求項２に係わる発明によれば、カード基
材とＩＣモジュール裏面の非ＩＣ形成部が接着テープに
より接着固定する構成をとることにより、ＩＣカードを
容易に製造ができる。According to the second aspect of the present invention, the IC card can be easily manufactured by adopting a configuration in which the card base and the non-IC forming portion on the back surface of the IC module are adhered and fixed by the adhesive tape.
【００１２】[0012]
【発明の実施の形態】以下、本発明の実施形態を詳細に
説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail.
【００１３】ＩＣモジュール５は、接続端子部を形成し
た矩形のプリント基板の裏面にＩＣチップを搭載後、ワ
イヤーボディング装置により接続端子部（スルーホー
ル）と電気的に接続し、更に樹脂にて封止したＩＣ形成
部を有したものである。なお、ＩＣ形成部はカード基材
面に見てプリント基板より小さい。The IC module 5 has an IC chip mounted on the back surface of a rectangular printed circuit board on which connection terminals are formed, and is electrically connected to the connection terminals (through holes) by a wire boding device. It has a sealed IC forming portion. Note that the IC forming portion is smaller than the printed board as viewed on the card substrate surface.
【００１４】カード基材６は、例えば長辺８５ｍｍ×短
辺５４ｍｍの大きさを有するＩＣモジュールの支持体で
ある。The card substrate 6 is a support for an IC module having a size of, for example, 85 mm long side × 54 mm short side.
【００１５】カード基材を構成する材料としては、引張
り強さ、衝撃強さ、柔軟温度、積層性、耐熱性、耐燃
性、耐熱伸縮性、耐薬品浸せき性、粘着性、耐湿性、光
透過濃度、毒性、耐久性等、各種物理的特性を考慮し、
ポリ塩化ビニル、ポリエステル、ポリカーボネート、ポ
リメタクリル酸メチル、ポリスチレン等のプラスチック
類、紙、合成紙などを単独あるいは組み合わせた複合体
より選択される。The materials constituting the card base material include tensile strength, impact strength, softening temperature, lamination property, heat resistance, flame resistance, heat-resistant stretchability, chemical immersion resistance, adhesion, moisture resistance, light transmission. Considering various physical characteristics such as concentration, toxicity and durability,
It is selected from composites of plastics such as polyvinyl chloride, polyester, polycarbonate, polymethyl methacrylate, and polystyrene, paper, synthetic paper, and the like, alone or in combination.
【００１６】カード基材に形成する凹部の形状として
は、基本的にはＩＣモジュールを略同一面となるように
埋め込むことができる形状であることは無論のこと、Ｉ
Ｃモジュールに加わる曲げ応力を吸収するために、少な
くともカード基材のＩＣモジュール裏面の４つの角部に
相対する部分に、ＩＣ形成部に相対する凹部と連続した
形状で、プリント基板の厚さより深い凹部を有する。こ
のことによりＩＣモジュールのＩＣ形成部（封入樹脂
部）とプリント基板との剥離を防止し、また、直接ＩＣ
モジュールにかかる応力を低減させ、変形が生じること
を防止する。なお、凹部を形成する位置は、通常長辺方
向に見て中央より短辺寄り、短辺方向に見て中央という
場合が多い。It goes without saying that the shape of the recess formed in the card base material is basically such that the IC module can be embedded so as to be substantially flush with the IC module.
In order to absorb the bending stress applied to the C module, at least the portion of the card base material opposite to the four corners on the back surface of the IC module has a shape continuous with the concave portion corresponding to the IC forming portion and is deeper than the thickness of the printed circuit board. It has a recess. This prevents separation of the IC module (encapsulated resin portion) of the IC module from the printed circuit board,
The stress applied to the module is reduced to prevent deformation. The position where the concave portion is formed is usually closer to the short side than the center when viewed in the long side direction, and is often the center when viewed in the short side direction.
【００１７】前記凹部を図３を用いて更に説明する。図
３のカード基材の凹部は、ＩＣ形成部に相対する凹部９
と、ＩＣモジュール裏面の４つの角部に相対する部分
に、ＩＣ形成部に相対する凹部９と連続した形状で、プ
リント基板の厚さより深い凹部８と、４つの角部を結ぶ
辺（ＩＣモジュールの４辺に相当）と接合したＩＣモジ
ュールを接着固定する凹部７とを有する。なお、図３中
Ａ−Ａ’断面を図４に示す。The recess will be further described with reference to FIG. The recess of the card base of FIG.
And a concave portion 8 continuous with the concave portion 9 facing the IC forming portion and deeper than the thickness of the printed circuit board at a portion facing the four corner portions on the back surface of the IC module, and a side connecting the four corner portions (IC module). (Corresponding to the four sides) of the IC module. FIG. 4 shows a cross section taken along the line AA ′ in FIG.
【００１８】なお、この形状は、ＩＣカード携帯の際に
最も多く発生するカード基材の対角線方向の曲げに対し
て、また、接着強度的にも有利である。This shape is advantageous for the diagonal bending of the card base material, which occurs most frequently when carrying an IC card, and is also advantageous in terms of adhesive strength.
【００１９】前記カード基材の製造は、平坦なカード基
材を切削する、あるいはカード基材形状の間隙を有する
金型に樹脂を射出し成形することによりなされる。The card base is manufactured by cutting a flat card base or by injecting a resin into a mold having a gap in the shape of the card base and molding the resin.
【００２０】前記ＩＣモジュールは、カード基材に略同
一面となるように埋め込み、カード基材とＩＣモジュー
ル裏面の４つの角部が接着固定されないように接着固定
する。接着する方法としては、ＩＣモジュール裏面の非
ＩＣ形成部及びＩＣ形成部をシリコン等の合成ゴム系接
着剤等により接着固定する方法、ＩＣモジュール裏面の
非ＩＣ形成部をアクリル、ＳＢＲ等の熱可塑性樹脂から
なる接着テープ、あるいは支持体の両面に感圧接着剤が
塗布された接着テープにより接着固定する方法がある。The IC module is embedded in the card base so as to be substantially flush with each other, and is bonded and fixed so that the four corners of the card base and the back surface of the IC module are not bonded and fixed. The non-IC forming portion on the back of the IC module and the IC forming portion are bonded and fixed with a synthetic rubber-based adhesive such as silicon, and the non-IC forming portion on the back of the IC module is formed of a thermoplastic resin such as acrylic or SBR. There is a method of bonding and fixing with an adhesive tape made of a resin or an adhesive tape in which a pressure-sensitive adhesive is applied to both surfaces of a support.
【００２１】[0021]
【実施例】以下、本発明に係わる実施例を詳述する。Embodiments of the present invention will be described below in detail.
【００２２】まず、矩形のプリント基板表面にエッチン
グ法を用いて接続端子部を形成した後、裏面にＩＣチッ
プを搭載後、ワイヤーボディング装置により接続端子部
と電気的に接続し、更にＩＣチップを樹脂にて封止し、
カード基材面に見てプリント基板より小さいＩＣ形成部
するとによりＩＣモジュール５を得た。First, a connection terminal portion is formed on the surface of a rectangular printed circuit board by etching, an IC chip is mounted on the back surface, and the connection terminal portion is electrically connected to the connection terminal portion by a wire bonding device. Is sealed with resin,
The IC module 5 was obtained by forming an IC forming portion smaller than the printed board on the card base surface.
【００２３】厚さ０．７６ｍｍ程度の白色塩化ビニル板
をカード形状に打ち抜いた後、エンドミルカッターを用
いた切削加工により、図３に記載の様な、ＩＣ形成部に
相対する凹部９と、ＩＣモジュール裏面の４つの角部に
相対する部分に、ＩＣ形成部に相対する凹部９と連続し
た形状で、プリント基板の厚さより深い凹部８と、４つ
の角部を結ぶ辺（ＩＣモジュールの４辺に相当）と接合
したＩＣモジュールを接着固定する凹部７とを形成する
ことによりカード基材を得た。After punching out a white vinyl chloride plate having a thickness of about 0.76 mm into a card shape, a cutting process using an end mill cutter is performed, and a concave portion 9 facing the IC forming portion as shown in FIG. A concave portion 8 having a shape continuous with the concave portion 9 facing the IC forming portion and deeper than the thickness of the printed circuit board, and a side connecting the four corner portions (four sides of the IC module) And a concave portion 7 for bonding and fixing the bonded IC module to obtain a card base material.
【００２４】前記ＩＣモジュール５の裏面（非ＩＣ形成
部）に支持体の両面に感圧接着剤が塗布された接着テー
プを貼着後、更に前記カード基材と接着固定した。An adhesive tape coated with a pressure-sensitive adhesive on both sides of the support was adhered to the back surface (non-IC forming portion) of the IC module 5 and further adhered and fixed to the card substrate.
【００２５】本実施例に係わるＩＣカードに、カード基
材の対角線方向の曲げ応力を加えたが、プリント基板
（ＩＣモジュール）の変形、剥離は見られなかった。When a bending stress in a diagonal direction of the card substrate was applied to the IC card according to the present embodiment, no deformation or peeling of the printed circuit board (IC module) was observed.
【００２６】[0026]
【発明の効果】以上説明したように本発明に係わるＩＣ
カードによれば、少なくともカード基材のＩＣモジュー
ル裏面の４つの角部に相対する部分に、ＩＣ形成部に相
対する凹部と連続した形状で、プリント基板の厚さより
深い凹部が形成され、かつ、カード基材とＩＣモジュー
ル裏面の４つの角部が接着固定されていないので、ＩＣ
モジュール裏面より応力が加わると、ＩＣモジュール裏
面の４つの角部がカード基材から若干突出するものの、
ＩＣモジュールに応力が加わらず変形しない。他方、Ｉ
Ｃモジュール表面より応力が加わると、ＩＣモジュール
裏面の４つの角部がカード基材の凹部に若干挿入するも
のの、ＩＣモジュールに応力が加わらず変形しない。更
にプリント基板とＩＣ形成部が剥離することもない。As described above, the IC according to the present invention is provided.
According to the card, at least a portion of the card substrate opposite to the four corners of the back surface of the IC module is formed with a concave portion deeper than the thickness of the printed circuit board in a shape continuous with the concave portion facing the IC forming portion, and Since the card substrate and the four corners of the back of the IC module are not bonded and fixed,
When stress is applied from the back of the module, the four corners of the back of the IC module slightly protrude from the card base,
The IC module is not deformed without stress. On the other hand, I
When stress is applied from the front surface of the C module, the four corners on the back surface of the IC module are slightly inserted into the recesses of the card base material, but the IC module is not deformed because no stress is applied. Further, the printed circuit board and the IC forming portion do not peel off.
【００２７】また、非ＩＣ形成部がほぼ凹部を隠蔽する
ため、見栄えが良い。Also, since the non-IC formation portion almost covers the recess, the appearance is good.
【００２８】更にカード基材とＩＣモジュール裏面の非
ＩＣ形成部が接着テープにより接着固定すれば、ＩＣカ
ードを容易に製造ができる。Furthermore, if the card base and the non-IC forming portion on the back of the IC module are bonded and fixed with an adhesive tape, an IC card can be easily manufactured.
【図１】従来例のＩＣカードを示す部分断面図である。FIG. 1 is a partial sectional view showing a conventional IC card.
【図２】従来例のＩＣカードに応力を加えた状態を示す
部分断面図である。FIG. 2 is a partial sectional view showing a state in which stress is applied to a conventional IC card.
【図３】実施例に係わるＩＣカード基材の部分平面図で
ある。FIG. 3 is a partial plan view of an IC card base material according to the embodiment.
【図４】実施例に係わるＩＣカード基材の部分断面図で
ある。FIG. 4 is a partial cross-sectional view of an IC card base according to the embodiment.
【図５】本発明に係わるＩＣカードに応力を加えた状態
を示す対角線方向の部分断面図である。FIG. 5 is a partial cross-sectional view in a diagonal direction showing a state in which stress is applied to the IC card according to the present invention.
１…プリント基板 ２…接続端子部 ３…ＩＣチップ ４…ＩＣ形成部 ５…ＩＣモジュール ６…カード基材 ７…ＩＣモジュールを接着固定する凹部 ８…角部に相対する凹部 ９…ＩＣ形成部に相対する凹部 DESCRIPTION OF SYMBOLS 1 ... Printed circuit board 2 ... Connection terminal part 3 ... IC chip 4 ... IC formation part 5 ... IC module 6 ... Card base material 7 ... Concave part which adheres and fixes an IC module 8 ... Concave part facing a corner part 9 ... IC formation part Opposing recesses
Claims (2)
に接続端子部を有し、裏面に接続端子部と電気的に接続
されたＩＣチップを樹脂にて封止してなるプリント基板
より小さいＩＣ形成部を有するＩＣモジュールを略同一
面となるように埋め込んだＩＣカードにおいて、 少なくともカード基材のＩＣモジュール裏面の４つの角
部に相対する部分に、ＩＣ形成部に相対する凹部と連続
した形状で、プリント基板の厚さより深い凹部が形成さ
れ、かつ、カード基材とＩＣモジュール裏面の４つの角
部が接着固定されていないことを特徴とするＩＣカー
ド。1. A printed circuit board having a connection member on the surface of a rectangular printed circuit board on a card substrate, and sealing an IC chip electrically connected to the connection terminal on the back with resin. In an IC card in which an IC module having a small IC forming portion is embedded so as to be substantially on the same surface, at least a portion corresponding to four corners on the back surface of the IC module of the card base is connected to a concave portion facing the IC forming portion. An IC card characterized in that a concave portion deeper than the thickness of the printed circuit board is formed in the above shape, and the four corners of the card substrate and the back surface of the IC module are not bonded and fixed.
形成部が接着テープにより接着固定されていることを特
徴とする請求項１記載のＩＣカード。2. The non-IC on the card substrate and the back of the IC module
2. The IC card according to claim 1, wherein the forming portion is fixed by an adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05164495A JP3106777B2 (en) | 1993-07-02 | 1993-07-02 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05164495A JP3106777B2 (en) | 1993-07-02 | 1993-07-02 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0717177A JPH0717177A (en) | 1995-01-20 |
| JP3106777B2 true JP3106777B2 (en) | 2000-11-06 |
Family
ID=15794252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05164495A Expired - Fee Related JP3106777B2 (en) | 1993-07-02 | 1993-07-02 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3106777B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602444A (en) * | 2015-01-29 | 2015-05-06 | 高德(苏州)电子有限公司 | Automotive multilayer-structured circuit board and production method thereof |
-
1993
- 1993-07-02 JP JP05164495A patent/JP3106777B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0717177A (en) | 1995-01-20 |
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